Wednesday October 21, 2020 Room 504 10:00

2020 2020 The 22nd International Conference on Electronics Materials and Packaging

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Plenary Speech Special Session Packaging Session PCB Session Poster Session

Day 1 – Wednesday October 21, 2020 Room 504 10:00-10:30 IMPACT-EMAP 2020 Opening & Awarding Ceremony Plenary Speech I: 3D Advanced Packaging Technology and Manufacturing 10:30-11:20 Dr. Marvin Liao, TSMC Plenary Speech II: Heterogeneous Integra�on for HPC Applica�on Driven by AI and 5G 11:20-12:10 Dr. John Lau, Unimicron 12:00-13:10 Lunch, The Banquet Hall, 3F Room 504a 504b 504c 503 【S1】【S3】【S4】【S2】 13:10-15:10 HPC Advanced Advanced and Green JIEP (Atotech) Packaging-1 Materials and Process 15:10-15:30 Coﬀee break 【S5】【S6】【S7】【S8】 15:40-17:40 SiP Signal and Warpage Test, Quality, AOI, (SPIL) Power Integrity Characteriza�on Inspec�on and Reliability

Day 2– Thursday October 22, 2020 Room 504 Plenary Speech III: Now and Future SiP for Double HI 09:00-09:50 Dr. C. P. Hung, ASE Group Plenary Speech IV: Emergent Memory Technology at the Crossroads 10:00-10:50 Dr. Wenchi Ting, UMC Room Foyer Area 11:00-12:00 【Poster Session】PCB & Packaging 12:00-13:10 Lunch, The Banquet Hall, 3F Room 504a 504b 504c 503 502 【S9】【S10】【S11】【S12】【S13】 AI New Materials for Power Advanced 13:10-15:10 HDI Technology Next Genera�on Electronic Materials and Technology (ASE) (Nanya Plas�c) Packaging Process 15:10-15:30 Coﬀee break 【S16】【S18】【S14】【S17】【S15】 Design, Electro Deposi�on 15:40-17:40 Heterogeneous Advanced ICEP Modeling & and Electrochemical Integra�on-1 Packaging-2 Tes�ng Processing Technology 18:30-20:30 IMPACT-EMAP 2020 Interna�onal Welcome Dinner (By Invited)

Day 3– Friday October 23, 2020 Room 504 Plenary Speech V: Impact of Connected Manufacturing in the New 5G Era 09:20-10:10 Mr. David Chang, IBM Taiwan 10:10-10:30 Coﬀee Break Room 504a 504b 504c 【S19】【S20】【S21】 10:30-12:35 Heterogeneous 3D Machine Learning Integra�on-2 Embedding Applica�on 12:00-13:30 Lunch, The Banquet Hall, 3F *The organizer reserves the right to modify the agenda. 2020 Floor Plan

IMPACT-EMAP 2020

Speaker Review Room Organizer's Office Registration VIP Lounge @ WIFI for 5F

Poster Poster

Room Room Room Room 5 503 504a 504b 504c F Room 502

@ Conference Room Coffee Break WiFi 2020 2020 The 22nd International Conference on Electronics Materials and Packaging Index

Conference Agenda...... Inside Cover Organizer, Co-Organizer and Sponsor ...... 0 Greeting of Chair Welcome Message from Ming-Yi Tsai, Conference General Chair...... 0 Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair...... 0 Welcome Message from Shen-Li Fu, Conference Co-Chair...... 0 Welcome Message from Chih-I Wu, Conference Co-Chair...... 0 Welcome Message from Maurice Lee, Conference Co-Chair...... 0

Special Tribute to Dr . Wei-Ping Dow...... 0 Committee Member...... 0 General Information About Conference...... 0 TPCA Show & Welcome Reception / International Welcome Dinner &Best Paper Award Ceremony/ IMPACT Best Paper 2019/Identification Badge / Registration Desk / Organizer’s Office Poster Session / Internet Access/Excursion Tour/Hotel Information/Inquiries...... 0-0

Conference Plenary Speeches...... 0 Sessions...... 0 Poster session...... 0

IMPACT Sponsor ASE ...... 0 Atotech ...... 0 Nanya Plastics ...... 0 SPIL...... 0 Applied Material ...... 0 Triallian Corp ...... 0

Note...... 0 Pre-Announcement- IMPACT 2021...... Inside Back Cover Organizer

TAIWAN PRINTED CIRCUIT IEEE ELECTRONICS PACKAGIMG INTERNATIONAL INDUSTRIAL ASSOCIATION (TPCA) SOCIETY MICROELECTRONICS TECHNOLOGY AND PACKAING SOCIETY RESEARCH INSTITUTE, TAIWAN (IMAPS Taiwan) TAIWAN (ITRI)

Co-Organizer

International Conference on Electronics 2020 Packaging

Graduate Institute of Communication International Conference on Electronics International Electronics Manufacturing Engineering Packaging (ICEP) Initiative (iNEMI)

I-Shou University (ISU) Korea Advanced Institute of Science Taiwan Semiconductor Taiwan Thermal Management and Technology (KAIST) Industry Association (TSIA) Association (TTMA)

Industrial / Special Session

Advanced Semiconductor Atotech Taiwan Limited Nan Ya Plastics Corporation Siliconware Precision Industries Engineering Inc. (ASE) Co., Ltd (SPIL)

Sponsor

Applied Materials, Inc. Amkor Technology Eternal Materials Co.,Ltd. Ichia Technologies., INC.

JSR Corporation MacDermid Performance Solutions Toray Research Center, Inc. Triallian Corp. Taiwan Ltd.

1 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

Sponsor

Taiwan Semiconductor Underwriter Laboratories (UL) Unitech Printed Circuit Board Corp. Manufacturing Company Limited (TSMC)

Media Partner

TechSearch International Yole Développement

Goverment Sponsor

Industrial Development Bureau, Ministry of Education Ministry of Science and Technology Department of Information and Ministry of Economic Aﬀairs Tourism, Taipei City Government

▲ 2 Greeting

Welcome Message from Ming-Yi Tsai, Conference General Chair

Ming-Yi Tsai, Ph.D. General Chair of IMPACT-EMAP 2020 President, IMAPS-Taiwan Professor, Chang Gung University

Dear Colleagues and Friends, Warmly welcome all of you to join this great annual event and meeting, the 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-EMAP 2020), in conjunction with the 22nd International Conference on Electronics Materials and Packaging (EMAP). On behalf of the IMPACT committee, I would like to express our gratitude to all of you for taking your time to attend this world-leading IC packaging and PCB conference and exhibition from Oct. 21-23, 2020 in Taipei, Taiwan . The main theme of the conference this year features “HPC-toward the Data Era,” highlighting the research, development and innovation of high-performance computing technologies ready for the data era . To arrange this 3-day conference, our dedicated Program Committee teaming up with TPCA, IMAPS-Taiwan, IEEE EPS-Taipei, and ITRI have been working very closely to organize these rich and various programs, including plenary speeches, invited talks, special and sponsored industrial sessions, outstanding paper and poster presentations . The purpose of this conference is to gather more and more packaging/PCB professionals from industries, research institutes, and academia to discuss about new trends, technologies, opportunities and challenges . It also provides a great platform for all of you to build the friendships, exchange information, create new ideas, and make new contact for further collaboration. Therefore, it is expected that there will be a lot of interactions, learning and sharing activities going between you and other attendees during the conference . Amid the outbreak of COVID-19 pandemic, unfortunately, a special prevention measure based on the government regulation will be taken and processed during the conference this year for creating a safe environment for attendees . Under such a safe environment we wish all of you enjoy the wonderful meeting, learn about new knowledge for future innovation and make new friendships during the conference . Finally, we sincerely wish everyone a safe, fruitful and enjoyable stay in Taipei and a successful year ahead .

Best Wishes,

Ming-Yi Tsai, Ph. D. General Chair of IMPACT-EMAP 2020 President, IMAPS-Taiwan Professor, Chang Gung University .

3 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair

Kuo-Ning Chiang, Ph.D. NTHU Chair Professor Academician, International Academy of Engineering (IAE) - Russia Fellow, IEEE / STAM / ASME / iMAPS Editor-in-Chief, Journal of Mechanics Senior Area Editor, IEEE Transactions on CPMT Topical Editor, IEEE Access

As Honorary Chair of IMPACT-EMAP 2020, I am pleased and honored to welcome participants from all over the world to participate in this Asia's largest electronic packaging conference. This year, as the COVID-19 pandemic has not completely ended and there are many restrictions on international travel, a lot of foreign participants were unable to attend this event . Some of the speakers we invited will use pre-recording or online internet to deliver their speeches, here I want to thank them for their enthusiastic support. As you know, IMPACT is one of the world’s leading electronic packaging conferences, with more than 500 participants, 200 papers and TPCA exhibitions. IMPACT- EMAP joint conference cover a wide range of important topics related to trends and cutting-edge technologies in electronic packaging and PCB fields, the agenda of the IMPACT-EMAP 2020 includes heterogeneous packaging, SiP, fan-out, automotive applications, 5G, solution for high-performance computing and AI related technologies, etc . I expect this conference to be an excellent platform for you to share knowledge, catch packaging trends and exchange research/development ideas. I sincerely hope that you will enjoy the program and networking environment we provide. Thank you for your participation .

