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Wednesday October 21, 2020 Room 504 10:00 2020 2020 The 22nd International Conference on Electronics Materials and Packaging IMPACT Official Site join IMPACT on What's app join IMPACT on Line like us on Facebook Plenary Speech Special Session Packaging Session PCB Session Poster Session Day 1 – Wednesday October 21, 2020 Room 504 10:00-10:30 IMPACT-EMAP 2020 Opening & Awarding Ceremony Plenary Speech I: 3D Advanced Packaging Technology and Manufacturing 10:30-11:20 Dr. Marvin Liao, TSMC Plenary Speech II: Heterogeneous Integra�on for HPC Applica�on Driven by AI and 5G 11:20-12:10 Dr. John Lau, Unimicron 12:00-13:10 Lunch, The Banquet Hall, 3F Room 504a 504b 504c 503 【S1】 【S3】 【S4】 【S2】 13:10-15:10 HPC Advanced Advanced and Green JIEP (Atotech) Packaging-1 Materials and Process 15:10-15:30 Coffee break 【S5】 【S6】 【S7】 【S8】 15:40-17:40 SiP Signal and Warpage Test, Quality, AOI, (SPIL) Power Integrity Characteriza�on Inspec�on and Reliability Day 2– Thursday October 22, 2020 Room 504 Plenary Speech III: Now and Future SiP for Double HI 09:00-09:50 Dr. C. P. Hung, ASE Group Plenary Speech IV: Emergent Memory Technology at the Crossroads 10:00-10:50 Dr. Wenchi Ting, UMC Room Foyer Area 11:00-12:00 【Poster Session】PCB & Packaging 12:00-13:10 Lunch, The Banquet Hall, 3F Room 504a 504b 504c 503 502 【S9】 【S10】 【S11】 【S12】 【S13】 AI New Materials for Power Advanced 13:10-15:10 HDI Technology Next Genera�on Electronic Materials and Technology (ASE) (Nanya Plas�c) Packaging Process 15:10-15:30 Coffee break 【S16】 【S18】 【S14】 【S17】 【S15】 Design, Electro Deposi�on 15:40-17:40 Heterogeneous Advanced ICEP Modeling & and Electrochemical Integra�on-1 Packaging-2 Tes�ng Processing Technology 18:30-20:30 IMPACT-EMAP 2020 Interna�onal Welcome Dinner (By Invited) Day 3– Friday October 23, 2020 Room 504 Plenary Speech V: Impact of Connected Manufacturing in the New 5G Era 09:20-10:10 Mr. David Chang, IBM Taiwan 10:10-10:30 Coffee Break Room 504a 504b 504c 【S19】 【S20】 【S21】 10:30-12:35 Heterogeneous 3D Machine Learning Integra�on-2 Embedding Applica�on 12:00-13:30 Lunch, The Banquet Hall, 3F *The organizer reserves the right to modify the agenda. 2020 Floor Plan IMPACT-EMAP 2020 Speaker Review Room Organizer's Office Registration VIP Lounge @ WIFI for 5F Poster Poster Poster Poster Room Room Room Room 5 503 504a 504b 504c F Room 502 4F 1F @ Conference Room Coffee Break WiFi 2020 2020 The 22nd International Conference on Electronics Materials and Packaging Index Conference Agenda . Inside Cover Organizer, Co-Organizer and Sponsor . 0 Greeting of Chair Welcome Message from Ming-Yi Tsai, Conference General Chair. 0 Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair . 0 Welcome Message from Shen-Li Fu, Conference Co-Chair . 0 Welcome Message from Chih-I Wu, Conference Co-Chair . 0 Welcome Message from Maurice Lee, Conference Co-Chair . 0 Special Tribute to Dr . Wei-Ping Dow. 0 Committee Member. 0 General Information About Conference . 0 TPCA Show & Welcome Reception / International Welcome Dinner &Best Paper Award Ceremony/ IMPACT Best Paper 2019/Identification Badge / Registration Desk / Organizer’s Office Poster Session / Internet Access/Excursion Tour/Hotel Information/Inquiries . 0-0 Conference Plenary Speeches . 0 Sessions . 0 Poster session . 0 IMPACT Sponsor ASE . 0 Atotech . 0 Nanya Plastics . 0 SPIL . 0 Applied Material . 0 Triallian Corp . 0 Note . 0 Pre-Announcement- IMPACT 2021 . Inside Back Cover Organizer TAIWAN PRINTED CIRCUIT IEEE ELECTRONICS PACKAGIMG INTERNATIONAL INDUSTRIAL ASSOCIATION (TPCA) SOCIETY MICROELECTRONICS TECHNOLOGY AND PACKAING SOCIETY RESEARCH INSTITUTE, TAIWAN (IMAPS Taiwan) TAIWAN (ITRI) Co-Organizer International Conference on Electronics 2020 Packaging Graduate Institute of Communication International Conference on Electronics International Electronics Manufacturing Engineering Packaging (ICEP) Initiative (iNEMI) I-Shou University (ISU) Korea Advanced Institute of Science Taiwan Semiconductor Taiwan Thermal Management and Technology (KAIST) Industry Association (TSIA) Association (TTMA) Industrial / Special Session Advanced Semiconductor Atotech Taiwan Limited Nan Ya Plastics Corporation Siliconware Precision Industries Engineering Inc. (ASE) Co., Ltd (SPIL) Sponsor Applied Materials, Inc. Amkor Technology Eternal Materials Co.,Ltd. Ichia Technologies., INC. JSR Corporation MacDermid Performance Solutions Toray Research Center, Inc. Triallian Corp. Taiwan Ltd. 1 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging Sponsor Taiwan Semiconductor Underwriter Laboratories (UL) Unitech Printed Circuit Board Corp. Manufacturing Company Limited (TSMC) Media Partner TechSearch International Yole Développement Goverment Sponsor Industrial Development Bureau, Ministry of Education Ministry