Intel I7 Core Processor – a New Order Processor Level
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Microcode Revision Guidance August 31, 2019 MCU Recommendations
microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. -
"PCOM-B216VG-ECC.Pdf" (581 Kib)
Intel® Arrandale processor based Type II COM Express module support ECC DDR3 SDRAM PCOM-B216VG-ECC with Gigabit Ethernet 204pin ECC DDR3 SODIMM socket ® Intel QM57 ® Intel Arrandale processor FEATURES GENERAL CPU & Package: Intel® 45nm Arrandale Core i7/i5/i3 or Celeron P4505 ® Processor The Intel Arrandale and QM57 platform processor up to 2.66 GHz with 4MB Cache in FC-BGA package with turbo boost technology to maximize DMI x4 Link: 4.8GT/s (Full-Duplex) CPU & Graphic performance Chipset/Core Logic Intel® QM57 ® Intel Arrandale platform support variously System Memory Up to 8GB ECC DDR3 800/1066 SDRAM on two SODIMM sockets powerful processor from ultra low power AMI BIOS to mainstream performance type BIOS Storage Devices SATA: Support four SATA 300 and one IDE Supports Intel® intelligent power sharing Expansion Interface VGA and LVDS technology to reduce TDP (Thermal Six PCI Express x1 Design Power) LPC & SPI Interface High definition audio interface ® ® Enhance Intel vPro efficiency by Intel PCI 82577LM GbE PHY and AMT6.0 Hardware Monitoring CPU Voltage and Temperature technology Power Requirement TBA Support two ECC DDR3 800/1066 SDRAM on Dimension Dimension: 125(L) x 95(W) mm two SODIMM sockets, up to 8GB memory size Environment Operation Temperature: 0~60 °C Storage Temperature: -20~80 °C Operation Humidity: 5~90% I/O ORDERING GUIDE MIO N/A IrDA N/A PCOM-B216VG-ECC ® Standard Ethernet One Intel 82577LM Gigabit Ethernet PHY Intel® Arrandale processor based Type II COM Express module with ECC DDR3 SDRAM and Audio N/A Gigabit Ethernet USB Eight USB ports Keyboard & Mouse N/A CPU Intel® Core i7-610E SV (4M Cache, 2.53 GHz) Support List Intel® Core i7-620LE LV (4M Cache, 2.00 GHz) Intel® Core i7-620UE ULV (4M Cache, 1.06 GHz) Intel® Core i5-520E SV (3M Cache, 2.40 GHz) Intel® Celeron P4505 SV (2M Cache, 1.86 GHz) DISPLAY Graphic Controller Intel® Arrandale integrated Graphics Media Accelerator (Gen 5.75 with 12 execution units) * Specifications are subject to change without notice. -
Class-Action Lawsuit
Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 1 of 279 Steve D. Larson, OSB No. 863540 Email: [email protected] Jennifer S. Wagner, OSB No. 024470 Email: [email protected] STOLL STOLL BERNE LOKTING & SHLACHTER P.C. 209 SW Oak Street, Suite 500 Portland, Oregon 97204 Telephone: (503) 227-1600 Attorneys for Plaintiffs [Additional Counsel Listed on Signature Page.] UNITED STATES DISTRICT COURT DISTRICT OF OREGON PORTLAND DIVISION BLUE PEAK HOSTING, LLC, PAMELA Case No. GREEN, TITI RICAFORT, MARGARITE SIMPSON, and MICHAEL NELSON, on behalf of CLASS ACTION ALLEGATION themselves and all others similarly situated, COMPLAINT Plaintiffs, DEMAND FOR JURY TRIAL v. INTEL CORPORATION, a Delaware corporation, Defendant. CLASS ACTION ALLEGATION COMPLAINT Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 2 of 279 Plaintiffs Blue Peak Hosting, LLC, Pamela Green, Titi Ricafort, Margarite Sampson, and Michael Nelson, individually and on behalf of the members of the Class defined below, allege the following against Defendant Intel Corporation (“Intel” or “the Company”), based upon personal knowledge with respect to themselves and on information and belief derived from, among other things, the investigation of counsel and review of public documents as to all other matters. INTRODUCTION 1. Despite Intel’s intentional concealment of specific design choices that it long knew rendered its central processing units (“CPUs” or “processors”) unsecure, it was only in January 2018 that it was first revealed to the public that Intel’s CPUs have significant security vulnerabilities that gave unauthorized program instructions access to protected data. 2. A CPU is the “brain” in every computer and mobile device and processes all of the essential applications, including the handling of confidential information such as passwords and encryption keys. -
