Mini ITX Mainboard D2703-S General Information

Andreas Ertel, Peter Hoser Augsburg, 28.01.2008 Agenda

n FSCIndustrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis Industrial Mainboards

XLT: 12-24 monthsextendedavailabilityafterEOL All mainboardsRoHScompliant

Mainboard 2007 2008 2009 2010 Series Name Socket Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1

IP Mini-ITX D2703-S ATI/AMD SocketS1 SA PL 1)

Intel next PL 2) IP ATX D2836-S generation LGA775 Intel next PL 2) IP µATX D2831-S generation LGA775

IP ATX D2156-S i945G LGA775 EOL XLT

IP µATX D2151-S i945G LGA775 EOL XLT

Note: Min. forecastquantityrequiredfor XLT 1) ShipmentsexpectedfromM01/08 2) Launchexpectedfor earlyQ4/2008

P Premium Mainboard ECN Engineering Change Notification V ValueMainboard LAO After Last Assured Order date, orders can only be accepted basedupon availability. SA Samples are available about 4 weeks ahead of launch date. Orders placed on LAO date are binding. Delivery is possible up to 8 weeks after LAO. PL? Product Launch: Date is not yet confirmed. EOL The product has End Of Life and can no longer be ordered. The date listed is the last month of availability. PL Product Launch: Date is confirmed. Mainboardin production

3 FSC_Desktop_Mainboard_Roadmap_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved Agenda

n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis Platform Socket S1 Low-Power Processor Longevity Roadmap

embeddeduntilend of 2011!

embeddeduntilend of 2011! Platform Socket S1 Low-Power Processor Features Embedded Socket S1 Low-Power Processor Longevity Roadmap (Planned)

2007 2008 2009 2010 2011 2012 2013

AMD Turion™64 Mobile Processors TL-62 “Tyler”–2.1GHz 35W Socket S1 Dual-Core Processor TL-56 “Tyler”–1.8GHz 31W Socket S1 Dual-Core Processor TL-52 “Tylor”–1.6GHz 31W Socket S1 Dual-Core Processor

Mobile AMD ™Processors 3700+ “Sherman”–2.0GHz 25W Socket S1 Single-Core Processor 3500+ “Keene”–1.8GHz 25W Socket S1 Single-Core Processor

AMD Sempron™Processors 2100+ “Keene”-9W 1.0GHz Lidless Socket S1 2100+ “Sherman”-1.0GHz 8W Lidless Socket S1 Single-Core Processor

Last Orders through Production For detailed ordering information, please refer to applicable Last Time Ship ACN/EOL notification distributed by AMD Business Operations. Two year contractual ACN to announce EOL extension possible Embedded Socket S1 Low-Power Processor Features AMD Embedded Client Chipset Production Schedule

ACN to DVT Sample Production Announce Last Model Availability Availability EOL Orders Last Ship OPN Code Part Marking

M690T Now Q1 2007 Q1 2011 Q3 2011 Q1 2012 100-CG1292 216-TQA6AVA12FG

M690E Oct 2007 Q4 2007 Q1 2011 Q3 2011 Q1 2012 100-CG1408 216-EVA6CVA12FG

SB600 Now Q1 2007 Q1 2011 Q3 2011 Q1 2012 100-CG1291 218-S6ECLA21FG

Note: Embedded components offer 5 year longevity with the option of purchasing an extended 2-year supply (via contract) beyond the standard 5 year offering. Agenda

n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis D2703-S based on ATI M690E / SB600 Mobile Chipset Specification n Mini-ITX for Industrial Applications, up to 60°C n AMD Mobile Socket S1g1 o AMD Mobile Turion™64 X2 / Sempron™ o Up to 35W; HyperTransport™1 -800MHz n DDR2 800/667 SDRAM, Dual Channel, 2 x SO socket n ATI RadeonX1250 graphics; VGA / DVI & LVDS support (up to 256MB) n 1 x PCI, 1 x PCIex1, 1 x CF, 8 x USB 2.0, 4 x SATA 300 / RAID, 1 x IDE n Dual LAN 10/100/1000Mbit, High Definition Audio, Firewire n 24V DC (via internal connector or external AC adapter) or internal ATX Power Supply

11 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved DVI / VGA Splitter Cable T26139-Y3957-V201

Specification n Simultaneoususeof DVI-and VGA monitorvia DVI-I connectorof D2703 n Cablelength 150mm (DVI output) 220mm (VGA output)

Notes: DDC data only possible for DVI monitor!

