WELCOME TO THE 71st ECTC FROM THE GENERAL CHAIR AND PROGRAM CHAIR

On behalf of the Program Committee and Executive ECTC will also feature a record twelve special sessions with Committee, it is our pleasure to welcome you to the 71st invited industry experts covering several important and Electronic Components and Technology Conference (ECTC), emerging topic areas. Rozalia Beica and Ed Sperling will chair which will be held virtually on a digital platform from June 1 a special session covering “Market Trends and Geopolitical until July 4, 2021. This premier international conference brings and Economic Outlook” addressing market trends in the together key stakeholders of the global microelectronics semiconductor industry, emerging applications, economic and packaging industry, such as semiconductor companies, foundry geopolitical uncertainties, and impact on the global supply chain and OSAT service providers, equipment manufacturers, in microelectronics packaging. The ECTC Panel Session will be materials suppliers, research institutions and universities all chaired by IEEE EPS President Christopher Bailey and IEEE EPS under one roof. Vice President of Conferences Sam Karikalan. This panel session The virtual platform will allow for recorded presentations of all will hear from several leading companies who will discuss their technical session talks to be available on-demand throughout future vision for advanced electronics packaging. the conference. During the last two weeks of the conference, We are continuing our tradition and bringing back the a live teleconferencing meeting for each session will be held networking events focused on young professionals and diversity. by the session chairs; all the presenters of the session will be Yan Liu and Adeel Bajwa will chair the Young Professionals available live to field questions from the attendees. The special Virtual Meetup. This is a great networking opportunity for sessions will be held in a slightly different manner. Special young engineers, researchers, and students, to meet senior sessions will be held live during the first two weeks of the EPS members and professionals, learn more about industry conference. Each panelist will pre-record their talks for the activities, receive career guidance, and engage through a series session; these talks will be broadcast live which will be followed of activities. The ECTC Diversity Panel – started a few years immediately by the live panel discussion during which attendees ago as a women-focused panel – has now evolved into a will be able to ask questions. The special sessions will be Diversity and Career focused Panel. The panel, chaired by recorded and be made available for on-demand streaming from Allyson Hartzell and Kitty Pearsall, will have a focus on the the date of the session until the end of the conference. correlation between diversity in workplace and enhanced business performance. This year’s ECTC Plenary Session For the 71st ECTC, the ECTC Program Committee has entitled, “Transformation of the Electronics Industry in a Post- selected over 350 papers which will be presented in 46 Covid World,” will be chaired by Jan Vardaman, Kimberly technical sessions including one session exclusively featuring Yess, and Mark Poliks. In this plenary session, experts will papers by student authors. The technical sessions will feature address the evolution and challenges of our industry in light selected papers on key topics and industry trends, from of the pandemic, and expectations that will drive packaging wirebonding, wafer- and panel-level packaging, flip chip, 2.5D developments in the future. Our colleagues from Japan, and 3D integration, to advanced substrates and interposers, Yasumitsu Orii and Shigenori Aoki, will be chairing the IEEE embedded technologies, system in package and heterogeneous EPS Seminar entitled, “Latency: Are High-Bandwidth Optical integration. Networks a Silver Bullet?” The seminar will focus on the Authors from over twenty five countries are expected to permissible latency in certain systems, and how high-bandwidth present their work at the 71st ECTC, covering ongoing optical networks are critically important for satisfying latency technology development within established disciplines or requirements. emerging topics of interest for our industry such as mobile, Following the industry trends and a growing interest in 5G, medical wearables and automotive applications including photonics, ECTC 2021 will feature a special session titled autonomous driving, flexible and printed electronics, to “Pathogen Detection and Eradication” to be chaired by Chris high-speed communications, wireless, Li-Fi, photonics, high- Bower and Mark Beranek. In this ECTC Special Session, a performance and quantum computing, and artificial intelligence panel of experts will provide their perspectives on the studies (AI) hardware. and technological improvements needed for safely detecting Sam Naffziger, Senior Vice President of AMD, will deliver the and eradicating pathogens on surfaces and spaces. A reliability- first keynote speech entitled, “What the Chiplet-Based Future focused ECTC Special Session entitled “Low Temperature of Compute Means for Components and Technology.” The Solder (LTS) – Packaging Challenges of a Next-Generation SMT second keynote speech entitled “Transitioning to a Renewable Interconnect” will be chaired by Kevin Byrd and Keith Newman. Energy-Based Grid,” will be delivered by Pedro Arsuaga, the This session will highlight LTS research areas most critical to Renewable Energy Business Program Manager at GE Research. component suppliers to improve compatibility with surface Additionally, a half-day workshop on Heterogeneous Integration mount technology (SMT) LTS processing and to enhance solder Roadmap, chaired by Bill Chen and Bill Bottoms, will be held. joint reliability.

2 Kotlanka Rama Krishna and Ahyeon Koh will chair an ECTC Supplementing the technical program, ECTC also offers Special Session entitled “Home Use Medical Devices and Professional Development Courses (PDCs). The 71st ECTC Packaging in Wearable Technologies.” This session will focus will offer fourteen PDCs, organized by the PDC Committee chaired by Kitty Pearsall and Jeffrey Suhling. on some of the challenges associated with packaging sensors Whether you are an engineer, a manager, a student, or a and the electronic signal chain into these emerging, at-home business and marketing professional or an executive, ECTC clinical-grade wearables. The fourth ECTC Special Session has offers something unique for everyone in the microelectronics the title “Materials and Technologies for Advanced Packaging packaging and components industry. We invite you to make (5G, RF, Power, Harsh environment),” and will be chaired by your plans now to join us and to be a part of all the exciting Karsten Meier and Przemyslaw Gromala. The ECTC Special technical and professional opportunities offered at this event. We would also like to take this opportunity to thank our Session “Rising to the Chiplet Challenge” will be chaired by sponsors, exhibitors, authors, speakers, PDC instructors, Kanad Ghose and Dale Becker. Finally, Dave Armstrong and session chairs, and program committee members, as well as all Robert Patti will chair the ECTC Special Session entitled “Test the volunteers who help make the 71st ECTC a success. We in Heterogeneous Integration.” look forward to virtually meeting all of you on June 1, 2021.

Nancy Stoffel Ibrahim Guven 71st ECTC General Chair 71st ECTC Program Chair General Electric Research Center Virginia Commonwealth University [email protected] [email protected]

WELCOME FROM ECTC SPONSORING ORGANIZATION

On behalf of the IEEE Electronics EPS Board of Governors, volunteers from the EPS Society, and Packaging Society, I am delighted to the ECTC and EPS staff for their outstanding efforts in bringing welcome you to the 71st Electronic you this year’s exciting event. We are fortunate to have such Components and Technology an enthusiastic team that keeps finding new ways to serve the Conference – the world’s premier electronic packaging community. event for electronics packaging. May I also thank our authors, presenters, and sponsors for their Starting 71 years ago, ECTC continues contributions to this year’s event. It is very rewarding to see to grow, innovate, and serve our the significant benefits that events such as ECTC have on the community with an exciting technical Electronics Packaging Society, our industry, and our members. program detailing the latest advances in electronics packaging. Building upon the outstanding event In addition to conferences, EPS has been implementing its from last year, we expect attendance at ECTC 2021 to exciting plans for membership, chapters, publications, education, well exceed 2,000 packaging professionals. This is a fantastic and technology to provide a unique service to our members achievement. Our conference portfolio continues to find worldwide. You can find more information about these activities innovative ways to grow and serve our community. Together at the EPS website. with ECTC and our Asia-Pacific flagship conference EPTC, to be Finally, may I thank you for attending this year’s ECTC. Enjoy held in December, EPS expects to reach over 7,000 conference the conference, and I look forward to meeting you again at one attendees world-wide in 2021. of our future events. These achievements would not be possible without the dedication and commitment of our conference organisers and volunteers. I would like to express my sincere thanks to the Christopher Bailey ECTC Executive and Program Committees, members of the EPS President 2020-2021

3 THE THIN FILM POWERHOUSE

WANT TO GET AHEAD IN ADVANCED PACKAGING?

