As a New Interface Nvme Enjoys Unprecedented

Total Page：16

File Type：pdf, Size：1020Kb

As a new interface NVMe enjoys unprecedented breadth and depth of industry support and involvement; a testament to its leading edge technology and to the organization’s openness and inclusiveness. NVMe has the support of companies that range from those who are in the Fortune 50 to those companies who are taking advantage of this technology shift to make their name in the industry. Below is a list of just some of the 50 plus members of the NVM Express organization. Promoter Member Cisco NetApp Dell Oracle America EMC Corporation PMC HGST, a Western Digital Company Samsung Intel Corporation SanDisk Micron Seagate Technology Microsoft Corporation Contributor Member Allion Labs, Inc. Marvell Semiconductor Apeiron Mobiveil, Inc. Avago Technologies NEC Corporation Baidu NetBRIC Technology Co., Ltd. Beijing Memblaze Technology Co. Ltd. Phison Electronics Corp. Cadence Design Systems OCZ Storage Solutions, Inc. Cavium, Inc. Qlogic Corporation CNEX Labs, Inc. Quanta Computer Inc. Elastifile Ltd. Realtek Semiconductor Corp. Fujitsu Silicon Motion Google, Inc. SK hynix memory solutions, Inc. Greenliant Systems SMART Modular Technologies Hewlett-Packard Company TDK Corporation Hitachi, Ltd. Teledyne LeCroy Huawei Technologies Co. Ltd. Tidal Systems, Inc. Hyperstone GmbH Toshiba Corporation IP-Maker ULINK Technology, Inc. JDSU - Storage Network Test Western Digital Technologies, Inc. JMicron Technology Corp. X-IO Technologies Kazan Networks Corporation Xilinx Mangstor Adopter Member Echostreams Innovative Solutions LLC Qnap Systems, Inc. eInfochips, Inc. SerialTek LLC Novachips Co. Ltd. Super Micro Computer, Inc OSR Open Systems Resources, Inc. April 29th, 2015 .

Copy Link

Recommended publications

Phison's Resilient Business Model Generates Results Through
March 2020 Release EXECUTIVE SUMMARY Phison’s Resilient Business Phison’s diversified revenue contribution flows from a range of NAND applications including consumer, embedded, and Model Generates Results enterprise markets, making Phison less susceptible to global crisis incidents. through Challenging World During cyclical NAND price declines, Phison has demonstrated it can increase market share and unit shipments. Events During cyclical NAND price increases, Phison has demonstrated it can increase margin and revenue. _____________________________________ Over the past 20 years, Phison (TPEx: 8299) has endured the financial crisis of 2008, the cyclicality of NAND industry pricing related to supply and demand, and the introduction of new NAND technologies and emerging applications. Throughout these events, Phison maintained profitability while overcoming the challenges and generating business growth. Though the COVID-19 virus is currently impacting businesses worldwide, Phison continues to leverage its unique and resilient business model to generate results as it has successfully done in the past. PHISON’S BUSINESS MODEL Phison’s business model in Exhibit 1 is straightforward in simplicity but is underlined by massive engineering capability and flexible execution. Peer companies have attempted to study and replicate Phison’s model, but none have been successful to date. Exhibit 1: Phison’s unique business model of differentiated revenue and flexible execution. PHISON ELECTRONICS CORPORATION 1 March 2020 Release This model consists of 2 key elements: 1) NAND controller IC design, and 2) NAND storage module integration. Storage module integration is defined as manufacturing an entire functioning storage device including the controller, NAND and firmware under private labels for our valued customers.