12 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved DVI-I / VGA Adapter Plug Ordercode CFO:AD-005-E-ROHS

Specification n Directconnectionof VGA monitorto DVI-I outputof mainboardD2703 n Adapter length: 45mm

13 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved Heatsink/ Fan for AMD Mobile Ordercode C26361-D6000-C100

Specification n Aluminium heatsinkwithmounting backplatefor mainboardD2703 n Supports AMD socketS1, up to 35W n Fan 60mm, ball bearing, max. 6.000rpm n Connector4pin PWM, cablelength50mm n Sound level20 db(A) –46 db(A) max. n MTBF ~ 50.000hrs

14 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved Heatsink(FanlessDesign) for AMD Mobile Ordercode V26898-B883-V1/V10

Specification n Aluminium heatsinkwithmounting backplatefor mainboardD2703 n Supports AMD socketS1 n Designedfor Sempron2100+ (max. 9W)

Note: B883-V1 = Heatsink; B883-V10 = mounting backplate

15 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved PCI Risercard(TwoPCI Slots) E318-A

Specification n Releasedfor mainboardD2703

16 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved PCI Risercard(One PCI Slot) D2704-A

Specification n Releasedfor mainboardD2703

17 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved Agenda

n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis Extendend(XLT) lifetimeat a glance

up to 5 years

standardlifecycle 3 month XLT Period up to 3 years up to 2 years LAO EOL

XLT Periodup to 2 years quarterlypricelists

LAO Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 t n t e t s n s a o MOQ 500pcs a c p CustomerA e c e d b r e m

e r o o o f u o t c f

n

i g t g a g

CustomerB n

i n n . n i i d o g o . d c n ce i ri g e s n

p i i

b f s b i i d CustomerC n u example ECN and ECN+ Process at a glance Engineering Change Notification D2703 S11 GS1

Name Version Revision Name: remains the same throughout the complete lifecycle Version: changes only, if the feature set is changing Revision: can change more often, because of technical improvements

Every customer has to decide in advance whether he wants to participate or not shipsamples Start MP max. 4 weeksof testing D2703-S11-GS1

GS1 GS2 GS2 LAO GS3 GS3 oldGS orS21 ECN to GS2 ECN+ to GS3, or from S11 to S21 „minor change“ „major change“ announced via E-Mail announced via E-Mail start shipping immediately start shipping after customer approval Agenda

n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis ReasonableFields of Applicationformini-ITXand D2703-S

Industrial Systems Business Systems ConsumerSystems

1U Entry Industrial PC Car PC Server KIOSK ThinClients Home Server POS, POI,

Digital Signage „Lifestyle“PC Gaming„Cubes“

Gaming Media Center Cabinets

MedicalSystems Reasonable System Configurations

fanlesslowpower fanlessmid standardmid-high solutions performancesolutions performancesolutions main- D2703-S board

256MB -8GB, Single ChannelorDual ChannelDDR2 800/667 SO-DIMM RAM SDRAM, unbuffered, no ECC

Mobile Mobile Sempron3600+ / 3700+ / 3800+ CPU Sempron2100+ TDP: 25 –31 W orTurionTL-56 –TL68 TDP: 8W TDP: 31 –35 W Standard mini mini ITX chassis Standard mini case ITX chassis withheatpipe ITX chassis technology cool- passive heatpipe activeheatsink heatsink solutionadopted withPWM fan ing byFSC to D2703-S byFSC

externalAC adapter(24V) or PSU internalfanlessPSU internalATX PSU D2703-S doesnotrequirea DC-to-ATXconvertor this is only a small overview on vendors of mini ITX chassis. FSC does not guarantee the mechanical fit of its mainboardsD2703-S/A. FurhtermoreFSC does not take any reliability on the products provided OverviewChassis formini ITX by the named vendors. We kindly recommend to check first before purchase!.