K. N. Chiang NTHU Chair Professor Academician, International Academy of Engineering (IAE) - Russia Fellow, IEEE / STAM / ASME / iMAPS Editor-in-Chief, Journal of Mechanics Senior Area Editor, IEEE Transactions on CPMT Topical Editor, IEEE Access

▲ 4 Greeting

Welcome Message from Shen-Li Fu, Conference Co-Chair

Shen-Li Fu, Ph.D. Chair, IEEE EPS – Taipei Honorary President & Distinguished Chair Professor, I-Shou University

Dear Colleagues,

I am delighted to welcome you to the “IMPACT-EMAP 2020 Conference” . All the participants will be benefited from various sessions organized by the Technical Program Committee and the organizers including ITRI, IEEE EPS-Taipei, IMAPS-Taiwan, and TPCA . The organizers dedicated to develop the international conference to bring access to cutting-edge technology trends and international collaboration opportunities. Out of the COVID-19 pandemic, the conference will be carried out in real presentation, but supplement by virtual presentation . For grasping the latest trend, the conference this year highlights the theme “IMPACT-EMAP on HPC-Toward the Data Era”. IMPACT-EMAP 2020 looks at the cutting-edge technological applications. Besides the plenary speeches, special sessions, industrial sessions, invited talks, and outstanding paper and poster presentations will be arranged . “IMPACT-EMAP 2020 Conference” brings together the world’s leading researchers, engineers, and the industrial experts. It’s for sure we will be organizing a successful conference, and the experience with IMPACT-EMAP 2020 will be fruitful and long lasting .

Best regards,

Shen-Li Fu, Ph.D. Co-Chair of IMPACT-EMAP 2020 Chair, IEEE EPS – Taipei Honorary President & Distinguished Chair Professor, I-Shou University

5 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

Welcome Message from Chih-I Wu , Conference Co-Chair

Chih-I Wu, Ph.D. Vice President & General Director,EORL, ITRI

On behalf of the IMPACT committee, it is my great pleasure to deliver you a warm welcome to the 2020 International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) from October 21-23 in Taipei, Taiwan .

The theme of this year is "IMPACT-EMAP on HPC – Toward the Data Era"exploring packaging and PCB technology for 5G generations and High Performance Computing . To prepare this 3-day conference, our Technical Program Committee and the dedicated team of IEEE EPS-Taipei, iMAPS- Taiwan, TPCA and ITRI have worked tirelessly to arrange rich and varied programs with plenary speeches, special sessions, invited talks, sponsored industrial sessions, posters and outstanding paper presentations .

IMPACT anticipates to not only bring worldwide leading experts and engineers together in sharing state-of-the-art advanced microelectronic packaging and PCB technology but also bring informative programs and network to all the participants this years.

It is again our great honor and pleasure to welcome you to participate in this conference . We cordially hope that you will enjoy the insightful and inspiring technical discussions along with the warm hospitality here in Taiwan .

Sincerely,

Chih-I Wu, Ph.D. Co-Chair of IMPACT-EMAP 2020 Vice President & General Director, ITRI

▲ 6 Greeting

Welcome Message from Maurice Lee, Conference Co-Chair

Maurice Lee Co-Chair of IMPACT-EMAP 2020 Chairman, TPCA Senior Consultant ,Unimicron Technology Corporation

On behalf of IMPACT organizer, it is my great pleasure to welcome you to join the 15th International Microsystems, Packaging, Assembly, and Circuits Technology Conference. This year marks the 15th anniversary of IMPACT which aims to bringing the leading experts and scholars over the world together in discussion of inspiring study and latest insight of PCB and Packaging technology . IMPACT-EMAP 2020 is in conjunction with total 5 exhibitions, includes TPCA show TAITRONICS AIoT Taiwan OPTO TAIWAN Laser & Photonics Taiwan to build up a platform、 which combines、 the leading edge、 technology in、 electronic industry to inspire participants and hope to facilitate collaborations from various themes . Under the challenge of COVID-19, the Program Committee are committed to organize diverse forums involving Heterogeneous integration SiP HPC AI Technology 3D Embedding and new material for next generation with marquee 、plenary、 speakers、 from TSMC、 Unimicron ASE UMC and IBM Taiwan. With the support of virtual presentation, remote speakers、 can still join、 IMPACT、 and allows to maintain the collaboration with JIEP ICEP iNEMI Yole TechSearch who invites foreign experts to bring accesses to the cutting-edge、 trends、 and international、、 collaboration opportunities . We believe IMPACT-EMAP 2020 will bring a positive prospect towards state-of-the-art technology . As TPCA Chairman, I sincerely invite all of our TPCA members to come to Taipei Nangang Exhibition Center and to make the IMPACT-EMAP 2020 another vigorous, inventive event. We particularly welcome the participation of professionals, leaders and pioneers to join us on the largest annual gathering of PCB & Packaging field.

Best Regards,

Maurice Lee Co-Chair of IMPACT-EMAP 2020 Chairman, TPCA Senior Consultant, Unimicron Technology Corporation

7 ▲ 2020 2020 Special tribute The 22nd International Conference on Electronics Materials and Packaging

Special Tribute to Dr. Wei-Ping Dow

R.I.P (1967-2020)

Distinguished Professor, Department of Chemical Engineering, National Chung Hsing University

We are deeply saddened by the passing of Dr . Wei-Ping Dow in early 2020 .

Dr . Wei-Ping Dow graduated from National Tsinghua University with a PhD in Chemical Engineering, specializing in microelectronics process metallization technology, electrochemical deposition technology, electronic special chemistry, and the application of molecular self-assembly in optoelectronic process . In his decades of teaching career, Dr . Dow has taught thousands of students and been committed to promoting industry-academia cooperation .

Dr . Dow has been serving as a Technical Program Committee and reviewer of IMPACT for a long time and published numerous inspiring papers on the PCB field. Under his guidance, his students have won the best paper award of IMPACT several times. In the related fields, Dr. Dow is not only a pioneer in Taiwan’s academic circles, but also devoted to inspiriting his students. Dr. Dow can be entitled as a top scholar, an industry-academic doer, and a selfless educator.

On behalf of the board of committee of IMPACT-EMAP 2020, Dr . Ming-Yi Tsai, General Chair, would like to send our deepest respect and gratitude to Dr. Wei-Ping Dow. Wish Dr. Dow’s family good health and everything goes well .

▲ 8 Committee

Committee Member

General Chair Honorary Chair Co Chair Executive Co-Chair

Ming-Yi Tsai Kuo-Ning Chiang Chih-I Wu Shen-Li Fu Maurice Lee Albert Lan Chang Gung University NTHU ITRI IEEE-EPS Taiwan TPCA Applied Materials 2019 Executive Co-Chair

Albert Yeh C.P. Hung James Tsai Joshua Jiang Shin-Puu Jeng Eric Feng Triallian Corp . ASE Group Atotech Nan Ya Plastics Corp . TSMC TTMA

Technical Program Committee

TPC Chair Co-chair SubCommittee

Hsien-Chie Cheng Kyung W. Paik Yu-Jung Huang Andreas Ostmann Charles Bauer Chih Hang Tung FCU KAIST ISU Fraunhofer IZM TechLead Corp . TSMC

Sub-Committee

Haley Fu Shaw Fong Wong Shi-Wei Ricky Lee Yasumitsu Orii Albert Wu Alex King iNEMI Intel Technology HKUST NAGASE NCU Taimide Tech . Inc .

Allen Liu Ben-Je Lwo C. Robert Kao C.E. Ho C.Y.Huang Chang-Chun Lee TTMA NDU NTU YZU Senju Metal Industry NTHU Co ., Ltd .

