POST SHOW REPORT Shaping the Digital Future
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POST SHOW REPORT Shaping the Digital Future @SEMI Europe #TechnologyUnites www.technologyunites.org PLATINUM SPONSORS A KLA Company The art of wet processing. GOLD SPONSORS SILVER SPONSORS EVENT SPONSORS KEY FIGURES 1724 50 INTERNATIONAL 57 COUNTRIES ATTENDEES EXHIBITORS 41 42 28 180 SPONSORS HOURS OF EXECUTIVE SPEAKERS & PROGRAMS SPEAKERS CONTRIBUTORS 225 25 55 215 STUDENTS PRESS MEDIA JOB POSTS ATTENDEES PARTNERS 7 PAVILIONS SOUTH SOUTH EUROPE AMERICAS TAIWAN CHINA JAPAN KOREA EASTH ASIA 8 FORUMS EXECUTIVE FORUM ADVANCED PACKAGING FORUM EU DIGITAL FUTURE FORUM FAB MANAGEMENT FORUM MEMS & IMAGING SENSORS FORUM DIVERSITY FORUM SMART MOBILITY SMART MEDTECH FORUM FORUM Thank you again for the support and collaboration with the virtual event which was very successful to us. We have received positive feedbacks and interesting leads. Daffy Yancu. Yaskawa Europe Technology Ltd. www.technologyunites.org | 2 ATTENDEE DEMOGRAPHICS KEY ATTENDING COMPANIES Germany 34% Advantest | Air Liquide | Airspace | Amkor United States 23% Technology | ams | AP&S International GmbH United Kingdom 14% Applied Materials | ARM Inc. | ASE Group | ASM International | ASML | Atotech | Axcelis Techno- France 8% logies | BASF SE | Beneq Oy | BESI | Bosch | Belgium 5% Brewer Science | Busch Vacuum Solutions | Canon Europa N.V. | Carl Zeiss SMT GmbH | CEA Leti | centrotherm Singapore | COMET Group | Coventor - A Lam Research Company | Crocus Nano Electronics | CyberOptics Corporation | 16% DAS Environmental Expert GmbH | EBARA CORPORATION | Edwards Vacuum | EMD 5% 34% Performance Materials | Entegris | Eumetrys | European Commission | EV Group (EVG) | Evatec | Fabmatics | Facebook | FastMicro B.V. | 8% Fraunhofer Institutes | FUJIFILM Electronic Materials | GE Digital | GLOBALFOUNDRIES | Hamamatsu Photonics | Henkel | Hitachi ABB 14% Power Grids | HUAWEI | IBM Research | IC’Alps 23% | imec | INFICON | Infineon Technologies | Intel | Jipal corporation | JSR Micro NV | KAUST – Nanofabrication Core Lab | KLA | Kokusai Semiconductor Europe GmbH | Lam Research | McKinsey & Company | Mentor, a Siemens business | Merck KGaA | Mitsubishi Chemical Semicon- Other 16% ductor Solutions | Murata Electronics | Nikon | Nippon Electric Glass Co.,Ltd. | Nova Measuring Netherlands Canada Liechtenstein Instruments | NXP Semiconductors | Okmetic Oy Switzerland Russian Federation Sweden | ON Semiconductor | Orbotech (a KLA company) Austria Turkey Cyprus | Osram | Peer Group | Pfeiffer Vacuum | Japan Czech Republic Algeria Picosun Oy | RENA Techno-logies GmbH | Robert Finland Portugal Indonesia Bosch GmbH | Samsung Semiconductor Europe Korea Spain Philippines GmbH | SCREEN Semiconductor Solutions Co., Italy Denmark Iran Ltd. | Semics | Siconnex customized solutions GmbH | Siemens Healthcare GmbH | Solmates | Israel Malaysia Colombia SPEA | SPTS Technologies (A KLA Company) | Saudi Arabia Norway Lebanon ST Microelectronics | SÜSS Microtec | TATA STEEL Taiwan Hungary Brazil | Thermo Fisher Scientific | Tokyo Electron | Singapore Albania Greece Trelleborg Sealing Solutions | TRUMPF | Trymax Ireland Australia Peru Semiconductor Equipment BV | TSMC | Umicore India Hong Kong Paraguay | UTAC | VAT Group | Volkswagen AG | Argentina Poland Malta VTT | YASKAWA Europe Technology Ltd. | China Kuwait Yole Développement The event and the virtual booth were a good opportunity to connect with potential partners and customers to promote our activities, the hosted session, content, but also job vacancies. Benjamin Uhlig, Fraunhofer Institute for Photonic Microsystems IPMS www.technologyunites.org | 3 INTERNATIONAL ACADEMIC PURCHASING AUTHORITY INSTITUTES Final Decision Maker 21% Aalborg University | Aalto University | ACM Research Inc | Auburn University | Australian Institute for Recommend / Evaluate 43% Bioengineering and Nanotechnology | Barkhausen Other 36% Institut | Brunel University London | Christ University | City College of San Francisco | Duale Hochschule Baden-Württemberg | Duke University | Facultad Re- gional Buenos Aires UTN | Gent