Jaromir Bajgar Sophie Chen [[email protected]] EMKO CaseA.G. www.coolermaster.de Jaromir Bajgar[[email protected]] contact: www.emko.cz AOpenHQ Ms. Claire Shieh Tel:+886-2-77101168 Mail: [email protected] www.aopen.com.tw

Dana Linde SilverStoneTechnology GmbH TzeChiew Tel :+49 40 675931-18 Contactperson: ChenbroEurope BV E-Mail /MSN: [email protected] Amy Lai[[email protected]] Tel:+31 40 295 2045 Ext. 732 www.silverstonetek.de www.morex.com.tw http://www.chenbro.com Overview24V AC Adapter suitableforD2703-S underconstruction Agenda

n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis TheminiITXMotherboard Market -Platforms

e + acceptable power consumption (approx. 35Watt TDP) c + dozens of vendors with a wide portfolio n

a + high performance due to DualCoretechnology m

r o platform costs vary, depending on configuration o f r + low power consumption(9 –25 Watt TDP) e

P + dozens of vendors with a wide portfolio o platform costs vary, depending on configuration o good performance, due to state of the art technology + very low platform costs (~60 USD CPU+MB) o acceptable performance (1200 Mhz) o acceptable power consumption (27 Watt TDP) -BGA CPU not scaleable D201GLY2AT -limited expandability and functionality + low power consumption(3,1-20 Watt TDP) + inexpensive platform costs (~100 USD CPU+MB) + dozens of vendors with a wide portfolio oacceptable performance (from.. 533-1500 Mhz) + very low power consumption (0,8-5,1 Watt TDP) + very low platform costs (approx. 40 USD CPU+CS) o companion solution (CPU integrated in Chipset) -low performance (from. 433-600 Mhz) 40$ 60$ 70 -130$ 150 -250$ 250$ -?? Price Competition Positioning Matrix http://wwwd.amd.com/catalog/salescat.nsf/shop?openform

Fujitsu Siemens Computers Albatron Albatron Axxtend Technology KINO KINO Kontron WINMATE D2703-S KI51PV-754 KI690-AM2 Eagle III ( ASIS-6030 ) MI930/F KINO-690AM2 KINO-690S1 KT690/mITX A270

Chipset AMD M690E/SB600 NVIDIA C51PVG/nForce 430 AMD M690T/SB600 SiS 771CX/966 AMD M690T/SB600 AMD M690T/SB600 AMD M690T/SB600 AMD M690T/SB600 AMD M690T/SB600

CPU AMD Turion 64 X2,AMD AMD , AMD Turion AMD Athlon 64, AMD Athlon AMD Turion 64 X2, AMD Sempron AMD , AMD Athlon AMD Athlon 64, AMD Athlon AMD Turion 64 X2, AMD AMD Turion 64 X2,AMD AMD Athlon 64, AMD Athlon Turion 64,AMD Sempron 64, AMD Sempron Mobile 64 X2 Mobile 64 64 X2 Turion 64, AMD Sempron Turion 64,AMD Sempron 64 X2 Mobile Mobile Mobile Sockel S1 754 AM2 S1 S1 AM2 S1 S1 AM2

Power Consumption max. 24V/5A 35 Watt 90 Watt [email protected], [email protected] [email protected], [email protected] Input Voltage 12V internal or 24V DC 12V ATX 12V ATX ATX ATX 20 PINs 5V/12V AT/ATX 5V/12V AT/ATX ATX ATX external ATX

