DOCSLIB.ORG

Semiconductor Times, April 2020

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Semiconductor Times, April 2020 SEMICONDUCTOR TIMES APR 2020 / 1 ® APR 2020 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES VOL 25, ISSUE 4 bandwidth in the automotive market. Christopher Mash, VP of Business De- Startup Profiles Next generation cars require multiple velopment (previously Senior Dir. layers of security protection to prevent, Automotive Apps, Product Definition Axonne detect, and adapt to evolving threats. The and Architecture at Marvell) Axonne was founded in early 2018 auto industry is increasingly adopting Craig Farnsworth, GM and Senior Dir. to develop connectivity solutions for Ethernet solutions and 2019 will see the of Engineering (previously Senior automotive and industrial applications. international standardization (IEEE) of Director of Digital Design at Peraso) The company has received funding multi-gigabit Ethernet bandwidth rates Ahmad Tavakoli, Sr. Director, Analog from Translink Capital. We believe for automotive applications. & Mixed-Signal Design (previously the company is developing automotive Sr. Hardware Engineer at Google and ethernet ICs. Ethernovia is developing an Ethernet Verily Life Sciences, and Sr. Director system sophisticated enough to process of Engineering at Aquantia) Gani Jusuf, Ph.D., Co-Founder and the bandwidth demands of future auto- 2050 Ringwood Ave Suite B CEO (previously VP of engineering motive systems by unifying in-vehicle San Jose, CA 95131 at Marvell) networks into an end to end Ethernet www.ethernovia.com William Lo, Co-Founder and CTO system. Ethernovia is developing an (previously VP, R&D Datacom En- Ethernet solution that will provide a gineering at Marvell) unified, standards-based solution built ONiO Sunnyvale, CA to meet automotive functional safety ONiO was founded in 2016 to develop www.axonne.com requirements. self-powered, battery-free solutions for the healthcare IoT market. Ramin Shirani, co-founder & CEO (pre- Ethernovia Continuous temperature monitoring is viously technical co-founder, Board Ethernovia was founded in April 2018 not a recent phenomenon; however, it’s Member and SVP of Engineering at to develop high-speed Ethernet solutions not common today because it is labor in- Aquantia. Before that, GM Ethernet for automotive market. tensive, expensive, and uncomfortable, Transceiver Group at Lucent Micro) Evolving autonomous technology Klaas Bult, GM Ethernovia BV and requires high bandwidth, secure, stan- VP Data Acquisition Engineering dardized Ethernet solutions. Advanced (Professor, Part-time Technische IN THIS ISSUE Driver-Assistance Systems (ADAS) Universiteit Delft. Previously an Startup Profiles ........................... 1 and increasing sensor bandwidth, driv- Independent Consultant with Analog People ......................................... 3 en by high resolution camera growth, Design Consult BV and VP & CTO Funding ...................................... 4 is pushing the boundaries of network CE at Broadcom) Mergers & Acquisitions ............. 5 SIA Global Sales ($B) SEMI’s N. American Equipment Billings Business & Financials ................. 6 3000 30% 40 COVID-19 .................................... 7 35 20% 2500 30 Market Research ........................ 9 10% 2000 25 Emerging Standards .................. 9 0% 20 1500 Products ...................................... 9 15 -10% Dollars (Millions) Dollars Y/Y Growth (%) Growth Y/Y 1000 10 Licensing & Partnerships ......... 13 -20% 5 500 Design Wins .............................. 14 -30% 0 1/19 2/19 3/19 4/19 5/19 6/19 7/19 8/19 9/19 10/19 11/19 12/19 1/20 Company Earnings ................... 14 0 -40% Feb-19 Mar-19 Apr-19 May-19 Jun-19 Jul-19 Aug-19 Sep-19 Oct-19 Nov-19 Dec-19 Jan-20 Feb-20 (final) (prelim) APAC-Other China Japan Europe America Billings Y/Y Growth % Stock Charts .............................. 