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UNIT CONVERSION FACTORS Temperature K C 273 C 1.8(F 32 Source: FUNDAMENTALS OF MICROSYSTEMS PACKAGING UNIT CONVERSION FACTORS Temperature K ϭ ЊC ϩ 273 ЊC ϭ 1.8(ЊF Ϫ 32) ЊR ϭ ЊF ϩ 460 Length 1 m ϭ 1010 A˚ ϭ 3.28 ft ϭ 39.4 in Mass 1 kg ϭ 2.2 lbm Force 1 N ϭ 1 kg-m/s2 ϭ 0.225 lbf Pressure (stress) 1 P ϭ 1 N/m2 ϭ 1.45 ϫ 10Ϫ4 psi Energy 1 J ϭ 1W-sϭ 1 N-m ϭ 1V-C 1Jϭ 0.239 cal ϭ 6.24 ϫ 1018 eV Current 1 A ϭ 1 C/s ϭ 1V/⍀ CONSTANTS Avogadro’s Number 6.02 ϫ 1023 moleϪ1 Gas Constant, R 8.314 J/(mole-K) Boltzmann’s constant, k 8.62 ϫ 10Ϫ5 eV/K Planck’s constant, h 6.63 ϫ 10Ϫ33 J-s Speed of light in a vacuum, c 3 ϫ 108 m/s Electron charge, q 1.6 ϫ 10Ϫ18 C SI PREFIXES giga, G 109 mega, M 106 kilo, k 103 centi, c 10Ϫ2 milli, m 10Ϫ3 micro, ␮ 10Ϫ6 nano, n 10Ϫ9 Downloaded from Digital Engineering Library @ McGraw-Hill (www.digitalengineeringlibrary.com) Copyright © 2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website. Source: FUNDAMENTALS OF MICROSYSTEMS PACKAGING CHAPTER 1 INTRODUCTION TO MICROSYSTEMS PACKAGING Prof. Rao R. Tummala Georgia Institute of Technology ................................................................................................................. Design Environment IC Thermal Management Packaging Single Materials Chip Opto and RF Functions Discrete Passives Encapsulation IC Reliability IC Assembly Inspection PWB MEMS Board Manufacturing Assembly Test Downloaded from Digital Engineering Library @ McGraw-Hill (www.digitalengineeringlibrary.com) Copyright © 2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website. INTRODUCTION TO MICROSYSTEMS PACKAGING ................................................................................................................. 1.1 What Are Microsystems? 1.2 Microsystem Technologies 1.3 What Is Microsystems Packaging (MSP)? 1.4 Why Is Microsystems Packaging Important? 1.5 System-Level Microsystems Technologies 1.6 What is Expected of You as a Microsystems Engineer? 1.7 Summary and Future Trends 1.8 Who Invented Microsystems and Packaging Technologies? 1.9 Homework Problems 1.10 Suggested Reading CHAPTER OBJECTIVES Ⅲ Introduce the concept of Microsystems Ⅲ Present Microsystems building block technologies to contain Microelectronics, Photonics, MEMS, and RF/Wireless Ⅲ Describe the role of Packaging as IC and Device Packaging, and Microsystems Packaging Ⅲ Describe Systems Packaging to go from wafer to complete system Ⅲ Describe the role of electrical, mechanical and materials in Systems Packaging CHAPTER INTRODUCTION Microsystems and the technologies they constitute are the building blocks of information technology. These systems require a set of fundamental technologies that include not only microelectronics but also photonics, MEMS, RF and wireless. For these functions to be integrated into systems, they have to be designed, fabricated, tested, cooled and reliability assured. In other words, they have to be system-packaged. This book is about Systems Packaging. 3 Downloaded from Digital Engineering Library @ McGraw-Hill (www.digitalengineeringlibrary.com) Copyright © 2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website. INTRODUCTION TO MICROSYSTEMS PACKAGING 4 FUNDAMENTALS OF MICROSYSTEMS PACKAGING 1.1 WHAT ARE MICROSYSTEMS? Imagine a world without personal computers, cell phones, fax machines, camcorders, stereos, microwave ovens, calculators and all the other electronic products. Now imagine what is coming. Microsystems will impact many areas of life. These systems include voice controlled computers, electronic notepads and work surfaces, electronic newspapers on flat panel displays which can be rolled or folded, small mobile x-ray and diagnostic tools, micromedical implants, videophones in watches and wireless Internet access any- time anywhere. The technologies behind all these and millions of other electronic prod- ucts in automotive, consumer, telecommunication, computer, aerospace, and medical industries are all based on microdevices and packaging technologies. They touch every aspect of human life with the potential to bring everyone around the globe into the digital age. 1.1.1 Microsystem Products Microsystems are microminiaturized and integrated systems based on microelectronics, photonics, RF, micro-electro-mechanical systems (MEMS) and packaging technologies. These new systems, and technologies as illustrated in Figure 1.1 and Figure 1.2, provide a variety of integrated functions that include consumer, computing, communications, automobile, sensing and micromechanical functions to serve a variety of human needs. Visions for future products cover all areas of life such as smart watches with integrated phone and video, wearable