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Multi-Die Integrationintegration Strategiesstrategies Andand Systemsystem Partitionspartitions Inin Mobilemobile WWANWWAN Devicesdevices Multi-DieMulti-Die IntegrationIntegration StrategiesStrategies andand SystemSystem PartitionsPartitions inin MobileMobile WWANWWAN DevicesDevices Presented by: Dr. Harrison Chang, USI, ASE Group Date: Nov 14, 2012 Ver.:0.9 ASE Group Outline • Strategic Thinking • Smartphone Partition and Challenges • Tear Down: iPhone5 and iPad3 4G • Miniaturization Approach ASE Group Package vs. Module; Design Rule vs. Design Case • Generic Package – For IC of a Wide Range of Industries – Each Industry May Have Different System Requirement: Power, Voltage, Frequency, EMI/EMC, Timing, Thermal, Mechanical, Temperature Ranges, … – May Need to Qualify for the Conjunction of All Applicable Requirement – Comprehensive Design Rule to Accommodate Versatile Applications • Specialized Module – For IC of Specific Industries – These Industries Often Have Similar System Requirement – Just Need to Qualify for the Intended Application Requirement – Single Point Design Case for Specific Application ASE Group From Multi-Die Integration to System in Package RF Passive Circuit Design Product Package-Module Full Qualification Type Approval Co-Design Thermal Design SW Development Layout Design Design for Manufacture & RF Communication Main Board Integration Stress & Reliability Performance!! Design Design ASE Group Multi-Die Integration: Cost Up or Down • Cost-up Factors – New CAPEX – Cost of Yield: ∏(1-xn) or 1-∑(xn) or in Between – Volume: Customized vs. Standard – Fluctuation of Commodity Pricing • Cost-down Factors – Less Package and Testing – Less Material – Design Cycle: Rule Based to Case Based – Less Overall System Cost ASE Group Who Owns the Multi-Die Integration • Die Vender #1? Die Vender #2? … • Module Maker? Device Owner? • What about GM? ASE Group Typical Partitions in Smartphone Antenna Switch Out Side of CMOS Node Front End Components RF Transceiver PMU Codec Communication Processor Application Processor PMU Memory GPS Wi-Fi BT POP Memory Sensors ASE Group Challenges at 3G/4G Modem 2G 3G 3.5G 3.9G 4G EDGE EVOLUTION ASE Group 3G and 4G Bands FDD TDD EU US LTE Name Uplink Downlink MO LTE Band Name Allocation (MHz) MO # (MHz) (MHz) Number (MHz) NTT Docomo 1 2.1GHz 1920 - 1980 2110 - 2170 33 TDD2000 Lower 1900 - 1920 Softbank (TBD) 2 PCS1900 1850 - 1910 1930 - 1990 34 TDD2000 Upper 2010 - 2025 KT, SKT(2013) 3-IT (2013) VF-IT (2013) V 3 1800MHz 1710 - 1785 1805 -1880 35 TDD1900 Lower 1850 - 1910 EE-UK (TBD) All Ausie MO (Telstra, Optus, VF) AT&T V 4 AWS 1710 - 1755 2110 - 2155 36 TDD1900 Upper 1930 - 1990 TMO-US(TBD2013) 5 850MHz 824 - 849 869 - 894 LGU, SKT 37 PCS Center Gap 1910 - 1930 6 850 (Japan) 830 - 840 875 - 885 KDDI 38 IMT EXT Gap 2570 - 2620 More Are Orange-FR (TBD2012) SFR Telefornica-DE VF-DE DT-DE E-Plus-DE Coming! 3-IT (2013) V 7 2.6GHz (IMT Ext) 2500 - 2570 2620 - 2690 VF-IT (2013) 39 China TDD 1880 - 1920 All Dutch MO(KPN, VF,TMO) All Spanish MO in (VF, Telefornica, Orange) O2-UK (2013) 3-UK (TBD) Yota-RUS 8 900Mhz 880 - 915 925 - 960 40 2300MHz 2300 - 2400 9 1700Mhz (Japan#2) 1749.9 - 1784.9 1844.9 - 1879.9 KDDI 41 US 2600 2496-2690 10 Ext1.7/2.1 1710 - 1770 2110 - 2170 42 3500MHz 3400 - 3600 1500 Lower 11 1427.9 - 1452.9 1475.9 - 1500.9 43 3700 MHz 3600-3800 (Japan#3) 12 Lower 700MHz 698 - 716 728 - 746 V 13 Upper C 700MHz 777 - 787 746 - 756 Verizon Operating Frequency Common UL Frequencies UE DL Frequencies Channel Number Channel Number (UARFCN) Upper D 700MHz Region 14 788 - 798 758 - 768 public safety Public Safety Band Band Name transmit (MHz) UE receive (UARFCN) UL DL V 17 Lower B 700MHz 704 - 716 734 - 746 AT&T Europe, Asia, Africa, Oceania (Telstra, 18 850 (Japan#4) 815 - 830 860 - 875 I 2100 IMT 1920 - 1980 2110 - 2170 9612 - 9888 10562 - 10838 Optus, Vodafone AU & NZ, Three Mobile 19 850 (Japan#5) 830 - 845 875 - 890 AU, 2° and Telecom NZ), Brazil Vodafone 9262 - 9538 additional 12, 9662 - 9938 additional 412, Orange-FR(TBD2012) Americas (AT&T, Bell Mobility, Telcel, Telus, II 1900 PCS 1850 - 1910 1930 - 1990 37, 62, 87, 112, 137, 162, 437, 462, 487, 512, 537, 562, SFR Rogers) TMO-DE 187, 212, 237, 262, 287 587, 612, 637, 662, 687 Telefornica-DE III 1800 DCS 1710 - 1785 1805 - 1880 937 - 1288 1162 - 1513 Europe, Asia, Oceania VF-DE 1312 - 1513 additional 1662, 1537 - 1738 additional 1887, USA (T-Mobile, Cincinnati Bell Wireless), V 20 CEPT800 832 - 862 791 - 821 DT-DE IV 1700 AWS 1710 - 1755 2110 - 2155 1687, 1712, 1737, 1762, 1912, 1937, 1962, 1987, 2012, Canada (WIND Mobile, Mobilicity, VF-IT (2013) 1787, 1812, 1837, 1862 2037, 2062, 2087 Videotron), Chile (VTR, Nextel) All Spanish MO (VF, Americas (AT&T, Bell Mobility, Telcel, Telus, Telefornica, Orange 4132 - 4233 additional 782, 4357 - 4458 additional 1007, V 850 CLR 824 - 849 869 - 894 Rogers), Oceania (Telstra, Telecom NZ, 2014) 787, 807, 812, 837, 862 1012, 1032, 1037, 1062, 1087 EE-UK (TBD) Vodafone AU) 3-UK (TBD) VI 800 830 - 840 875 - 885 4162 - 4188 additional 812, 4387 - 4413 additional 1037, Japan (NTT DoCoMo) 21 1500 (Japan#6) 1447.9 - 1462.9 1495.5 - 1510.9 2012 - 2338 additional 2362, 2237 - 2563 additional 2587, 24 US L Band 1625-1660 1525-1559 2387, 2412, 2437, 2462, 2612, 2637, 2662, 2687, 2712, V 25 US PCS + G Block 1850 - 1915 1930 - 1995 Sprint VII 2600 IMT-E 2500 - 2570 2620 - 2690 Europe (future) V 26 800MHz iDEN 859-894 814-849 Sprint (2014) 2487, 2512, 2537, 2562, 2737, 2762, 2787, 2812, 2837, 2587, 2612, 2637, 2662, 2862, 2887, 2912 Europe[1], Asia, Oceania (Optus, Vodafone VIII 900 GSM 880 - 915 925 - 960 2712 - 2863 2937 - 3088 AU, Vodafone NZ), Dominican Republic (Orange), Venezuela (Digitel GSM) IX 1700 1749.9 - 1784.9 1844.9 - 1879.9 8762 - 8912 9237 - 9387 Japan (E Mobile, NTT DoCoMo) 2887 - 3163 additional 3187, 3112 - 3388 additional 3412, 3212, 3237, 3262, 3287, 3437, 3462, 3487, 3512, 3537, X 1700 1710 - 1770 2110 - 2170 3312, 3337, 3362, 3387, 3562, 3587, 3612, 3637, 3662, 3412, 3437, 3462 3687 XI 1500 1427.9 - 1447.9 1475.9 - 1495.9 3487 - 3562 3712 - 3787 Japan (Softbank) 3612–3678 additional 3702, 3837–3903 additional 3927, XII 700 SMH 698 - 716 728 - 746 USA (future) (lower SMH blocks A/B/C) 3707, 3732, 3737, 3762, 3932, 3957, 3962, 3987, 3992 3792–3818 additional 3842, 4017–4043 additional 4067, XIII 700 SMH 777 - 787 746 - 756 USA (future) (upper SMH block C) 3867 4092 3892–3918 additional 3942, 4117–4143 additional 4167, XIV 700 SMH 788 - 798 758 - 768 USA (upper SMH block D) (VZW) 3967 4192 ASE Group Challenges at the Connectivity • Connectivity 2.4GHz, 5GHz, 60GHz • WiFi, BT, GPS, FM, NFC, … • Co-existence with LTE • Mobile and WiFi Digital Integration ASE Group Challenge on PCB Area Side View (from Bottom) 4.5mm Phone T: 7.1mm vs. 7.6mm 3.75mm Battery 2.3mm Metal Shield Battery PCB Metal Shield 1.5mm Metal Shield PCB 0.7mm W = 56mm 33.3 mm 19.5 mm Moto Droid Razr Apple iPhone5 Moto Droid Razr iPhone4s iPhone5 (4G LTE) (3G) (4G LTE) LCD 4.3" 3.5" 4" L(mm) 130.7 115.2 123.8 W(mm) 68.9 58.6 60.1 Phone Size T(mm) 7.1 9.3 7.6 Area (mm^2) 9005.2 6750.7 7442.2 Capacity 1780mAh 3.7V/5.3Whr 3.8V/5.45Whr (Whr) (1420mAh) L(mm) 94.5 82.0 87.5 Battery W(mm) 56.0 33.3 33.3 T(mm) 2.3 4.0 3.75 Size (mm^3) 12171.6 10922.4 10922.4 L 94.5 92.0 79.1 W 56.0 18.0 19.5 PCBA T 2.2 4.0 3.75 Area (mm^2) 5292.0 3312.0 3084.4 ASE Group iPhone5 Example ASE Group iPhone5 Example (Continue) • Skyworks 77352-15 GSM/GPRS/EDGE • Qualcomm PM8018 RF power power amplifier module management IC • SWUA 147 228 RF antenna switch • Hynix H2JTDG2MBR 128 Gb (16 GB) module NAND flash • Triquint 666083-1229 WCDMA / HSUPA PA/ duplexer module for UMTS bands • Apple 338S1131 dialog power • Avago AFEM-7813 dual-band LTE B1/B3 management IC* PA+FBAR duplexer module • Apple 338S1117 Cirrus Logic device • Skyworks 77491-158 CDMA power (second image) amplifier module • STMicroelectronics L3G4200D • Avago A5613 ACPM-5613 LTE band 13 (AGD5/2235/G8SBI ) low-power three- power amplifier axis • Murata/USI 339S0171 Wi-Fi module ASE Group iPhone5 Example (Continue) • STMicroelectronics LIS331DLH (2233/DSH/GFGHA) ultra low-power, high performance, three-axis linear accelerometer • Texas Instruments 27C245I touch screen SoC • Broadcom BCM5976 touchscreen controller • Apple A6 application processor • Qualcomm MDM9615M LTE modem • Qualcomm RTR8600 Multi-band/mode RF transceiver ASE Group iPAD3 4G Example ASE Group iPAD3 4G Example (Continue) • Texas Instruments CD3240 driver device • Apple A5X processor • Broadcom BCM4330 802.11a/b/g/n • Apple 343S0561 - This IC looks like an MAC/baseband/radio with integrated updated version of the 343S052 that we Bluetooth 4.0+HS and FM transceiver found in the iPad 2, and is used for power management. • 2 x 4Gb Elpida LP DDR2 = 1 GB DRAM in separate packages in a 64-bit • The NAND, part number configuration THGVX1G7D2GLA08 is a 16 GB 24 nm MLC Flash from Toshiba • Fairchild FDMC 6683 • Qualcomm MDM9600 - 3G and 4G • Broadcom BCM5973 I/O controller wireless modem • Broadcom BCM5974 microprocessor • Skyworks 77469 • Apple 338S0987 (Cirrus Logic audio • Avago A7792 codec) ASE Group Miniaturization Technology Roadmap USI ASE USI/ASE Third Party MUF (CFS) Conformal Selective/Irregular Composite Shielding Molding & Molding/Coating Molding/Coating Shielding Compartment Shielding X Y MoM TVM FO-TVM 3D Shielding Module Z Reduction/ FO WLP 3D FO WLP 3D Stacking XY Reduction IPD for RF IPD Hi-Cap + Hi-Q IND IPD High Phase 2, Phase 3, d Phase 4, Density d=6 d=4 d=3 Development SMT Research 2014 2015 2016 ASE Group 2011 2012 2013 Version # 17 Q & A ASE Group ASE Group 91 91 91.
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