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Informatyka 1 Informatyka 1 Politechnika Białostocka --WydziałWydział Elektryczny Elektrotechnika, semestr II, studia stacjonarne I stopnia Rok akademicki 2018/2019 Wykład nr 11 (24.05.2019) dr inż. Jarosław Forenc Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 2/51 Plan wykładu nr 11 Budowa komputera § jednostka centralna, płyta główna, procesory § moduły pamięci , obudowa (AT, ATX) § interfejsy wewnętrzne i zewnętrzne Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 3/51 Zestaw komputerowy Monitor Mikrofon, słuchawki Jednostka Pendrive centralna Myszka Dysk Kamera zewnętrzny internetowa Klawiatura Skaner Drukarka UPS Głośniki Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 4/51 Jednostka centralna Napęd Zasilacz DVD Procesor Pamięć Stacja RAM dyskietek Płyta Dysk główna twardy Karta graficzna Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 5/51 Płyta główna ((motherboardmotherboard)) --przykładyprzykłady Model GigabyteGA-7N400-L GigabyteGA-X58A-UD5 GigabyteG1-Assassin 2 Rok 2003 2009 2011 Gniazdo SocketA Socket1366 Socket2011 Procesor AMD Athlon, Athlon XP Intel Core i7 Intel Core i7 Northbridge nVIDIA nForce 2 Ultra 400 Intel X58 Express Chipset Intel X79 Southbridge nVIDIA nForce 2 MCP Intel ICH10R 4 x 184-pin DDR DIMM 6 x 1.5V DDR3 DIMM 4 x 1.5V DDR3 DIMM Pamięć sockets, max. 3 GB sockets, max. 24 GB sockets, max. 32 GB Format ATX ATX ATX 4 × PCIe x16, 2 × PCIe x1, 3 × PCIe x16, 2 × PCIe x1, PCI, 8 × SATA II 3 Gb/s, PCI, 4 × SATA II 3 Gb/s, AGP, 5 × PCI, 2 × IDE, FDD, 2 × SATA II 6 Gb/s, 4 × SATA III 6 Gb/s, Inne LPT, 2 × COM, 6 × USB, 2 × eSATA, IDE, FDD, 2 × eSATA, RJ45, IrDA, RJ45, 2 × PS/2 2 × RJ45, 10 × USB 2.0, 9 × USB 2.0, 2 × USB 3.0, 2 × PS/2 3 × USB 3.0, PS/2 Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 6/51 Gigabyte GA--7N4007N400--LL Audio LAN BIOS SIOSIO PCI Socket AA AGP NorthBridge CMOS battery DIMM SouthBridge socket Power źródło: http://www.3cvillage.com IDEIDE FDD Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 7/51 Gigabyte GA--7N4007N400--LL źródło: GA-7N400 Pro2 / GA-7N400 / GA-7N400-L AMD Socket A Processor Motherboard User’s Manual Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 8/51 Gigabyte GA--7N4007N400--LL źródło: GA-7N400 Pro2 / GA-7N400 / GA-7N400-L AMD Socket A Processor Motherboard User’s Manual Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 9/51 Gigabyte GA--X58AX58A--UD5UD5 NorthBridge LAN PCIe x1x1 Intel X58(IOH) SIOSIO 88--PinPin BIOS Power PCI FDD LGA1366 PCIe x16x16 SouthBridge DDR3 Intel ICH10R socket IDEIDE CMOS battery SATA 3 GbGb/s/s 2424--PinPin Power Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 10/51 Gigabyte GA--X58AX58A--UD5UD5 źródło: GA-X58A-UD5 LGA1366 socket motherboard for Intel ® Core ™ i7 processor family User's Manual Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 11/51 Gigabyte G1G1--AssassinAssassin 2 PCIe x1x1 LAN Audio PCIe x16x16 PCI DDR3 socket CMOS battery LGA2011 I/O Controller 88--PinPin Power Intel X79 DDR3 socket SATA 2424--PinPin Power Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 12/51 Gigabyte G1G1--AssassinAssassin 2 źródło: Gigabyte G1.Assassin 2, User's Manual, Rev. 1001 Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 13/51 Płyty główne --standardystandardy Standard Rok Wymiary 12 × 11–13 in ATAT 1984 (IBM) 305 × 279–330 mm 8.5 × 10–13 in BabyBaby--ATAT 1985 (IBM) 216 × 254 –330 mm 12 × 9.6 in ATX 1996 (Intel) 305 × 244 mm 9.6 × 9.6 in MicroMicro--ATXATX 1996 244 × 244 mm 6.7 × 6.7 in MiniMini--ITXITX 2001 (VIA) 170 × 170 mm max. 4.7 × 4.7 in NanoNano--ITXITX 2003 (VIA) 120 × 120 mm PicoPico--ITXITX 2007 (VIA) 100 × 72 mm max. źródło: http://en.wikipedia.org Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 14/51 Płyty główne --standardystandardy Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 15/51 Procesory Intel --mikroarchitekturymikroarchitektury Mikroarchitektura - organizacja procesora Proces Mikroarchitektura Nazwa kodowa Data Procesory 45 nm Nehalem 2008-11-17 Bloomfield, Lynnfield, Clarksfield Nehalem Westmere 2010-01-04 Westmere-EX, -EP, Gulftown, Clarkdale 32 nm Sandy Bridge 2011-01-09 Sandy Bridge-EP, -E, -M, Sandy Bridge Sandy Bridge Ivy Bridge 2012-04-29 Ivy Bridge-EX, -EP, -E, -M, Ivy Bridge 22 nm Haswell 2013-06-02 Haswell-EX, -EP, -E, -DT, -MB, -LP