15 Copyright © 2020, Pinestream Communications, Inc. Tel 781.647.8800 www.pinestream.com [email protected] 2 / APR 2020 SEMICONDUCTOR TIMES Startup Profiles added cost and inefficiency. But ONIO The IC has a RISC-V 16/32-bit architec- argues that the real issue is shelf life. A ture (RV32EMC) supporting high code (Continued from page 1) shelf life of 5 to 10 years means that 99% density with compressed instructions. leading to the disappearance of fever of the battery capacity was expended It run at 24MHz at 1.8V, 6MHz at 1.0V curves in modern medical care. ONiO from self-discharge during storage. and 1MHz at 0.8V. From 450mV to has developed the technology to allow 800mV, it supports asynchronous opera- everyone to access Continuous Tem- The ONiO smart patch is based on tion from ROM/RAM. The device has a perature in an affordable, reliable way. ONiO.zero, an ultra-low-power bat- range of peripherals including I2C, SPI, tery-free wireless MCU that uses energy UART, AES module, GPIO, program- With a smart adhesive patch, hub and harvesting technology. ONiO.zero sup- mable current source, 12-bit ADC and app working together, ONiO measures ports a wide range of power sources more. It has 1KB of mask ROM, 2KB continuous temperature of a fever, in- from multi-frequency RF bands support- RAM, and 8/16/32KB ULP Flash with corporates affects from environmental ing GSM and ISM to optional external support for 100k writes and reads down conditions, and creates patterns that sources like solar, piezoelectric, thermal to 850mV. While traditional solutions can be used to identify the nature of and voltaic cells. require over 15 external components and the illness, from serious infections and The internal RF Rectifier supports inductors, the ONiO.zero needs only 1 diseases such as meningitis, malaria and multiple frequencies (800/900/1800/ external component. pneumonia to common less dangerous 1900/2400MHz bands (ISM and GSM) illnesses, distinguishing between bac- with 40dBm sensitivity and a demodu- Kjetil Meisalm CEO & Founder (pre- terial and viral infections. lator chain for RX. The range depends viously Senior Product Marketing on the frequency and duty cycle of the Manager at Novelda) The ONiO smart patch is a small sensor energy bearer. As one application exam- Vemund Kval Bakken, CTO (previously in an adhesive bandage that attaches to ple, an RF beacon at +18 dBm at 1% TX Group Manager for System Architec- the forehead or other parts of the body. duty cycle achieves 3 - 5m range. The ture Group at Nordic Semiconductor) The smart patch securely transmits maximum range at maximum allowed encrypted health info wirelessly to the TX level is 10m. The internal power Runar Finanger, Chief Marketing ONiO hub for viewing in the mobile app. unit supports photovoltaic cells down to Officer & Founder (previously Se- The app also offers extended features to 400mV, pizoelectric and thermal (1.8V nior Product Marketing Manager at register when and how much antipyretic to 3.6V). Novelda) drugs is administered and record the Tobias Skylstad Kvernebo, Director of general condition of the person using ONiO.zero integrates a crystal-less Life Sciences ONiO. The hub also collects useful BTLE transmitter with programmable environmental data that may help care, output power (-40 to 0dBm), an IEEE Lille Grensen 3, 0159 Oslo such as room temperature and humidity. 802.15.4 UWB transmitter that runs Skippergata 14, 7042 Trondheim at 3.5GHz to 10GHz, and an optional Norway Running from any type of battery means 433MHz MICS radio transmitter for onio.com adding a step-down or boost circuit with medical devices. Source: ONiO Copyright © 2020, Pinestream Communications, Inc. Tel 781.647.8800 www.pinestream.com [email protected] SEMICONDUCTOR TIMES APR 2020 / 3 PETAiO Sales/Marketing/Customer Services PETAiO was founded in 2016 to devel- at Link-A-Media, which was acquired People op SSD controllers for distributed data by SKHynix for >$250M) center applications. Tim Ding, PETAiO Lingqi Zeng, Ph.D., VP of Technology ASM International has appointed Chairman, CEO and founder provided (previously a Director