System on Chip Design and Modelling Dr. David J Greaves
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Floating-Point Package for Intel 8008 and 8080 Microprocessors
UCRL-51940 FLOATING-POINT PACKAGE FOR INTEL 8008 AND 8080 MICROPROCESSORS Michael D. Maples October 24, 1975 Prepared for U.S. Energy Research& Development Administration under contract No. W-7405-Eng-48 I_AV~=IENCE I_IVEFIMORE I.ABOFIATOFIY University ol Calilomia ~ Livermore ~ NOTICE .sponsored by tht: United $~ates G~ven~menl.Neilhe~ the United States nor the United ~tates I’:n,~rgy of their employees,IIOr lilly of their eorltl’ilctclrs~ warranty~ express t~r implied, or asstltlleS ~t]y legld liability or responsihilit y fnr the accuracy, apparatus, product or ])rc)eess disclosed, represents that its rise would IIt~l illl’r liege privlttely-owned rights." Printed in the United States of America Avai.] able from National Technical. information Service U.S. Department of Commerce 5285 Port Royal Road Springfield, Virginia 22151 Price: Printed Copy $ *; Microfiche $2.25 NTIS ""Pages _Sellin_.g Price 1-50 $4.00 51-150 $5.45 151-325 $7.60 326-500 $10.60 501.-1000 $13.60 DISCI.AlMBR This documeut was prepared as an account of work sponsored by an agency of the United States Gnvernment.Neither the United States Governmentnor the University of California nor any of their employees,makes any warranty, express or implied, or assumesany legal liability or responsibility for the accuracy, complete.aess, or usefulness of any information, apparatus, product, or process disclosed, or represents that its use wouldnot infrioge privately ownedrights. Refarenceherein to any specific commercialproduct, process, or service by trade name, trademark, manufacturer, or otherwise, does not necessarily constitute or imply its endorsement, recommendation,or favoring by the United States Govermnentor the University of California. -
Oriented Conferences Four Solutions
Delivering Solutions and Technology to the World’s Design Engineering Community Four Solutions- Oriented Conferences • System-on-Chip Design Conference • IP World Forum • High-Performance System Design Conference • Wireless and Optical Broadband Design Conference Special Technology Focus Areas January 29 – February 1, 2001 • Internet and Information Exhibits: January 30–31, 2001 Appliance Design Santa Clara Convention Center • Embedded Design Santa Clara, California • RF, Optical, and Analog Design NEW! • IEC Executive Forum International Engineering Register by January 5 and Consortium save $100 – and be entered to win www.iec.org a Palm Pilot! Practical Design Solutions Practical design-engineering solutions presented by practicing engineers—The DesignCon reputation of excellence has been built largely by the practical nature of its sessions. Design engineers hand selected by our team of professionals provide you with the best electronic design and silicon-solutions information available in the industry. DesignCon provides attendees with DesignCon has an established reputation for the high design solutions from peers and professionals. quality of its papers and its expert-level speakers from Silicon Valley and around the world. Each year more than 100 industry pioneers bring to light the design-engineering solutions that are on the leading edge of technology. This elite group of design engineers presents unique case studies, technology innovations, practical techniques, design tips, and application overviews. Who Should Attend Any professionals who need to stay on top of current information regarding design-engineering theories, The most complete educational experience techniques, and application strategies should attend this in the industry conference. DesignCon attracts engineers and allied The four conference options of DesignCon 2001 provide a professionals from all levels and disciplines. -
The Intro to GPGPU CPU Vs
12/12/11! The Intro to GPGPU . Dr. Chokchai (Box) Leangsuksun, PhD! Louisiana Tech University. Ruston, LA! ! CPU vs. GPU • CPU – Fast caches – Branching adaptability – High performance • GPU – Multiple ALUs – Fast onboard memory – High throughput on parallel tasks • Executes program on each fragment/vertex • CPUs are great for task parallelism • GPUs are great for data parallelism Supercomputing 20082 Education Program 1! 12/12/11! CPU vs. GPU - Hardware • More transistors devoted to data processing CUDA programming guide 3.1 3 CPU vs. GPU – Computation Power CUDA programming guide 3.1! 2! 12/12/11! CPU vs. GPU – Memory Bandwidth CUDA programming guide 3.1! What is GPGPU ? • General Purpose computation using GPU in applications other than 3D graphics – GPU accelerates critical path of application • Data parallel algorithms leverage GPU attributes – Large data arrays, streaming throughput – Fine-grain SIMD parallelism – Low-latency floating point (FP) computation © David Kirk/NVIDIA and Wen-mei W. Hwu, 2007! ECE 498AL, University of Illinois, Urbana-Champaign! 