Multiprocessing Contents
Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References ............................................. -
The Intel X86 Microarchitectures Map Version 2.0
The Intel x86 Microarchitectures Map Version 2.0 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • Variant: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128 -
Lecture Note 7. IA: History and Features
System Programming Lecture Note 7. IA: History and Features October 30, 2020 Jongmoo Choi Dept. of Software Dankook University http://embedded.dankook.ac.kr/~choijm (Copyright © 2020 by Jongmoo Choi, All Rights Reserved. Distribution requires permission) Objectives Discuss Issues on ISA (Instruction Set Architecture) ü Opcode and operand addressing modes Apprehend how ISA affects system program ü Context switch, memory alignment, stack overflow protection Describe the history of IA (Intel Architecture) Grasp the key technologies in recent IA ü Pipeline and Moore’s law Refer to Chapter 3, 4 in the CSAPP and Intel SW Developer Manual 2 Issues on ISA (1/2) Consideration on ISA (Instruction Set Architecture) asm_sum: addl $1, %ecx movl -4(%ebx, %ebp, 4), %eax call func1 leave ü opcode issues § how many? (add vs. inc è RISC vs. CISC) § multi functions? (SISD vs. SIMD vs. MIMD …) ü operand issues § fixed vs. variable operands f bits n bits n bits n bits § fixed: how many? opcode operand 1 operand 2 operand 3 § operand addressing modes f bits n bits n bits ü performance issues opcode operand 1 operand 2 § pipeline f bits n bits § superscalar opcode operand 1 § multicore 3 Issues on ISA (2/2) Features of IA (Intel Architecture) ü Basically CISC (Complex Instruction Set Computing) § Variable length instruction § Variable number of operands (0~3) § Diverse operand addressing modes § Stack based function call § Supporting SIMD (Single Instruction Multiple Data) ü Try to take advantage of RISC (Reduced Instruction Set Computing) § Micro-operations -
M39 Sandy Bridge-PDF
SANDY BRIDGE SPANS GENERATIONS Intel Focuses on Graphics, Multimedia in New Processor Design By Linley Gwennap {9/27/10-01} ................................................................................................................... Intel’s processor clock has tocked, delivering a next- periods. For notebook computers, these improvements can generation architecture for PCs and servers. At the recent significantly extend battery life by completing tasks more Intel Developer’s Forum (IDF), the company unveiled its quickly and allowing the system to revert to a sleep state. Sandy Bridge processor architecture, the next tock in its tick-tock roadmap. The new CPU is an evolutionary im- Integration Boosts Graphics Performance provement over its predecessor, Nehalem, tweaking the Intel had a false start with integrated graphics: the ill-fated branch predictor, register renaming, and instruction de- Timna project, which was canceled in 2000. More recently, coding. These changes will slightly improve performance Nehalem-class processors known as Arrandale and Clark- on traditional integer applications, but we may be reaching dale “integrated” graphics into the processor, but these the point where the CPU microarchitecture is so efficient, products actually used two chips in one package, as Figure few ways remain to improve performance. 1 shows. By contrast, Sandy Bridge includes the GPU on The big changes in Sandy Bridge target multimedia the processor chip, providing several benefits. The GPU is applications such as 3D graphics, image processing, and now built in the same leading-edge manufacturing process video processing. The chip is Intel’s first to integrate the as the CPU, rather than an older process, as in earlier graphics processing unit (GPU) on the processor itself. -