at SK Hynix Benjamin Loh as CEO, President seed funding. The company has offices memory solutions where he led and Chairman, succeeding Chuck in Santa Clara, China and South Korea. an R&D cross functional team in del Prado who has retired. From the Advanced ECC architecture, Flash late nineties until 2005 he worked for The company’s first product is Titani- memory technology, NAND man- Oerlikon, lastly as SVP responsible for um-DC, a PCIe Gen4x4, NVMe 1.4, 8 agement and FTL algorithms. Prior Asia. After that, he joined Veeco where channel SSD controller delivering 7GB/ to SK Hynix, he was Senior Manager his last position was EVP responsible sec sequential read, 6GB/sec sequential and ECC Architect at Link-A-Media) for Global Field Operations. He then write, 1.2 MIOPS random read and 280 Jongman Yoon, VP of Firmware (pre- moved to FEI Company in 2007 where KIOPS sustained random write (assum- viously led Samsung SSD FW he held various executive positions ing 3D-TLC Flash) with burst up to 1.2 development team. Also worked at culminating in COO. In 2015, he joined MIOPS. Titanium’s architecture and SK Hynix and Toshiba before taking VAT Vacuum Valves where, as Group implementation achieved the industry’s leadership positions at several start- Management Board member, he was smallest area and power for this class of ups developing SSD) responsible for worldwide Sales and part, according to the company, with a Fan Yang, VP of ASIC (previously in Marketing until late 2017. Loh’s re- 2 die size of 29.9 mm in TSMC 16/12nm charge of the CPU subsystem team at muneration package consists of a base FinFET, typical power of 2.75W and SK Hynix Memory Solutions) salary of €630,000 in combination peak power < 3.5W for an 8TB TLC Aldo Cometti, VP of Products (previ- with a long-term share incentive and a ously Senior Director in the CTO SSD configuration that can hit 100kI- short term cash incentive. OPS/W random read and 80kIOPS/W office of Western Digital) random mix. With total read latency of 4800 Patrick Henry Drive, #110 Cyient, a provider of technology 10uSec, Titanium-DC delivers best-in- Santa Clara, CA 95054 services and solutions, has appointed class performance at low queue depth Tel: 408.883.7382 Karthikeyan Natarajan as President for response-time sensitive applications.
Load more

Recommended publications
  • Portfolio Holdings Listing Fidelity China Region Fund As of June 30
    Portfolio Holdings Listing Fidelity China Region Fund DUMMY as of July 30, 2021 The portfolio holdings listing (listing) provides information on a fund’s investments as of the date indicated. Top 10 holdings information (top 10 holdings) is also provided for certain equity and high income funds. The listing and top 10 holdings are not part of a fund’s annual/semiannual report or Form N-Q and have not been audited. The information provided in this listing and top 10 holdings may differ from a fund’s holdings disclosed in its annual/semiannual report and Form N-Q as follows, where applicable: With certain exceptions, the listing and top 10 holdings provide information on the direct holdings of a fund as well as a fund’s pro rata share of any securities and other investments held indirectly through investment in underlying non- money market Fidelity Central Funds. A fund’s pro rata share of the underlying holdings of any investment in high income and floating rate central funds is provided at a fund’s fiscal quarter end. For certain funds, direct holdings in high income or convertible securities are presented at a fund’s fiscal quarter end and are presented collectively for other periods. For the annual/semiannual report, a fund’s investments include trades executed through the end of the last business day of the period. This listing and the top 10 holdings include trades executed through the end of the prior business day. The listing includes any investment in derivative instruments, and excludes the value of any cash collateral held for securities on loan and a fund’s net other assets.
    [Show full text]
  • STOXX ASIA 1200 Selection List
    STOXX ASIA 1200 Last Updated: 20200901 ISIN Sedol RIC Int.Key Company Name Country Currency Component FF Mcap (BEUR) Rank (FINAL)Rank (PREVIOUS) TW0002330008 6889106 2330.TW TW001Q TSMC TW TWD Y 295.1 1 1 KR7005930003 6771720 005930.KS KR002D Samsung Electronics Co Ltd KR KRW Y 195.5 2 2 JP3633400001 6900643 7203.T 690064 Toyota Motor Corp. JP JPY Y 143.3 3 3 HK0000069689 B4TX8S1 1299.HK HK1013 AIA GROUP HK HKD Y 104 4 4 JP3435000009 6821506 6758.T 682150 Sony Corp. JP JPY Y 82.6 5 6 JP3436100006 6770620 9984.T 677062 Softbank Group Corp. JP JPY Y 78.4 6 5 INE002A01018 6099626 RELI.BO IN0027 Reliance Industries Ltd IN INR Y 77.8 7 7 JP3236200006 6490995 6861.T 649099 Keyence Corp. JP JPY Y 66 8 8 INE040A01034 BK1N461 HDBK.BO IN00CH HDFC Bank Ltd IN INR Y 58.5 9 11 CNE1000002H1 B0LMTQ3 0939.HK CN0010 CHINA CONSTRUCTION BANK CORPCN H HKD Y 57.8 10 9 JP3970300004 BQRRZ00 6098.T JP503G RECRUIT HOLDINGS JP JPY Y 53.8 11 17 JP3756600007 6639550 7974.T 663955 Nintendo Co. Ltd. JP JPY Y 53.3 12 18 CNE1000003X6 B01FLR7 2318.HK CN0076 PING AN INSUR GP CO. OF CN 'H' CN HKD Y 51.5 13 10 JP3735400008 6641373 9432.T 664137 Nippon Telegraph & Telephone C JP JPY Y 50.2 14 16 HK0388045442 6267359 0388.HK 626735 Hong Kong Exchanges & Clearing HK HKD Y 50.1 15 12 JP3463000004 6870445 4502.T 687044 Takeda Pharmaceutical Co. Ltd. JP JPY Y 49.2 16 13 JP3481800005 6250724 6367.T 625072 Daikin Industries Ltd.
    [Show full text]
  • Stoxx® Global 3000 Technology Index
    SUPERSECTOR INDICES 1 STOXX® GLOBAL 3000 TECHNOLOGY INDEX Stated objective Key facts The STOXX Supersector indices track supersectors of the relevant » Categorization according to their primary source of revenue benchmark index. There are 19 supersectors according to the guarantees an accurate classification of companies in their respective Industry Classification Benchmark (ICB). Companies are categorized business environments according to their primary source of revenue. The following supersectors are available: automobile and parts, banks, basic » Component capping ensures that no component can dominate the resources, chemicals, construction and materials, financial services, index food and beverage, health care, industrial goods and services, insurance, media, oil and gas, personal and household goods, real estate, communications, retail, technology, travel and leisure and utilities. Descriptive statistics Index Market cap (USD bn.) Components (USD bn.) Component weight (%) Turnover (%) Full Free-float Mean Median Largest Smallest Largest Smallest Last 12 months STOXX Global 3000 Technology Index 4,573.6 4,143.5 19.6 5.4 618.0 1.2 14.9 0.0 4.1 STOXX Global 3000 Index 48,487.0 40,843.1 13.6 5.1 618.0 1.2 1.5 0.0 3.4 Supersector weighting (top 10) Country weighting Risk and return figures1 Index returns Return (%) Annualized return (%) Last month YTD 1Y 3Y 5Y Last month YTD 1Y 3Y 5Y STOXX Global 3000 Technology Index 3.8 15.3 33.8 56.5 87.5 55.8 23.3 33.0 15.7 13.1 STOXX Global 3000 Index 2.3 7.5 21.7 51.5 87.5 31.3 11.2 21.2 14.5 13.1
    [Show full text]
  • 2019 Corporate Governance Evaluation Results in Taiwan