Evatec delivers production tools and processes for wafer and panel scale technologies. Take a look at the results we deliver.

WLCSP & Fanout Heterogenous Advanced (WLP & PLP) Integration IC Substrates

ƒ Excellent interface performance ƒ TSV, TGV metallization processes ƒ RIE for descum and adhesion with lowest Rc for 2.5/3D applications promotion and DRIE for next ƒ Lowest CoO for UBM/RDL seed ƒ Backside metallization solutions generation vertical interconnects layer processes for WLP and for HPC applications on thin or ƒ UBM/RDL seed layer processes PLP applications molded substrates for next generation laminated ƒ Solutions for 200/300mm WLP ƒ Excellent step coverage for micro and glass substrates and PLP up to 650x650mm via applications ƒ Excellent adhesion on ABF and PI with lowest Rc performance for fine line designs

Substrate drawings source: Status of the Advanced Packaging Industry report, Yole Développement, 2020

Evatec AG, Hauptstrasse 1a, CH-9477 Trübbach, Switzerland www.evatecnet.com Telephone: +41 81 403 8000

4 Keynote Week 1 Keynote Week 2 What the Chiplet-Based Future of Compute Transitioning to a Renewable Means for Components and Technology Energy-Based Grid

Sam Naffziger – AMD, Senior Vice President, Corporate Pedro Arsuaga – GE Research, Renewable Energy Business Fellow, and Produce Technology Architect Program Manager Chiplet architecture is now becoming After the Paris Agreement was adopted mainstream, and recognized as and ratified by the overwhelming majority fundamental to enabling the continued of member states, most nations are taking economically viable growth of power actions to reduce their carbon footprint. efficient computing. We will cover the In the area of power generation, this benefits of these approaches in enabling means that a very significant transition is lower costs from smaller die combined taking place from fossil fuel based power with modularity to scale performance and configuration, generation to renewable energy based power generation. taking examples from industry products. The costs of This energy transition is shaking the foundation of how splitting and modularizing an SOC into chiplets will be the grid was created and has been operating for the last discussed, which include the high-bandwidth and low-latency century, as both wind and solar technologies connect to the communication requirements between die, overheads of grid using power electronics. In addition, the exponential testing and power-managing what used to be individual growth of distributed energy resources and electric vehicles, SOC modules as standalone chips, and engineering the drives the need for increased visualization and control package substrate to provide routing and power delivery of these resources, in order to keep a reliable energy resources for the complex integration. Today’s solutions supply. In this session we will discuss the role that digital will be evaluated in the context of what will be required technologies, power electronics and controls will play in the from packaging and silicon technologies over the next energy transition. decade to achieve the true potential of chiplet architecture.

TABLE OF CONTENTS

Keynote Week 1 ...... 5 IEEE EPS Transaction Awards ...... 10

Keynote Week 2 ...... 5 EPS Student Travel Awards ...... 11

Heterogeneous Integration Roadmap Workshop ...... 6 ECTC Volunteer Awards ...... 11 ECTC Best Paper Awards ...... 11 ECTC Plenary ...... 6 Technical Sessions 1 - 46 ...... 12 & 13 ECTC Diversity Panel ...... 6 Virtual Exhibition ...... 15 IEEE EPS President’s Panel ...... 6 ECTC Executive Committee ...... 16 ECTC Young Professionals Meetup ...... 6 ECTC Program Committee ...... 16 - 18 ECTC Special Sessions ...... 6 & 7 72nd Call for Papers ...... 19

IEEE EPS Seminar ...... 7 Conference Sponsors ...... 21 & 22

Professional Development Courses ...... 9 Media Sponsors ...... 22

IEEE EPS Major Awards ...... 10 Registration ...... 23

Conference organizers reserve the right to cancel or change this program without prior notice.

5 SPECIAL SESSIONS

HETEROGENEOUS INTEGRATION ROADMAP WORKSHOP 2021 ECTC PLENARY SESSION Chairs: Bill Chen - ASE Transformation of the Electronics Industry and Bill Bottoms - 3MTS in a Post-Covid World Heterogeneous Integration uses packaging technology Chairs: E. Jan Vardaman – TechSearch International, to integrate dissimilar chips, devices or components Inc., Mark D. Poliks – Binghamton University, and with different materials and functions, and from different Kimberly Yess – Brewer Science, Inc. fabless design houses, foundries, wafer materials, feature sizes and companies into a system or subsystem. 23 Panelists: Technical working groups will present on their areas Jie Xue, Cisco Systems, Inc. of expertise. This workshop is a half-day pre-recorded event with a planned follow-up live Q/A session. Rama Divakaruni, IBM Corporation Workshop Segments: Thorsten Meyer, Infineon 1. Overview – Bill Chen and Bill Bottoms: Ram Trichur, Henkel Heterogeneous Integration Is the Future Yadunath Zambre, Air Force Research Laboratory 2. Moderator - Bill Bottoms: High Performance Computing & Data Centers; 2D-3D & Interconnect; David Davenport, General Electric Research Thermal Management; Integrated Photonics; Test & Craig Orr, Samsung Foundry USA Cyber Security 3. Moderator - Tom Salmon, SEMI: Automotive; MEMS & Sensors Integration; SiP & Module; Supply Chain; Integrated Power Electronics 4. Moderator - Ravi Mahajan, Intel Corporation: 5G & Future Communications; WLP (Fan-In & Fan-Out); Aerospace & Defense; Mobile; Materials & Emerging Research Materials; IoT 5. Moderator - Amr Helmy, U. Toronto: Medical, Health & Wearables; Emerging Research Devices; Single Chip and Multi Chip Integration; Co-Design; Modeling & Simulation; Reliability

2021 SPECIAL SESSION 2021 DIVERSITY PANEL Market Trends and Diversity Does Matter and Can Drive Enhanced Geopolitical & Economic Outook Business Performance Chairs: Rozalia Beica – AT&S and Chairs: Allyson Hartzell – Philips and Ed Sperling – SemiEngineering Kitty Pearsall – Boss Precision, Inc. Panelists: Panelists: Carolyn Evans, Intel Corporation Joyce Wu, Analog Devices Duncan Meldrum, Hilltop Economics Viktor Tymchenko, Intel Corporation Risto Puhakka, VLSI Research Alezandra Gualdino, PMD Technologies Jean Christophe Eloy, Yole Developpement Adeel Bajwa, Kulicke and Soffa Industries, Inc.