computers, multifunctional global phones, and micro minia- turized medical implants. Many futuristic devices are becoming feasible, or have already been partly realized, based on the miniaturization in microsystem technologies, leading to electronics with larger memory capacities, higher computing speeds with lower energy consumption batteries, and finally, to more powerful data networks and improved data Computers Hand-held Devices Communications Consumer MICROSYSTEMS Electronics Space Biomedical USA Applications Applications FIGURE 1.1 Microsystem products. Downloaded from Digital Engineering Library @ McGraw-Hill (www.digitalengineeringlibrary.com) Copyright © 2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website. INTRODUCTION TO MICROSYSTEMS PACKAGING Chapter 1 Introduction to Microsystems Packaging 5 ms Engine ste erin Sy g S y g s n Microelectronics t i e r m e ice Packa ev gin e D g s n E i g n n MEMS Microsystem Photonics g i E Technologies n e s S e m y st ng r e i i e m ag s Pack n t g s y S RF/Wireless S y g s n t i e r m e e s n i E g n FIGURE 1.2 Microsystem technologies. compression processes. Microsystem components also play an increasingly important role. Table 1.1 gives some of the trends in microsystems products. 1.2 MICROSYSTEM TECHNOLOGIES The fundamental building block technologies behind all the electronic products, whether that product is a PC, a DVD player, a cell phone or an airbag in your car, are four technology waves: Microelectronics, RF/wireless, Photonics and MEMS. A fifth wave, consisting of Systems Packaging that integrates and engineers all these into products, is depicted in Figure 1.3. 1.2.1 Microelectronics: The First Technology Wave Microelectronics is the first and most important technology wave. It started with the invention of the transistor. The three discoveries that made this possible were: 1. The invention of the transistor in 1949 by Brattain, Bardeen and Shockley at Bell Labs 2. The development of planar transistor technology by Bob Noyce in 1959 Downloaded from Digital Engineering Library @ McGraw-Hill (www.digitalengineeringlibrary.com) Copyright © 2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website. INTRODUCTION TO MICROSYSTEMS PACKAGING 6 FUNDAMENTALS OF MICROSYSTEMS PACKAGING TABLE 1.1 Trends in microsystems equipment. Electronic Product Trend Consumer Analog to digital TV/PC merge Network of music and video Interactive communication (Merge of PC with phone) Analog to digital audio (CD-ROM, MD, MP-3, etc.) Video to digital disk (DVD) LAN (Electrical→Optical→Wireless) Smart watch with integrated video and phone Smart clothes House sensors Wearable computer Communication From voice to data exchange Mobile phone (analog to digital) Electrical cable to optical fiber Multi-functional phone, global phone Automobile Navigation system Auto pilot Integrated electronics control (Air bag, anti-skid brake, automatic transmission, etc.) Collision warning system Information and traffic control systems Computers PC to networking system Multi-functional mobile equipment from Desktop →Notebook→Palmtop Infrastructure Big capacity, high speed server High bandwidth, wireless Internet access Analog to digital equipment Medical Mobile X-ray Diagnostic tools Miniaturized implants Pumping and injection systems Drug-screener Microinstruments for endoscopic neurosurgery 3. The first integrated circuit (IC), which incorporated two transistors and a resistor, (Figure 1.4) developed by Jack Kilby in 1959. Their combined discoveries earned them Nobel Prizes in 1972 and in 2000. The transistor is the single most important fundamental building block of all modern electronics. Microelectronics acts as the fundamental base of more than 90% of all microsystems products. Figure 1.5 illustrates the famous Moore’s Law. In 1965, three years before he co-founded Intel with Bob Noyce, Gordon Moore published an article in Electronics magazine that turned out to be uncannily prophetic. Moore wrote that the number of circuits on a silicon chip would keep doubling every year. He Downloaded from Digital Engineering Library @ McGraw-Hill (www.digitalengineeringlibrary.com) Copyright © 2004 The McGraw-Hill Companies. All rights reserved. Any use is subject to the Terms of Use as given at the website. INTRODUCTION TO MICROSYSTEMS PACKAGING Chapter 1 Introduction to Microsystems Packaging 7 FIGURE 1.3 Building block technologies of the Medical information age. Telecom Aerospace Computer Consumer USA Automotive lay Disp agneti M c Sto Battery rage Software, Applications, Services Microelectronics Photonics RF/Wireless MEMS MICROSYSTEMS PACKAGING later revised this to every 18–24 months, a forecast
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