    2019 Corporate Governance Evaluation Results in Taiwan Conducted by the Securities and Futures Institute Entrusted by Taiwan Stock Exchange Corporation & Taipei Exchange Despite all reasonable care given in the screening process to ensure objectivity, the SFI bears no responsibility in case of any damage or loss incurred from use of the evaluation results. April 30, 2020 2019 Corporate Governance Evaluation Results in Taiwan About the “Corporate Governance Evaluation System” In response to the market need for enhanced corporate governance reforms, the Financial Supervisory Commission ("FSC") issued the "Corporate Governance Roadmap" in December 2013 and the new one in April 2018, aiming to accelerate the implementation of corporate governance among Taiwanese listed companies, assist them with sound development and boost market confidence. According to the roadmaps, the implementation of corporate governance evaluation is one of the major projects with the goal of investors and enterprises better understanding the performance of corporate governance by comparing the evaluation results among companies. In 2014, the Taiwan Stock Exchange Corporation (“TWSE”) and the Taipei Exchange (“TPEx”) launched the “Corporate Governance Evaluation System”, conducted by the Securities and Futures Institute (“SFI”) annually. The FSC believes this evaluation system will make companies take corporate governance more seriously, encourage healthy competition among companies and cultivate a culture that companies voluntarily improve their corporate governance. 2019 is the sixth year of the evaluation and the results have been published on April 30, 2020.The industry differentiation was also taken into account and the evaluation results were released both on a listing market basis and on an industry by industry basis.
    [Show full text]
  • Emerging Markets Social Core Equity Portfolio As of March 31, 2021 (Updated Monthly) Source: State Street Holdings Are Subject to Change
    Emerging Markets Social Core Equity Portfolio As of March 31, 2021 (Updated Monthly) Source: State Street Holdings are subject to change. The information below represents the portfolio's holdings (excluding cash and cash equivalents) as of the date indicated, and may not be representative of the current or future investments of the portfolio. The information below should not be relied upon by the reader as research or investment advice regarding any security. This listing of portfolio holdings is for informational purposes only and should not be deemed a recommendation to buy the securities. The holdings information below does not constitute an offer to sell or a solicitation of an offer to buy any security. The holdings information has not been audited. By viewing this listing of portfolio holdings, you are agreeing to not redistribute the information and to not misuse this information to the detriment of portfolio shareholders. Misuse of this information includes, but is not limited to, (i) purchasing or selling any securities listed in the portfolio holdings solely in reliance upon this information; (ii) trading against any of the portfolios or (iii) knowingly engaging in any trading practices that are damaging to Dimensional or one of the portfolios. Investors should consider the portfolio's investment objectives, risks, and charges and expenses, which are contained in the Prospectus. Investors should read it carefully before investing. Your use of this website signifies that you agree to follow and be bound by the terms and conditions of use in the Legal Notices. Notional Market Asset Cumulative Row Id Security Name Amount USD Value USD Weight Weight Equity 1,719,683,770.89 100.000% 1 TENCENT HOLDINGS LTD COMMON STOCK HKD.00002 76,575,311.59 4.453% 4.453% 2 SAMSUNG ELECTRONICS CO LTD COMMON STOCK KRW100.0 53,443,287.97 3.108% 7.561% 3 TAIWAN SEMICONDUCTOR SP ADR ADR 43,810,912.00 2.548% 10.108% 4 ALIBABA GROUP HOLDING SP ADR ADR USD.000025 39,731,031.55 2.310% 12.419% 5 TAIWAN SEMICONDUCTOR MANUFAC COMMON STOCK TWD10.