Mechanical Humidity 5-95% 10-90% 10-90% 0-90% 10-90% 5-95% 5-95% 10-90% op.temp 0-60 0-50 0-50 0-50 0-60 0-60 0-60 0-60 0-60 MTBF 200000 200000 200000 Shock: 100g @ 11ms Vibration: 1g (rms - 5 ~ 500Hz)

Memory SODIMM DIMMM SODIMM SODIMM DIMM DIMM SODIMM DIMM DIMM max 8 GB 2GB 2GB 2GB 4 GB 2 GB 2 GB 32 GB 2 GB Flash Compact Flash Type II 4GB IDE Compact Flash Type II 4GB Compact Flash Type II

Display CRT 1600x1200 1280x1024 yes 1600x1200 1920x1440 1920x1440 1920x1440 2048x1536 1920x1440 LCD/DVI 2048x1536 1600x1200 2560x1060 1280x1024 2560x1600 2560x1600 1600x1200 2560x1600 LVDS 2048x1537 1600x1200 1600x1200 2560x1600 18/24 Bit, Dual Channel Dual Channel 18/24 Bit Dual Channel Dual Channel Dual Channel, 24-bit TV-Out NTSC, S-Video NTSC, PAL, SCART, HD, NTSC, PAL, SCART, S-video HD HD S-Video (optional) - Component, Composite S- Video

LAN 2 x GbLAN 1 x 10/100 + 1 x GbLAN 1 x GbLAN 2 x GbLAN 2 x GbLAN 2 x GbLAN 2 x GbLAN 2 x GbLAN 2 x GbLAN Typ Realtek RTL8111C Broadcom Marvell Marvell + SIS966 Marvell Broadcom Broadcom Realtek RTL 8111B Realtek

Input/Output USB 8 8 8 6 6 6 8 10 10 PS/2 2 2 1 2 2 2 2 2 Audio Digital AC97, HD Audio, S/PDIF In S/PDIF in /out HD-Audio, S/PDIF in /out HD Audio, S/PDIF Out HD Audio AC97 AC97 HD Audio AC97 Analog Line In, Line Out Line Out Line Out Line Out, HS (Headset), Line In, MIC Line Out, L&R out, Center/LFE, Line Out, HS (Headset), Line Line Out, HS (Headset), Line Line Out, Line In, MIC Line Out, Line In, MIC Line In, CD in, MIC In In COM 1 x ext 1 x ext 1 x ext 1 x ext 2 x ext RS232 2 x ext RS232 2 x int RS232 2 x ext RS232 1 x int 1 x int 2 x int 1 x ext RS232/RS422/RS485 1 x int RS232/RS422/RS485 1 x int RS232/RS422/RS485 1 x int RS232/RS422/RS485 1 x int RS232/RS422/RS485

LPT 1 x int (Pinheader) 1 x int RS232 1 x int RS232 1 x int RS232 Digital I/O 8 Channel 8 Channel GPIO 8 Channel GPIO 8 Channel GPIO 8 Channel GPIO 8 Channel 1394 2 - 2 - -

Slots PCI 1 1 1 1 1 1 1 1 1 Mini PCI 1 PCI x1 1 1 1 1 PCI x16 1 (used as x8) Mini PCI x1 1 1

Drives PATA 1 2 1 1 1 1 1 1 1 SATA 150 4 4 SATA 300 4 4 2 4 4 4 2 Raid 0,1,0+1 0,1,0+1,5 0,1,0+1 0,1,0+1 0,1,10 0,1,10 0,1,0+1 Floppy 1 shared with LPT Pinheader

SW Windows XP/XPe, Redhat Windows XP/XPe Windows XP/XPe Windows XP, Linux Windwos XP/XPe, Windows XP Windows CE, Winodws Winodws® XPe, Windows® Windows XP/XPe, Windows Linux, Linux, Windows Vista, WindowsServer 2003, Redhat XP/Xpe XP/XPe, Linux®, Windows® Vista Other Linux, Windows Vista, Linux XP, Windows® Vista, Terminal VxWorks, Other