[Show full text]
USER's MANUAL of Intel X58 Express Chipset and Intel ICH10R Chipset Based
USER'S MANUAL Of Intel X58 Express Chipset And Intel ICH10R Chipset Based M/B for Intel Core i7 Processors NO. G03-BI600 -F Rev: 2.0 Release date: April, 2009 Trademark: * Specifications and Information contained in this documentation are furnished for information use only, and are subject to change at any time without notice, and should not be construed as a commitment by manufacturer. Environmental Protection Announcement Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle. i TABLE OF CONTENT SAFETY ENVIROMENTAL INSTRUCTION ....................................................................iii USER’S NOTICE.....................................................................................................................iv MANUAL REVISION INFORMATION ..............................................................................iv COOLING SOLUTIONS........................................................................................................iv CHAPTER 1 INTRODUCTION OF X58 EXPRESS AND ICH10R MOTHERBOARDS 1-1 FEATURES OF MOTHERBOARD .................................................................................... 1 1-1.1 SPECIAL FEATURES OF MOTHERBOARD.................................................... 2 1-2 SPECIFICATION.................................................................................................................. 4 1-3 PERFORMANCE LIST.......................................................................................................
[Show full text]
Semiconductor Times, April 2020
SEMICONDUCTOR TIMES APR 2020 / 1 ® APR 2020 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES VOL 25, ISSUE 4 bandwidth in the automotive market. Christopher Mash, VP of Business De- Startup Profiles Next generation cars require multiple velopment (previously Senior Dir. layers of security protection to prevent, Automotive Apps, Product Definition Axonne detect, and adapt to evolving threats. The and Architecture at Marvell) Axonne was founded in early 2018 auto industry is increasingly adopting Craig Farnsworth, GM and Senior Dir. to develop connectivity solutions for Ethernet solutions and 2019 will see the of Engineering (previously Senior automotive and industrial applications. international standardization (IEEE) of Director of Digital Design at Peraso) The company has received funding multi-gigabit Ethernet bandwidth rates Ahmad Tavakoli, Sr. Director, Analog from Translink Capital. We believe for automotive applications. & Mixed-Signal Design (previously the company is developing automotive Sr. Hardware Engineer at Google and ethernet ICs. Ethernovia is developing an Ethernet Verily Life Sciences, and Sr. Director system sophisticated enough to process of Engineering at Aquantia) Gani Jusuf, Ph.D., Co-Founder and the bandwidth demands of future auto- 2050 Ringwood Ave Suite B CEO (previously VP of engineering motive systems by unifying in-vehicle San Jose, CA 95131 at Marvell) networks into an end to end Ethernet www.ethernovia.com William Lo, Co-Founder and CTO system. Ethernovia is developing an (previously VP, R&D Datacom En- Ethernet solution that will provide a gineering at Marvell) unified, standards-based solution built ONiO Sunnyvale, CA to meet automotive functional safety ONiO was founded in 2016 to develop www.axonne.com requirements.