2021 IEEE EPS PRESIDENT’S PANEL 2021 ECTC YOUNG PROFESSIONALS MEETUP Future Vision of Electronics Packaging – Chairs: Yan Liu – Medtronic and Industry Perspective Adeel Bajwa – Kulicke and Soffa Industries, Inc. This event is designed just for you – young Chairs: Chris Bailey – EPS President, University professionals, including current graduate students. of Greenwich and Sam Karikalan – EPS VP In this active event, you will interact with senior Conferences, Broadcom EPS members and professionals through a series Panelists: of active and engaging activities. You will have Bryan Black, AMD opportunities to learn more about packaging- related topics, ask career questions, and meet some Raj Pendse, Facebook professional colleagues. Pooya Tadayon, Intel Corporation Mark Kuemerle, Marvell Semiconductor

6 SPECIAL SESSIONS

2021 IEEE EPS SEMINAR 2021 ECTC SPECIAL SESSION Latency: Are High-Bandwidth Optical Networks Materials and Technologies for Advanced a Silver Bullet? Packaging (5G, RF, Power, Harsh Environment) Chairs: Yasumitsu Orii – NAGASE and Chairs: Karsten Meier – TU Dresden and Shigenori Aoki – LINTEC Przemyslaw Gromala – Robert Bosch GmbH Panelists: Panelists: Takaaki Ishigure, Keio University Claudio-Maria Villa, ST Micro Yuichiro Ajima, Fujitsu Vanessa Smet, Georgia Institute of Technology Masao Akata, HUAWEI Japan Wilson Maia, Thales Toshio Ito, Shibaura Inst. Tech. Xueren Zhang, Xilinx Takanobu Mizuta, SPARX Asset Helmut Kroener, Showa Denko Materials (Europe) Benyuan Zhu, OFS GmbH Harald Haas, Strathclyde University

2021 ECTC SPECIAL SESSION 2021 ECTC SPECIAL SESSION Low Temperature Solder – Packaging Heterogeneous Integration Roadmap: Challenges of a Next-Generation SMT Rising to the Chiplet Challenge Interconnect Chairs: Kanad Ghose – Binghamton University and Chairs: Kevin Byrd – Intel Corporation and Dale Becker – IBM Keith Newman – AMD Panelists: Panelists Bryan Black, AMD Traian C. Cucu, MacDermidAlpha Bapi Vennakota, OCP/ODSA & Broadcom David Kehlet, Intel Luke Wentlent, Universal Instruments CP Hung, ASE Richard Coyle, Nokia Bell Labs Shin-Puu Jeng, TSMC Carol A. Handwerker, Purdue University Madhavan Swaminathan, Georgia Tech Eric Cotts, Binghamton University Jie Xue, Cisco Systems, Inc.

2021 SPECIAL SESSION 2021 ECTC SPECIAL SESSION Pathogen Detection & Eradication via Photonics Heterogeneous Integration Roadmap: Chairs: Chris Bower – X Display Company and Test in Heterogeneous Integration Mark Beranek – NAVAIR Chairs: Dave Armstrong – Advantest and Panelists: Robert Patti – NHanced Semiconductors James Malley, University of New Hampshire Panelists: Gary Eden, University of Illinois & Eden Park Michael Alfano, AMD Illumination Pooya Tadayon, Intel Benjamin Miller, University of Rochester Phil Nigh, Broadcom Zlatko Sitar, North Carolina State University Bapi Vinnakota, ODSA Ling Zhou, Bolb Inc. Calvin Cheung, ASE Thomas Baer, Stanford Photonics Research Center

2021 ECTC WOMEN’S LUNCHEON 2021 SPECIAL SESSION Virtual Women’s Luncheon Table Home Use Medical Devices and Packaging in Chairs: Jean Trewhella – GLOBALFOUNDRIES and Wearable Technologies Tanja Braun – Fraunhofer IZM Chairs: Kotlanka Rama Krishna – Analog Devices Are you missing the networking connections you are used to and Ahyeon Koh – Binghamton University making at ECTC? Panelists: If so this event is for you! Join Jean and Tanja for a roundtable “Virtual Women’s David Bolognia, Analog Devices Luncheon Table”! Kelvin Pun, Compass Technologies Find out where people are from and where they are in their careers. Talk about what is great about the virtual conference Aghogho Obi, GE and what could be better. Hear how people are involved in ECTC, EPS, how to get involved, and how to make ECTC and Wei Gao, California Institute of Technology EPS even more compelling to get women engaged. Of course, just as for the ECTC in-person Women’s Luncheon Benjamin C. K. Tee, National University of Singapore Tables, ALL ARE INVITED.

7 8 PROFESSIONAL DEVELOPMENT COURSES • For more details see www.ectc.net/courses

1. Achieving High Reliability of Lead-Free Solder 8. Wafer-Level Chip-Scale Packaging (WCSP) Joints -- Materials Considerations Fundamentals Course Leader: Ning-Cheng Lee – Indium Corporation Course Leader: Patrick Thompson – Texas Instruments, Inc.

2. Fundamentals of Glass Technology and 9. Additive Flexible Hybrid Electronics – Applications for Advanced Semiconductor Manufacturing and Reliability Packaging Course Leader: Pradeep Lall – Auburn University Course Leaders: Prakash Gajendran and Joseph Canale – Corning, Inc.

3. Fundamentals of RF Design and Fabrication 10. Fan-Out Wafer/Panel Level Packaging and 3D Processes of Fan-Out Wafer/Panel Level Chiplet Heterogeneous Integrations Packages and Interposers Course Leader: John Lau – Unimicron Technology Corporation Course Leaders: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM

4. Eliminating Package Failure Mechanisms for 11. Polymers in Wafer-Level Packaging Improved Reliability Course Leader: Jeffrey Gotro – InnoCentrix, LLC Course Leader: Darvin Edwards – Edwards Enterprises

5. Characterization of Advanced EMCs for 12. Reliability Mechanics and Modeling for IC FO-WLP, Heterogeneous Integration, and Packaging Automotive Electronics Course Leaders: Ricky Lee - HKUST and Xuejun Fan – Lamar Course Leaders: Przemyslaw Gromala – Robert Bosch GmbH University

6. Reliable Integrated Thermal Packaging for 13. From Wafer to Panel-Level Packaging Power Electronics Course Leaders: Tanja Braun and Michael Töpper – Fraunhofer Course Leader: Patrick McCluskey – University of Maryland IZM

7. Flip Chip Technologies 14. Thermal Management of Electronics Course Leaders: Eric Perfecto – IBM Corporation and Shengmin Course Leader: Jaime Sanchez – Intel Corporation Wen – Synaptics Inc.