    [Show full text]
  • A Brief Introduction to Tsmc
    TSMC commits itself to providing its customers with the best quality and most comprehensive services. LETTER TO SHAREHOLDERS Dear Shareholders, Year 2004 was a banner year for TSMC. We again set new records for revenues and earnings, while continuing to lead the semiconductor dedicated foundry sector. Our production accounted for more than 7% of the total value of the world's semi- conductor output. TSMC's performance was anchored in our "Trinity of Strength": strength in technology development and deployment, strength in manufacturing capacity and efficiency, and strength in building customer partnerships. For example: ● TSMC cumulatively shipped over one million wafers (8-inch equivalent) in 0.13-micron technology. SM ● TSMC's Nexsys 90nm, the world's first 12-inch, low-k, 90-nanometer process to reach full production, was adopted in more than 30 customer products after one year's ramp, and achieved product yields ahead of internal goals. ● TSMC served more than 300 customers and produced more than 5,000 products in our fabs. With its core manufacturing and logistics competencies, TSMC's experience in integrating front-end design and back-end turn- key services has helped customers resolve many daunting challenges in advanced chips designed with our 90nm technology. We collaborate closely with customers, enabling them to deliver their products on time and to achieve success in their end markets. Financial Strength and Results TSMC broke new records in both revenues and net income in 2004. Revenue reached NT$255.9 billion, an increase of 26.8% compared with the previous record set in 2003. Net income was NT$92.32 billion, an increase of 95.3% compared with 2003 results, while fully diluted earnings per share were NT$3.97 (US$0.59 per ADS unit), an increase of 96.8 %.
    [Show full text]
  • GMO Trust Semiannual Report August 31, 2020
    GMO Trust Semiannual Report August 31, 2020 Climate Change Fund Cyclical Focus Fund Emerging Domestic Opportunities Fund Emerging Markets Fund International Equity Fund Quality Fund Resources Fund Risk Premium Fund Tax-Managed International Equities Fund U.S. Equity Fund U.S. Small Cap Value Fund Beginning on January 1, 2021, as permitted by regulations adopted by the Securities and Exchange Commission, GMO expects that paper copies of each Fund’s annual and semiannual reports to shareholders will no longer be sent by mail, unless you specifically request paper copies of the reports by writing or calling GMO Shareholder Services at the address or phone number below or by contacting your financial intermediary, such as a broker or agent. Instead, reports will be available on a website, and you will be notified by mail each time a report is posted and provided with a website link to access the report. If you already elected to receive shareholder reports electronically, you will not be affected by this change and you need not take any action. If you are a direct investor, you may elect to receive shareholder reports and other communications from the Fund electronically by contacting GMO Shareholder Services or if you own your shares through a financial intermediary, you may contact your financial intermediary. Beginning January 1, 2019, you may elect to receive all future reports in paper free of charge. If you invest through a financial intermediary, you can contact your financial intermediary to request to continue to receive paper copies of your shareholder reports or you can follow instructions included with this disclosure.
    [Show full text]
  • SK Hynix to Acquire Intel NAND Memory Business
    SK hynix to Acquire Intel NAND Memory Business NEWS HIGHLIGHTS SK hynix will pay US $9 billion for the Intel NAND memory and storage business, which includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. SK hynix aims to enhance the competitiveness of its NAND flash solutions as one of the leading global semiconductor companies and grow the memory ecosystem to the benefit of customers, partners, employees and shareholders. Intel will retain its Intel® Optane™ business and intends to invest transaction proceeds in long-term growth priorities. SEOUL, Republic of Korea and SANTA CLARA, Calif., Oct. 20, 2020 -- SK hynix and Intel today announced that they have signed an agreement on Oct. 20, KST, under which SK hynix would acquire Intel’s NAND memory and storage business for US $9 billion. The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain its distinct Intel® OptaneTM business. SK hynix and Intel will endeavor to obtain required governmental approvals expected in late 2021. Following receipt of these approvals, SK hynix will acquire from Intel the NAND SSD business (including NAND SSD-associated IP and employees), as well as the Dalian facility, with the first payment of US $7 billion. SK hynix will acquire from Intel the remaining assets, including IP related to the manufacture and design of NAND flash wafers, R&D employees, and the Dalian fab workforce, upon a final closing, expected to occur in March 2025 with the remaining payment of US $2 billion.