9 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

Charlie Lu Chien-Yuh Yang Chih Chen Chuan-Seng Tan David Tarng Fan-Yi Ouyang TSMC NCU NCTU Nanyang Technological ASE Group NTHU University

Frank Bai G.S. Shen Hsiang-Chen Hsu Jason Lee Jeffrey Lee Jenn-Ming Song TPCA ChipMOS ISU BoardTek IST NCHU

Jimmy Hsu John Liu Jun Cao Kuan-Jung Chung Kuan-Neng Chen Kuoming Chen INTEL TPCA Henan Polytechnic NCUE NCTU UMC University

Lih Shan Chen Ming-Tzer Lin Shih-Kang Lin Tz-Cheng Chiu Wei-Chung Lo Wun-Yan Chen ISU NCHU NCKU NCKU ITRI ITRI

Yu-Hua Chen Yung-Yu Hsu Yu-Po Wang Unimicron Apple Inc . SPIL

▲ 10 Committee

International Advisory Board Chair Co-Chair

Chris Bailey Rolf Aschenbrenner Chew Chee Hiong Eiji Higurashi Hiroshi Yamada Jan Vardaman University of Greenwich, Fraunhofer IZM ON Semiconductor AIST Toshiba Corporation TechSearch UK

Johan Liu Kwang-Lung Lin Marc Benowitz Ning-Cheng Lee Noriyuki Miyazaki Rozalia Beica Chalmers University of NCKU iNEMI Indium Corp ., Kyoto University AT&S Technology

Sung Yi Takafumi Fukushima Takeyasu SAITO Ying-Hui Wang Portland State University Tohoku University, Japan Osaka Prefecture Institute of Microelectronics of University Chinese Academy of Sciences Domestic Advisory Board Chair

Hung-Yin Tsai C.H.Hsu Eric Tseng Harry Yang Heinz Lu Irving Lee nthu Unitech Ichia Technologies . MacDermid Alpha Tong Hsing UL Electronics Solutions

Mike Ma Stephen Wang Wendy Chen Amkor ETERNAL King Yuan Electronics

11 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

Local Committee Chair Co-chair

David Lai Michelle Hung TPCA TPCA

Secretariat Michelle Kao ITRI Sophia Huang TPCA Cindy Lee TPCA Owen Tsai TPCA

Registration & Public Relation Chelsea Kao TPCA

▲ 12 Information

General Information of IMPACT-EMAP

IMPACT-EMAP 2020 Conference, organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year will be held on Oct. 21st -23rd at Taipei Nangang Exhibition Center, in conjunction with TPCA Show, TAITRONICS AIoT Taiwan OPTO TAIWAN Laser & Photonics Taiwan . For grasping the latest trend, the symposium this year 、highlights the theme、 “IMPACT-EMAP、 on HPC - Toward the Data Era”. In the big data era, the fifth-generation (5G) mobile communication network brings out innovative technologies like mmWave and MIMO, which will change everything we know in cellular systems. Driven by high- frequency and high-speed transmission, the demand for processing huge amounts of information has emerged . Big data processing and high-speed computing have become key requirements for the development of the new generation. IMPACT-EMAP 2020 looks at the cutting-edge technological applications. With the increasing numbers of artificial intelligence (AI) and high-performance data analytics (HPDA), there is a need to expand high-performance computing infrastructure to cope with the challenges of machine learning, deep learning and enable to gain better understanding of digital data. That makes the HPC infrastructure more indispensable than ever. IMPACT-EMAP 2020 will arrange plenary speeches, special sessions, industrial sessions, invited talks, and outstanding paper and poster presentations. Meanwhile, this conference will keep collaborating with international organizations such as ICEP JIEP from Japan, KAIST from South Korea, and iNEMI from USA in this year’s gathering. 、 Due to the COVID-19 pandemic and restriction for cross-country traveling, IMPACT-EMAP 2020 will run as a hybrid conference which provides an opportunity for remote speaker to share their study as scheduled. We are pleased to bring you the annual technology gala of packaging, microsystems, assembly, PCB, materials and thermal . Hope you can enjoy the over 150 papers, speeches, posters and discussions . We sincerely pledge this conference can bring you access to meet industrial best practice, to create an opportunity for networking, and to build international collaborations .

About Conference ■ Date: October 21(Wed) - October 23 (Fri), 2020 ■ Venue: Taipei Nangang Exhibition Center, Taipei ■ Exhibition : TPCA Show TAITRONICS AIoT Room 502 Speaker Taiwan OPTO TAIWAN 、Laser & Photonics、 Taiwan Preview Room ■ Theme:、 IMPACT-EMAP 、on HPC – Toward the Data Era P o s ter OrganizerOﬃce Registration Desk Room 503 Room Reception desk is located on 5th floor of Taipei Nangang Exhibition Center . Coﬀee Please check in and get proceeding during the following Break P o s schedule ter Open Hour: 10/21 09:00-16:30 10/22 08:30-16:30 Rigistra�on 10/23 09:00-12:00 Desk

Organizer Office & Speaker Preview Room Room 504 a VIP Lounge Organizer’s office on the 5th floor of Taipei Nangang Exhibition Center . Open Hour: 10/21 08:30-17:30 10/22 08:30-17:30 Room 504 b 10/23 09:00-12:00 Room 504 c

13 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

International Welcome Dinner Internet Access (By invitation only) Wireless internet is provided on 5th floor of Taipei Time: Oct. 22th, 2020 (18:30 – 20:30) Nangang Exhibition Center for free . Venue: Gen.Sun Li-Jen Residence ( ) 孫立人將軍官邸 Lunch Address: No . 136, Sec . 1, Nanchang Rd ., Zhongzheng Dist ., Taipei City 100, Taiwan (R.O.C.) Organizer will arrange lunch vouchers for every TEL: 02-2321-6910 registered attendee . Invited Guest: Plenary Speakers, Invited speakers, Location: 3F, Banquet Hall ( ) , Taipei Nangang Exhibition Center, Hall 1 燴館 Sponsors, VIP and Committee members Date: Oct .21st-23rd, 2020 noon Time, suggested lunch Gathering Time: 5:50pm time . Gathering Site: In front of IMPACT registration desk 10/21 12:00-13:10 10/22 12:00-13:10 Location of Poster Session 10/23 12:00-13:30 Poster session will be located at foyer area, 5th floor of Identification of Badges Taipei Nangang Exhibition Center . Time: 11:00-12:00, Oct 22, 2020 Badges are required for admittance to all sessions, lunchbox and coffee break. Please bring it with you all Welcome to vote for your Best Poster of IMPACT-EMAP the times . 2020 Conference Venue Conference rooms will be located on the 5th floor of Taipei Nangang Exhibition Center . Conference Venue Map

TWTC Nangang Exhibition Hall Transport & Parking Information

Neihu . Donghu Parking Lots： TWTC Nangang／620 Parking spaces N Keelung River Taiwan Fertilizer C2 Parking Lot／352 Parking spaces Nanhu Bridge Taiwan Fertilizer C3 Parking Lot／768 Parking spaces

Huandong Blvd Taiwan Fertilizer C4 Parking Lot／82 Parking spaces

Park P5 MRT Neihu Depot Parking Lot／584 Parking spaces P5 ／During Exhibition Periods Huandong Blvd

Business Xingzhong Parking Tower／647 Parking spaces／ Lane 157 MRT Nangang Software Park Station P4 Jingmao NT$30(per hour)／24HR 1st Rd Yuanqu St Chongyang Rd Nangang Nangang Connecting P3 Highway Jingmao 2nd Rd Lane 106 Lane 105 I、II Underground Parking Huimin St NKSP Lane 88 Nangang P2 Parking Lot Xingzhong Rd Vocational NKSP High School III Entrance / Exit Xindong Rd Lane 62 The parking fee above is for Sanchong Rd 3 1 Directions to TWTC Nangang TWTC 6 reference only Singhua Rd Main Entrance Nangang Lane 44 Xinmin Rd TWTC P6 （underNangang construction） 2 4 2 5 B1 P1 Nangang Rd, Sec. 1 7 ： Dongnan St Transport Information Zhongnan St MRT TWTC Nangang Station Sijhih 1 Shuttle Bus Stop (Pick-up / Drop-off) Cheng-Zheng North-south railway(Western Line) Junior 2 Bus Stop High School 3 Taxi Drop-off Zhongxiao E. Rd, Sec. 7 Small Vehicle Drop-off Academia Rd, Sec. 1 4 5 B1 Taxi Pick-up Nangang 6 Underground Parking Entrance 7 MRT Shuttle Bus Stop (to MRT Nangang Station)

2010.05 Contact: Ms . Cindy Lee / Tel: +886-3- 3815659#407 / Email: cindy@tpca .org .tw

▲ 14 Information

IMPACT Best Paper 2019 IMPACT 2019 received over 190 papers, and we have conducted the 3 stage paper review process including abstract, full paper and onsite oral presentation. Thanks to the IMPACT Technical Program Committees, paper reviewers, and session chairs’ great support, we are delighted to announce those papers which have been selected as the IMPACT 2019 Paper Award .