[Show full text]
Stoxx® Global 3000 Technology Index
SUPERSECTOR INDICES 1 STOXX® GLOBAL 3000 TECHNOLOGY INDEX Stated objective Key facts The STOXX Supersector indices track supersectors of the relevant » Categorization according to their primary source of revenue benchmark index. There are 19 supersectors according to the guarantees an accurate classification of companies in their respective Industry Classification Benchmark (ICB). Companies are categorized business environments according to their primary source of revenue. The following supersectors are available: automobile and parts, banks, basic » Component capping ensures that no component can dominate the resources, chemicals, construction and materials, financial services, index food and beverage, health care, industrial goods and services, insurance, media, oil and gas, personal and household goods, real estate, communications, retail, technology, travel and leisure and utilities. Descriptive statistics Index Market cap (USD bn.) Components (USD bn.) Component weight (%) Turnover (%) Full Free-float Mean Median Largest Smallest Largest Smallest Last 12 months STOXX Global 3000 Technology Index 4,573.6 4,143.5 19.6 5.4 618.0 1.2 14.9 0.0 4.1 STOXX Global 3000 Index 48,487.0 40,843.1 13.6 5.1 618.0 1.2 1.5 0.0 3.4 Supersector weighting (top 10) Country weighting Risk and return figures1 Index returns Return (%) Annualized return (%) Last month YTD 1Y 3Y 5Y Last month YTD 1Y 3Y 5Y STOXX Global 3000 Technology Index 3.8 15.3 33.8 56.5 87.5 55.8 23.3 33.0 15.7 13.1 STOXX Global 3000 Index 2.3 7.5 21.7 51.5 87.5 31.3 11.2 21.2 14.5 13.1
[Show full text]
Phison Electronics Corporation 2016 ANNUAL REPORT
ި౻жዸǺ8299 ဂᖄႝηިҽԖज़Ϧљ Phison Electronics Corporation ΋Ʉϖԃࡋ ԃ ൔ 2016 ANNUAL REPORT ԃൔࢗ၌ᆛ֟ Ϧ໒ၗૻᢀෳઠᆛ֟Ǻhttp://mops.twse.com.tw ҁ Ϧ љ ᆛ ֟Ǻwww.phison.com т ӑ В ය Ǻ ύ ๮ ҇ ୯ ΋ Ʉ Ϥ ԃ ϖ Д Β Μ Ϥ В Ӝ/ᙍᆀ/ᖄ๎ႝ၉/ႝηແҹߞጃۉΓقz Ϧљว மדӜǺΪ ۉ ᙍ ᆀǺၗు੝ձշ౛ ႝ၉Ǻ(037) 586-896 ext.1019 ႝηແҹߞጃǺ[email protected] Ӝ/ᙍᆀ/ᖄ๎ႝ၉/ႝηແҹߞጃۉΓقz Ϧљж౛ว ๮ਁ۔ӜǺ ۉ ᙍ ᆀǺ੝ձշ౛ ႝ၉Ǻ(037) 586-896 ext. 1029 ႝηແҹߞጃǺ[email protected] z ᕴϦљ/ϩϦљ/πቷϐӦ֟Ϸႝ၉ ᕴϦљ Ӧ ֟ǺཥԮᑜԮчѱൺᑫ΋ຉ 251 ဦ 10 ኴϐ 6 ႝ၉Ǻ(03)657-9299 ԮࠄϩϦљϷπቷ Ӧ ֟ǺभਪᑜԮࠄᙼဂကၡ 1 ဦϷभਪᑜԮࠄᙼဂကၡ 1-1 ဦ ႝ၉Ǻ(037)586-896 z ި౻ၸЊᐒᄬϐӜᆀ/Ӧ֟/ᆛ֟/ႝ၉ ҽԖज़Ϧљ ި୍ж౛೽ިچӜ ᆀǺֻᇻ᛾ Ӧ ֟ǺѠчѱεӼ୔ߞကၡѤࢤ 236 ဦ 3 ኴ ᆛ֟Ǻwww.honsec.com.tw ႝ၉Ǻ(02)2326-8818 Ӝᆀ/Ӧ֟/ᆛ֟/ႝ၉܌٣୍/Ӝۉz ന߈ԃࡋ଄୍ൔ֋ᛝ᛾཮ीৣ ӜǺᔎߞᆢǵणԖ଻ۉ཮ीৣ ܌ӜᆀǺ༇཰౲ߞᖄӝ཮ीৣ٣୍܌٣୍ Ӧ ֟ǺѠчѱ҇ғܿၡΟࢤ 156 ဦ 12 ኴ ᆛ֟Ǻwww.deloitte.com.tw ႝ၉Ǻ(02)2545-9988 ၗૻϐБԄǺคǶچӜᆀϷࢗ၌၀ੇѦԖሽ᛾܌௠จວ፤ϐҬܰ൑چz ੇѦԖሽ᛾ z Ϧљᆛ֟Ǻwww.phison.com ဂᖄႝηިҽԖज़Ϧљ ΋Ʉϖԃࡋԃൔ Ҟ ᒵ ൘ǵठިܿൔ֋ਜ........................................................................................................... 1 ΋ǵ 105 ԃࡋᔼ཰่݀.................................................................................................................... 1 Βǵ 106 ԃࡋᔼ཰ीჄཷा............................................................................................................ 3 Ѧ೽ᝡݾᕉნǵݤೕᕉნϷᕴᡏ࿶ᔼᕉნϐቹៜ ................... 4ډڙΟǵ ҂ٰϦљว৖฼ౣǵ ມǵϦљᙁϟ................................................................................................................... 5 ΋ǵ ೛ҥВය................................................................................................................................... 5 Βǵ Ϧљݮॠ..................................................................................................................................