Informatyka 1, Studia Niestacjonarne I Stopnia Dr Inż
Informatyka 1, studia niestacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 5 2/59 Plan wykładu nr 5 Informatyka 1 Język C § pętla for, operatory ++ i – Klasyfikacja systemów komputerowych (Flynna) Architektura von Neumanna i architektura harwardzka Politechnika Białostocka --WydziałWydział Elektryczny Budowa komputera § jednostka centralna Elektrotechnika, semestr II, studia niestacjonarne I stopnia § płyta główna Rok akademicki 2018/2019 § procesor (mikroarchitektury) Wykład nr 5 (05.04.2019) dr inż. Jarosław Forenc Informatyka 1, studia niestacjonarne I stopnia dr inż. Jarosław Forenc Informatyka 1, studia niestacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 5 3/59 Rok akademicki 2018/2019, Wykład nr 5 4/59 Język C --sumasuma kolejnych 10 liczb: 1+2+…+10 Język C --sumasuma kolejnych 100 liczb: 1+2+…+100 Suma wynosi: 55 Suma wynosi: 5050 #include <stdio.h> #include <stdio.h> int main(void ) int main(void ) { { int suma; int suma=0, i; suma = 1 + 2 + 3 + 4 + 5 + 6 + 7 + 8 + 9 + 10; for (i=1; i<=100; i=i+1) suma = suma + i; printf("Suma wynosi: %d\n" ,suma); printf("Suma wynosi: %d\n" ,suma); return 0; } return 0; } Informatyka 1, studia niestacjonarne I stopnia dr inż. Jarosław Forenc Informatyka 1, studia niestacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 5 5/59 Rok akademicki 2018/2019, Wykład nr 5 6/59 Język C --pętlapętla for Język C --pętlapętla for Najczęściej stosowana postać pętli for for (wyr1; wyr2; wyr3) wyr1 instrukcja int i; for (i = 0; i < 10; i = i + 1) NIE wyr 2 ≠ 0 instrukcja wyr1 , wyr2 , wyr3 - dowolne wyrażenia w języku C TAK Instrukcja zostanie wykonana 10 razy Instrukcja: instrukcja (dla i = 0, 1, 2, … 9 ) § prosta - jedna instrukcja Funkcje pełnione przez wyrażenia zakończona średnikiem wyr3 § złożona - jedna lub kilka instrukcji objętych nawiasami klamrowymi for (inicjalizacja ;test ;aktualizacja ) instrukcja Informatyka 1, studia niestacjonarne I stopnia dr inż. -
The Intel X86 Microarchitectures Map Version 2.2
The Intel x86 Microarchitectures Map Version 2.2 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • New instructions: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128 -
2 Basic Compiler Optimizations.Pdf
What’s New for Intel compilers 19.1? Advance Support for Intel® Architecture – Use Intel compiler to generate optimized code for Intel Atom® processor through Intel® Xeon® Scalable processor and Intel® Xeon Phi™ processor families Achieve Superior Parallel Performance – Vectorize & thread your code (using OpenMP*) to take full advantage of the latest SIMD-enabled hardware, including Intel® Advanced Vector Extensions 512 (Intel® AVX-512) What’s New in C++ What’s New in Fortran Initial C++20, and full C++ 17 enabled Substantial Fortran 2018 support ▪ Enjoy advanced lambda and constant expression support ▪ Enjoy enhanced C-interoperability features for effective mixed language ▪ Standards-driven parallelization for C++ developers development Initial OpenMP* 5.0, and full OpenMP* 4.5 ▪ Use advanced coarray features to parallelize your modern Fortran code support Initial OpenMP* 5.0, and substantial OpenMP* 4.5 ▪ Modernize your code by using the latest parallelization support specifications ▪ Customize your reduction operations by user-defined reductions 2 Optimization Notice Copyright © 2020, Intel Corporation. All rights reserved. *Other names and brands may be claimed as the property of others. Common optimization options Linux* Disable optimization -O0 Optimize for speed (no code size increase) -O1 Optimize for speed (default) -O2 High-level loop optimization -O3 Create symbols for debugging -g Multi-file inter-procedural optimization -ipo Profile guided optimization (multi-step build) -prof-gen -prof-use Optimize for speed across the entire program (“prototype switch”) -fast same as: fast options definitions changes over time! -ipo –O3 -no-prec-div –static –fp-model fast=2 -xHost) OpenMP support -qopenmp Automatic parallelization -parallel Optimization Notice Copyright © 2020, Intel Corporation. -