Award Paper Paper Title Affiliation Author List Category Code

Packaging- TW0116 Ultra-thin Package Board Level Drop TSMC Shu-Shen Yeh Best Paper Reliability Modeling Award TW0052 Light Extraction Enhancement and High Tong Hsing Electronic Vito Cheng Relia-ble DPC Ceramic Base against Photochemical Damage by PVD Al Thin-film for UV-LED Appli-cation

AS0093 EMI Shielding Solutions for RF SiP Assembly SPIL James Su

Packaging- TW0101 Coupled Hygro-Thermo-Mechanical Analysis National Cheng Kung University Tz-Cheng Chiu Best of Moisture Induced Interfacial Stresses in student Fan-Out Package Award AS0037 LiTaO3/Quartz bonding with low-residual Waseda university Ami Tezuka stress Al2O3 amorphous intermediate layer for 5G surface acoustic wave devices .

TW0086 Reliability Prediction of WLP using AI Recur- National Tsing Hua University Yi-Chieh Tseng rent Neural Network Regression Model

PCB-Best TW0018 A novel fabrication process and measurement MMSL/ITRI Yiu-Hsiang Chang Paper results of 28GHz glass antenna with single Award TGV for 5G communication applications

EU0068 A Robust Palladium-Free Activation Process Atotech Deutschland GmbH Laurence Gregoriades for Electroless Copper Plating

PCB-Best TW0048 Roughness Effect of Cu Interconnects on Yuan Ze University Wei-Ling Chou Student Signal Transmission Performance in 5G Award Communica-tion Applications

TW0047 Microstructure Modification of Electroplating Yuan Ze University Cheng Yu Lee Cu and Improvement of Its Etching Characteris-tics in the Roughening Process

Packaging- AS0036 LTD PKG. (Liquid Thermal Dissipation Siliconware Precision Industries Dragon Huang Best Poster Package) Technology Co ., Ltd ./National Taiwan Award University

PCB-Best TW0124 Materials with low dielectric constant National Tsing Hua University Huang Chien Ho Poster and good thermal properties prepared Award by intro-ducing meldrum’s acid (MA) into bismaleimide based thermosetting resins

15 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

Hotel Information To enjoy the discount for IMPACT conference attendees, please book your hotel right away and make further follow- up confirmation with the hotel.

Hotel Infomation

The Evergreen Laurel Hotel Taipei Taiwan Taoyuan Interna�onal Airport—35mins by aiport shu�le bus 台北長榮桂冠酒店 Taipei Songshan Airport—15mins by taxi Tel: +886-2-2501-9988 MRT—5 mins by walk (Songjiang nanjing) *Near Xing�an Temple

The Place Taipei Taiwan Taoyuan Interna�onal Airport—45mins by taxi 南港老爺行旅 Taipei Songshan Airport—20 mins by taxi Tel: +886-2-7750-0588 MRT —5 mins by walk (Gangang So�ware Park) *Near Nangang Exhibi�on Center

Caesar Park Taiwan Taoyuan Interna�onal Airport—40 mins by Taoyuan Airport MRT 台北凱薩大飯店 Taipei Songshan Airport—15 mins by taxi Tel: +886-2-2311-5151 MRT —3 mins by walk (Taipei Main) *Near Taipei Main Sta�on

Courtyard Taipei Taiwan Taoyuan Interna�onal Airport—45 mins by taxi 六福萬怡酒店 Taipei Songshan Airport—20 mins by taxi Tel:886-2-2171-6565 MRT —2 mins by walk (Nangang) *Near Nangang Exhibi�on Center

Guideline for health and safety Inquiries Requests for information about the Conference should be directed to: Secretariat- Taiwan Printed Circuit Association TPCA-Cindy Lee No . 147, Sec . 2, Gaotie N . Rd ., Dayuan, Taoyuan 33743, Taiwan Tel: +886-3-3815659 Ext . 407 Fax: +886-3-3815150 E-mail: service@impact .org .tw Website: www .impact .org .tw

▲ 16 Plenary Speeches

PLENARY SPEECH Wednesday, October 21st, 10:30-11:20

Dr. Marvin Liao

Vice President, Advanced Packaging Technology and Service Taiwan Semiconductor Manufacturing Co., Ltd.

Topic: 3D Advanced Packaging Technology and Manufacturing Room 504

Outline ● 3D System Integration ▲

Advanced Packaging ▲

Chip Stacking ● Advanced Packaging Manufacturing ▲

Intelligent 3D Fab

Bio ● Education : - Ph .D ., Materials Science, University of Texas at Arlington, USA, 1989 - Bachelor, Materials Science, Tsing Hua University, Taiwan, 1979 ● Experience : - TSMC Advanced Packaging Technology and Service, 2011 ~ now - TSMC Special Project, 2009 ~ 2010 - TSMC Fab 6 Director, 2003 ~ 2009 - Chartered Semiconductor, 1997 ~ 2002 (Singapore) - Applied Materials, 1994 ~ 1997 (USA) - SGS Thomson Microelectronics (STM),1990 ~1994 (USA)

17 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

Wednesday, October 21st, 11:20-12:10

Dr. John Lau

CTO Unimicron Technology Corporation

Topic: Heterogeneous Integration for HPC Application Driven by AI and 5G Room 504

Outline/Abstract Semiconductor industry has identified five main growth engines (applications), namely mobile, HPC, autonomous vehicle, IoTs, and big data . The system-technology drivers such as 5G and AI are boosting the growths of these 5 applications . Because of the drive of 5G and AI, the HPC semiconductors' speed increases, density increases, pad-pitch decreases, chip-size increases, and power dissipation increases . All these provide challenges (opportunities) to packaging technologists. One of the advanced packaging technologies is heterogeneous integration (HI), which uses various packaging technologies to integrate dissimilar chips, photonic devices, or components (either side-by-side, stack, or both) with different materials and functions, and from different fabless design houses, foundries, wafer sizes, feature sizes, and companies into a system or subsystem. For the next few years, we will see more of a higher level of HI, whether it is for time-to-market, performance, form factor, power consumption, signal integrity, and/or cost . In this presentation, the HI will be defined and it is classified into 5 categories, namely, HI on organic substrate, HI on TSV-interposer substrate, HI on TSV-less interposer substrate, HI on fan-out RDL-substrate, and HI on ceramic substrate. The trends of HI for HPC driven by 5G and AI will also be discussed .

Bio John H Lau with more than 40 years of R&D and manufacturing experience in semiconductor packaging, John has published more than 500 peer-reviewed papers, 30 issued and pending US patents, and 20 textbooks on, e.g., Advanced MEMS Packaging (McGraw-Hill, 2010), Reliability of 2D and 3D IC Interconnects (McGraw-Hill, 2011), TSV for 3D Integration, (McGraw-Hill, 2013), 3D IC Integration and Packaging (McGraw-Hill, 2016), Fan-out Wafer-Level Packaging (Springer, 2018), Heterogeneous Integrations (Springer, 2019), and Assembly and Reliability of Lead-Free Solder Joints (Springer, 2020). John is an elected ASME Fellow, IEEE Fellow, and IMAPS Fellow .

▲ 18 Plenary Speeches

Thursday, October 22nd, 9:00-9:50

Dr. C.P. Hung

Vice President, Engineering Design Group ASE Group

Topic: Now and Future SiP for Double HI

Room 504

Outline System in Package (SiP) provides the user the great promise to optimize and differentiate their products to meet their integration requirements. This talk will review innovations in SiP technologies – Flip-Chip, Fan- Out, embedded and beyond, describing how these promises are fulfilled for achieving higher bandwidth, small form factor, with increased functionality and mixed wafer nodes, so very comprehensive Heterogenous Integration and Homogeneous Integration technologies for the AIoT, 5G and data center application .

Bio Education: • Ph .D . from Department of Electrical and Electronic Engineering, University of Paisley, UK Experience: • SEMICON_TaiwanPKG CommitteeChair since 2013 • IEEE EPS Board of Governor since 2019 • In ASE Holdings Inc., currently VP of Corporate R&D;Previous VP of Logistic Service Integration / Business DevelopmentandVP of Central Engineering, in ASEKH Biography: • Dr. CPHung currently holds the position of Vice President, Corporate R&D, at ASE Holdings Inc.Based in Kaohsiung, Taiwan, he leads teams responsible for next-generation product development to be rolled out to various ASE manufacturing sites . He has been a SEMI Taiwan PKG & TEST Committee Chair since 2013 . He received the Ph .D . degree in Department of Electrical and Electronic Engineering from the University of Paisley, U .K . • Dr . Hung has over 20 years of research focusing product developed featuring integrated design technologies, as well as a broad range of advanced chip, package, and system integration solutions. Hehas over 50 technical publications of SCI journal and international conference papers . Dr . Hung is also the inventor of more than 72 patents in multiple countries .

