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Mini ITX Mainboard D2703-S General Information

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Mini ITX Mainboard D2703-S General Information Mini ITX Mainboard D2703-S General Information Andreas Ertel, Peter Hoser Augsburg, 28.01.2008 Agenda n FSCIndustrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis Industrial Mainboards XLT: 12-24 monthsextendedavailabilityafterEOL All mainboardsRoHScompliant Mainboard 2007 2008 2009 2010 Series Name Chipset Socket Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 IP Mini-ITX D2703-S ATI/AMD SocketS1 SA PL 1) Intel next PL 2) IP ATX D2836-S generation LGA775 Intel next PL 2) IP µATX D2831-S generation LGA775 IP ATX D2156-S i945G LGA775 EOL XLT IP µATX D2151-S i945G LGA775 EOL XLT Note: Min. forecastquantityrequiredfor XLT 1) ShipmentsexpectedfromM01/08 2) Launchexpectedfor earlyQ4/2008 P Premium Mainboard ECN Engineering Change Notification V ValueMainboard LAO After Last Assured Order date, orders can only be accepted basedupon availability. SA Samples are available about 4 weeks ahead of launch date. Orders placed on LAO date are binding. Delivery is possible up to 8 weeks after LAO. PL? Product Launch: Date is not yet confirmed. EOL The product has End Of Life and can no longer be ordered. The date listed is the last month of availability. PL Product Launch: Date is confirmed. Mainboardin production 3 FSC_Desktop_Mainboard_Roadmap_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved Agenda n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis Platform Socket S1 Low-Power Processor Longevity Roadmap embeddeduntilend of 2011! embeddeduntilend of 2011! Platform Socket S1 Low-Power Processor Features Embedded Socket S1 Low-Power Processor Longevity Roadmap (Planned) 2007 2008 2009 2010 2011 2012 2013 AMD Turion™64 Mobile Processors TL-62 “Tyler”–2.1GHz 35W Socket S1 Dual-Core Processor TL-56 “Tyler”–1.8GHz 31W Socket S1 Dual-Core Processor TL-52 “Tylor”–1.6GHz 31W Socket S1 Dual-Core Processor Mobile AMD Sempron™Processors 3700+ “Sherman”–2.0GHz 25W Socket S1 Single-Core Processor 3500+ “Keene”–1.8GHz 25W Socket S1 Single-Core Processor AMD Sempron™Processors 2100+ “Keene”-9W 1.0GHz Lidless Socket S1 2100+ “Sherman”-1.0GHz 8W Lidless Socket S1 Single-Core Processor Last Orders through Production For detailed ordering information, please refer to applicable Last Time Ship ACN/EOL notification distributed by AMD Business Operations. Two year contractual ACN to announce EOL extension possible Embedded Socket S1 Low-Power Processor Features AMD Embedded Client Chipset Production Schedule ACN to DVT Sample Production Announce Last Model Availability Availability EOL Orders Last Ship OPN Code Part Marking M690T Now Q1 2007 Q1 2011 Q3 2011 Q1 2012 100-CG1292 216-TQA6AVA12FG M690E Oct 2007 Q4 2007 Q1 2011 Q3 2011 Q1 2012 100-CG1408 216-EVA6CVA12FG SB600 Now Q1 2007 Q1 2011 Q3 2011 Q1 2012 100-CG1291 218-S6ECLA21FG Note: Embedded components offer 5 year longevity with the option of purchasing an extended 2-year supply (via contract) beyond the standard 5 year offering. Agenda n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis D2703-S based on ATI M690E / SB600 Mobile Chipset Specification n Mini-ITX for Industrial Applications, up to 60°C n AMD Mobile Socket S1g1 o AMD Mobile Turion™64 X2 / Sempron™ o Up to 35W; HyperTransport™1 -800MHz n DDR2 800/667 SDRAM, Dual Channel, 2 x SO socket n ATI RadeonX1250 graphics; VGA / DVI & LVDS support (up to 256MB) n 1 x PCI, 1 x PCIex1, 1 x CF, 8 x USB 2.0, 4 x SATA 300 / RAID, 1 x IDE n Dual LAN 10/100/1000Mbit, High Definition Audio, Firewire n 24V DC (via internal connector or external AC adapter) or internal ATX Power Supply 11 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved DVI / VGA Splitter Cable T26139-Y3957-V201 Specification n Simultaneoususeof DVI-and VGA monitorvia DVI-I connectorof D2703 n Cablelength 150mm (DVI output) 220mm (VGA output) Notes: DDC data only possible for DVI monitor! 