    [Show full text]
  • Supply Chain Innovation: Responding to Dynamic Challenges
    Global Semiconductor Alliance SURVIVING UNDER CURRENT MARKET CONDITIONS RISK MANAGEMENT IN THE SEMICONDUCTOR SUPPLY CHAIN FAKING IT: WHY COUNTERFEITING IS THE SYMPTOM, NOT THE DISEASE ACCELERATING TECHNOLOGY EVOLUTION THROUGH PROCESS OUTSOURCING SEMICONDUCTOR EQUIPMENT SERVICE SUPPLY CHAIN—ANTICIPATING THE UPTURN Supply Chain Innovation: Responding to Dynamic Challenges Vol.16 No.3 Sept. 2009 Published by GSA $60 (U.S.) 1 A Powerful Platform for Amazing Performance Performance. To get it right, you need a foundry with an Open Innovation Platform™ and process technologies that provides the flexibility to expertly choreograph your success. To get it right, you need TSMC. Whether your designs are built on mainstream or highly advanced processes, TSMC ensures your products achieve maximum value and performance. Product Differentiation. Increased functionality and better system performance drive product value. So you need a foundry partner who keeps your products at their innovative best. TSMC’s robust platform provides the options you need to increase functionality, maximize system performance and ultimately differentiate your products. Faster Time-to-Market. Early market entry means more product revenue. TSMC’s DFM-driven design initiatives, libraries and IP programs, together with leading EDA suppliers and manufacturing data-driven PDKs, shorten your yield ramp. That gets you to market in a fraction of the time it takes your competition. Investment Optimization. Every design is an investment. Function integration and die size reduction help drive your margins. It’s simple, but not easy. We continuously improve our process technologies so you get your designs produced right the first time. Because that’s what it takes to choreograph a technical and business success.
    [Show full text]
  • Emerging Markets Growth Fund Class J (USD)
    William Blair SICAV - Emerging Markets Growth Fund Class J (USD) Portfolio Review June 2021 Todd M. McClone, CFA, Partner Casey K. Preyss, CFA, Partner ISIN: LU0995405320 Portfolio Managers FOR PROFESSIONAL INVESTORS ONLY Summary & Outlook June 2021 manager’s index (PMI) which rose to a record high level (63.4) in June. Market Review Strength within Latin America (+15.56% for the quarter Global equities continued to advance in the second quarter and +9.64% year-to-date) was primarily driven by Brazil (the MSCI ACWI IMI gained +7.18% in the second quarter (+23.60% for the quarter and +11.89% year-to-date) and 12.68% year-to-date in USD terms) amid further bolstered by stronger commodity prices and currency success of vaccination rollouts and a healthy rebound in tailwinds. China underperformed on a relative basis economic activity, especially in developed markets. The (+2.35% for the quarter and +2.36% year-to-date) amid sharp style rotation in the first quarter which favored value concerns over tightening liquidity and increased regulatory areas subsided in the second quarter with growth stocks oversight on large cap technology companies. outperforming. From a global sector perspective, Information Technology outperformed (+10.22% for the Performance quarter and +12.39% year-to-date) while Utilities significantly underperformed (-0.09% for the quarter and Second quarter outperformance versus the MSCI Emerging +0.86% year-to-date). Energy also continued to rally Markets IMI (net) was primarily driven by positive stock (+10.08% for the quarter and +30.51% year-to-date) as selection across most sectors.
    [Show full text]
  • Comparison of Leading Edge 3D NAND Memories TOSHIBA-Sandisk /SAMSUNG/SK HYNIX/INTEL- MICRON Memory Report by Belinda Dube December 2018
    REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT 3D NAND FLASH MEMORIES Comparison of Leading Edge 3D NAND Memories TOSHIBA-SanDisk /SAMSUNG/SK HYNIX/INTEL- MICRON Memory report by Belinda Dube December 2018 22 Bd. Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr Table of Contents Overview / Introduction 4 o SK Hynix 80 o Executive Summary Synthesis o Reverse Costing Methodology Die design Company Profile 8 Cross-Section o Toshiba/SanDisk Patents o Samsung o SK Hynix o Intel/ Micron 110 o Micron/Intel Synthesis Die design Cross-Section Technology & Market 8 o NAND Roadmap Patents o NAND Revenue Manufacturing Process Flow 146 o Global Overview Physical Analysis 14 o Wafer Fabrication Unit o Toshiba Synthesis of the Physical Analysis o Front-End Process o Toshiba Physical Analysis Methodology o Toshiba Physical analysis Cost Analysis 179 Die o Synthesis of the cost analysis Cross-Section Yields Explanation & Hypotheses o Toshiba Patents NAND wafer and die cost o Samsung Synthesis of the Physical Analysis 53 Front-End Cost o Samsung Physical Analysis Methodology Component Cost o Samsung Physical analysis Die Estimated Price and Manufacturer Gross Margin 228 Cross-Section Company services 239 o Samsung Patents Executive Summary Overview / Introduction o Executive Summary The memory semiconductor industry continues to grow due to higher memory demand in consumer electronics and o Reverse Costing Methodology mass storage. Remarkable investments are channeled into the memory manufacturing business. IoT escalates this o Glossary demand and hence manufacturers continue to increase the die density of memories at the same time aiming on Company Profile reduction of the NAND die.
    [Show full text]
  • Case 1:14-Cv-01432-LPS-CJB Document 13 Filed 03/27/15 Page 1 of 57 Pageid #: 219
    Case 1:14-cv-01432-LPS-CJB Document 13 Filed 03/27/15 Page 1 of 57 PageID #: 219 IN THE UNITED STATES DISTRICT COURT FOR THE DISTRICT OF DELAWARE ELM 3DS INNOVATIONS, LLC, a ) Delaware limited liability company, ) ) Plaintiff, ) ) C.A. No. 1:14-cv-01432-LPS-CJB v. ) ) SK HYNIX INC., a Korean corporation, ) Jury Trial Demanded SK HYNIX AMERICA INC., a California ) corporation, ) HYNIX SEMICONDUCTOR ) MANUFACTURING AMERICA INC., a California corporation, and ) SK HYNIX MEMORY SOLUTIONS ) INC., a Delaware corporation, ) ) ) Defendants. FIRST AMENDED COMPLAINT FOR PATENT INFRINGEMENT Plaintiff Elm 3DS Innovations, LLC (“Plaintiff” or “Elm 3DS”), by its attorneys, for its complaint against Defendants SK hynix Inc., and its U.S. subsidiaries and related entities SK hynix America Inc., Hynix Semiconductor Manufacturing America Inc., and SK hynix Memory Solutions Inc. (individually or collectively “Defendants” or “Hynix”) hereby alleges as follows: INTRODUCTION 1. This is an action for patent infringement under the Patent Laws of the United States, 35 U.S.C. § 1 et seq., for infringing the following Elm 3DS patents: 1 Case 1:14-cv-01432-LPS-CJB Document 13 Filed 03/27/15 Page 2 of 57 PageID #: 220 (a) U.S. Patent No. 7,193,239 (“Leedy ’239 patent”), entitled “Three Dimensional Structure Integrated Circuit,” owned by Elm 3DS Innovations, LLC (attached as Exhibit 1); (b) U.S. Patent No. 7,474,004 (“Leedy ‘004 patent”), entitled “Three Dimensional Structure Memory,” owned by Elm 3DS Innovations, LLC (attached as Exhibit 2); (c) U.S. Patent No. 7,504,732 (“Leedy ‘732 patent”), entitled “Three Dimensional Structure Memory,” owned by Elm 3DS Innovations, LLC (attached as Exhibit 3); (d) U.S.
    [Show full text]