Others Longlife components for 24/7 Supports HDTV 720i and 1080i HDMI Connector Supports 2D/3D engine and MPEG-2/14 v ideoPort deRSc232oder expansion with Dual Independant Display VGA AND DVI on I/O daughter board Support Full revision control SCART header x 1 Battery Lithium 3V/220 mAH TPM onbaord Extended Lifetime up to 5 years AMD XPC header for AMD XPC module Tin-plated PCB Main Competitors

D2703-S KINO690S1 KT690/mITX

-no Raid?? + TV Out S-Video + 24 V DC IN + FW 1394b -no DC IN + 4 x COM -no DC IN + TPM costsavingsfornotrequired -no FW 1394 AC-to-ATXconvertorboard: ~ 30€ -no FW 1394 + HDTV Out Agenda

n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n The MiniITXMarket n Summary Summary-Advantages usingtheD2703-S

n Start with a brand new product leads to a, at least 3 year, stable platform strategy n With “Extended Lifetime”up to 5 years of availability possible n Scalable AMD platform opens the opportunity to use Images on different solutions n Functionality headroom (LVDS, Firewire, CF usw.) for other applications n Bundle opportunities with different AMD embedded CPUs n Committed Revision Control Process for early announcements of technical changes n Direct technical support contact with all clients Mini ITX Mainboard D2703-A General Information

Andreas Ertel, Peter Hoser Augsburg, 28.01.2008 Agenda

nFSC AMD Desktop MainboardRoadmap nComparison sheet between D2703-S and D2703-A nD2703-A and Accessories Mainboards for AMD processors

All mainboardsRoHScompliant

Mainboard Q1/08 Q2/08 Q3/08 Q4/08 Series Name Chipset Socket RAM VGA 1 2 3 4 5 6 7 8 9 10 11 12 nVidia PCIex16 V µBTX D2721-A AM2+ 4x DDR2 SA PL 2) Update MCP78B & on Board nVidia PCIex16 V µBTX D2721-H 1) AM2+ 4x DDR2 SA PL Update MCP78B & on Board nVIDIA PCIex16 V µBTX D2461-C AM2 4x DDR2 LAO EOL Update C51PVG & on Board

Mini-ITX„ThinClient“Mainboard -For Projects only- V M-ITX D2703-A 3) ATI M690T AMD S1 1x SO VGA/DVI PL

1) DedicatedmodelforWebhostingApplications(e.g. Dual GbitLAN onboard, fullAMD Opteron12xx/13xx Support) 2) Shipmentexpectedfromearly03/2008 3) Note: Mainboardwill be provided w/o I/O shield, appropriate aperture in housing required!

P Premium Mainboard ECN Engineering Change Notification V ValueMainboard LAO After Last Assured Order date, orders can only be accepted basedupon availability. SA Samples are available about 4 weeks ahead of launch date. Orders placed on LAO date are binding. Delivery is possible up to 8 weeks after LAO. PL? Product Launch: Date is not yet confirmed. EOL The product has End Of Life and can no longer be ordered. The date listed is the last month of availability. PL Product Launch: Date is confirmed. Mainboardin production

34 FSC_Desktop_Mainboard_Roadmap_2008_01_V1 01/2008 ©Fujitsu Siemens Computers 2008 All rights reserved Agenda

nFSC AMD Desktop MainboardRoadmap nComparison sheet between D2703-S and D2703-A nD2703-A and Accessories Feature Overviewmini-ITXD2703