Haswell Broadwell 2014-09-05 Broadwell-EX, -EP, -E Skylake 2015-08-05 Skylake-EX, -EP Kaby Lake 2016-10 Kabylake-X 14 nm Coffee Lake 2017-10-05 CoffeLake-S Skylake Whiskey Lake Whiskey Lake-U 2018-08-28 Amber Lake AmberLake-Y Cascade Lake 2019-04-02 Cascade Lake-X Cannonlake 2018-05 Cannon Lake-U 10 nm Icelake 2019 / 2020 Icelake Tigerlake Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 16/51 Procesory Intel --mikroarchitekturymikroarchitektury Mikroarchitektura - organizacja procesora Proces Mikroarchitektura Nazwa kodowa Nazwa marketingowa 45 nm Nehalem Nehalem Core i3, i5, i7, Pentium, Celeron, Xeon Westmere 32 nm Sandy Bridge Core i3, i5, i7 (2 gen.), Pentium, Celeron, Xeon Sandy Bridge Ivy Bridge Core i3, i5, i7 (3 gen.), Pentium, Celeron, Xeon 22 nm Haswell Core i3, i5, i7 (4 gen.), Pentium, Celeron, Xeon Haswell Broadwell Core i3, i5, i7 (5 gen.), Core M, Pentium, Celeron, Xeon Skylake Core i3, i5, i7 (6 gen.), Core M, Pentium, Celeron, Xeon Kaby Lake Core i3, i5, i7 (7/8 gen.), Celeron, Pentium, Xeon 14 nm Coffee Lake Core i3, i5, i7, i9 (8/9 gen.), Celeron, Pentium Gold Skylake Whiskey Lake Core i3, i5, i7 (8 gen.) Amber Lake Cascade Lake Core i7, i9, Xeon Cannonlake 10 nm Icelake Icelake Tigerlake Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 17/51 Procesory Intel --gniazdagniazda LGA (Land Grid Array) - na procesorze złocone, miedziane, płaskie styki, dociskane do pinów w gnieździe na płycie głównej Gniazdo Data Piny Uwagi LGA 1150 ( Socket H3) czerwiec 2013 1150 Haswell (22 nm ), Broadwell (14 nm ) Skylake (14 nm), Kaby Lake (14 nm), LGA 1151 ((SocketSocket H4) sierpień 2015 1151 wsparcie DDR4 i DDR3(L) LGA 2011 ((SocketSocket R)R) listopad 2011 Sandy Bridge (22 nm), Ivy Bridge LGA 20112011--11 luty 2014 2011 (14 nm), Haswell (22 nm), LGA 20112011--v3v3 sierpień 2014 PCI Express 3.0 Skylake-X, Kaby Lake-X, Skylake-SP, LGA 2066 ((SocketSocket R4) czerwiec 2017 2066 Cascade Lake-X Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 18/51 Procesory Intel --gniazdagniazda LGA (Land Grid Array) - na procesorze złocone, miedziane, płaskie styki, dociskane do pinów w gnieździe na płycie głównej LGA 1151 LGA 2011 Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 19/51 Procesory AMD --gniazdagniazda PGA-ZIF - nóżki znajdują się na procesorze Gniazdo Data Piny Uwagi mikroarchitektura Bulldozer, Socket AM3+ 2011 942 procesory: Athlon II, Phenom II, FX mikroarchitektura: Zen, Excavator, obsługa: Socket AM4 2017 1331 DDR4 Memory, PCIe Gen 3, USB 3.1 Gen2 podstawka LGA , Socket Threadripper 4, Socket Socket TRTR sierpień 2017 4094 SP3r2, procesory: Zen, Ryzen Threadripper AMD Trinity, APU - połączenie tradycyjnego Socket FM2 wrzesień 2012 904 procesora x86 z proc. graficznym AMD Kaveri, APU - połączenie tradycyjnego Socket FM2+ 2013 906 procesora x86 z proc. graficznym Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 20/51 Procesory AMD --gniazdagniazda PGA-ZIF - nóżki znajdują się na procesorze Socket AM4 Socket FM2 Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 21/51 Moduły pamięci DIP Dual In-line Package zastosowanie: XT, AT rok: 1981 SIPP Single In-line Pin Package liczba pinów: 30 zastosowanie: AT, 286, 386 rok: 1983 Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 22/51 Moduły pamięci SIMM (30(30--pins)pins) Single Inline Memory Module liczba styków: 30 (te same styki po obu stronach modułu) pojemność: 256 KB, 1 MB, 4 MB, 16 MB zastosowanie: 286, 386, 486 rok: 1994 Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 23/51 Moduły pamięci SIMM (72(72--pins)pins) Single Inline Memory Module liczba styków: 72 (te same styki po obu stronach modułu) pojemność [MB]: 1, 2, 4, 8, 16, 32, 64, 128 zastosowanie: 486, Pentium, AMD K5, AMD K6 rok: 1996 Informatyka 1, studia stacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 11 24/51 Moduły pamięci DIMM Dual In-Line Memory Module styki po przeciwnych stronach modułu mają inne znaczenie najczęściej stosowane moduły DIMM: § 72-pinowe, stosowane w SO-DIMM (32-bitowe) § 144-pinowe, stosowane w SO-DIMM (64-bitowe) § 168-pinowe, stosowane w SDR SDRAM § 184-pinowe, stosowane w DDR SDRAM § 240-pinowe, stosowane w DDR2 SDRAM § 240-pinowe, stosowane w DDR3 SDRAM § 288-pinowe, stosowane w DDR4 SDRAM Informatyka 1, studia stacjonarne I stopnia dr inż.
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