[Show full text]
JMS562 USB3.0 & Esata GEN III to Dual SATA GEN III Ports
JMS562 Product Brief JMS562 USB3.0 & eSATA GEN III to Dual SATA GEN III Ports Bridge Chip Overview JMicron JMS562 is a Supper Speed & eSATA GEN III to Dual SATA Gen III Ports bridge chip. It integrated four independent SATA channels and a micro-processor. With proper setting, the chip can be configured as 1 to 2- ports Serial ATA III Port Multiplier or hardware striping & mirror. The JMS562 is able to reach a data transmission rate above 400M bytes per second when paired with an SSD module using JMicron’s JMF667 SSD controller. The readings were measured by IOMeter, a gauge for storage device performance, with a variety of queue depths and worker number settings, on a platform with an xHCI host on an Intel Panther Point C1 stepping PC, running Windows 8 Build 8315 Core 2. Enabling USB Attached SCSI Protocol (UASP) on the JMS562, increased the data transmission rate by as much as 30%. JMS562 has passed the USB-IF test procedure for USB3.0 products and it won the Windows Hardware Certification approval. Features ➢ Complies with Serial ATA International Organization: Serial ATA Revision 3.1 ➢ Complies with Universal Serial Bus 3.0 Specification Revision 1.0 ➢ Complies with USB Mass Storage Class Bulk-Only Transport (BOT) Rev. 1.0 Specification ➢ Complies with USB Attached SCSI Protocol (UASP) Rev. 1.0 Specification ➢ Supports USB Super-Speed/High-Speed/Full-Speed Operation ➢ Supports USB 2.0/USB 3.0 power saving mode ➢ Supports multi LUNs for USB 2.0/USB 3.0 ➢ Supports port multiplier for eSATA ➢ Supports hardware RAID0 (striping) and RAID1 (mirror) over USB 2.0/USB 3.0/eSATA ➢ Flexible GPIOs for customized functions ➢ Provides a hardware control PWM ➢ Provides software utilities for downloading the upgraded firmware code under USB2.0/USB3.0/eSATA ➢ Design for Windows XP, Windows 7, Windows 8, MAC 10.3 or later versions ➢ 30MHz external crystal ➢ An embedded 2.5V to 1.3V voltage regulator ➢ An embedded 5.0V to 3.3V voltage regulator ➢ QFN 76 package Copyright © 2014 JMicron Inc.
[Show full text]
Fiscal Year 2020 Form 10-K
UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 Form 10-K (Mark One) ☒ ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended February 1, 2020 or ☐ TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the transition period from to Commission file number 0-30877 Marvell Technology Group Ltd. (Exact name of registrant as specified in its charter) Bermuda 77-0481679 (State or other jurisdiction of (I.R.S. Employer incorporation or organization) Identification No.) Canon’s Court, 22 Victoria Street, Hamilton HM 12, Bermuda (Address of principal executive offices) (441) 296-6395 (Registrant’s telephone number, including area code) Securities registered pursuant to Section 12(b) of the Act: Title of each class Trading Symbol Name of each exchange on which registered Common shares, $0.002 par value per share MRVL The Nasdaq Stock Market LLC Securities registered pursuant to Section 12(g) of the Act: None Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. Yes ☐ No ☒ Indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or Section 15(d) of the Act. Yes ☐ No ☒ Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days.