19 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

Thursday, October 22nd, 10:00-10:50

Dr. Wenchi Ting

Vice President, Technology United Microelectronics Corporation

Topic: Emergent Memory Technology at the Crossroads

Room 504

Outline The few most promising emerging memory technologies have now passed the stage of so-called “peak of inflated expectations,” and are now entering a more mature phase. This allows the technology community to take a realistic assessment of the directions they are heading toward, which will be covered in this speech.

Bio Wenchi Ting received his Ph . D . from the University of Texas at Austin . In his 29 years in the semiconductor industry, he has worked for companies such as UMC, Macronix, NXP, and TSMC in various technology development and operation management capacities . Currently his mission at UMC is to identify new technology opportunities in areas such as embedded memory and other specialty technologies .

▲ 20 Plenary Speeches

Friday, October 23rd, 9:20-10:10

Mr. David Chang

Senior Managing Consultant, Global Electronics Center of Competence IBM

Topic: Impact of Connected Manufacturing in the New 5G Era Room 504

Outline In average, it takes about a decade to advance a generation (G) in the path of telecommunication technology evolution . A leap forward from 4G to 5G implies not only the increase of 10-100 folds of data transmission and network speed but also the unexplored potentials for improvement, innovation and transformation . In the era of 5G, operations and services available for inside and outside a manufacturing fab that built around smart and connected technologies such as Cloud, Internet of Things (IoT), Artificial Intelligence (AI), and many other applications would have a different look with a different value delivery result expected. In the speech, both IBM’s perspectives on the 5G impact, thoughts, and strategy in deign as well as application of the connected technologies in manufacturing will be explored and addressed .

Bio ▲ Profile Joint IBM in 1997 Industrial Sector knowledge in Semiconductor and TFT-LCD Manufacturing areas specializing in Solution Design, Implementation, Solution Offering, and Project Management in Manufacturing Execution System (MES) and Analytics Solutions ▲ Career History 2015 to date Industry Consultant, IBM Global Electronics Center of Competence 2009 – 2015 Engagement Partner 2003 – 2009 Project Manager/Engagement Manager 1999 – 2003 MES Solution Architect / MES Consultant 1997 – 1999 IBM MES Solution IT Specialist / Subsystem Leader

21 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION INTRODUCTION

Opening Ceremony & Best Paper Award Ceremony Time: 10:00-10:30, Wednesday, Oct . 21, 2020 Room: R504, Taipei Nangang Exhibition Center Symposium Chair: Ming-Yi Tsai, Ph .D . General Chair of IMPACT-EMAP 2020 President, IMAPS-Taiwan Professor, Chang Gung University

ORAL PRESENTATION SESSION 1: HPC Room: 504a Time: 13:10-15:10, Wednesday, Oct . 21, 2020

Time Topic Lead Author Affiliation 13:10-13:40 HPC options and challenges TechSearch Pre-recorded

Jan Vardaman 13:40-14:10 Advanced Substrate Technology for Heterogeneous Unimicron Integration

Jackie Chien 14:10-14:40 Emerging Solutions for High Performance Digital Computing Third Millennium Test Requirements Pre-recorded

W. R. (Bill) Bottoms 14:40-15:10 Process technology evolution to enable more than Moore system scaling in High performance computing Pre-recorded

Jobert van Eisden Atotech

Sven Lamprecht Atotech * Scan the QR code and submit your question to the speaker

▲ 22 Sessions

SESSION 2: JIEP Time: 13:10-15:15, Wednesday, Oct . 21, 2020 Room: 504b Chair: Takeyasu SAITO, Osaka Prefecture University

Time Topic Lead Author Affiliation

13:10-13:35 Development of Self-releasing adhesive tape as a Sekisui Chemical(Taiwan) temporary bonding material for 3D integration Co .,Ltd .

Iris CHEN 13:35-14:00 Total Solutions for mass production of micro LED display Toray Engineering Co ., Ltd .

Yasuyuki SAKAMOTO 14:00-14:25 Dielectric Material with Low Insertion Loss at High Sekisui Chemical(Taiwan) Operational Temperature Enabling Features for Next-Gen Co .,Ltd . 2.5D Packages for HPC

Po Chao Chang 14:25-14:50 Development of Highly Flexible/Stretchable Epoxy Film, Mitsubishi Chemical Especially Suitable for Display and Printed Electronics Corporation Pre-recorded

Iori DOI 14:50-15:15 Low Stress and Low Temperature Curable Photosensitive Toray Industries, Inc . Polyimide Pre-recorded

Yu Shoji * Scan the QR code and submit your question to the speaker

23 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION 3: Advanced Packaging 1 Time: 13:10-15:10, Wednesday, Oct . 21, 2020 Room: 504c Chair: Dyi-Chung Hu, Siplus Shih-Kang Lin, National Cheng Kung University Paper Time Topic Lead Author Affiliation Code 13:10-13:40 Invited Reduce the Levels of Heterogeneous Siplus Integration by using Integrated Substrate

Dyi-Chung Hu 13:40-13:55 AS0084 Evaluation of Critical Bevel Angle for Ultra- Tatsuhiko Aoki Global Wafers Japan Co ., Thinning of Wafer Ltd . Pre-recorded

13:55-14:10 TW0034 Evaluation of Laser Releasable Temporary Tsung Yu Ou Yang Industrial Technology Bonding Adhesives for the Thinned Wafer Research Institute (ITRI) Integration 14:10-14:25 TW0035 Optimization of Temporary Wafer Bonding Tsung Yu Ou Yang Industrial Technology Materials and Processes for 3D IC Integration Research Institute (ITRI) 14:25-14:40 TW0030 Design for Void Free Transfer Molding SiP Bing-Yuan Huang ASE Technology Holding Co ., Ltd . 14:40-14:55 TW0021 MICRO BUMP INTERFACE JOINT VALIDATION Nistec Chang Siliconware Precision ENABLING 3D PACKAGE ARCHITECTURE Industries Co ., Ltd 14:55-15:10 TW0115 FOMCM Assembly Technology for Chiplet in Kao Feng SPIL HPC Application * Scan the QR code and submit your question to the speaker

▲ 24 Sessions

SESSION 4: Advanced and Green Materials and Process Time: 13:10-15:10, Wednesday, Oct . 21, 2020 Room: 503 Chair: Cheng-Ta Ko, Unimicron Jenn-Ming Song, National Chung Hsing University Paper Time Topic Lead Author Affiliation Code 13:10-13:40 Invited Preparation Technology and Applications Henan Polytechnic Research of New Alloy Bonding Materials University Pre-recorded

Jun Cao 13:40-13:55 TW0093 Formation of Hydrophilic Nanoporous Copper Yuan-Kuan Chen National Chung Hsing Surface University Materials Science and Engineering 13:55-14:10 TW0090 High-throughput calculations for Sn-Bi-based Chih-han Yang National Chen Kung low-temperature lead-free solders University 14:10-14:25 TW0087 A 77 GHz Planar Antenna Array in Four Chien-Chang Huang Yuan Ze University Layer Printed Circuit Board for Automotive Radar Applications 14:25-14:40 TW0078 Electromagnetic Properties of Ni(P) and Hao-Wei Tseng Unimicron Technology Its Signal Transmission Performance in 5G Corp ./Yuan Ze University Communication Applications 14:40-14:55 TW0107 Photonic Sintering of Composite Pastes with Wei-Han Cheng National Chung Hsing Copper Oxide Powders Using Different Light University Sources * Scan the QR code and submit your question to the speaker

25 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION 5: SiP Time: 15:40-17:40, Wednesday, Oct . 21, 2020 Room: 504a Chair: YuPo Wang, SPIL Kuo-Ming Chen, UMC

Time Topic Lead Author Affiliation

15:40-16:10 System in Package (SiP) business is booming driven by Yole Développement heterogeneous integration demand Pre-recorded

Santosh Kumar 16:10-16:40 PCB Frame Embedding for High-Density Packages Fraunhofer IZM Pre-recorded

Andreas Ostmann 16:40-17:10 Low-thermal-budget Cu-Cu bonding by (111)-oriented National Chiao Tung nanotwinned Cu University

Chih Chen 17:10-17:40 Innovative Antenna in Package Solution for 5G mmW SPIL

Chih Yuan Shih * Scan the QR code and submit your question to the speaker

▲ 26 Sessions

SESSION 6: Signal and Power Integrity Time: 15:40-17:40, Wednesday, Oct . 21, 2020 Room: 504b Chair: Lih-Shan Chen, I-Shou University Yu-Jung Huang, I-Shou University Paper Time Topic Lead Author Affiliation Code 15:40-16:10 Invited IPC Standard Update for PCB Electrical Intel Corporation Characterization Pre-recorded

Jimmy Hsu 16:10-16:25 AS0038 Vertical Silicon capacitors integration within Charles Muller Murata Integrated Passive IC package for lower ESL using thicker and Solutions multiple wiring pattern Pre-recorded

16:25-16:40 TW0091 Electrical performance of Multi-chip Chiplet Ho Chuan Lin Siliconware Precision Integration System Industries Co . Ltd . 16:40-16:55 TW0075 High Speed SerDes Design on FOCoS with Li-Chieh Hung Advanced Semiconductor Thick RDL Engineering, Inc . 16:55-17:10 TW0053 The substrate design rule impact on Hong-Sheng Huang Advanced Semiconductor millimeter-wave antenna-in-package Engineering (ASE) application 17:10-17:25 TW0055 Enhanced Simulation Methodology for High- Neo Hsiao Intel speed Data Center Application 17:25-17:40 TW0060 Low loss interconnection Solutions of Chip- Chia Ching Chu ASE Group to-Antenna for millimeter-wave Antenna-in- Package application * Scan the QR code and submit your question to the speaker

27 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION 7: Warpage Characterization Time: 15:40-17:40, Wednesday, Oct . 21, 2020 Room: 504c Chair: Po-Yao Lin, TSMC Ben-Je Lwo, National Defense University Paper Time Topic Lead Author Affiliation Code 15:40-16:10 Invited PCB Warpage Characterization and Wistron Corporation Minimization

Mike Huang 16:10-16:25 TW0098 Development of Modified Convolution Neural Guan-Ru Huang National Tsing Hua Network Model for Panel Level Warpage University Prediction 16:25-16:40 TW0068 Process and Thermal Effects on Warpage of Yi-Huang Chen Feng Chia University Flip Chip Package on Packaging 16:40-16:55 TW0088 Warpage Assessment of Chip Module in Chip George Pan SPIL Last FO-MCM Platform for Non-wetting Risk Evaluation 16:55-17:10 TW0057 Prediction of Warpage Considering P-V-T-C Sheng-Jye Hwang National Cheng Kung Relation and Viscoelastic Behavior of EMC University during IC Encapsulation Process 17:10-17:25 TW0025 Predictive Modelling Methodologies for Bi- Jennan Wang Core Tech System Co ., Ltd . material Strip Warpage

▲ 28 Sessions

SESSION 8: Test, Quality, AOI, Inspection and Reliability Time: 15:40-17:55, Wednesday, Oct . 21, 2020 Room: 503 Chair: Kuan-Jung Chung, National Changhua University of Education Irving Lee, UL Paper Time Topic Lead Author Affiliation Code 15:40-16:10 Invited Press-Fit Standard for Automotive UL LLC Requirements

Irving Lee 16:10-16:25 TW0111 Study of Electromigration of Solder Tzu Wen Lin NCTU Microbumps by 3D X-ray Microscopy 16:25-16:40 TW0082 Enhancement on the bonding strength of Cu- Jia Juen Ong National Chiao Tung Cu joints by 2-step annealing University 16:40-16:55 TW0076 An effective accelerated method to verify Dem Lee Integrated Service the creep corrosion failure occurrence on Technology, Inc . electronics 16:55-17:10 TW0073 High Electromigration Resistance of I-Hsin Tseng National Chiao Tung Nanotwinned Cu Used in Redistribution Layers University of Fan-out 17:10-17:25 TW0074 High toughness of nt-Cu lines for RDLs in Fan- Wei-You Hsu National Chaio Tung out wafer level packaging University 17:25-17:40 TW0070 Reliability of Instant Bonding of Cu-Cu joints: Kai-Cheng Shie National Chiao Tung ☆ Thermal Cycling and Electromigration Tests University 17:40-17:55 TW0047 Direct Current Tester (DCT) Applied to 2.5D Yi-Sheng Lin Advanced Semiconductor IC Defect Analysis Engineering ☆ 2020 PCB Student Best Paper

29 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION 9: AI Technology Time: 13:10-15:10, Thursday, Oct . 22, 2020 Room: 504a Chair: David Tarng, ASE Group Henry Lin, ASE Group

Time Topic Lead Author Affiliation

13:10-13:35 AI processors : the new fuel of innovation in the advanced Yole Développement packaging industry Pre-recorded

Emilie Jolivet 13:35-14:00 @ ITRI

Wei-Chung Lo 14:00-14:25 @ Taipei Medical University

Marc Hsu 14:25-14:50 @ ASE Group

Calvin Hsiao 14:50-15:15 Broad PVD solution offering for Advanced Substrate, Luke Liu Applied Materials Backside Metal and EMI Shielding * Scan the QR code and submit your question to the speaker

▲ 30 Sessions

SESSION 10: New Materials for Next Generation Time: 13:10-15:10, Thursday, Oct . 22, 2020 Room: 504b Chair: Gordon Lee, Nanya Plastic

Time Topic Lead Author Affiliation

13:10-13:30 High Frequency CCL Materials for 5G and Millimeter Wave Nanya Plastic Applications

Ming Hao Huang 13:30-13:50 Fiber Weave Study With Stackup and CCL Materials Nanya Plastic

Chia-Chieh Hsiao 13:50-14:10 Next generation high speed Server Halogen free ultra low Nanya Plastic loss materials develop

Shiau-Peng Hung 14:10-14:30 High reliability Low Dk/Df Low C.T.E Halogen free Nanya Plastic materials develop

Chun-Hsiung Yang 14:30-14:50 Advanced FCCL Copper Foil for 5G Application Nanya Plastic

Elena Chen 14:50-15:10 Properties of High Comparative tracking index(CTI) Nanya Plastic Photoimageable Solder Mask

Huang Shao En

31 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION 11: Power Electronic Packaging Time: 13:10-15:10, Thursday, Oct . 22, 2020 Room: 504c Chair: Hsien-Chie Cheng, Feng Chia University Chun-Kai Liu , ITRI Paper Time Topic Lead Author Affiliation Code 13:10-13:40 Invited EV Power Module Optimization and ITRI Reliability Testing

Chun-Kai Liu 13:40-13:55 AS0109 Enabling MSL1 Zero Delamination Packaging April Joy Garete Nexperia Solutions for Robust Automotive Power Electronics Packages Pre-recorded

13:55-14:10 TW0080 High Tensile Strength Nanotwinned Copper Chen Fu-Chian National Chiao Tung Applied to Negative Electrode Substrate in University Lithium Battery 14:10-14:25 TW0043 Electro-Thermal Modeling of Three-phase Yan-Cheng Liu Feng Chia University Bridge Inverter System 14:25-14:40 TW0054 Double-Sided Cooling SiC Power Module Chun-Kai Liu Industrial Technology Packaging for Industrial Motor Driving System Research Institute (ITRI) 14:40-14:55 TW0058 Power Cycle Reliability of Power Module with Hsueh-Kuo Liao Delta Electronics, Inc Different Solder Systems 14:55-15:10 TW0032 The New SSMT Design of Intelligent HENG LEE Industrial Technology Power Module for Low Power Motor Drive Research Institute (ITRI) Applications * Scan the QR code and submit your question to the speaker

▲ 32 Sessions

SESSION 12: Advanced Materials and Processg Time: 13:10-15:10, Thursday, Oct . 22, 2020 Room: 503 Chair: Chih Chen, National Chiao Tung University John Liu, TPCA Paper Time Topic Lead Author Affiliation Code 13:10-13:40 Invited Chemical approaching for reliability, quality Grand Joint Technology & yield improvement for power device, 5G Ltd new components & via last TSV Pre-recorded

Onishi Tetsuya 13:40-13:55 AS0105 Effects of minor element addition on Yuki Hirata Osaka University mechanical properties of Sn-Bi alloy . Pre-recorded

13:55-14:10 TW0028 Compression Molding Mechanism and YiXuan Lin Advanced Semiconductor Parameter Evaluation of SiP Engineering (ASE) Inc. 14:10-14:25 TW0027 X-on-interposer ecosystem to migrate IoT1.0 eigen fu Yuan Consulting Ltd to value-added IoT2 0. 14:25-14:40 TW0004 Fabrication and Characterization of Wafer Ying-Tzu Hung Industrial Technology Level Three-Dimensional Silicon Lens Research Institute (ITRI) 14:40-14:55 TW0079 Effects of Surface Finish on the Intermetallic Cheng-Han Li Yuan Ze University Compound Formation and Mechanical Reliability of Microelectronic Solder Joints 14:55-15:10 TW0085 High thermal conductivity thermal interface Wen-Yu Teng Siliconware Precision material (TIM) for advanced packaging Industries Co ., Ltd applications * Scan the QR code and submit your question to the speaker