9 IEEE ELECTRONIC PACKAGING IEEE ELECTRONICS PACKAGING SOCIETY MAJOR AWARDS SOCIETY TRANSACTION AWARDS Electronics Manufacturing Technology: Advanced Packaging Yong Liu Technologies Category Extensive research and development in the field of analog and Thin Film Metallization Stacks Serve as power packaging manufacturing assembly process modeling, Reliable Conductors on Ceramic-based reliability prediction and innovation. Substrates for Active Implants VOL. 10, ISSUE 11 NOVEMBER 2020 Outstanding Sustained Technical Contribution: Patrick Kiele, Paul Čvančara, Wilmer R. Bottoms Michael Langenmair, Matthias For outstanding entrepreneurship and sustained visionary Mueller, Thomas Stieglitz leadership that continues to foster microelectronics packaging innovation and comprehensive technology roadmapping. Electronics Manufacturing Category Effects of Thickness and Crystallographic Exceptional Technical Achievement: Orientation on Tensile Properties of Tanja Braun Thinned Silicon Wafers Beth Keser VOL. 10, ISSUE 2 FEBRUARY 2020 For seminal contributions and leadership in Fan-out Wafer Level Sangmin Lee, Jae-Han Kim, Packaging. Young Suk Kim, Takayuki Ohba, Taek-Soo Kim

Components: Characterization & Modeling Category Experimental Study of Relationship between Arc Light Intensity and Temperature in Low Voltage Switching Devices David Feldman Outstanding Contribution Award: VOL. 10, ISSUE 11 NOVEMBER 2020 Paul Svasta Dongkyu Shin, Thomas G. Bull, For strongly promoting and implementing Electronic Packaging and John W. McBride IEEE EPS activities in Europe, Region 8, for establishing a functional AND networking bridge from Academia to Industry. Steady-State Parametric Optimization and Transient Characterization of Heat Outstanding Young Engineer: Flow Regulation with Binary Diffusion Bo Song VOL. 10, ISSUE 12 DECEMBER 2020 For outstanding contribution to the development of advanced Tanya Liu, James W. Palko, packaging materials and nanofabrication technology, as well as his Joseph S. Katz, Feng Zhou, service to the IEEE EPS society. Ercan M. Dede, Mehdi Asheghi, Kenneth E. Goodson Regional Contributions: 10 Best Associate Editor Awards Ranjan Rajoo Wendem Beyene, Intel Corporation For growing R10 flagship conference EPTC through strategic Abhijit Chandra, Iowa State partnerships with the entire microelectronics supply chain, and for University contributions to the Singapore EPS Chapter. Cemal Basaran, SUNY at Buffalo Xiaobing Luo, Huazhong Univ. of Science & Technology EPS PhD Student Fellowship Chuan Seng Tan, Nanyang Abhishek Deshpande Technological University For his contributions in the development of multiaxial microscale Paragkumar Thadesar, solder joint test specimens and cyclic test setups for demonstrating QUALCOMM Inc. the differences in solder joint vulnerability to tensile fatigue vs. shear fatigue. 10 EPS ECTC STUDENT TRAVEL AWARDS Ramon Sosa - Georgia Institute of Technology Peng Zhao - Nanyang Technological University Session 9: Low-temperature all-Cu interconnections formed Session 7: Heterogeneous Integration of Silicon Ion Trap and by pressure-less sintering of Cu pillars with nanoporous-Cu Glass Interposer for Scalable Quantum Computing Enabled by caps TSV, Micro-bumps, and RDL

Claudio Alvarez - Georgia Institute of Technology Kai-Cheng Shie - National Chiao Tung University Session 29: Demonstration of a High-Inductance, High-Density, Session 10: Hybrid bonding of nanotwinned copper/organic and Low DC Resistance Compact Embedded Toroidal dielectrics with low thermal budget Inductor for IVR Seokkan Ki - Kyung Hee University Yuki Susumago - Tohoku University Session 14: Rapid Enhancement of Thermal Conductivity Session 1: FOWLP-Based Flexible Hybrid Electronics with by Incorporating Oxide-Free Copper Nanoparticle Clusters 3D-IC Chiplets for Smart Skin Display for Highly Conductive Liquid Metal-based Thermal Interface Materials Woosol Lee - University of Florida Session 29: 3D integrated high gain rectenna in package with Sunil Kumar Panigrahy - National Tsing Hua University metamaterial superstrates for high efficiency wireless power Session 32: Study on an Artificial Intelligence Based Kernel transfer applications Ridge Regression Algorithm for Wafer Level Package Reliability Prediction Tomo Odashima - Tohoku University Session 12: Wafer-Level Flexible 3D Corrugated Interconnect Jia Juen Ong - National Chiao Tung University Formation for Scalable In-Mold Electronics with Embedded Session 5: Two-step fabrication process for die-to-die and die- Chiplets to-wafer Cu-Cu bonds

25 YEARS ECTC 2020 ECTC BEST PAPERS VOLUNTEER AWARD Best Session Paper Jaber Derakhshandek, Giovanni Capuz, J Rao Bonda - Amkor Technology InFO_SoW (System-on-Wafer) Vladimir Cherman, Funnihiro Inoue, Craig Gaw - NXP Semiconductor for High Performance Computing Inge De Preter, Lin Hou, Pieter Bex, Eric Perfecto - IBM Research Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Carine Gerets, Fabrice Duval, Thomas Tsai, Chung-Shi Liu, Chuei-Tang Wang, Webers, Julien Bertheau, Stefaan Van Suresh K Sitaraman - Georgia Jeng-Shien Hsieh, Tsung-Shu Lin, Terry Huylenbroeck, Alain Phommahaxay, Institute of Technology Ku, Douglas Yu - Taiwan Semiconductor Ehsan Shafahian, Geert Van der Plas, Eric Jan Vardaman - TechSearch Manufacturing Beyne, Andy Miller, Gerald Beyer - IMEC International Best Interactive Presentation Outstanding Interactive Paper Presentation Paper 10 YEARS ECTC Embedded 3D-IPD Technology Processing Glass Substrate for VOLUNTEER AWARD based on Conformal 3D-RDL: Advanced Packaging Using Laser Induced Deep Etching Wendem Beyene - Intel Corporation Application for Design and Rafael Santos, Jean-Pol Delrue, Norbert Abhilash Goyal - Velodyne LIDAR, Inc. Fabrication of Compact, High- Performance Diplexer and Ultra- Ambrosius, Roman Ostholt, Stephan Vikas Gupta - ASE US, Inc. Wide Band Schmidt - LPKF Laser & Electronics AG Ibrahim Guven - Virginia Ayad Ghannam, Alessandro Magnani, Intel Best Student Session Paper Commonwealth University David Bourrier, Thierry Parra - 3DiS A Comprehensive Study of Robert Kao - National Taiwan Technologies Electromigration in Lead-free University Outstanding Session Paper Solder Joint Jiefeng Xu, Chongyang Cai, Vanlai Pham, Wei Koh - Pacrim Technology 10 and 7 µm Pitch Thermo- Compression Solder Joint, Using Ke Pan, Huayan Wang, Seungbae Park - Nancy Stoffel - GE Research a Novel Solder Pillar and Metal Binghamton University Shaw Fong Wong - Intel Corporation Spacer Process

11 TECHNICAL SESSIONS • For more details see www.ectc.net/program Packaging Technologies Subcommittee Interconnections Subcommittee Session 1: 2D and 3D Chiplets Interconnects in Session 7: 3D TSV and Interposer FO-WLP/PLP Session 8: Chiplet Integration and Fan-Out Interconnections Session 2: Wafer/Panel Level System Integration and Process Advances Session 9: Advances in Cu Bonding

Session 3: Advanced Heterogeneous Chiplet and Session 10: Surface Preparation for Cu Bonding Integration for HPC Session 11: Advanced Chip to Chip/Package Session 4: Heterogeneous Integration Using 2.xD/3D Interconnections for 3D and Heterogeneous Integration Packaging Technologies

Session 12: Flexible Interconnects and Low- Session 5: Technologies for Advanced Substrates Temperature Sintering and Flip-Chip Bonding

