WINTER 2015 Meptec.Org Meptec.Org WINTER 2015 MEPTEC REPORT 13 Rich Rice SEMICO RESEARCH CORP
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2015 A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 19, Number 4 WINTER 14th ANNUAL MEPTEC MEMS TECHNOLOGY SYMPOSIUM Advancing MEMS and Sensors for Today’s Exploding Demands Wednesday, May 11, 2016 San Jose, California + page 22 The Great Miniaturization Symposium Follow-Up page 15 MEPTEC MEMBER COMPANY PROFILE Now in its 43rd year, SHENMAO TECHNOLOGY INC., the leading solder material provider globally, started by manu- facturing resin flux cored solder wire and solder bar in 1973 at its Taiwan Headquarters, continuously expanding since 1998 to 10 worldwide locations. page 18 -Corp. INSIDE THIS ISSUE Semico Research SiP module packaging The technology of IC The large number Corp. looks at provides an alternative packaging has over- of mergers and the growing and and complementary taken chip fabrication acquisitions this last changing SoC solution to System- as the focal point of year has been truly market. on-Chip. innovation. staggering. 13 23 26 SPRING 342011 MEPTEC Report 3 Wear Sense Move it. it. it. Innovative IC, System-in-Package, and MEMS packaging portfolio for today’s miniaturization, mobility, and IoT needs. Wire Flip 2.5D WLP Fanout SiP Bond Chip & 3D Package it. Visit: aseglobal.com 2015 The MEPTEC Report is a Publication of the Microelectronics Packaging & Test Engineering Council 315 Savannah River Dr., Summerville, SC 29485 Tel: (650) 714-1570 Email: [email protected] A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 19, Number 4 WINTER Publisher MEPCOM LLC Editor Bette Cooper Art Director/Designer Gary Brown Sales Manager Gina Edwards 2015 ON THE COVER A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council Volume 19, Number 4 WINTER 14th ANNUAL MEPTEC MEPTEC Advisory Board MEMS TECHNOLOGY MEPTEC presents its 14th Annual MEMS Technology Symposium titled SYMPOSIUM Advancing MEMS for Today’s Exploding Demands “Advancing MEMS and Sensors for Today’s Exploding Demands” on Wed- Wednesday, May 11, 2016 Board Members San Jose, California page 22 + nesday, May 11 2016 at the Holiday Inn - San Jose Airport in San Jose, The Great Miniaturization Xilinx, Inc. Symposium Follow-Up Ivor Barber page 15 California. Invited speakers will focus on the fundamental MEMS technolo- MEPTEC MEMBER COMPANY PROFILE Now in its 43rd year, SHENMAO TECHNOLOGY INC., the leading solder material provider globally, started by manu- facturing resin flux cored solder wire and solder bar in 1973 Delphon Industries at its Taiwan Headquarters, continuously expanding since gies and manufacturing techniques to address this explosive growth short to Jeanne Beacham 1998 to 10 worldwide locations. page 18 -Corp. INSIDE THIS ISSUE medium term, but also take a peek at what’s coming longer term that we all Semiops Semico Research SiP module packaging The technology of IC The large number Joel Camarda Corp. looks at provides an alternative packaging has over- of mergers and the growing and and complementary taken chip fabrication acquisitions this last changing SoC solution to System- as the focal point of year has been truly market. on-Chip. innovation. staggering. 13 23 26 SPRING 342011 MEPTEC Report 3 need to be aware of today. Jeff Demmin Booz Allen Hamilton Douglass Dixon Henkel Corporation ANALYSIS Exar Corporation think and are treated like engineers and Nikhil Kelkar that management assigns them clearly CAN YOUR EPOXY ANALYSIS – The SoC market has been growing and defined projects that don’t easily change scope. (This implies a healthy relation- ADHESIVE GO LOW? ship between marketing and engineering, An Inside Look at the System-on-a-Chip which of its own, is a worthy discussion.) Epoxy System EP42HT-2LTE Let’s focus on the corporate culture and Features an ultra low coefficient (SoC) Market not on job titles to improve the quality of software. of thermal expansion Adrienne Downey, Director of Technology For more of my thoughts, please see X -6 in in CTE 9-12 10 / /°C Semico Research Corp. my blog http://hightechbizdev.com. TechDirect Consulting evolving for the last 15 - 20 years and is a very complex As always, I look forward to hearing LOW SHRINKAGE UPON CURE Nick Leonardi your comments directly. Please contact me to discuss your thoughts or if I can be Linear <0.01% ◆ 13 of any assistance. Volumetric <0.1% THE SOC MARKET HAS BEEN EVOLUTION OF THE ASIC MARKET growing and evolving for the last 15 - 20 Programmable years and is a very complex combination SoC Advanced IRA FELDMAN (ira@feldmanengineer- Elongation <5% of semiconductor solutions that fills every Performance Multicore SoC ing.com) is the Principal Consultant possible niche in the electronics market Standard System on System(s) today. Semico Research Corp. looks at Cell a Chip on a Chip combination of semiconductor solutions that fills every pos- of Feldman Engineering Corp. which Value this market on a regular basis and pub- Multi-core guides high technology products and Application SoC Basic SoC HIGH DIMENSIONAL STABILITY lishes research on its makeup, direction PPM Associates Custom Specific Standard Platform Phil Marcoux services from concept to high volume and evolution. ASIC Products (ASSP) SoC Customer From -60 to +300°F Platform To get a better understanding of the Owned Tooling manufacturing. He engages on a wide ASIC range of projects including technical SoC market, it is important to understand Gate Array Structured where it came from and what its roots are. ASIC marketing, product-generation process- Simple / Field Programmable Hackensack, NJ 07601, USA As Figure 1 shows, the origin of Programmable Complex Computing es, supply-chain management, and busi- Logic Device (PLD) +1.201.343.8983 ∙ mainmasterbond.com the ASIC market was the rise of what PLD System on a Array were called full custom designs in the Programmable ness development. Chip sible niche in the electronics market today. Semico Research www.masterbond.com Field mid-1970s. These devices were usually FPGA Programmable FPGA / SoC produced by large IDMs only for specific Analog Array with customers. In most cases, the customer Programmable Dow Chemical Corp. Fabric supplied the design to the IDM. The Bhavesh Muni 1974 1980 1986 1988 1997 1999 2000 2001 2002 2006 2009 2010 2012 Register now! customer consumed all the output of the MARCH 6—9,2016 • MESA,A RIZONA IDM and used the parts internally. As the Figure 1. History of the ASIC Market. (Source: Semico Research Corp.) semiconductor market grew, new types of devices arose to help meet the needs of Corp. looks at this market on a regular basis and publishes customers and markets alike. designers to be used in the creation of SoC in the market today. (see Figure 2) these designs. To track this market accu- The reason for the market evolution Around 1980, the ASIC market Workshop S fragmented into three basic types: Gate rately, Semico has created a paper defini- to create a separate SoC segment was to Arrays, Standard Cells and Programmable tion that details the three main classes of provide designers with more flexibility to Logic. Later, as the demand grew for olutions © 2015 BiT Maxim Integrated S certain types of systems, the Application Kumar Nagarajan Specific Standard Product category arose. Revised Revised The World’s Premier Event for Definitions Metrics featuring This class of device filled a gap between Advanced What’s Now & Next in Test and the three standard types of ASIC. 2+ IP Subsystems Performance 3+ Complex Interconnects In the mid-1990s, the ASIC market research on its makeup, direction and evolution. MEMS Test Tooling Test anium; Teradyne; Traditional Traditional N >150 Discrete IP Blocks Burn-in of Packaged IC’s Definitions Multicore SoCs nc.; Metrics & WLCSP Test I again reached a point where the standard CELEBRATING SEVENTEEN YEARS OF EXCELLENCE, approaches for creating an ASIC were Value Performance 1+ IP Subsystems no longer satisfying customer or market 10M+ Gates Multicore 2+ Complex Interconnects the annual BiTS Workshop brings together experts SoCs needs, and another wave of innovation >16Mb Memory SoCs 75 - 150 Discrete IP Blocks miths Connectors; Cohu, miths Connectors; Cohu, and exhibitors in the field of test and burn-in from S and fragmentation started with the advent tock; around the world. Join your colleagues in Arizona S of the SoC. From a single type of SoC, Value Basic 1+ Bus Structure STATS ChipPAC 4 - 10M Gates or 1 Complex Interconnect for three days of speakers, technical programs, BBCFC/i we now have moved to a market environ- 2 - 8Mb Memory SoCs SoCs ≥ 50 - 75 Discrete IP Blocks OS: Raj Pendse T ment where it is possible for different networking opportunities, EXPO 2016, and more! PHO types of SoC to co-exist to fill necessary Simple Bus Structure 1 - 4M Gates Commodity T. Reitzle T. Microcontrollers ≥ 10 - 20 Discrete IP Blocks market niches. 1 - 2Mb Memory Controllers PREMIER SPONSOR Very Low Cost INDUSTRY PARTNER DESIGN: A major component of the SoC mar- ket is the use of 3rd Party Semiconductor Moore’s Law Continues WWW.BITSWORKSHOP.ORG Intellectual Property (SIP) and SIP that RICH WAWRZYNIAK was created for reuse internally by the Figure 2. SoC Definition by Complexity. (Source: Semico Research Corp.) ASE (US) Inc. 12 MEPTEC REPORT WINTER 2015 meptec.org meptec.org WINTER 2015 MEPTEC REPORT 13 Rich Rice SEMICO RESEARCH CORP. Jim Walker Gartner Altera Corporation John Xie PROFILE SHENMAO HEALTH, SAFETY AND PROFILE – SHENMAO Technology Inc. produces and SHENMAOSHENMAO HISTORY HISTORY ENVIRONMENT CONCEPTS SHENMAO Technology has achieved 1973 Established SHENMAO incorpora- 2006 Set up “SHENMAO Technology (Thai- and is maintaining the ISO 9001, ISO tion to manufacture Resin Flux Solder Wire land) Co., Ltd.”, plant and office in Thailand 14001, TS 16949, OHSAS 18001 and QC and Solder Bar. and “SHENMAO Europe GmbH” in Munich, 080000 Standards. In the future, SHEN- Germany.