12 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved DVI-I / VGA Adapter Plug Ordercode CFO:AD-005-E-ROHS Specification n Directconnectionof VGA monitorto DVI-I outputof mainboardD2703 n Adapter length: 45mm 13 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved Heatsink/ Fan for AMD Mobile Ordercode C26361-D6000-C100 Specification n Aluminium heatsinkwithmounting backplatefor mainboardD2703 n Supports AMD socketS1, up to 35W n Fan 60mm, ball bearing, max. 6.000rpm n Connector4pin PWM, cablelength50mm n Sound level20 db(A) –46 db(A) max. n MTBF ~ 50.000hrs 14 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved Heatsink(FanlessDesign) for AMD Mobile Ordercode V26898-B883-V1/V10 Specification n Aluminium heatsinkwithmounting backplatefor mainboardD2703 n Supports AMD socketS1 n Designedfor Sempron2100+ (max. 9W) Note: B883-V1 = Heatsink; B883-V10 = mounting backplate 15 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved PCI Risercard(TwoPCI Slots) E318-A Specification n Releasedfor mainboardD2703 16 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved PCI Risercard(One PCI Slot) D2704-A Specification n Releasedfor mainboardD2703 17 FSC_Desktop_Mainboard_Details_2007_12_V1.ppt 12/2007 ©Fujitsu Siemens Computers 2007 All rights reserved Agenda n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis Extendend(XLT) lifetimeat a glance up to 5 years standardlifecycle 3 month XLT Period up to 3 years up to 2 years LAO EOL XLT Periodup to 2 years quarterlypricelists LAO Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 t n t e t s n s a o MOQ 500pcs a c p CustomerA e c e d b r e m e r o o o f u o t c f n i g t g a g CustomerB n i n n . n i i d o g o . d c n ce i ri g e s n p i i b f s b i i d CustomerC n u example ECN and ECN+ Process at a glance Engineering Change Notification D2703 S11 GS1 Name Version Revision Name: remains the same throughout the complete lifecycle Version: changes only, if the feature set is changing Revision: can change more often, because of technical improvements Every customer has to decide in advance whether he wants to participate or not shipsamples Start MP max. 4 weeksof testing D2703-S11-GS1 GS1 GS2 GS2 LAO GS3 GS3 oldGS orS21 ECN to GS2 ECN+ to GS3, or from S11 to S21 „minor change“ „major change“ announced via E-Mail announced via E-Mail start shipping immediately start shipping after customer approval Agenda n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis ReasonableFields of Applicationformini-ITXand D2703-S Industrial Systems Business Systems ConsumerSystems 1U Entry Industrial PC Car PC Server KIOSK ThinClients Home Server POS, POI, Digital Signage „Lifestyle“PC Gaming„Cubes“ Gaming Media Center Cabinets MedicalSystems Reasonable System Configurations fanlesslowpower fanlessmid standardmid-high solutions performancesolutions performancesolutions main- D2703-S board 256MB -8GB, Single ChannelorDual ChannelDDR2 800/667 SO-DIMM RAM SDRAM, unbuffered, no ECC Mobile Mobile Sempron3600+ / 3700+ / 3800+ CPU Sempron2100+ TDP: 25 –31 W orTurionTL-56 –TL68 TDP: 8W TDP: 31 –35 W Standard mini mini ITX chassis Standard mini case ITX chassis withheatpipe ITX chassis technology cool- passive heatpipe activeheatsink heatsink solutionadopted withPWM fan ing byFSC to D2703-S byFSC externalAC adapter(24V) or PSU internalfanlessPSU internalATX PSU D2703-S doesnotrequirea DC-to-ATXconvertor this is only a small overview on vendors of mini ITX chassis. FSC does not guarantee the mechanical fit of its mainboardsD2703-S/A. FurhtermoreFSC does not take any reliability on the products provided OverviewChassis formini ITX by the named vendors. We kindly recommend to check first before purchase!. Jaromir Bajgar Sophie Chen [[email protected]] EMKO CaseA.G. www.coolermaster.de Jaromir Bajgar[[email protected]] contact: www.emko.cz AOpenHQ Ms. Claire Shieh Tel:+886-2-77101168 Mail: [email protected] www.aopen.com.tw Dana Linde SilverStoneTechnology GmbH TzeChiew Tel :+49 40 675931-18 Contactperson: ChenbroEurope BV E-Mail /MSN: [email protected] Amy Lai[[email protected]] Tel:+31 40 295 2045 Ext. 732 www.silverstonetek.de www.morex.com.tw http://www.chenbro.com Overview24V AC Adapter suitableforD2703-S underconstruction Agenda n FSC Industrial MainboardRoadmap n Supported CPUs & AMD platform and embedded Roadmap n D2703-S and Accessories n Extended Lifetime and Revision Control n Reasonable System Configurations & Field of Applications n Competitive Analysis TheminiITXMotherboard Market -Platforms e + acceptable power consumption (approx. 35Watt TDP) c + dozens of vendors with a wide portfolio n a + high performance due to DualCoretechnology m r o platform costs vary, depending on configuration o f r + low power consumption(9 –25 Watt TDP) e P + dozens of vendors with a wide portfolio o platform costs vary, depending on configuration o good performance, due to state of the art technology + very low platform costs (~60 USD CPU+MB) o acceptable performance (1200 Mhz) o acceptable power consumption (27 Watt TDP) -BGA CPU not scaleable D201GLY2AT -limited expandability and functionality + low power consumption(3,1-20 Watt TDP) + inexpensive platform costs (~100 USD CPU+MB) + dozens of vendors with a wide portfolio oacceptable performance (from.
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