33 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION 13: HDI Technology Time: 13:10-15:10, Thursday, Oct . 22, 2020 Room: 502 Chair: Alex King, Taimide Kuo-Chan Chiou, ITRI Paper Time Topic Lead Author Affiliation Code 13:10-13:40 Invited 5G antenna Printed Wiring Boards Interconnection Technology, Inc Pre-recorded

Henry H . Utsunomiya 13:40-13:55 TW0077 Microstructure Modification of Fine Copper Cheng Yu Lee Yuan Ze University Lines and Mechanical Reliability 13:55-14:10 EU0066 Next generation of adhesion enhancement Thomas Thomas Atotech Deutschland system for high frequency PCB manufacturing GmbH Pre-recorded

14:10-14:25 EU0061 Copper Surface Preparation to Enhance NEAL WOOD ATOTECH Absorption of Carbon Dioxide Laser Energy in Blind Micro-via Formation Pre-recorded

14:25-14:40 EU0065 A new oxide replacement process to meet Thomas Thomas Atotech Deutschland the high process cleanliness requirements of GmbH mSAP Production Pre-recorded

14:40-14:55 EU0015 ENEPIG – HOW TO OVERCOME Britta Schafsteller Atotech Deutschland LIMITATIONS OF PURE PALLADIUM PLATING GmbH SOLUTIONS Pre-recorded

14:55-15:10 US0006 COPPER ELECTROPLATING PROCESS for Kesheng Feng MacDermidAlpha Inc mSAP Pre-recorded

* Scan the QR code and submit your question to the speaker

▲ 34 Sessions

SESSION 14: Heterogeneous Integration 1 Time: 15:40-17:50, Thursday, Oct . 22, 2020 Room: 504a Chair: Shin-Puu Jeng, TSMC Albert Lan, Applied Material

Time Topic Lead Author Affiliation

15:40-16:05 Market leading process and equipment solutions for 3D Applied Materials Heterogeneous Integration Packaging applying in AI and HPC Applications

Albert Lan 16:05-16:30 Package Technologies for AI and HPC applications MTK

Ian Hsu 16:30-16:55 Heterogeneous System-Level Package Integration – Trends TSMC and Challenges

Daniel Chang 16:55-17:20 Future applications and markets for Heterogeneous TechSearch Integration Pre-recorded

Jan Vardaman 17:20-17:50 Panel Discussion Moderator: Director, TSMC Albert Lan, Senior Director, Applied Material Shin-Puu Jeng Chung Key, Senior Director, SPIL Daniel Chang, Manager, TSMC Lewis Huang, Vice President, Senju Electronic Ian Hsu, Director, MTK Wei-Chung Lo, Deputy General Director, ITRI * Scan the QR code and submit your question to the speaker

35 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION 15: ICEP Time: 15:40-17:40, Thursday, Oct . 22, 2020 Room: 504b Chair: Yasumitsu Orii, NAGASE & CO ., LTD . Andy Tsai, NAGASE & CO ., LTD .

Time Topic Lead Author Affiliation

15:40-16:05 AI Hardware Drives Innovation of Heterogeneous IBM Research Tokyo Integration Pre-recorded

Takashi Hisada 16:05-16:30 Market Trend of FOPLP NAGASE & CO ., LTD . Pre-recorded

Atsushi Takahashi 16:30-16:55 High Frequency Chracteristics of Glass Interposer Dai Nippon Printing Co ., Ltd . Pre-recorded

Satoru Kuramochi 16:55-17:20 Fabrication of Imprint-Through Mold Via (i-TMV) and its Hitachi Chemical Co ., Ltd . application for compartmental EMI shielding Pre-recorded

Tomoaki Shibata * Scan the QR code and submit your question to the speaker

▲ 36 Sessions

SESSION 16: Design, Modeling & Testing Time: 15:40-17:55, Thursday, Oct . 22, 2020 Room: 504c Chair: Tz-Cheng Chiu, National Cheng Kung University Chang-Chun Lee, National Tsing Hua University Paper Time Topic Lead Author Affiliation Code 15:40-16:10 Invited Electro and Stress-Induced Migration of Tohoku University Various Thin Film Interconnections Pre-recorded

Hideo Miura 16:10-16:25 TW0112 Effects Of Substrate Modulus On Thermal Allen Liu NTU Fatigue Life Of Solder Joints 16:25-16:40 TW0102 Reliability Assessment of Thermal Induced Yu-wei Huang ITRI Creep Failure of WLCSP 16:40-16:55 TW0071 A cyclic-softening viscoplastic model for Tz-Cheng Chiu National Cheng Kung considering the temperature-cycling reliability University of SAC305 solder joints 16:55-17:10 TW0062 Effective material characteristics extraction Chang-Chun Lee National Tsing Hua on redistribution layer of fan-out panel-level University packaging architecture 17:10-17:25 TW0039 Fracture Modeling and Characterization of Shu-Shen Yeh TSMC Underfill/Polymer Interfacial Adhesion in RDL Interposer Package 17:25-17:40 TW0031 The Application of Reverse Engineering Lev Tseng ASE Group Chung-Li Method on Compact Thermal Model Extraction 17:40-17:55 TW0029 System Thermal Analysis of RF SiP Module in Cheng-Yu Tsai Advanced Semiconductor Smartphone Engineering Inc. (ASE Inc.) * Scan the QR code and submit your question to the speaker

37 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION 17: Advanced Packaging 2 Time: 15:40-17:40, Thursday, Oct . 22, 2020 Room: 503 Chair: Chih Hang Tung, TSMC Kuan-Neng Chen, National Chiao Tung University Paper Time Topic Lead Author Affiliation Code 15:40-16:10 Invited Electrochemical Solutions for Next generation Ralf Schmidt Atotech Advanced Packaging Pre-recorded

16:10-16:25 EU0040 Room Temperature Interconnection Technology Olav Birlem NanoWired GmbH for Bonding Fine Pitch Bumps Using NanoWiring, KlettWelding, KlettSintering and KlettGlueing Pre-recorded 16:25-16:40 TW0049 Panel Level RDL Topography Improvement Shao-An Yen Industrial Technology by Pattern Compensation Design with Digital Research Institute (ITRI) Lithography Technology 16:40-16:55 TW0020 Effects of Isothermal Heat Treatment on HAN TANG HUNG National Taiwan University Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure 16:55-17:10 TW0101 Effects of Surface Porosity on Ultrasonic Cu/ Liang-Shing Shih National Chung Hsing Cu Bonding University 17:10-17:25 TW0160 Preliminary study on the simulation of hole Po-Ning Hsu National Chiao Tung formation characteristics of nano-twin copper University * Scan the QR code and submit your question to the speaker

▲ 38 Sessions

SESSION 18: Electro Deposition and Electrochemical Processing Technology Time: 15:40-17:40, Thursday, Oct . 22, 2020 Room: 502 Chair: John Liu, TPCA Wun Yan Chen, ITRI Paper Time Topic Lead Author Affiliation Code 15:40-16:10 Invited Versatile TIM Solution with Chain Network Indium Corporation Solder Composite Pre-recorded

Ning-Cheng Lee 16:10-16:25 TW0108 Influence of Phase Constitutes and CING-WUN JHENG National Chung Hsing Distributions on Electrochemical Properties of University Cu-Ag Sintered Interconnections 16:25-16:40 TW0081 Controlling Magnetism of Diamond Powder Hui-Hung Lo National Tsing Hua ☆ Metallization using Electroless Cobalt/Nickel University Plating 16:40-16:55 TW0083 A Novel Wet Metallization on Photo- JIA-YI GUO National Tsing Hua ☆ Imageable Dielectric Material with High University T-Peel Adhesion Using Pd Nanoparticle Catalyst and Micro Surface Roughening 16:55-17:10 TW0018 The Contact Resistance Between Pogo Pin of Ho-Shu (Plory) Huang National Taiwan University IC Package Final Test Socket and Surface Finish Quality of Load Board PCB Pad 17:10-17:25 EU0046 A SAP-Capable Electroless Copper Plating Laurence Gregoriades Atotech Deutschland Procedure Deploying Palladium-Free GmbH Activation Pre-recorded

17:25-17:40 US0005 Single Step Metallization Process for the Richard Bellemare MacDermid Enthone Filling of Through Holes with Copper Electronic Solutions Pre-recorded

* Scan the QR code and submit your question to the speaker ☆ 2020 PCB Student Best Paper

39 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION 19: Heterogeneous Integration 2 Time: 10:30-12:35, Friday, Oct . 23, 2020 Room: 504a Chair: Wei-Chung Lo, ITRI Kuo-Ning Chiang, NTHU

