www.osram.com/os
Application Note No. AN037
Recommended pick and place tools for LEDs from OSRAM Opto Semiconductors
Application Note Valid for: all SMT LEDs from OSRAM Opto Semiconductors
Abstract
OSRAM Opto Semiconductors SMT devices are developed for assembly by automatic placement machines. To achieve a damage-free processing of LEDs, appropriate and individual pick and place tools (the nozzles) must be used. The following pages provide information about important parameters that should be considered for LED assembly. Furthermore a recommended nozzle design for each LED in the OSRAM Opto Semiconductors portfolio is given.
Authors: Retsch Stefanie / Lang Kurt-Jürgen
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Table of contents
A.Pick-and-place process ...... 2 B.Overview of recommended nozzle designs ...... 2
A. Pick-and-place process As is the standard for SMT devices, all SMT LEDs from OSRAM Opto Semiconductors are designed for an automated pick and place process. To receive optimal process results, it is necessary to set the pick and place machine properly. In the initial production run, it must be ensured that the LED package can be grabbed by the nozzle and sucked out of the tape pocket. Therefore, an appropriate nozzle (pipette or pick-up tool) has to be used. This application note gives an overview on the recommended nozzles and the dimensions. An appropriate nozzle not only ensures a good pick and place process, it also helps to prevent damage to the LED. To avoid any damage during the pick-up process, the pick-up position should be controlled and adjusted during the set-up. All other pick and place process parameters should also be adjusted. The default settings of the machine are a good starting point. The placement force, for example, can be tested with 2.0 N at the beginning, but it should be less than 2.0 N if possible.
B. Overview of recommended nozzle designs For the processing of LEDs it must be ensured that the process parameters are conform to the package characteristics during assembly. If nozzles or nozzle designs other than the recommendations are used, it must be strictly observed that especially the critical and optical relevant area (area over die/s and wire bond/s) is not loaded. If further information or support regarding the processing of LEDs is needed please contact OSRAM Opto Semiconductors. A catalog with a linkage of the tools to the associated LED product family is listed in Table 1. This table shows the LED product families and the recommended nozzle design with the nozzle number and a dimension drawing of the nozzle. Alternative nozzles are indicated for some products. Since most products were tested with SIPLACE pick and place machines, SIPLACE nozzles are often
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recommended. If other types of pick and place machines are used in the field, please use modified tools according to the given dimensions and body structure for the mounting.
Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
Advanced Power TOPLED® SIPLACE 3121424 Lx GxxP 3.2 15.6
Ø 2 5.5 2.8
Power TOPLED® SIPLACE 3121424 Lx E6xx / Lx Exxx / Lxx T67x
SFH 4250 / SFH 4240 / 3.2 SFH 4250S / 15.6
Ø 2 5.5 2.8
Power TOPLED® Lens SIPLACE 3082992 Lx E63x / Lx E65x Ø 3.1 SFH 4258 / SFH 4259 / SFH 4248 / SFH 4249 /
SFH 4258S / SFH 4259S 14
Ø 2.6 4.6
TOPLED® SIPLACE 3121424 Lx T67x / Lx T68xx
SFH 320 FA / SFH 320 / 3.2 SFH 4243 / SFH 4257 15.6
Ø 2 5.5 2.8
TOPLED® Reverse Gullwing SIPLACE 3121424 SFH 3211 FA 3.2 15.6
Ø 2 5.5 2.8
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
TOPLED® Lens SIPLACE 3082992 SFH 3219 Ø 3.1 14
Ø 2.6 4.6
TOPLED® E3014 SIPLACE 03090143 LUW JLSH
KW DCLMS11.PC 3 15
5.5 1.8
TOPLED® E1608 SIPLACE 2007 Kx DELxS1 1 1.38 16
0.45 0.66
CHIPLED® SIPLACE 2007 SFH 4053 SFH 4043 1 1.38 16
0.45 0.66
CHIPLED® SIPLACE 933 / 2033 SFH 2704 1.7 2.2 14
1.1 1.6
CHIPLED® 0402 SIPLACE 2007 Lx QHxG 1 1.38 16
0.45 0.66
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
CHIPLED® 0603 SIPLACE 2004 Lx Q3xx 1.2 Lx Q976 1.7 15
CHIPLED® 0805 SIPLACE 2004 Lx R97x 1.2 1.7 15
CHIPLED® with Lens SIPLACE 3085131 SFH 4052 Ø 2.4 SFH 4046 SFH 4056 14
Ø 1.95 5.75
FIREFLY® SIPLACE 2007 Lx VHxx 1 1.38 16
0.45 0.66
FIREFLY® E1608 SIPLACE 2007 Cx DELSS1.x2 1 1.38 16
0.45 0.66
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
Micro SIDELED® SIPLACE 2004 Lx Y87x 1.2 LW Y1SG KRBTQCLP61 1.7
SFH 4254 / SFH 3204 15
Mini TOPLED® SIPLACE 2004 Lx M67x / Lx Mxxx 1.2 LCB M67x SFH 4247 1.7 15
Mini TOPLED® SIPLACE 2033 Lx MxSG 1.7 2.2 14
1.1 1.6
MULTILED® SIPLACE 3121424 Lxxx Gxxx 3.2 15.6
Ø 2 5.5 2.8
Multi CHIPLED® SIPLACE 3146362 LRTB RxxG Ø 0.5 16.4
Ø4
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
Multi CHIPLED® SIPLACE 2033 LTRB RxSx 1.7 2.2 14
1.1 1.6
Multi TOPLED® SIPLACE 3121424 Lxx T67x
LxG T77x 3.2 SFH 7252 / SFH 331 /
SFH 7251 / SFH 7250 15.6
Ø 2 5.5 2.8
OSIRE® E3323 SIPLACE 2035 KRTBDWLM32.32 1.2 2.5 3.5 14
1.9
OSIRE® E3635 SIPLACE 3121424 LRTBGVSR 3.2 15.6
Ø 2 5.5 2.8
OSIRE® E5515 SIPLACE 2033 KRTBAELPS1.32 1.7 2.2 14
1.1 1.6
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
OSLON® Black SIPLACE 3090409 Lx H9GP SFH 47xx 14 4.1 Ø 2.9 Ø 3.2 Ø 3.5
Essemtec paraquda SP26/BN15 2.18 1.5 Ø 2.85
OSLON® Black Flat SIPLACE 3124628 LUW HxxP
Lx H9PP 3.6 SFH 4735 15
Ø 2 5.4 3.6
OSLON® Black Flat SIPLACE 3124628 KW H2L531.TE 3.6 15
Ø 2 5.4 3.6
OSLON® Black Flat SIPLACE 3110067 KW H3L531.TE Ø 2 14 4.2 4 3.8
Essemtec paraquda SP26/BN36
3.4 4.2
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
OSLON® Black Flat SIPLACE 3110067 KW H4L531.TE Ø 2 14 4.2 4 3.8
OSLON® Black Flat SIPLACE 3110071 KW H5L531.TE Ø 2 6.4 14
4 3.7
OSLON® Black Flat S SIPLACE 3124628 KW HHL532.TK 3.6 15
Ø 2 5.4 3.6
OSLON® Black Flat S SIPLACE 3110067 KW2 HIL532.TK Ø 2 14 4.2 4 3.8
OSLON® Black Flat S SIPLACE 3110067 KW HJL531.TE Ø 2 14 4.2 4 3.8
OSLON® Black Flat S SIPLACE 3081899 KW HKL531.TE 2 7 15
4.8 5.5
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
OSLON®Black Flat S SIPLACE 3081899 KW HLL531.TE 2 7 15
4.8 5.5
OSLON® Boost SIPLACE 3124628 KW CULPM1 3.6 15
Ø 2 5.4 3.6
OSLON® Compact CM SIPLACE 2004 LUW CEUN.CE 1.2 1.7 15
OSLON® Compact CL / SIPLACE 2004 1.2 OSLON® PL single / OSLON® Boost HM
LCY CEUP 1.7
LUW CEUP.xx 15 KW CELNm1.TG KY CELNMx.FY KW CELMM1.TG
OSLON® Compact PL SIPLACE 3124628 KW2 CFLNM1.TG 3.6 15
Ø 2 5.4 3.6
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
OSLON® Compact PL SIPLACE 3110067-01 KW4 CHLNM1.TG Ø 2 14 4.2 4 3.8
OSLON® PURE 1010 SIPLACE 2031 ø 0.9
ø 4 1.2
JUK-0166/18 Top view Side view 0.60 Ø 0.2
90°
0.60 0.075
OSLON® SX / OSLON® MX / SIPLACE 3086301 OSLON® LX / OSLON® Signal Lx Cxxx / Lxx Cxxx / Ø 2.4
LxW Cxxx 14
Ø 2.7 Ø 3.3
Essemtec paraquda SP26/BN04 1.95 1.5 Ø 2.4
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
OSLON® Signal ChingYi: P/N: JUK-0400/19 Lx CRBP.01 PU95A R 1.55 1.6
3.1 Ø 3.4 Alternative nozzle: SIPLACE 0309409
OSLON® P1616 SIPLACE 2004 SFH 4170S 1.2 SFH 4180S SFH 4170S A01 SFH 4180S A01 1.7 15
SIPLACE 2007 1 1.38 16
0.45 0.66
OSLON® Square Flat SIPLACE 3112054 KW CSLPM2 Ø 1.6 15.25 7 5