Assembly & Manufacturing Technology Subcommittee RF, High-Speed Components & Systems Subcommittee Session 23: Heterogeneous Integration Processes and Manufacturing Session 26: Antenna-in-Package for 5G/6G and Radar Systems Session 24: Fan-Out Wafer Level Packaging Developments and Applications Session 27: Novel High-Frequency Integrated Modules and Systems Session 25: Advances in Assembly Methods

Session 28: High-Speed Signal Integrity and Interconnections Materials & Processing Subcommittee Session 13: Dielectric Materials for High-Speed Wireless Communications Session 29: 3D Power Components and Power Integrity Session 14: Enhancements in Sintering Technology and Power Applications

Session 15: Material and Process Advancements for Emerging Technologies Subcommittee Interconnects and Metallurgy Reliability Session 34: Flexible Hybrid Sensors and Electronics Session 16: Innovation on Bonding and Hybrid Bonding Materials and Processing Session 35: Emerging Quantum and Advanced Interconnects Session 17: Latest Trends in Fan-Out Packaging and Substrate Technology Session 36: Packaging, Machine Learning, and Session 18: Emerging Technology Advancements in Integration Technologies Applications and Processing

12 TECHNICAL SESSIONS • For more details see www.ectc.net/program Thermal/Mechanical Simulation & Characterization Subcommittee Photonics Subcommittee Session 22: Advanced Package Modeling and Session 6: Advanced Optoelectronics Packaging Reliability Applied Reliability Subcommittee Session 30: Package to System Level Thermo- Session 19: Enhanced Reliability Characterization Mechanical Reliability Modeling and Methodologies

Session 31: Analyses on Chip Package Interaction and Thermal Management for Heterointegration Session 20: Reliability of Automotive Electrification and Autonomous Electronic Components

Session 32: Novel Approaches for Reliability and Process Modeling Session 21: Advances in Interconnect Reliability

Session 33: Flexing and Warpage Characterization Session 22: Advanced Package Modeling and and Modeling Reliability

TOPICAL SESSIONS HOSTED BY THE INTERACTIVE PRESENTATIONS TECHNICAL SUBCOMMITTEE Session 37: Photonics, 5G, mm Wave Applications & Session 42: Topics in Advanced Packaging Techniques

Session 43: Manufacturing Techniques for Emerging Session 38: Reliability Analysis of New Materials in Packaging Requirements Modern Packaging

Session 39: High-Speed Channel Design, Power Session 44: Thermo-mechanical Analysis for Delivery and Analysis Reliability in Packaging Technology

Session 40: Materials and Techniques in High-Speed Session 45: Heterogeneous Integration, Flex and Interconnects Emerging Technologies

Session 41: Characterization and Performance Analysis of Packaging Materials Session 46: Student Session

13 INTRODUCING CARBON CAPACITORS:

2005 2009 2011 2015 2017 2019 2020 2021

Odling av vertikala Odling av CNT Halvledarindustrin ser Första licensav- kolnanostrukturer under 390°C möjligheterna med talen tecknas för SEM picture of the CNF-MIM capacitor die SEM picture shows side-view of the CNF-MIM die (CNT/CNF) tekniken CNF-MIM- konceptet

Patentplattform säkrad Kondensatortekniken Enorma teknikframsteg Fortsatt utveckling av CNF-MIM tar form gör CNF-MIM het på CNF/CNT öppnar helt nya ”Capacitors so thin they fit everywhere” marknaden möjligheter för Smoltek

Smoltek presents: ”the thinnest capacitors in the world”. The technology is based on carbon nanofibers and they are developed for further miniaturization of semiconductor components. Carbon capacitor properties: High capacitance density | Low ESR | Low ESL | Extremely small form factor | So thin they fit everywhere. Applications: Discrete component (embedded, landside, hybrid bonding) or fully integrated. Learn more about “the thinnest capacitors in the world” on www.smoltek.com/ectc2021. Or visit our virtual booth at www.ectc.net for more in detail information.

PIONEERING CARBON NANOTECHNOLOGY

14 2021 VIRTUAL EXHIBITION ECTC will be holding a virtual exhibition event that will To reserve your exhibit page for the 2021 ECTC virtual event, be online for the entirety of the ECTC virtual conference please contact: this year. The virtual exhibit event provides companies the opportunity to connect with conference attendees virtually Alan Huffman, ECTC Exhibits Chair or in live chat/video interactions and present information in [email protected] video and print formats on their products and services. The format for each company’s virtual exhibit is an easy-to-navigate & webpage, accessible only through the ECTC virtual conference Jodi Towner, ECTC Exhibits & Registration platform, that makes getting connected quick and easy. Participation as a virtual exhibitor also includes one free virtual Customer Service Manager conference registration, making this a cost effective way for [email protected] your company to participate in the entire virtual conference experience.

Confirmed Exhibitors as of April 28, 2021

5N Plus Micro Powders KLA Tencor Ajinomoto Fine-Techno USA Corporation Kleindiek Amkor Marvell AOI Electronics Microcircuit Laboratories ASE Group Micross Advanced Interconnect Tech. Atotech Nagase America Corporation Binghamton University NAMICS Technologies, Inc. Brewer Science Nepes ChipScale Review NTK Technologies Corning Incorporated Onto Innovation PacTech CPS Technologies Corp. QualiTau Deca Technologies, Inc. Semiconductor Equipment Corporation DISCO Hi-Tec America, Inc. Smoltek DuPont Electronics and Imaging SPIL Ebina Denka Kogyo SPTS EMD Performance Materials Corp. SUSS MicroTec EV Group Taiyo Ink, Mfg., Co., Ltd Evatec AG Tatsuta Electric Wire & Cable Fraunhofer IIS TechSearch International FujiFilm Toray International HD Microsystems L.L.C. Towa USA Heidelberg Instruments TSMC Henkel Corporation XPERI IBM Canada Yield Engineering Systems IC Chip Cooling Technologies, Inc. Yole Développement Integrated Service Technology Zeiss Interconnect Systems International (ISI) Zuken JCET Group Co., Ltd. Zymet

15 2021 Executive Committee Packaging Technologies Applied Reliability General Chair Chair Chair Nancy Stoffel Darvin R. Edwards GE Research Markus Leitgeb Edwards Enterprise Consulting, LLC [email protected] AT&S [email protected] [email protected] Assistant Chair Vice General Chair ECTC Assistant Chair Keith Newman Rozalia Beica AMD AT&S Bora Baloglu [email protected] [email protected] Amkor Technology Seung-Hyun Chae Program Chair [email protected] SK Hynix Ibrahim Guven Daniel Baldwin Tz-Cheng Chiu Virginia Commonwealth University National Cheng Kung University H. B. Fuller Company [email protected] Deepak Goyal Luke England Intel Corporation Assistant Program Chair Karlheinz Bock Marvell Technology Vikas Gupta TU Dresden Jie Fu Texas Instruments, Inc. [email protected] Apple Sandy Klengel Fraunhofer Institute for Microstructure of Jr. Past General Chair ECTC Mike Gallagher Materials and Systems Christopher Bower DuPont Electronic and Imaging Pilin Liu X-Display Company, Inc. Intel Corporation [email protected] Ning Ge Vikas Gupta Consultant Sr. Past General Chair ECTC ASE US, Inc. Mark Poliks Allyson Hartzell Sandy Klengel Binghamton University Veryst Engineering Fraunhofer Institute for Microstructure of [email protected] Kuldip Johal Materials and Systems Sponsorship Chair Atotech Pilin Liu Wolfgang Sauter Intel Corporation Marvell Semiconductor, Inc. Sam Karikalan Varughese Mathew [email protected] Broadcom Inc. NXP Semiconductors Beth Keser Toni Mattila Finance Chair Aalto University Patrick Thompson Intel Corporation Texas Instruments, Inc. Donna M. Noctor [email protected] Young-Gon Kim Nokia Renesas Electronics America S. B. Park Publications Chair Andrew Kim Binghamton University Henning Braunisch Intel Corporation Lakshmi N. Ramanathan Intel Corporation Microsoft Corporation [email protected] John Knickerbocker René Rongen Publicity Chair IBM Corporation NXP Semiconductors Eric Perfecto Steffen Kroehnert Scott Savage IBM Corporation Medtronic Microelectronics Center ESPAT Consulting [email protected] Christian Schmidt Albert Lan NVIDIA Corporation Treasurer Applied Materials Tom Reynolds Jeffrey Suhling T3 Group LLC John H. Lau Auburn University [email protected] Unimicron Technology Corporation Pei-Haw Tsao Taiwan Semiconductor Manufacturing Company, Exhibition Management Jaesik Lee Ltd. Alan Huffman Nvidia Dongji Xie Micross Advanced Interconnect Technology NVIDIA Corporation [email protected] Dean Malta Micross Advanced Interconnect Technology IT Coordinator Assembly & Manufacturing Technology Florian Herrault Luu Nguyen Chair HRL Laboratories, LLC Psi Quantum Christo Bojkov [email protected] Qorvo Raj Pendse [email protected] Professional Development Course Chair Facebook FRL (Facebook Reality Labs) Assistant Chair Kitty Pearsall Tejpal Hooghan Boss Precision, Inc. Subhash L. Shinde [email protected] Notre Dame University Amkor [email protected] Conference Management Joseph W. Soucy Sai Ankireddi Lisa Renzi Ragar Draper Laboratory Maxim Integrated Renzi & Company, Inc. Hamid Eslampour [email protected] Peng Su Juniper Networks Global Foundries Mark Gerber EPS Representative Kuo-Chung Yee Annette Teng Advanced Semiconductor Engineering Inc. Promex Industries Taiwan Semiconductor Manufacturing Habib Hichri [email protected] Corporation, Inc. Ajinomoto Fine-Techno USA Corporation

16 Paul Houston Rajen M Murugan Jintang Shang Engent Texas Instruments Southeast University Li Jiang Ivan Ndip Rohit Sharma Texas Instruments Fraunhofer Institute for Reliability and IIT Ropar Wei Koh Microintegration (IZM) Nancy Stoffel Pacrim Technology Dan Oh GE Research Ming Li Samsung Liu Yang ASM Pacific Technology P. Markondeya Raj IBM Corporation Debendra Mallik Florida International University Jimin Yao Intel Corporation Intel Corporation Hideki Sasaki Jae-Woong Nah Renesas Electronics Corporation Hongqing Zhang IBM Corporation IBM Corporation Li-Cheng Shen Valerie Oberson Wistron NeWeb Corporation IBM Canada Ltd Jaemin Shin Interconnections Chair Shichun Qu Qualcomm Corporation Intersil, a Renesas Company Chuan Seng Tan Manos M. Tentzeris Nanyang Technological University Paul Tiner Georgia Institute of Technology [email protected] Texas Instruments Chuei-Tang Wang Assistant Chair Andy Tseng Taiwan Semiconductor Manufacturing Company David Danovitch JSR Micro (TSMC) University of Sherbrooke Jan Vardaman [email protected] Techsearch International Emerging Technologies Jian Cai Yu Wang Tsinghua University Sensata Technologies Chair W. Hong Yeo Zhang Chaoqi Shaw Fong Wong Georgia Tech Qualcomm Inc Intel Corporation [email protected] William Chen Jin Yang Advanced Semiconductor Engineering, Inc. Intel Corporation Assistant Chair Ramakrishna Kotlanka Bernd Ebersberger Tonglong Zhang Analog Devices Infineon Technologies Nantong Fujitsu Microelectronics Ltd. [email protected] Takafumi Fukushima Isaac Robin Abothu Tohoku University RF, High-Speed Components & Systems Siemens Healthineers Tom Gregorich Chair Meriem Akin Zeiss Semiconductor Manufacturing Technology Yong-Kyu Yoon Volkswagen AG Chung C. Key University of Florida Vasudeva P. Atluri Advanced Packaging Division, Corp. R&D, SPIL [email protected] Ltd. Renavitas Technologies Assistant Chair Seung Yeop Kook Maciej Wojnowski Karlheinz Bock GLOBALFOUNDRIES Technische Universität Dresden Infineon Technologies AG Kangwook Lee [email protected] Benson Chan SK Hynix Binghamton University Amit P. Agrawal Li Li Microsemi Corporation Vaidyanathan Chelakara Cisco Systems, Inc. Kemal Aygün Acacia Communications Changqing Liu Intel Corporation Rabindra N. Das Loughborough University Wendem Beyene MIT Lincoln Labs Wei-Chung Lo Intel Corporation Dongming He ITRI, Industrial Technology Research Institute Eric Beyne Qualcomm Technologies, Inc. Nathan Lower IMEC Florian Herrault Collins Aerospace Prem Chahal HRL Laboratories, LLC James Lu Michigan State University Jae-Woong Jeong Rensselaer Polytechnic Institute Zhaoqing Chen KAIST Peter Ramm IBM Corporation TengFei Jiang Fraunhofer EMFT Charles Nan-Cheng Chen University of Central Florida Katsuyuki Sakuma Shanghai Jiao Tong University IBM Corporation Jong-Hoon Kim Craig Gaw Washington State University Vancouver Lei Shan NXP Semiconductor IBM Corporation Ahyeon Koh Abhilash Goyal Binghamton University Ho-Young Son Velodyne LIDAR, Inc. SK Hynix Santosh Kudtarkar Xiaoxiong (Kevin) Gu Jean-Charles Souriau Analog Devices IBM Corporation CEA Leti Rockwell Hsu Kevin J. Lee Chih-Hang Tung Cisco Systems, Inc. Qorvo Corporation Taiwan Semiconductor Manufacturing Company Lih-Tyng Hwang Zhuo Li Xin Yan National Sun Yat-Sen University Fudan University Intel Corporation Timothy G. Lenihan Chukwudi Okoro Matthew Yao TechSearch International Corning GE Aviation Lianjun Liu C. S. Premachandran Dingyou Zhang NXP Semiconductor, Inc. GLOBALFOUNDRIES Broadcom Inc.

17 Materials & Processing Kuo-Ning Chiang Andrew Shapiro Chair National Tsinghua University JPL Tanja Braun Xuejun Fan Fraunhofer IZM Masato Shishikura Lamar University [email protected] Oclaro Japan Assistant Chair Przemyslaw Gromala Robert Bosch GmbH Masao Tokunari Kimberly Yess IBM Corporation Brewer Science Nancy Iwamoto [email protected] Honeywell Performance Materials and Shogo Ura Yu-Hua Chen Technologies Kyoto Institute of Technology Unimicron Pradeep Lall Stefan Weiss Auburn University Qianwen Chen II-VI Laser Enterprise GmbH IBM Corporation Chang-Chun Lee Jae Kyo Cho National Tsing hua University (NTHU) Feng Yu Huawei Technologies Japan GLOBALFOUNDRIES Sheng Liu Bing Dang Wuhan University Thomas Zahner IBM Corporation Yong Liu OSRAM Opto Semiconductors GmbH Yung-Yu Hsu ON Semiconductor Apple Inc. Ping Zhou Erdogan Madenci LDX Optronics, Inc. Lewis Huang University of Arizona Senju Electronic Tony Mak C. Robert Kao Interactive Presentations National Taiwan University Wentworth Institute of Technology Chair Alvin Lee Karsten Meier Pavel Roy Paladhi Brewer Science Technische Universität Dresden IBM Corporation Yi Li Erkan Oterkus Intel Corporation University of Strathclyde [email protected] Ziyin Lin Suresh K. Sitaraman Assistant Chair Intel Corporation Georgia Institute of Technology Michael Mayer Yan Liu G. Q. (Kouchi) Zhang University of Waterloo Medtronic Inc. USA Delft University of Technology (TUD) [email protected] Mikel Miller Tieyu Zheng Rao Bonda Apple Inc. Microsoft Corporation Amkor Technology Praveen Pandojirao-S Jiantao Zheng Johnson & Johnson Hisilicon Mark Eblen Mark Poliks Kyocera International SC Binghamton University Photonics Ibrahim Guven Dwayne Shirley Chair Virginia Commonwealth University Inphi Harry G. Kellzi Alan Huffman Ivan Shubin Micropac Industries RAM Photonics LLS [email protected] Micross Advanced Interconnect Technology Bo Song Assistant Chair Jeffrey Lee HP Inc. Ajey Jacob iST-Integrated Service Technology Inc. Yoichi Taira University of Southern California (USC); Nam Pham Keio University Information Sciences Institute (ISI) Lejun Wang ajey.jacob@globalfoundries.com IBM Corporation Analog Devices Mark Beranek Mark Poliks Frank Wei Naval Air Systems Command Binghamton University Disco Japan Stephane Bernabe Patrick Thompson Lingyun (Lucy) Wie CEA Leti Texas Instruments, Inc. DuPont Chris Bower Kristina Young-Fisher Myung Jin Yim X-Display Apple GLOBALFOUNDRIES Gordon Elger Hongbin Yu Technische Hochschule Ingolstadt Arizona State University Professional Development Courses Zhangming Zhou Z. Rena Huang Qualcomm Rensselaer Polytechnic Institute Chair Takaaki Ishigure Kitty Pearsall Keio University Boss Precision, Inc. Thermal/Mechanical Simulation & Characterization Soon Jang [email protected] Chair ficonTEC USA Assistant Chair Ning Ye Richard Pitwon Jeffrey Suhling Western Digital Resolute Photonics Ltd [email protected] Auburn University Vivek Raghuraman [email protected] Assistant Chair Broadcom Wei Wang Deepak Goyal Qualcomm Technologies, Inc. Alex Rosiewicz Intel Corporation [email protected] A2E Partners Christopher J. Bailey Henning Schroeder Lakshmi N. Ramanathan University of Greenwich Fraunhofer IZM Microsoft Corporation

18 FIRST CALL FOR PAPERS

IEEE 72nd Electronic Components and Technology Conference www.ectc.net • May 31 - June 3, 2022 The Electronic Components and Technology Conference (ECTC) is the premier international electronics symposium that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Electronics Packaging Society (EPS) of the IEEE. You are invited to submit abstracts that provide non-commercial information on new developments, technology and knowledge in the areas including, but not limited to the topics listed those given below for each technical program committee name. Authors are encouraged to review the sessions of the previous ECTC programs to determine the committee selection for their abstracts.

Applied Reliability Materials & Processing Emerging product reliability including LED, memory, IoT and autonomous Conductive and Non-Conductive Adhesives, 3D Materials and Thin Wafer vehicles, medical/wearable electronics; Interconnect reliability in flip chip, Processing, Solder Alloys, Dielectrics, Underfills, Molding Compounds, Thermal wire & hybrid bonded packages; Novel reliability test methods, life models, Interface Materials, Novel Materials and Processing, Emerging Materials. FA techniques & materials characterization; Package board-level reliability in computing, telecommunications, automotive & harsh environments; Reliability of Thermal/Mechanical Simulation & Characterization TSV, 2.5D, 3D, fan-out, WLCSP, WLFO, PLFO, & Heterogeneous Integration. Component, Board and System Level Modeling for Microelectronics, e.g., 3D Interconnects (TSV, Stacked Die, etc.), 2.5D Packaging (Si, Glass, Flexible Assembly and Manufacturing Technology Interposer, etc.), flexible substrates/systems, Wafer-Level-Package (WLP), Ball- Advanced dicing and bonding; Advanced encapsulation and embedding Grid-Array (BGA), Fan-Out Packages, Embedded Packages with Active and technology; Assembly and manufacturing process improvement; Assembly Passive Components, System-in-Package (SiP), Chiplet Systems/Packages, Panel and manufacturing advances in flexible and printed electronics; Assembly and Level Packaging (PLP), Power Electronic Modules, LED Packaging, RF materials manufacturing challenges for 5G/RF packaging and integration; Fan-out and panel (substrates, EMC, solder mask) & RF/5G systems, and MEMS; Reliability modeling level assembly; Heterogeneous integration process & manufacturing; Package related fracture mechanics, fatigue, Electromigration, warpage, delamination, warpage and substrate; Thermal enhanced packaging and assembly. moisture, drop test, material constitutive relations and characterization; Chip- Package Interaction, Wafer Fabrication Process Related Modeling; Novel Emerging Technologies modeling techniques including Multi-Scale Physics, and Co-Design Approaches, Emerging, novel, and unique packaging and material technologies for: soft and and Wide Range Strain Rate Solutions; Measurement methodologies, intelligent packaging, flexible/stretchable hybrid electronics, implantable biosensors characterization and correlations, model order reduction, sensitivity analysis, and bioelectronics, extreme harsh environment, green/bio-resorbable packaging, optimization, probability, machine learning and digital twin; Fab/thin wafer nanomanufacturing, paper sensors/electronics pop-up/origami, MEMS & NEMS, handling, wire bonding and assembly manufacture process. CLOSE-TO-MOTOR high-voltage power electronics, packaging for wide band gap devices, anti-tamper, cryptography, additive manufacturing, packaging for Packaging Technologies (formerly Advanced Packaging) quantum computing and electro-optical integration, recyclable and sustainable 2.5 & 3D, TSV & interposer; Advanced flip-ship, SiP, CSP, PoP, MEMS, sensors & electronics packaging, packaging for quantum computing and electro-optical loT; Automotive & power electronics, Bio, medical, flexible & wearable packaging; integration, recyclable and sustainable electronics packaging, AI, ML and Embedded & advanced substrates; Fan-out, wafer & panel level process; computer vision for packaging, point-of-care diagnostic packaging, packaging Heterogeneous integration. for quantum computing/sensing/communication, and space hardened packaging technologies. Photonics Photonics components packaging for computing, communications, data RF, High-Speed Components & Systems processing, mobility. Photonics components packaging for healthcare, green 5G, IoT, cloud computing, autonomous vehicles, AI/machine learning; Antennas, energy, security, environment, climate. Photonics components packaging for sensors, power transfer, EM shielding, wired/wireless communications, RF to space, atmosphere, automobile, underwater, defense. Photonics packaging THz; Electrical and multi-physics modeling, simulation and characterization of technology for process integration, co-packaging, free space optics. Photonics interconnects, components, modules, and heterogeneous integration; Signal/ packaging technology for 3D printing, microscopy, advanced spectroscopy. power integrity, chip/package/board co-design. Photonics packaging technology for micro-optics, quantum interconnects. Packaging of new photonics materials. Characterization of packaging components. Interconnections Equipment and tools for photonics packaging. Interconnection Technology and Processing: Fan-out, panel-level, chiplets, SiP, flip- chip, 2.5D/3D, Si/glass/organic interposers, TSV, micro-bump, Cu pillar, wirebonds, Interactive Presentations high I/O thermo-compression/hybrid bonding, fine-pitch/multi-layer RDL, printable Abstracts may be submitted related to any of the nine major program interconnects, flexible substrates; Interconnect Material, Characterization and committee topics listed above. Interactive presentations of technical papers are Reliability: Conductive/non-conductive adhesives, low temperature solder, under- highly encouraged at ECTC. They allow for significant interaction between the fill, molding compounds, thermal interface materials, thermal/mechanical/electrical presenter and attendees, which is especially suited for material that benefits from tests and reliability; Interconnects design and technology for emerging applications: more explanation than is practical in oral presentations. Interactive presentation HPC, mobile, 5G, IoT, power and rugged electronics, medical and health, session papers are published and archived in equal merit with the other ECTC automotive, aerospace, flexible hybrid electronics, micro-LED display conference papers..