Time Topic Lead Author Affiliation

10:30-10:55 ASE Pre-recorded

Bill Chen 10:55-11:20 Advanced Packaging Solutions for High Performance SPIL Computing and Big Data processing

C . Key Chung 11:20-11:45 Through Packaging, Interconnect Status and Trend to see Senju Electronic the Challenges and Opportunities for Advanced Materials

Lewis Huang 11:45-12:10 Driving Future Innovation and Growth through AT&S Heterogeneous Integration Pre-recorded

Rozalia Beica 12:10-12:35 Heterogeneous Integration of Surface Ion Trap, Silicon Nanyang Technology Photonics and 3D-TSV for Quantum Computing University Pre-recorded

Chuan-Seng Tan * Scan the QR code and submit your question to the speaker

▲ 40 Sessions

SESSION 20: 3D-Embedding Time: 10:30-12:35, Friday, Oct . 23, 2020 Chair: Ray-Min Tain, Unimicron Room: 504b Yoshihisa Katoh, Fukuoka University Executive coordinator: Hisao Kasuga, International Jisso Centre

Time Topic Lead Author Affiliation

10:30-10:55 The concept of 3D Fan-out Device Embedded Module Korea Packaging (FODEM) Integration Association-JKC Pre-recorded

Hyun-Ho Kim 10:55-11:20 Study of 3D Device Embedded Module toward the high- Fukuoka University performance IoT Module and AI edge Module Pre-recorded

Yoshihisa Katoh 11:20-11:45 A New Material and Process Technology of Single Layer ITRI Embedded Capacitor

Chun-An Lu 11:45-12:10 System Level Co-Design Platform for 3D SiP & 3D electronic Zuken Inc. module Pre-recorded

Masaomi Suzuki 12:10-12:35 Embedded Structure for PCB Thermal Solution in High Unimicron Speed Optical Module

Ray-Min Tain * Scan the QR code and submit your question to the speaker

41 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

SESSION 21: Machine Learning Application Time: 10:30-12:30, Friday, Oct . 23, 2020 Room: 504c Chair: De-Shin Liu, National Chung Cheng University Ta-Hsin Chou, ITRI Paper Time Topic Lead Author Affiliation Code 10:30-10:45 AS0033 Reliability Assessment of Wafer Level Sunil Kumar Panigrahy National Tsing Hua Package using K-nearest neighbor’s University Regression Model 10:45-11:00 TW0099 Study on Reliability Assessment of Wafer Hsuan-Cheng Kuo National Tsing Hua Level Package Using Design-on-Simulation University with Support Vector Regression Techniques 11:00-11:15 TW0097 Investigation of data distribution effect in Bo-Wei Chen National Tsing Hua Random Forest Machine Learning Algorithm University for WLCSP Reliability Prediction 11:15-11:30 TW0096 Study on Data Effect of Using RNN Model Sheng-Yuan Fu National Tsing Hua to Predict Reliability Life of Wafer Level University Packaging 11:30-11:45 TW0042 Predicting Sn-based solder hardness using Yu-chen Liu National Cheng Kung machine learning University 11:45-12:00 TW0086 Millimetre Wave Receiver of Radar Wen-Cheng Lai National Taiwan University Detection with Deep Learning for ADAS Edge of Science and Technology Computing Vision 12:00-12:15 TW0012 Offline Data Analysis On Panasonic SMT ZongYuan Wu USI Production Log

▲ 42 Poster Session

Postet session

Time: 10:00-11:00, Thursday , Oct . 22, 2020 Venue: 5F, Taipei Nangang Exhibition Center Paper Topic Lead Author Affiliation Code TW0100 Influence of N2 ratio in Hydrogen/Nitrogen Plasma on Titanium Chan Huang-Tian Kun Shan University dioxide/Aluminum doped Zinc Oxide Bilayer Films Applied for Multifunctional Energy-saving Glass TW0067 WLCSP Solder Ball Interconnection Enhancement for High Stephen Chen TSMC Temperature Stress Reliability TW0023 Determination of Biaxial Bending Strength of Thin Silicon Dies by YU WEN WANG Chang Gung University the PoEF Test TW0037 The investigation of the correlation between electroless nickel Ian Su HLHC Industry Co.; Ltd. immersion gold and high-speed signal transmission TW0041 Controllable Growth of Nanotwinned Copper and their Yong-Da Chiu ASE Characteristics Explore TW0063 Development of electrochemical deposition plating technology for Shau Fei Cheng Industrial Technology high resolution redistribution layer using design of experiment and Research Institute (ITRI) simulation method TW0036 STUDY OF DSP (TMS320F2812) CHIP FOR ADVANCED Chang Kuo-chi Fujian University of PHOTOVOLTAIC POWER GENERATION MAXIMUM POWER POINT Technology TRACKING CONTROL SYSTEM TW0008 STUDY OF FPGA-BASED EDGE COMPUTING IN SEMICONDUCTOR Chang Kuo-chi Fujian University of MANUFACTURING SAFETY MANAGEMENT APPLICATION Technology TW0009 Ergonomics Management of High-tech FAB based on Visual Chang Kuo-chi Fujian University of Recognition- Case Study for Etching Process PM Technology TW0010 Study of Green Supply Chain Management Platform Performance Chang Kuo-chi Fujian University of for Intelligent High-tech Factory based on Advanced CSR Technology Governance TW0161 Signal Integrity Improvement on High-Speed Packaging Routing by Ming-Lung Kung R .O .C . Air Force Academy Enhanced T Stub TW0092 Feasibility Study of Designing SR Dam or Trench on SiP Module to Chunchi Chiu Universal Global Scientific Solve Under-fill Bleeding Industrial Co ., LTD TW0064 Process induced warpage simulation of redistribution layer TeHsun Lin Industrial Technology structure integrated with LTPS TFT using Fan-out Panel Level Process Research Institute (ITRI) TW0048 Characteristics of Power Module with New Advanced Substrate HAO CHIANG HSU Delta Electronics

TW0011 Flexible Thermoelectric Films by Electrospinning Ben-Je Lwo National Defense University

TW0103 Hybrid Cu-Cu Bonding with Non-Conductive Paste and Highly Yu-Hao Kuo National Chiao Tung (111)-Oriented Nanotwinned Copper University TW0113 Wearable Conforming Intelligent Vital Signs Detection Patch Kuo-Hua Tseng Industrial Technology Sensing System Based on Hybrid Printed Electronics with ACF Research Institute bonding technology

43 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging

Packaging Poster Interactive Presentation

Time: 15:00-16:00, Oct . 23 Venue: 5F, Taipei Nangang Exhibition Center Paper Topic Lead Author Affiliation Code TW0013 Hidden Markov Model Recognize Capacitive Signal to User Chao-Ting Chu CHT Gesture in Proximity Sensor Field TW0014 A Single Chip Microcontroller Solution Obtain Electrocardiogram Chao-Ting Chu CHT Signal in Wearable Device TW0050 Stress Analysis of Flexible IC Package Chih-Ming Shen Industrial Technology Research Institute (ITRI) TW0095 Excellent mechanical properties of copper foil by using different Chuan-Yu Fang National Chiao Tung waveforms to electroplate nanotwinned copper foils with slanted University grains . TW0007 SiON waveguide and polymer waveguide for optical interconnects Chih-Cheng Hsiao Industrial Technology of silicon photonics Research Institute (ITRI) TW0044 Enhanced Board Level Design Methodology by Statistical Analysis Denis Chen Intel Corporation

TW0072 Using 3D X-ray to Detect Under-fill (UF) Crack of Fan-out Package Chung-Yu Ke SPIL

US0089 Digital Processing and Signal Analysis of Computer-generated Chris Wang National Experimental High Acoustic Output for Application as Modulated Audio Identifiers School at Hsinchu Science Park TW0045 A Crosstalk Noise-aware Signal Integrity Simulation Methodology Denis Chen Intel Corporation

TW0106 The efficient placement design for 3D Stacked Dies Packages Yu-Jung Huang I-Shou University

TW0104 Novel Fabric Strain Measurement Techniques towards to Flexible I-Hung Chiang ITRI Hybrid Electronics TW0022 STUDY OF CIRCUIT EVOLUTION TO REPAIR DESIGN FLAWS IN Chang Kuo-chi Fujian University of FPGA EDGE COMPUTING CHIPS Technology TW0024 Fast Fabrication of Hollow SiO2 Tube (HSNT) to Prepare Low Hsiang chi CHIEN National Chung Hsing Dielectric Polyimide/HSNT Composite Film University AS0017 SMT Line Balance and CPH Analysis and Application JINBIAO XU Universal Scientific Industrial Co ., Ltd . AS0114 Evaluation on Wedge Bond Performance of Different Cu Wire Xianghong Bi Nexperia Types during Thermal Cycling Test

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