[Show full text]
Press Release – 28 January 2019 Wibu-Systems Returns to Embedded
Press Release – 28 January 2019 The compound value of collaboration broadens the perspective on the digital transformation Wibu-Systems returns to Embedded World with an incredible lineup of solution partners Karlsruhe, Germany – Wibu-Systems will once again exhibit at Embedded World, the most iconic event for Europe’s embedded community, hosted in Nuremberg, Germany, from February 26th to 28th. The journey starts at Wibu-Systems’ principal booth (4/360) and continues at the OSADL, SD Association, Trusted Computing Group, and Wind River spaces for a fully engaging experience of the world of secure license management applied to electronic systems, distributed intelligence, the Industrial Internet of Things, e-mobility, and energy efficiency. At Wibu-Systems’ main space (Hall 4, booth 360), the company security experts will be focusing specifically on IP protection as a way to prevent attempts to pirate or reverse engineer crucial code and to ultimately ensure the lasting commercial success for businesses everywhere. They will also be sharing several case studies where IP protection was skillfully integrated into modern business models to multiply revenue streams. At the collective exhibit of OSADL, the Open Source Automation Development Lab (Hall 4, booth 168), embedded software developers will be laying out the importance of monetizing digital know-how and raising the quality of their code. Wibu-Systems, who affiliated with OSADL a couple of years ago, will join forces with them to provide their combined expertise and services to the entire OSADL community. Together with ATP, Delkin, GRL, Hagiwara, JMicron, Micron, Phison, Swissbit, Toshiba, and WD, Wibu-Systems will also present some of WIBU-SYSTEMS AG Page 1 Press Release – 28 January 2019 its many hardware secure elements at the SD Association’s group exhibit (Hall 3A, booth 524).
[Show full text]
FOR IMMEDIATE RELEASE Wibu‐Systems to Expand Its Presence
FOR IMMEDIATE RELEASE Wibu‐Systems to Expand its Presence at Embedded World 2019 in Close Collaboration with Solution Partners The company to focus on secure license management and IP protection January 24, 2019 ‐ Edmonds, WA – Wibu‐Systems will exhibit at Embedded World 2019, the iconic event for Europe’s embedded community, hosted in Nuremberg, Germany, from February 26 to 28. The company will focus on secure license management applied to electronic systems, distributed intelligence, the Industrial Internet of Things, e‐mobility, and energy efficiency. Wibu‐Systems’ will exhibit in its main booth (Hall 4/Booth 360) in addition to a presence at the Open Source Automation Development Lab (OSADL), SD Association, Trusted Computing Group, and Wind River exhibits. At Wibu‐Systems’ main stand, company security experts will focus specifically on IP protection as a way to prevent attempts to pirate or reverse engineer crucial code and to ultimately ensure the lasting commercial success for global businesses. They will also share several case studies where IP protection was skillfully integrated into modern business models to multiply revenue streams. At the collective exhibit of OSADL, (Hall 4, booth 168), embedded software developers will lay out the importance of monetizing digital know‐how and raise the quality of their code. Wibu‐Systems, who affiliated with OSADL a couple of years ago, will join forces with them to provide their combined expertise and services to the entire OSADL community. Together with ATP, Delkin, GRL, Hagiwara, JMicron, Micron, Phison, Swissbit, Toshiba, and WD, Wibu‐ Systems will also present some of its many hardware secure elements at the SD Association’s group exhibit (Hall 3A, booth 524).
[Show full text]
4 Cos. Don't Infringe Sandisk Flash Patents: ITC
Portfolio Media, Inc. | 648 Broadway, Suite 200 | New York, NY 10012 | www.law360.com Phone: +1 212 537 6331 | Fax: +1 212 537 6371 | [email protected] 4 Cos. Don't Infringe SanDisk Flash Patents: ITC By Ryan Davis Law360, New York (April 13, 2009) -- An administrative law judge for the U.S. International Trade Commission has ruled that flash memory products made by Silicon Motion Technology Corp., Phison Electronics Corp., Skymedi Corp and Imation Corp. do not infringe two patents held by SanDisk Corp., a setback for SanDisk in a patent case it originally brought against dozens of competitors. In an initial determination issued Friday, Administrative Law Judge Charles E. Bullock ruled that the four companies did not infringe the asserted claims of SanDisk's patents, and that one claim of one of the patents was invalid for obviousness. Both patents involve methods for storing and organizing data in portable flash memory devices. “SanDisk tried to coerce the flash memory industry to pay unwarranted license fees on patents of limited value,” said Mike Bettinger, an attorney for Taiwan-based Silicon Motion. “We said from the beginning that the SanDisk patents don’t cover Silicon Motion products. We are pleased with the fact that Silicon Motion came away with a complete victory.” E. Earle Thompson, SanDisk's vice president and chief intellectual property counsel, said in a statement that the company was disappointed by the ruling. “We will continue to vigorously pursue actions against companies that use SanDisk’s patented technology without a license,” Thompson said. “SanDisk expects that the Initial Determination will not adversely impact existing licensing agreements or the royalties expected from those agreements.” The patents-at-issue in the ruling are U.S.