You are invited to submit an abstract of no more than 750 Professional Development Courses words that describes the scope, content, and key points of Proposals are solicited from individuals interested in teaching educational, four-hour long Professional Development your proposed paper via the website at www.ectc.net. Courses (PDCs) on topics described on the previous page. From the proposals received, 18 PDCs will be selected for offering at the 72nd ECTC on Tuesday, May 31, 2022. Each selected course will be given a minimum honorarium If you have any questions, contact: of $1,000. In addition, instructors of the selected courses will be offered the speaker discount rate for the conference. Karlheinz Bock, 72nd ECTC Program Chair Attendees of the PDCs will be offered Continuing Education Units (CEUs). These CEUs are recognized by TU Dresden employers as a formal measure of participation and attendance in “noncredit” self-study courses, tutorials, symposia, Email: [email protected] and workshops. Using the format “Course Objectives/Course Outline/Who Should Attend,” 200-word proposals must be submitted Abstracts must be received by October 10, 2021. All via the ECTC website at www.ectc.net by October 24, 2021. Authors will be notified of course acceptance with abstracts must be submitted electronically at www.ectc.net. instructions by December 20, 2021. If you have any questions, contact: You must include the affiliation, mailing address, business telephone number, and email address of all authors with your If you have any questions, contact: submission. The authors will be notified about the abstract Kitty Pearsall, 72nd ECTC Professional Development Courses Chair selection outcome by December 20, 2021. Boss Precision, Inc. • Phone: +1-512-845-3287 • E-mail: [email protected]

19 20 CONFERENCE SPONSORS

PLATINUM

www.amkor.com www.aseglobal.com www.jcetglobal.com

GOLD

www.decatechnologies.com www.evgroup.com www.marvell.com

www.tsmc.com/english/default.htm www.yieldengineering.com

REGISTRATION PATRONS

www.spts.com www.zymet.com PROGRAM SPONSORS

www.evatecnet.com www.ibm.com

www.smoltek.com www.suss.com PANEL SPONSORS

www.aseglobal.com www.binghamton.edu www.brewerscience.com

www.dupont.com/electronic-materials www.zymet.com STUDENT RECEPTION INTEL BEST STUDENT PAPER

www.ti.com/support-packaging/packaging-information.html www.intel.com 21 CONFERENCE SPONSORS TECHNICAL SESSION SPONSORS

www.atoech.com www.discousa.com www.dupont.com/electronic-materials www.ebinadk.com

www.emdgroup.com www.fujifilmusa.com www.hdmicrosystems.com

www.ibm.com www.isipkg.com www.jsrmicro.com www.kla-tencor.com

www.kleindiek.us www.nagase.co.jp www.namics.co.jp

www.nepes.us www.ntktech.com www.ontoinnovation.com www.na.industrial.panasonic.com

www.samtec.com www.semicorp.com www.spts.com

www.invensas.com www.yole.fr www.zuken.com www.zymet.com MEDIA Official Media Sponsor

www.chipscalereview.com Additional Media Sponsors

www.i-micronews.com www.3dincites.com www.circuitassembly.com www.imcreativity.com

www.magneticsmag.com www.memsjournal.com www.memsjournal.com www.meptec.com www.semiconductorpackagingnews.com 22 71st Electronic Components & Technology Conference

2021 ECTC REGISTRATION INFORMATION Conference Registration Advance Registration Door Registration Now - May 14, 2021 May 15 - July 4, 2021 IEEE Member Attendee (full ECTC conference) US $250 US $300 Speaker or Chair (full ECTC conference) $250 $250 Non-IEEE Member Attendee (full ECTC conference) $300 $350 Speaker or Chair (full ECTC conference) $250 $250 Student Attendee or Speaker (full conference) $175 $175 Professional Development Courses (PDCs) IEEE Member One (1) PDC $250 $250 Two (2) PDCs $400 $400 Three (3) PDCs $600 $600 Four (4) PDCs $800 $800 Non-IEEE Member One (1) PDC $300 $300 Two (2) PDCs $450 $450 Three (3) PDCs $650 $650 Four (4) PDCs $850 $850 Student One (1) PDC - Two (2) PDCs $90 $90 Three (3) - Four (4) PDCs $150 $150 Other Registration Fees Cancellation Fee $50 $50

Please log onto www.ectc.net/registration to register for the 2021 ECTC. There will be no refunds or cancellations after May 14, 2021. Please note that a $50 cancellation fee will be in effect for all cancellations made on or prior to May 14, 2021. Substitutions can be made at any time. For additional information about registration or ECTC please contact us at: Renzi & Company, Inc. Phone: +1-703-863-2223 Email: [email protected] *If you join IEEE BEFORE you register for the 2021 ECTC you can save on registration fees and get the Electronics Packaging Society (EPS) add-on membership free for the rest of the year! To take advantage of this offer, simply go to: https://www.ieee.org/membership- catalog/productdetail/showProductDetailPage.html?product=MEMEP021 At destination, create your IEEE Web Account. Once complete, proceed to the Shopping Cart and enter EPSFREE2021 in the promotion code box. Click “Apply” and the Shopping Cart will be updated to show the discount. Use your new IEEE membership ID number and register for ECTC at the discounted IEEE Member Rate. *Non-IEEE members can join IEEE and save on ECTC registration and receive EPS Society membership free for 2021. IEEE members can join the EPS Society free for the remainder of 2021 with ECTC registration.

23