D2703-S D2703-A Industrial ThinCLient DesignedforIndustrial Applications( 24/7; up to 60°C) x -- DesignedforThinClient Applications(8/5; fanless) -- x PCB: tinplating x -- ATX I/O-ShieldprovidedbyFSC x .-- 1) Sempron/ Turion, DualCore, Processorsupport up to 35W Sempron, Single Core, max. 9W SO DIMM socketDDR2/667 2 / Dual Channel 1 / Single Channel Single DC power supplyoption +24V / 5A +19V / 4A Standard ATX power supplyoption x -- Processorfansupport(4 pinPWM) 1 -- Chassis fansupport(4 pinPWM) 2 x -- PCI slot 1 x 1 x PCIeX1 slot 1 x -- SATA II onboard 4 x -- SATA II RAID-support(0, 1, 0+1) x IDE onboard(e.g. forslimlineopticaldrives) 1 x (onedrive) -- CF connectoronboard 1 x 1 x GbitLAN onboard(Realtek) 2 x 1 x USB 2.0 onboard(internalconnector) 2) 2 x 1 x USB 2.0 (external, front connector) -- 2 x USB 2.0 (external, rearconnector) 4 x 4 x Feature Overviewmini-ITXD2703

D2703-S D2703-A Industrial ThinCLient Frontpanelaudioconnector x -- Microphone/ Headphone(external, front connector) --/ -- 1 x / 1 x S/PDIF out onboard 1 x -- Firewireconnectorinternal/ external 1 x / 1 x --/ -- Stereo Audio / MultichannelAudio x / -- x / -- COM connectorexternal COM1 COM1, COM2 COM connectorinternal COM2 -- General PurposeI/O (8 Bit, internalconnector) 1 x -- Frontpanel(FP) connector(internal, 10 pinIntel-compliant) 1 x -- Power switch(internalconnector) via FP connector 1 x Power LED / HDD LED (internalconnector) via FP connector -- LVDS supportonboard(dual channel, internalconnector) 1 x -- LVDS backlightinvertersupport(internalconnector) 1 x -- Floppy support(internalconnector) -- -- Parallel Interface support(internal/ externalconnector) --/ -- --/ -- TV out support(internal/ externalconnector) --/ -- --/ -- TrustedPlatformModule TPM V1.2 stuffingoption stuffingoption Mini-PCIe(„Mini-Card“) support stuffingoption --

1) Note: RequiredsizeextendsstandardATX dimension; Chassis mustproviderequiredapertures

2) Note: Twochannelsper connector Agenda

nFSC AMD Desktop MainboardRoadmap nComparison sheet between D2703-S and D2703-A nD2703-A and Accessories Specification

D2703-A based on ATI M690E / SB600 Mobile Chipset

n Mini-ITX “Thin Client” n AMD Mobile Socket S1g1 o AMD Mobile Low-Power Sempron™2100+ Processor o Max. 9W; HyperTransport™1 -800MHz n DDR2 667 SDRAM, 1 x SO socket n ATI RadeonX1250 graphics; VGA & DVI support (up to 256MB) n 1 x PCI, 1 x CF for Embedded OS, 8 x USB 2.0 n LAN 10/100/1000Mbit, High Definition Audio n 19V DC Power Supply (via AC adapter) n Designed for fanlessoperation

39 FSC_Desktop_Mainboard_Details_2008_01_V1 01/2008 ©Fujitsu Siemens Computers 2008 All rights reserved Proprietary I/O Layout of D2703-A The I/O layout of D2703-A is not fully compliant to ATX standard and therefore requires a proprietary solution for the chassis.

standardformatof an ATX compliantI/O shield doesnotcovertheCOM 2 connector 19V AC Adapter suitablefor D2703-A S26113-E519-V15

Specification n Releasedfor mainboardD2703-A (notsuitableforD2703-S whichstrictly requires24V!) n (20V, 3.25A, 65W) n power chords: o EU version: T26139-Y2540-V100-*-Z111 o UK version: T26139-Y2540-V200-*-Z111

41 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved Heatsink(FanlessDesign) for AMD Mobile Ordercode V26898-B883-V1/V10

Specification n Aluminium heatsinkwithmounting backplatefor mainboardD2703 n Supports AMD socketS1 n Designedfor Sempron2100+ (max. 9W)

Note: B883-V1 = Heatsink; B883-V10 = mounting backplate

42 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved PCI Risercard(One PCI Slot) D2704-A

Specification n Releasedfor mainboardD2703

43 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved