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ECTC 2017 Final Program WELCOME FROM THE MAYOR OF ORANGE COUNTY 2 WELCOME FROM 67th ECTC GENERAL AND PROGRAM CHAIRS On behalf of the Program Committee and Executive Committee, it is our pleasure to welcome you to the IEEE 67th Electronic Components and Technology Conference (ECTC), held at the beautiful Walt Disney World Swan & Dolphin Resort, Lake Buena Vista, Florida, from May 30 to June 2, 2017. All ECTC meetings and events will be taking place in the Dolphin building of the resort. This premier international conference of the global microelectronic packaging industry is sponsored by the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society. The ECTC Program Committee has selected 335 papers that will be presented in 36 oral sessions and five interactive presentation sessions, including one interactive presentation session exclusively featuring papers by student authors. The oral sessions will feature selected papers on key topics such as flip chip packaging, 3D/TSV technologies, wafer level packaging, design for RF performance and signal/power integrity, thermal and mechanical modeling, optoelectronics packaging, and materials and reliability. Interactive presentation sessions will showcase papers in a format that encourages more in-depth discussion and interaction with authors about their work. Authors from 22 countries are expected to present their work at the 67th ECTC, covering ongoing technological challenges with established disciplines or emerging topics of interest for our industry, such as additive manufacturing, heterogeneous integration, and flexible and wearable electronics. ECTC will also feature panel and special sessions with industry experts covering a number of important and emerging topic areas. On Tuesday, May 30 at 10 a.m., Vikas Gupta and Pradeep Lall will chair a session on “Material and Package Reliability Needs/Challenges for Harsh Environments.” That same day at 2 p.m., Bing Dang will chair a panel session on “Flexible Hybrid Electronics – Electronics Outside the Box,” where a panel of experts will discuss how innovation in device integration and packaging will bring together thinned silicon die with printed components to deliver electronics that conform to the shape of the human body and vehicles. Tuesday evening will also include the ECTC Panel Session at 7:30 p.m. on “Panel Fan-Out Manufacturing: Why, When, and How?” chaired by CPMT President Jean Trewhella and Young Gon Kim. Babak Sabi, Corporate Vice President and Director of Assembly and Test Technology Development, Intel Corporation, will be giving the invited keynote talk on “Advanced Packaging Opportunities and Challenges” at the ECTC Luncheon on Wednesday, May 31. Later that day and continuing to build on the success of the first-ever CPMT Women’s Panel and Reception held at the 65th ECTC two years ago, this year’s conference will also feature a panel discussion chaired by Kitty Pearsall on Wednesday, May 31, at 6:30 p.m. on “Emotional Intelligence (EI) – Link to Successful Leadership,” with participation from distinguished women leaders and technologists in our industry. All conference attendees are invited. Also on Wednesday at 7:30 p.m., Luke England will chair the ECTC Plenary Session titled “Packaging for Autonomous Vehicle Electronics,” featuring key technologists sharing their views on the evolutionary requirements for packaging and reliability challenges to support widespread implementation of self-driving vehicles on the road. On Thursday, June 1 at 8 p.m., the CPMT Seminar titled “3D Printing Tools, Technologies and Applications,” will be moderated by Venkatesh Sundaram and Yasumitsu Orii from the High-Density Substrates & Boards Technical Committee of the CPMT Society. Supplementing the technical program, ECTC also offers several Professional Development Courses (PDCs) and Technology Corner exhibits. Co-located with the IEEE ITherm Conference this year, the 67th ECTC will offer 18 PDCs, organized by the PDC Committee chaired by Kitty Pearsall. The PDCs will take place on Tuesday, May 30, and are taught by distinguished experts in their respective fields. The Technology Corner will showcase the latest technologies and products offered by leading companies in the electronic components, materials, packaging, and services fields. More than 100 Technology Corner exhibits will be open starting at 9 a.m. on Wednesday and Thursday. ECTC also offers attendees numerous opportunities for networking and discussion with colleagues during coffee breaks, daily luncheons, and nightly receptions. Whether you are an engineer, a scientist, a manager, a student, or an executive, ECTC offers something unique for everyone in the microelectronics packaging and components industry. We would like to take this opportunity to thank all our sponsors, exhibitors, authors, speakers, PDC instructors, session chairs, program committee members, as well as all the volunteers who have helped to make the 67th ECTC another resounding success. Once again, thank you for being a part of the 67th ECTC. Henning Braunisch Mark D. Poliks General Chair Program Chair Intel Corporation Binghamton University 3 WELCOME FROM ECTC SPONSORING ORGANIZATION On behalf of CPMT, it is my great pleasure and • To encourage diversity, networking, and professional development, CPMT privilege to welcome you to the 67th ECTC will host a Women’s Panel and Reception Wednesday at 6:30 p.m. on in Lake Buena Vista, Florida at the spectacular “Emotional Intelligence – Link to Successful Leadership,” chaired by Kitty Walt Disney World Swan & Dolphin Resort! Pearsall. All conference attendees are invited. CPMT will continue the women’s networking tables during the Wednesday and Thursday luncheons. The ECTC held its opening night 66 years ago and it hasn’t missed a single year yet! Today, • On Thursday, June 1, CPMT will sponsor an award luncheon session to ECTC has become the premier international present several prestigious IEEE and CPMT awards. conference where professionals not only get • After the traditional Gala reception on Thursday evening the CPMT High- a close-up look at every side of our industry, Density Substrates & Boards technical committee will host the seminar “3D but also share research and development in Printing Tools, Technologies and Applications,” moderated by Venkatesh technological breakthroughs across a wide Sundaram and Yasumitsu Orii. range of semiconductor packaging, electronics devices, design, materials, Friday will feature sessions on topics that range from the reliability of fan-out manufacturing, and modeling. WLP, automotive electronics and power module packaging to processing for The CPMT Society is proud to be a sponsor of ECTC and present these 3D integration – all showing cutting edge advances in these critical areas. program highlights: Lastly I would like to take this opportunity to thank our dedicated volunteers on the ECTC program committee for their hard work over the past year. • Opening Day: Tuesday, May 30, in addition to the ever popular Professional Also, appreciation goes to the session chairs, authors, speakers, and exhibitors Development Courses there will be two special sessions: “Material and who are instrumental to making the 67th ECTC a great success. As always I Package Reliability Needs/Challenges for Harsh Environments” chaired by look forward to the impact all these technical and networking events will make Vikas Gupta and Pradeep Lall and “Flexible Hybrid Electronics – Electronics on the CPMT Society, our industry, and our members. Outside the Box” chaired by Bing Dang. In the evening I will co-chair the ECTC CPMT Panel Session together with Young Gon Kim at 7:30 p.m. Here’s to four fast paced days of in-depth analysis, peer debate, and network on “Panel Fan-Out Manufacturing: Why, When, and How?” Tuesday’s expansion! program highlights the breadth and depth that ECTC delivers each year. Jean Trewhella, President, IEEE CPMT Society CONFERENCE POLICIES AND GUIDELINES Badges Conference attendees MUST wear the official conference badge to be admitted to all training courses, sessions, meals, Technology Corner exhibits and all conference sponsored social functions. Medical Services For emergency medical services, locate any hotel phone, whether in your room or elsewhere in the hotel, and follow its directions for emergencies. Hotel “house” phones have been placed throughout the hotel and conference area for your convenience. If no phone can be located, please locate the nearest hotel staff or ECTC staff for assistance with your emergency. The closest available hotel staff person may be at the front desk. Personal Property The hotel’s safety deposit box is available for storing your valuables; particularly cash and jewelry. If there is a mini-safe in your room, you should consider using it. Smoking Policy Smoking is NOT permitted in the hotel. Please follow hotel policies and signs regarding this. Smoking is also NOT permitted at any ECTC activities including, but not limited to, functions, events, sessions, and / or seminars. Thank you for your consideration and cooperation. Recording presentations via photos or video is prohibited. ECTC Mobile App ECTC is pleased to announce that a free mobile app is available again this year. The app provides information on schedules for our technical program and PDCs as well as exhibitors, sponsors, and general conference information and venue maps. The app also features tools to set your schedule so you don’t miss presentations important to you, social interaction functions, and the ability to provide
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