Ø 2.8 Ø 2.2
OSLON® Square SIPLACE 3086301 GW CSSRM1.xx LCW CQAR.xx Ø 2.4 14
Ø 2.7 Ø 3.3
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
OSLON® Square SIPLACE 03090409 GW CSSRM2.xx 14 4.1 Ø 2.9 Ø 3.2 Ø 3.5
ChingYi: P/N: JUK-0381/15 Ø 3.1 1 R 1.5
Alternative nozzle: SIPLACE 03122708-03
OSLON® SSL 80 White / Colors SIPLACE 3086301 GW CS8PM1.xM LCW CR7P.xC Ø 2.4 Cx CS8pMx.xx 14 Lx Cx7P
Ø 2.7 Ø 3.3
OSLON® SSL 150 White / Colors SIPLACE 3086301 GW CSHOM1.xM LCW CRDP.xC Ø 2.4 Gx CSHPMx.xx 14 Lx CxDP
Ø 2.7 Ø 3.3
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
OSLON® SSL 120 SIPLACE 3086301 Gx CSSPM1.xx Ø 2.4 14
Ø 2.7 Ø 3.3
ChingYi: P/N: JUK-0778/16 Ø 2.7 3.1 2.5
OSLUX® SIPLACE 3124628 SFH 4780S
SFH 4786S 3.6 SFH 4796S
SFH 4787S 15
Ø 2 5.4 3.6
OSRAM OSTAR® Projection SIPLACE 3112054 Compact Ø 1.6 KW CSLxx1 15.25 7 5
Ø 2.8 Ø 2.2
OSRAM OSTAR® Projection SIPLACE 2033 Compact
LE x Q9Wx 1.7 2.2 LE BA Q6WM
LCR H9RN 14 LE x Q8WP LE x Q7WP 1.1 1.6
OSRAM OSTAR® Projection Cube SIPLACE 3124628 LCG H9Rx 3.6 15
Ø 2 5.4 3.6
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
OSRAM OSTAR® Stage SIPLACE 2035 LE RTDUW S2Wx 1.2 LE x Q8WP 2.5 3.5 14
1.9
PointLED® SIPLACE 3096148 Lx P4xx 13.5 Ø 0.8 Ø 2
Power SIDELED® SIPLACE 2038 Lx B6SP 11
2 4
SIDELED® SIPLACE 2004 Lx A67x 1.2 SFH 4256 SFH 325 1.7
SFH 4244 15 SFH 4255
SMARTLED® 0603 SIPLACE 2004 Lx L2xx 1.2 SFH 4050 / SFH 3010 1.7 15
SYNIOS® P2720 SIPLACE 2033 Kx DMLx31
SFH 4770S / SFH 4775S 1.7 2.2 SFH 4776 14
1.1 1.6
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
SYNIOS® E2314 SIPLACE 2033 KW DNLS31.RA 1.7 2.2 14
1.1 1.6
SYNIOS® E4014 SIPLACE 2087 KW DPLS3x 4 14.5
5.5 Ø 1 1.7
DURIS® E 2835 SIPLACE 2033 GW JBLMSxEM 1.7 2.2 14
1.1 1.6
Alternative nozzle: ChingYi: P/N: JUK-0344/17
DURIS® E 3 SIPLACE 3090143 GW JCLPSx.Ex
LUW JNSH.xC 3 15
5.5 1.8
Alternative nozzle: ChingYi: P/N: JUK-0436/15
DURIS® E 5 SIPLACE 3081896 GW JDSxS1.xC GW JDSxSx.EM 5.6 4.4 15
2.4 3.6
Alternative nozzle: ChingYi: P/N: JUK-0436/15
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
DURIS® P 5 SIPLACE 0328149 GWDASPA1.EC Gx DASPA1.xx 14
Ø 1.95 Ø 2.4
DURIS® S 2 SIPLACE 3117100 GW SBLMAx.EM Ø 2.0
4.5 Ø 1.2
JUKI “KE-2080RL”; Nozzle 503
Ø 3.2 1.2 Ø 1.0
Alternative nozzles: Essemtec paraquda SP26/BN39 Ching Yi Nozzle JUK-0049/15 Ching Yi Nozzle 104590801403 (D)
DURIS® S 5 SIPLACE 3121424 Gx PSLx31.xx
GW PSLPS1.xC 3.2 GW PSLRS1.xC 15.6
Ø 2 5.5 2.8 Alternative nozzle dimensions: Outer dimension: Ø 3.0mm Inner dimension: Ø 1.5mm
DURIS® S 5E ChingYi: P/N: JUK-0130/17 Ø 4 GW JSLPS1.EM 2.5 3 Ø 3.7 Ø 3.9
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
DURIS® S 8 SIPLACE 3083400 GW P9Lx3x.xM 5.1
14.5 Ø 4.65
6.25 5.1 Alternative nozzle dimensions: Outer dimension: Ø 5,0mm Inner dimension: Ø 3,2mm
DURIS® S 10 ChingYi: P/N JUK-0342/17 GW P7LP32.xM 7
OSCONIQ® P 3737 ChingYi: P/N: JUK-0461/15 GW PUSRA1.PM 2.5 Ø 2.8 Ø 3.2
OSCONIQ® P 2226 SIPLACE 0328149 GWDASPA1.EC Gx DASPA1.xx 14
Ø 1.95 Ø 2.4
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
MIDLED® Toplooker SIPLACE 2033 SFH 4651
SFH 4641 1.7 2.2 SFH 4650
SFH 4640 14 SFH 3600 1.1 1.6
Recommended Nozzle-Design Silicone area (1.2) Isolation area 2.15 2.35
Pad 1 Pad 2 metallisation metallisation
MIDLED® Sidelooker SIPLACE 2007 SFH 4656 SFH 4646 SFH 4655 1 1.38
SFH 4645 16 SFH 4647 0.45 SFH 3605 0.66
Mini MIDLED® SIPLACE 2033 SFH 4451
SFH 4441 1.7 2.2 14
1.1 1.6
Recommended Nozzle-Design
min. inner diameter: Ø 1.7mm
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Table 1: Recommended nozzle designs for the OSRAM OS SMT portfolio