[Show full text]
SK Hynix to Acquire Intel NAND Memory Business
SK hynix to Acquire Intel NAND Memory Business NEWS HIGHLIGHTS SK hynix will pay US $9 billion for the Intel NAND memory and storage business, which includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. SK hynix aims to enhance the competitiveness of its NAND flash solutions as one of the leading global semiconductor companies and grow the memory ecosystem to the benefit of customers, partners, employees and shareholders. Intel will retain its Intel® Optane™ business and intends to invest transaction proceeds in long-term growth priorities. SEOUL, Republic of Korea and SANTA CLARA, Calif., Oct. 20, 2020 -- SK hynix and Intel today announced that they have signed an agreement on Oct. 20, KST, under which SK hynix would acquire Intel’s NAND memory and storage business for US $9 billion. The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain its distinct Intel® OptaneTM business. SK hynix and Intel will endeavor to obtain required governmental approvals expected in late 2021. Following receipt of these approvals, SK hynix will acquire from Intel the NAND SSD business (including NAND SSD-associated IP and employees), as well as the Dalian facility, with the first payment of US $7 billion. SK hynix will acquire from Intel the remaining assets, including IP related to the manufacture and design of NAND flash wafers, R&D employees, and the Dalian fab workforce, upon a final closing, expected to occur in March 2025 with the remaining payment of US $2 billion.
[Show full text]
2014 NAND Flash Market Update -Supply, Demand and Beyond
2014 NAND Flash Market Update -Supply, Demand and Beyond- Memory and Storage Division Sean Yang June 5 th , 2014 Supply, Sufficiency and ASP ALL RIGHTS RESERVED. REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION . June, 2014 |Page 2 NAND Market Revenue Trend 2014 NAND market revenue continues to grow with solid demand from diversified applications. 60% 51% 31% 7% 23% 14% 16% 19% -7% 5% USD$bn 30 -18% NAND Revenue Growth.(%) 25 20 15 10 5 - 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014E External Drive/ Consumer Embedded Drive/ ICT Storage Source: DRAMeXchange,June2014 ALL RIGHTS RESERVED. REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION . June, 2014 |Page 3 2014 NAND Market: Balance is the Theme 2014: Supply growth @38% YoY, Demand grwoth@39% YoY. NAND makers are profit-oriented and conservative toward supply strategy. Supply & Demand balance is a new paradigm. 12.3% Unit: 2GB M equiv. 5.8% 6.0% 2.6% 1.9% 30,000 1.3% 1.8% -0.2% 20,000 10,000 - 2007 2008 2009 2010 2011 2012 2013 2014E Bit Supply Shipment Bit Demand Shipment Source: DRAMeXchange,June2014 ALL RIGHTS RESERVED. REPRODUCTION PROHIBITED WITHOUT WRITTEN PERMISSION . June, 2014 |Page 4 CAPEX: Preparation for 3D-NAND Era 2014 CAPEX : US$9.2 Bn with 15%yoy , mostly reserved for 3D-NAND in the future. Memory CAPEX is US$15-16 Bn level, allocation favor on NAND. NAND Flash CAPEX CAPEX: DRAM vs. NAND Unit: US$M Unit: US$M 12,000 25,000 100% 10,000 20,000 DRAM CAPEX NAND Flash CAPEX 8,000 60% 15,000 6,000 20% 10,000 4,000 -20% 5,000 2,000 0 -60% - 2008 2009 2010 2011 2012 2013 2014E 2008 2009 2010 2011 2012 2013 2014E Source: DRAMeXchange,June2014 ALL RIGHTS RESERVED.
[Show full text]