University | Georgia Institute of Technology | Graz University of Tech- 21% nology | Hochschule Aalen | Htw Berlin | Imperial College London | Indian Institute of Science (IISc) | 36% KAUST - Nanofabrication Core Lab | Keio University | King Abdullah University of Science and Technology | King Fahd University of Petroleum and Mi | KU Leuven | Northwestern University | Ohio University | Penn State University | Portland State University | Pur- due University | Queen Mary University of London | Ruhe-Universität Bochum | San Jose State University 43% | Shinshu University | Soongsil University | Southern Methodist University St Joseph Engineering College | Swansea Univeristy | | TU Dresden | TU Graz | TU Ilmenau | TU Wien | Uludag University | Univer- sidad Nacional de Colombia | Universidad Tecno- logica Nacional | Universidade do Minho | Univer- JOB AREA sitas Pertamina | Universität Rostock | Universität Stuttgart | Universiteit Utrecht | University College Marketing, Sales, Business London | University of Arizona | University of Aveiro Development 29% | University of Calgary | University of Cambridge | University of Freiburg | University of Maine at R&D 18% Augusta | University of Minho | University of Executive Management 9% Strasbourg | University of York | Vellore Institute Product Management 8% of Technology | Yonsei University School of Electrical and Electronic Engineering JOB LEVEL 29% 36% Executive 13% Senior Management 21% Professional / Engineer / Staff 30% Student 11% Other Management 25% 8% 18% 9% 13% 25% Other 36% • Fabrication • Manufacturing / • Government / and Process Operations Manage- Public Policy 21% Engineering ment / Production • Industrial • Human • Chemicals / Engineering 11% Resources / Materials • Logistics / Training / • Design Supply Chain Education • Financial / Management • Equipment Industry Analyst / • Packaging / 30% Engineering Investor Relations Assembly • Software • EHS • Test Engineering • Facilities / Engi- neering Support www.technologyunites.org | 4 APPLICATIONS MANUFACTURING TECHNOLOGIES Virtual Reality / Augmented Reality Fr ont-end Manufacturing (IDM, (VR/AR) 14% Foundry) 25% Internet of Things (IoT) 13% Packaging / Assembly 15% Automotive Electronics / Ma terial Engineering / Smart Transportation 12% Materials Science 14% Consumer Electronics / Wearables 12% S ystem Integration / Artificial Intelligence Systems (AI) 10% Product-level Manufacturing 10% 14% 25% 39% 13% 36% 15% 12% 12%10% 14%10% Other 39% Other 36% • Mobile Technologies / • Smart Manufacturing • Test • Board-level Wireless / 5G • Cloud Computing / • Design / EDA / IP Manufacturing • Imaging / OLED High-Performance • System-level • Roll-to-Roll / Printing • Medical Electronics / Computing Manufacturing MedTech • Green Manufacturing / • Other Applications EHS PRODUCT AND SERVICES Foundries 10% Front-end Processing 9% 10% ER&D / Technology Transfer 8% Packaging & Test Services (OSAT) 7% 9% Electronic Manufacturing Services (EMS) / 8% System Integration 6% 60% Other 60% 7% • Design / EDA • Manufacturing Ser- • Test 6% • Wafers / Substrates vices and Consulting • Cleaning • Inspection & • Process Materials: • Components / Measurement / Gases / Liquids / Sub-systems / Metrology Solids / Chemicals Instrumentation • Other Manufactur- •Secondary • Assembly / • Abatement / Environ- • Consumables ing Equipment Equipment mental Systems and Services Packaging • General Business • Other Materials • Fabless • Engineering Services Services / Consulting • Parts • Standards • Factory Control / • Factory Auto- • Inks / Pastes / • Printing / Coating / • Support Products / Process Software mation / Robotics Printing Materials Roll-to-Roll Cleanroom • Large-area / • Packaging / • Other Design / Manu- • Representative Thin Film Assembly facturing Services Sales and Service www.technologyunites.org | 5 PARTICIPATING EXHIBITORS AEM | Logo - CMYK (Gradient) PMS 7479C C66 M0 Y66 K0 R38 G208 B124 #26D07C PMS 7725C C90 M35 Y76 K19 R13 G128 B101 #0D8065 PMS 7479C 20% C15 M0 Y13 K0 R212 G246 B229 #D4F6E5 COPYRIGHT© DIA BRANDS The art of wet processing. 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