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YMTC 64L 3D NAND Product Brief YMTC 64L 3D NAND Product Brief March 2020 GLOBAL LEADER IN IP & TECHNOLOGY INTELLIGENCE Because we reveal the innovation others can’t inside advanced technology, business and technology leaders trust us to prove patent value and make the best, fact-based IP and technology investment decisions. Technology Intelligence Intellectual Property Services We help decision makers in semiconductor, system, financial, We help IP Professionals in global technology companies, and communication service provider companies: licensing entities and legal firms to: • Discover what products are winning in the highest- • Build higher quality, more effective patents growth markets and why • Identify patents of value and gather evidence of use to • Spot or anticipate disruptive events, including the demonstrate this value entrance of new players • Obtain accurate data for planning a potential defensive • Understand state-of-the-art technology strategy or assertion case through independent, objective analysis • Make better portfolio management decisions to invest, • Make better, faster product decisions with greater abandon, acquire or divest confidence • Understand their competition, identify strategic partners, • Understand product costs and bill of materials acquisition targets and business threats 2 TechInsights CONFIDENTIAL. All content © 2020. TechInsights Inc. All rights reserved. TechInsights has been publishing technology analysis for 30 years, enabling our customers to advance their intellectual property and product strategies. We maintain the world’s largest database of reverse 1 engineering analysis of semiconductor and consumer products ▪ 14,000+ technical reports available for purchase ▪ Covering 40 years of technologies (1977 to today) ▪ Thousands of new programs every year Markets Devices Scope Consumer Electronics DRAM Memory Product Teardowns & Costing / BOM Mobile Devices NAND Flash Memory Structural / Materials Analysis Medical Devices Microprocessors / Controllers Packaging Analysis Storage Devices Wireless R/F Circuit Extraction and Analysis Automotive Electronics Analog Transistor Characterization Internet of Things Antennas Waveform Analysis Semiconductors Power Management Functional Testing Wi-Fi Sensors Software Analysis Clean-Tech Devices Displays Optoelectronics 3 TechInsights CONFIDENTIAL. All content © 2020. TechInsights Inc. All rights reserved. Examining Disruptive Memory Technologies ▪ TechInsights constantly monitors the product releases of new advanced memory products.​ ▪ As new products are launched, we conduct exploratory analysis to find industry innovations and disruptions. When we find a device of interest, we subject it to more comprehensive analysis​ Analysis complete; reports available now Analysis in progress Samsung Toshiba Intel/Micron SK hynix YMTC 92L 3D V-NAND 96L 3D BiCS 96L 3D NAND Flash 4D (PUC) 96L NAND 3D 64L Xtacking TLC • Samsung 970 EVO Plus • Toshiba XG6 SSD • Crucial BX500 960GB SSD • SK hynix SSD NAND SSD KXG60ZNV256G CT960BX500SSD1 • HFB1A8MQ431A0MR • K9DUGY8J5B-DCK0 • TH58LJT0T24BADE • MT29F512G08EBHBFJ4-R (H25FT4MM1 die) 4 TechInsights CONFIDENTIAL. All content © 2020. TechInsights Inc. All rights reserved. Market Overview Semiconductors play a pivotal role in China's state-backed investment in Market share held by leading NAND Flash memory cutting-edge memory chips. The "Made manufacturers worldwide in China 2025" initiative, unveiled three years ago, aims to upgrade the country's manufacturing sector. Yangtze Memory Technologies was poised to become China's first mass- producer of 3D NAND flash memory chips and TechInsights has now confirmed it’s presence. This will be sure to disrupt the 52 billion NAND Memory Market and its respective https://www.statista.com/statistics/275886/market-share-held-by-leading-nand-flash-memory- Market Leaders. manufacturers-worldwide/ 5 TechInsights CONFIDENTIAL. All content © 2020. TechInsights Inc. All rights reserved. YMTC 3D 64L Xtacking TLC NAND: Early Observations We have found 3D 64L Xtacking® TLC NAND devices manufactured by Yangtze Memory Technologies Co., Ltd. (YMTC). We are seeing 73 gates in total for a vertical NAND string with nine vertical Top-metal viewed die photo showing the very small/compact die with higher memory bit density channel (VC) holes, including one dummy hole between common source line contacts. It is likely that 5 select gates (1 SSG and 4 DSGs) and 4 dummy gates are also used. Delayering NAND array level die photo (Hybrid bonded) B-ploy die photo (Hybrid bonded) 6 TechInsights CONFIDENTIAL. All content © 2020. TechInsights Inc. All rights reserved. YMTC Xtacking Architecture ▪ In Xtacking architecture, periphery circuits and memory cell operations are processed on a separate wafer, resulting in