of Science and Technology Department of Information and Ministry of Economic Affairs Tourism, Taipei City Government ▲ 2 Greeting Welcome Message from Ming-Yi Tsai, Conference General Chair Ming-Yi Tsai, Ph.D. General Chair of IMPACT-EMAP 2020 President, IMAPS-Taiwan Professor, Chang Gung University Dear Colleagues and Friends, Warmly welcome all of you to join this great annual event and meeting, the 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT-EMAP 2020), in conjunction with the 22nd International Conference on Electronics Materials and Packaging (EMAP). On behalf of the IMPACT committee, I would like to express our gratitude to all of you for taking your time to attend this world-leading IC packaging and PCB conference and exhibition from Oct. 21-23, 2020 in Taipei, Taiwan . The main theme of the conference this year features “HPC-toward the Data Era,” highlighting the research, development and innovation of high-performance computing technologies ready for the data era . To arrange this 3-day conference, our dedicated Program Committee teaming up with TPCA, IMAPS-Taiwan, IEEE EPS-Taipei, and ITRI have been working very closely to organize these rich and various programs, including plenary speeches, invited talks, special and sponsored industrial sessions, outstanding paper and poster presentations . The purpose of this conference is to gather more and more packaging/PCB professionals from industries, research institutes, and academia to discuss about new trends, technologies, opportunities and challenges . It also provides a great platform for all of you to build the friendships, exchange information, create new ideas, and make new contact for further collaboration. Therefore, it is expected that there will be a lot of interactions, learning and sharing activities going between you and other attendees during the conference . Amid the outbreak of COVID-19 pandemic, unfortunately, a special prevention measure based on the government regulation will be taken and processed during the conference this year for creating a safe environment for attendees . Under such a safe environment we wish all of you enjoy the wonderful meeting, learn about new knowledge for future innovation and make new friendships during the conference . Finally, we sincerely wish everyone a safe, fruitful and enjoyable stay in Taipei and a successful year ahead . Best Wishes, Ming-Yi Tsai, Ph. D. General Chair of IMPACT-EMAP 2020 President, IMAPS-Taiwan Professor, Chang Gung University . 3 ▲ 2020 2020 The 22nd International Conference on Electronics Materials and Packaging Welcome Message from Kuo-Ning Chiang, Conference Honorary Chair Kuo-Ning Chiang, Ph.D. NTHU Chair Professor Academician, International Academy of Engineering (IAE) - Russia Fellow, IEEE / STAM / ASME / iMAPS Editor-in-Chief, Journal of Mechanics Senior Area Editor, IEEE Transactions on CPMT Topical Editor, IEEE Access As Honorary Chair of IMPACT-EMAP 2020, I am pleased and honored to welcome participants from all over the world to participate in this Asia's largest electronic packaging conference. This year, as the COVID-19 pandemic has not completely ended and there are many restrictions on international travel, a lot of foreign participants were unable to attend this event . Some of the speakers we invited will use pre-recording or online internet to deliver their speeches, here I want to thank them for their enthusiastic support. As you know, IMPACT is one of the world’s leading electronic packaging conferences, with more than 500 participants, 200 papers and TPCA exhibitions. IMPACT- EMAP joint conference cover a wide range of important topics related to trends and cutting-edge technologies in electronic packaging and PCB fields, the agenda of the IMPACT-EMAP 2020 includes heterogeneous packaging, SiP, fan-out, automotive applications, 5G, solution for high-performance computing and AI related technologies, etc . I expect this conference to be an excellent platform for you to share knowledge, catch packaging trends and exchange research/development ideas. I sincerely hope that you will enjoy the program and networking environment we provide. Thank you for your participation . K. N. Chiang NTHU Chair Professor Academician, International Academy of Engineering (IAE) - Russia Fellow, IEEE / STAM / ASME / iMAPS Editor-in-Chief, Journal of Mechanics Senior Area Editor, IEEE Transactions on CPMT Topical Editor, IEEE Access ▲ 4 Greeting Welcome Message from Shen-Li Fu, Conference Co-Chair Shen-Li Fu, Ph.D. Chair, IEEE EPS – Taipei Honorary President & Distinguished Chair Professor, I-Shou University Dear Colleagues, I am delighted to welcome you to the “IMPACT-EMAP 2020 Conference” . All the participants will be benefited from various sessions organized
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