3! 12/12/11! Why is GPGPU? • Large number of cores – – 100-1000 cores in a single card • Low cost – less than $100-$1500 • Green computing – Low power consumption – 135 watts/card – 135 w vs 30000 w (300 watts * 100) • 1 card can perform > 100 desktops 12/14/09!– $750 vs 50000 ($500 * 100) 7 Two major players 4! 12/12/11! Parallel Computing on a GPU • NVIDIA GPU Computing Architecture – Via a HW device interface – In laptops, desktops, workstations, servers • Tesla T10 1070 from 1-4 TFLOPS • AMD/ATI 5970 x2 3200 cores • NVIDIA Tegra is an all-in-one (system-on-a-chip) ATI 4850! processor architecture derived from the ARM family • GPU parallelism is better than Moore’s law, more doubling every year • GPGPU is a GPU that allows user to process both graphics and non-graphics applications. -
Computer Organization and Architecture Designing for Performance Ninth Edition
COMPUTER ORGANIZATION AND ARCHITECTURE DESIGNING FOR PERFORMANCE NINTH EDITION William Stallings Boston Columbus Indianapolis New York San Francisco Upper Saddle River Amsterdam Cape Town Dubai London Madrid Milan Munich Paris Montréal Toronto Delhi Mexico City São Paulo Sydney Hong Kong Seoul Singapore Taipei Tokyo Editorial Director: Marcia Horton Designer: Bruce Kenselaar Executive Editor: Tracy Dunkelberger Manager, Visual Research: Karen Sanatar Associate Editor: Carole Snyder Manager, Rights and Permissions: Mike Joyce Director of Marketing: Patrice Jones Text Permission Coordinator: Jen Roach Marketing Manager: Yez Alayan Cover Art: Charles Bowman/Robert Harding Marketing Coordinator: Kathryn Ferranti Lead Media Project Manager: Daniel Sandin Marketing Assistant: Emma Snider Full-Service Project Management: Shiny Rajesh/ Director of Production: Vince O’Brien Integra Software Services Pvt. Ltd. Managing Editor: Jeff Holcomb Composition: Integra Software Services Pvt. Ltd. Production Project Manager: Kayla Smith-Tarbox Printer/Binder: Edward Brothers Production Editor: Pat Brown Cover Printer: Lehigh-Phoenix Color/Hagerstown Manufacturing Buyer: Pat Brown Text Font: Times Ten-Roman Creative Director: Jayne Conte Credits: Figure 2.14: reprinted with permission from The Computer Language Company, Inc. Figure 17.10: Buyya, Rajkumar, High-Performance Cluster Computing: Architectures and Systems, Vol I, 1st edition, ©1999. Reprinted and Electronically reproduced by permission of Pearson Education, Inc. Upper Saddle River, New Jersey, Figure 17.11: Reprinted with permission from Ethernet Alliance. Credits and acknowledgments borrowed from other sources and reproduced, with permission, in this textbook appear on the appropriate page within text. Copyright © 2013, 2010, 2006 by Pearson Education, Inc., publishing as Prentice Hall. All rights reserved. Manufactured in the United States of America. -
System-On-A-Chip (Soc) & ARM Architecture
System-on-a-Chip (SoC) & ARM Architecture EE2222 Computer Interfacing and Microprocessors Partially based on System-on-Chip Design by Hao Zheng 2020 EE2222 1 Overview • A system-on-a-chip (SoC): • a computing system on a single silicon substrate that integrates both hardware and software. • Hardware packages all necessary electronics for a particular application. • which implemented by SW running on HW. • Aim for low power and low cost. • Also more reliable than multi-component systems. 2020 EE2222 2 Driven by semiconductor advances 2020 EE2222 3 Basic SoC Model 2020 EE2222 4 2020 EE2222 5 SoC vs Processors System on a chip Processors on a chip processor multiple, simple, heterogeneous few, complex, homogeneous cache one level, small 2-3 levels, extensive memory embedded, on chip very large, off chip functionality special purpose general purpose interconnect wide, high bandwidth often through cache power, cost both low both high operation largely stand-alone need other chips 2020 EE2222 6 Embedded Systems • 98% processors sold annually are used in embedded applications. 2020 EE2222 7 Embedded Systems: Design Challenges • Power/energy efficient: • mobile & battery powered • Highly reliable: • Extreme environment (e.g. temperature) • Real-time operations: • predictable performance • Highly complex • A modern automobile with 55 electronic control units • Tightly coupled Software & Hardware • Rapid development at low price 2020 EE2222 8 EECS222A: SoC Description and Modeling Lecture 1 Design Complexity Challenge Design• Productivity Complexity -
Lecture 1: Course Introduction G Course Organization G Historical Overview G Computer Organization G Why the MC68000? G Why Assembly Language?
Lecture 1: Course introduction g Course organization g Historical overview g Computer organization g Why the MC68000? g Why assembly language? Microprocessor-based System Design 1 Ricardo Gutierrez-Osuna Wright State University Course organization g Grading Instructor n Exams Ricardo Gutierrez-Osuna g 1 midterm and 1 final Office: 401 Russ n Homework Tel:775-5120 g 4 problem sets (not graded) [email protected] n Quizzes http://www.cs.wright.edu/~rgutier g Biweekly Office hours: TBA n Laboratories g 5 Labs Teaching Assistant g Grading scheme Mohammed Tabrez Office: 339 Russ [email protected] Weight (%) Office hours: TBA Quizes 20 Laboratory 40 Midterm 20 Final Exam 20 Microprocessor-based System Design 2 Ricardo Gutierrez-Osuna Wright State University Course outline g Module I: Programming (8 lectures) g MC68000 architecture (2) g Assembly language (5) n Instruction and addressing modes (2) n Program control (1) n Subroutines (2) g C language (1) g Module II: Peripherals (9) g Exception processing (1) g Devices (6) n PI/T timer (2) n PI/T parallel port (2) n DUART serial port (1) g Memory and I/O interface (1) g Address decoding (2) Microprocessor-based System Design 3 Ricardo Gutierrez-Osuna Wright State University Brief history of computers GENERATION FEATURES MILESTONES YEAR NOTES Asia Minor, Abacus 3000BC Only replaced by paper and pencil Mech., Blaise Pascal, Pascaline 1642 Decimal addition (8 decimal figs) Early machines Electro- Charles Babbage Differential Engine 1823 Steam powered (3000BC-1945) mech. Herman Hollerith, -
The Birth, Evolution and Future of Microprocessor
The Birth, Evolution and Future of Microprocessor Swetha Kogatam Computer Science Department San Jose State University San Jose, CA 95192 408-924-1000 [email protected] ABSTRACT timed sequence through the bus system to output devices such as The world's first microprocessor, the 4004, was co-developed by CRT Screens, networks, or printers. In some cases, the terms Busicom, a Japanese manufacturer of calculators, and Intel, a U.S. 'CPU' and 'microprocessor' are used interchangeably to denote the manufacturer of semiconductors. The basic architecture of 4004 same device. was developed in August 1969; a concrete plan for the 4004 The different ways in which microprocessors are categorized are: system was finalized in December 1969; and the first microprocessor was successfully developed in March 1971. a) CISC (Complex Instruction Set Computers) Microprocessors, which became the "technology to open up a new b) RISC (Reduced Instruction Set Computers) era," brought two outstanding impacts, "power of intelligence" and "power of computing". First, microprocessors opened up a new a) VLIW(Very Long Instruction Word Computers) "era of programming" through replacing with software, the b) Super scalar processors hardwired logic based on IC's of the former "era of logic". At the same time, microprocessors allowed young engineers access to "power of computing" for the creative development of personal 2. BIRTH OF THE MICROPROCESSOR computers and computer games, which in turn led to growth in the In 1970, Intel introduced the first dynamic RAM, which increased software industry, and paved the way to the development of high- IC memory by a factor of four. -
Comparative Study of Various Systems on Chips Embedded in Mobile Devices
Innovative Systems Design and Engineering www.iiste.org ISSN 2222-1727 (Paper) ISSN 2222-2871 (Online) Vol.4, No.7, 2013 - National Conference on Emerging Trends in Electrical, Instrumentation & Communication Engineering Comparative Study of Various Systems on Chips Embedded in Mobile Devices Deepti Bansal(Assistant Professor) BVCOE, New Delhi Tel N: +919711341624 Email: [email protected] ABSTRACT Systems-on-chips (SoCs) are the latest incarnation of very large scale integration (VLSI) technology. A single integrated circuit can contain over 100 million transistors. Harnessing all this computing power requires designers to move beyond logic design into computer architecture, meet real-time deadlines, ensure low-power operation, and so on. These opportunities and challenges make SoC design an important field of research. So in the paper we will try to focus on the various aspects of SOC and the applications offered by it. Also the different parameters to be checked for functional verification like integration and complexity are described in brief. We will focus mainly on the applications of system on chip in mobile devices and then we will compare various mobile vendors in terms of different parameters like cost, memory, features, weight, and battery life, audio and video applications. A brief discussion on the upcoming technologies in SoC used in smart phones as announced by Intel, Microsoft, Texas etc. is also taken up. Keywords: System on Chip, Core Frame Architecture, Arm Processors, Smartphone. 1. Introduction: What Is SoC? We first need to define system-on-chip (SoC). A SoC is a complex integrated circuit that implements most or all of the functions of a complete electronic system. -
Organising Committees
DATE 2005 Executive Committee GENERAL CHAIR PROGRAMME CHAIR Nobert Wehn Luca Benini Kaiserslautern U, DE DEIS – Bologna U, IT VICE CHAIR & PAST PROG. CHAIR VICE PROGRAMME CHAIR Georges Gielen Donatella Sciuto KU Leuven, BE Politecnico di Milano, IT FINANCE CHAIR PAST GENERAL CHAIR Rudy Lauwereins Joan Figueras IMEC, Leuven, BE UP Catalunya, Barcelona, ES DESIGNERS’ FORUM DESIGNERS’ FORUM Menno Lindwer Christoph Heer Philips, Eindhoven, NL Infineon, Munich, DE SPECIAL SESSIONS & DATE REP AT DAC FRIDAY WORKSHOPS Ahmed Jerraya Bashir Al-Hashimi TIMA, Grenoble, FR Southampton U, UK INTERACTIVE PRESENTATIONS ELECTRONIC REVIEW Eugenio Villar Wolfgang Mueller Cantabria U, ES Paderborn U, DE WEB MASTER AUDIO VISUAL Udo Kebschull Jaume Segura Heidelberg U, DE Illes Baleares U, ES TUTORIALS & MASTER COURSES FRINGE MEETINGS Enrico Macii Michel Renovell Politecnico di Torino, IT LIRMM, Montpellier, FR AUTOMOTIVE DAY BIOCHIPS DAY Juergen Bortolazzi Christian Paulus DaimlerChrysler, DE Infineon, Munich, DE PROCEEDINGS EXHIBITION PROGRAMME Christophe Bobda Juergen Haase Erlangen U, DE edacentrum, Hannover, DE UNIVERSITY BOOTH UNIVERSITY BOOTH & ICCAD Volker Schoeber REPRESENTATIVE edacentrum, Hannover, DE Wolfgang Rosenstiel Tuebingen U/FZI, DE AWARDS & DATE REP. AT ASPDAC PCB SYMPOSIUM Peter Marwedel Rainer Asfalg Dortmund U, DE Mentor Graphics, DE TRAVEL GRANTS COMMUNICATIONS Marta Rencz Bernard Courtois TU Budapest, HU TIMA, Grenoble, FR LOCAL ARRANGEMENTS PRESS LIASON Volker Dueppe Fred Santamaria Siemens, DE Infotest, Paris, FR ESF CHAIR & EDAA -
Network on Chip for FPGA Development of a Test System for Network on Chip
Network on Chip for FPGA Development of a test system for Network on Chip Magnus Krokum Namork Master of Science in Electronics Submission date: June 2011 Supervisor: Kjetil Svarstad, IET Norwegian University of Science and Technology Department of Electronics and Telecommunications Problem Description This assignment is a continuation of the project-assignment of fall 2010, where it was looked into the development of reactive modules for application-test and profiling of the Network on Chip realization. It will especially be focused on the further development of: • The programmability of the system by developing functionality for more advanced surveillance of the communication between modules and routers • Framework that will be used to test and profile entire applications on the Network on Chip The work will primarily be directed towards testing and running the system in a way that resembles a real system at run time. The work is to be compared with relevant research within similar work. Assignment given: January 2011 Supervisor: Kjetil Svarstad, IET i Abstract Testing and verification of digital systems is an essential part of product develop- ment. The Network on Chip (NoC), as a new paradigm within interconnections; has a specific need for testing. This is to determine how performance and prop- erties of the NoC are compared to the requirements of different systems such as processors or media applications. A NoC has been developed within the AHEAD project to form a basis for a reconfigurable platform used in the AHEAD system. This report gives an outline of the project to develop testing and benchmarking systems for a NoC. -
Exhibition Report
Exhibition Report Japan Electronics and Information Technology Industries Association (JEITA) Contents Exhibition Outline 1 Exhibition Configuration 2 1. Scope of Exhibits 2 2. Conference 2 3. Number of Exhibitors and Booths 2 4. Suite Exhibits 2 5. Exhibitors 3 Conference Activities 4 1. Exhibitor Seminars 4 2. Keynote Speech 4 3. Special Event Stage 4 4. The 13th FPGA/PLD Design Conference 4 5. FPGA/PLD Design Conference User’s Presentations 4 6. IP(Intellectual Property) Flea Market in EDSFair 4 7. System Design Forum 2006 Conference 4 Other Events and Special Projects 5 1. Opening Ceremony 5 2. University Plaza 5 3. Venture Conpany Pavilion 5 4. EDAC Reception 5 5. Press 5 Number of Visitors 6 Results of Visitor Questionnaire 6-7 Exhibition Outline Name . Electronic Design and Solution Fair 2006 (EDSFair2006) Duration . Thursday, January 26 and Friday, January 27, 2006 (2 days) 10:00 a.m. to 6:00 p.m. Location . Pacifico Yokohama (Halls C-D hall and Annex Hall) 1-1-1 Minato Mirai, Nishi-ku, Yokohama 220-0012, Japan Admission. Exhibition: Free (registration required at show entrance) Conference: Fees charged for some sessions Sponsorship . Japan Electronics and Information Technology Industries Association (JEITA) Cooperation . Electronic Design Automation Consortium (EDAC) Support . Ministry of the Economy, Trade and Industry, Japan (METI) Embassy of the United States of America in Japan Distributors Association of Foreign Semiconductors (DAFS) City of Yokohama Assistance . Institute of Electronics, Information and Communication Engineers (IEICE) Information Processing Society of Japan (IPSJ) Japan Printed Circuit Association (JPCA) Spacial Assistance. Hewlett-Packard Japan, Ltd. Sun Microsystems K.K Management . -
Embedded Networks on Chip for Field-Programmable Gate Arrays by Mohamed Saied Abdelfattah a Thesis Submitted in Conformity With
Embedded Networks on Chip for Field-Programmable Gate Arrays by Mohamed Saied Abdelfattah A thesis submitted in conformity with the requirements for the degree of Doctor of Philosophy Graduate Department of Electrical and Computer Engineering University of Toronto © Copyright 2016 by Mohamed Saied Abdelfattah Abstract Embedded Networks on Chip for Field-Programmable Gate Arrays Mohamed Saied Abdelfattah Doctor of Philosophy Graduate Department of Electrical and Computer Engineering University of Toronto 2016 Modern field-programmable gate arrays (FPGAs) have a large capacity and a myriad of embedded blocks for computation, memory and I/O interfacing. This allows the implementation of ever-larger applications; however, the increase in application size comes with an inevitable increase in complexity, making it a challenge to implement on-chip communication. Today, it is a designer's burden to create a customized communication circuit to interconnect an application, using the fine-grained FPGA fab- ric that has single-bit control over every wire segment and logic cell. Instead, we propose embedding a network-on-chip (NoC) to implement system-level communication on FPGAs. A prefabricated NoC improves communication efficiency, eases timing closure, and abstracts system-level communication on FPGAs, separating an application's behaviour and communication which makes the design of complex FPGA applications easier and faster. This thesis presents a complete embedded NoC solution, includ- ing the NoC architecture and interface, rules to guide its use with FPGA design styles, application case studies to showcase its advantages, and a computer-aided design (CAD) system to automatically interconnect applications using an embedded NoC. We compare NoC components when implemented hard versus soft, then build on this component-level analysis to architect embedded NoCs and integrate them into the FPGA fabric; these NoCs are on average 20{23× smaller and 5{6× faster than soft NoCs.