higher array efficiency and memory bit density than conventional 3D NAND solutions, such as Samsung 64L V-NAND and KIOXIA/WD 64L BiCS NAND. For example: ▪ YMTC 64L 256 Gb die bit density is 4.41 Gb/mm2 which is higher than Samsung 64L 256 Gb die (3.42 Gb/mm2), and comparable to Micron/Intel 64L CuA FG 256 Gb TLC die (4.40 Gb/mm2) YMTC Xtacking uses Wafer-to-Wafer hybrid bonding technology, meaning the NAND array is upside-down on periphery circuits. The process integration consists of: 1. Metal 1 through Metal 4 for periphery circuits on a wafer 2. NAND array with a source plate (SP) and Metal 1’ through Metal 3’ on a separate wafer 3. Wafer-to-Wafer hybrid bonding to connect M4 X-section SEM image along BL direction showing Xtacking architecture and Metal 3’ 4. Through SP Via and Metal 5. Here, Metal 1’ is for BL 7 TechInsights CONFIDENTIAL. All content © 2020. TechInsights Inc. All rights reserved. Types of Memory Analysis we Provide Teardown and Costing Floorplan and Node Design Elements Transistor Advanced Process & Characterization Circuit Analysis Packaging Process Flows 8 TechInsights CONFIDENTIAL. All content © 2020. TechInsights Inc. All rights reserved. TechInsights Analysis How to access our products Platform Subscription Allows you to go to market quicker with best of class products Access a broad database of detailed Empowers you to grow market share and TECHNOLOGY technical analysis that delivers insight revenue PROFESSIONAL into leading edge technology, curated Provides the facts you need to make by industry experts. informed decisions on your biggest investments TechLibrary Updated daily Online web-based application for IP Search favorites with automated notifications IP customers that provides access to View and navigate product-component-die PROFESSIONAL TechInsights’ technical archive. relationships and design wins Custom Analysis TechInsights has been providing technology analysis for over 30 years, enabling our customers to advance their intellectual property and product strategies. If our library does not currently have LEARN MORE the analysis you are looking for, we want to speak with you. Our custom analysis capabilities span the following markets, devices, and scope. 1 TechInsights CONFIDENTIAL. All content © 2020 TechInsights Inc. All rights reserved. Analysis Details TechInsights has a considerable amount of analysis planned for this part, including the reports listed below: Report Name Description Report Code Subscription Channel Top metal and polysilicon planar die image, SEM X-section, YMTC 64L NAND Memory NAND Floorplan process proof, floorplan analysis and die utilization including MFR-2003-801 Floorplan Analysis Report (MFR) block sizes and functionality, die and package cost YMTC 64L NAND Memory Design Plan view SEM image set with hierarchical schematics of NAND Peripheral MDP-2003-801 – Periphery target blocks Design (MDP) YMTC 64L NAND Process Flow Spreadsheets showing process architecture, mask list, and Process Flow Analysis PFA-2003-803 Analysis integration-level process steps (PFA) SEM planar and X-sections, TEM EDS and EELS, SCM, SIMS YMTC 64L NAND Advanced and other advanced techniques of structural and material AME-2003-801 Process (AME) Memory Essentials analysis YMTC 64L NAND Process Flow Process flow steps and 3D emulations of advanced Process Flow Analysis PFF-2003-802 Full Analysis semiconductor technologies. (PFF) Plan view SEM image set with hierarchical schematics of Circuit Analysis YMTC 64L NAND Circuit Analysis CAR-2003-801 target blocks Reports (CAR) 10 TechInsights CONFIDENTIAL. All content © 2020. TechInsights Inc. All rights reserved. Memory Floorplan Analysis Report (MFR) An overview of leading-edge NAND and 3D NAND design SEM X-Section WL SEM X-Section BL Floor Plan Analysis This report includes: ▪ High-resolution SEM cross-sections Critical Dimensions ▪ Critical dimensions ▪ Functional Block Summary ▪ Detailed images of package and die ▪ CircuitVision™ enabled stack images 11 TechInsights CONFIDENTIAL. All content © 2020. TechInsights Inc. All rights reserved. NAND Memory Design Periphery Report (MDP) A concise analyst’s summary of critical device metrics: ▪ Circuit schematic diagram of a page buffer: decoder, switch, and controller ▪ Circuit schematic diagram of a wordline driver: decoder and switch ▪ Detailed stacked plan view SEM images of a beveled NAND page buffer and wordline driver delivered in CircuitVision™. Includes calibrated measurement and annotation tools. Critical Dimensions Memory Array Block Layout and CircuitVision: Stacked Dimensions plan view SEM Images Schematics: Page Buffer Wordline Driver SEM Layout 12 TechInsights CONFIDENTIAL. All content © 2020. TechInsights Inc. All rights reserved. Advanced Memory Essentials (AME) This report will provide:
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