Microcode Revision Guidance April2 2018 MCU Recommendations the Following Table Provides Details of Availability for Microcode Updates Currently Planned by Intel
microcode revision guidance april2 2018 MCU Recommendations The following table provides details of availability for microcode updates currently planned by Intel. Changes since the previous version are highlighted in yellow. LEGEND: Production Status: • Planning – Intel has not yet determined a schedule for this MCU. • Pre-beta – Intel is performing early validation for this MCU. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. • Stopped – After a comprehensive investigation of the microarchitectures and microcode capabilities for these products, Intel has determined to not release microcode updates for these products for one or more reasons including, but not limited to the following: • Micro-architectural characteristics that preclude a practical implementation of features mitigating Variant 2 (CVE-2017-5715) • Limited Commercially Available System Software support • Based on customer inputs, most of these products are implemented as “closed systems” and therefore are expected to have a lower likelihood of exposure to these vulnerabilities. Pre-Mitigation Production MCU: • For products that do not have a Production MCU with mitigations for Variant 2 (Spectre), Intel recommends using this version of MCU. This does not impact mitigations for Variant 1 (Spectre) and Variant 3 (Meltdown). STOP deploying these MCU revs: • Intel recommends to discontinue using these select versions of MCU that were previously released with mitigations for Variant 2 (Spectre) due to system stability issues. • Lines with “***” were previously recommended to discontinue use. Subsequent testing by Intel has determined that these were unaffected by the stability issues and have been re-released without modification. -
Intel: Manufacturing, Chip Design Expertise Driving Innovation and Integration, Historic Change to Computers
Intel: Manufacturing, Chip design Expertise Driving Innovation and Integration, Historic Change to Computers SAN FRANCISCO, Sep 22, 2009 (BUSINESS WIRE) -- Intel Corporation executives today said Moore's Law, driven by Intel's advances in 32 and 22 nanometer (nm)-manufacturing technologies, is leading to a broader and faster pace of "innovation and integration." Future Intel(R) Atom(TM), Core(R) and Xeon(R) processors and System on Chip (SoC) products will make computers smaller, smarter, more capable and easier to use. For example, among a number of other innovations on tap, Intel will integrate graphics into some of its future chip products for the first time ever. "Over the past 40 years, the opportunities enabled by Moore's Law have gone beyond just impressive performance increases," said Sean Maloney, executive vice president and general manager of the Intel Architecture Group. "The rapidly increasing number of transistors and processor instructions we add have made possible the integration of more and more capabilities and features within our processors. This has driven an incredible amount of innovation throughout the industry, with the real winners being the consumers, gamers and businesses which buy these Intel-based computers." Next Generation Processors - Westmere and Sandy Bridge In his Intel Developer Forum keynote, Maloney demonstrated a Westmere-based PC that showed a marked increase in responsiveness on simple, everyday tasks such as Web-surfing with multiple windows open. Moreover, Westmere is Intel's first 32nm processor, and historic in that it is the first-ever Intel processor to integrate graphics die right into the processor's package.