Product family Recommended nozzle design
T-MIDLED® Sidelooker SIPLACE 933 / 2033 SFH 4140 1.7 2.2 14
1.1 1.6
IR TOPLED® D5140 SIPLACE 3110067 SFH 2200 / SFH 2201 SFH 2240 Ø 2 14 4.2 4 3.8
BIDOS® P2835 C SIPLACE 2033 V102C021A-850
V102C121A-850 1.7 2.2 V102C021A-940
V102C121A-940 14 V105C121A-940 V105C131A-940 1.1 V105C141A-940 1.6 V107C000A-850 V107C021A-850 V107C021A-940
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ABOUT OSRAM OPTO SEMICONDUCTORS OSRAM, Munich, Germany is one of the two leading light manufacturers in the world. Its subsidiary, OSRAM Opto Semiconductors GmbH in Regensburg (Germany), offers its customers solutions based on semiconduc- tor technology for lighting, sensor and visualization applications. OSRAM Opto Semiconductors has produc- tion sites in Regensburg (Germany), Penang (Malaysia) and Wuxi (China). Its headquarters for North America is in Sunnyvale (USA), and for Asia in Hong Kong. OSRAM Opto Semiconductors also has sales offices th- roughout the world. For more information go to www.osram-os.com.
DISCLAIMER PLEASE CAREFULLY READ THE BELOW TERMS AND CONDITIONS BEFORE USING THE INFORMA- TION SHOWN HEREIN. IF YOU DO NOT AGREE WITH ANY OF THESE TERMS AND CONDITIONS, DO NOT USE THE INFORMATION. The information provided in this general information document was formulated using the utmost care; howe- ver, it is provided by OSRAM Opto Semiconductors GmbH on an “as is” basis. Thus, OSRAM Opto Semicon- ductors GmbH does not expressly or implicitly assume any warranty or liability whatsoever in relation to this information, including – but not limited to – warranties for correctness, completeness, marketability, fitness for any specific purpose, title, or non-infringement of rights. In no event shall OSRAM Opto Semiconductors GmbH be liable – regardless of the legal theory – for any direct, indirect, special, incidental, exemplary, con- sequential, or punitive damages arising from the use of this information. This limitation shall apply even if OSRAM Opto Semiconductors GmbH has been advised of possible damages. As some jurisdictions do not allow the exclusion of certain warranties or limitations of liabilities, the above limitations and exclusions might not apply. In such cases, the liability of OSRAM Opto Semiconductors GmbH is limited to the greatest extent permitted in law. OSRAM Opto Semiconductors GmbH may change the provided information at any time without giving notice to users and is not obliged to provide any maintenance or support related to the provided information. The provided information is based on special conditions, which means that the possibility of changes cannot be precluded. Any rights not expressly granted herein are reserved. Other than the right to use the information provided in this document, no other rights are granted nor shall any obligations requiring the granting of further rights be inferred. Any and all rights and licenses regarding patents and patent applications are expressly excluded. It is prohibited to reproduce, transfer, distribute, or store all or part of the content of this document in any form without the prior written permission of OSRAM Opto Semiconductors GmbH unless required to do so in ac- cordance with applicable law. of OSRAM Opto Semiconductors GmbH unless required to do so in accordan- ce with applicable law.
OSRAM Opto Semiconductors GmbH
Head office:
Leibnizstr. 4 93055 Regensburg Germany www.osram-os.com
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