Semiconductor Times, April 2020

SEMICONDUCTOR TIMES APR 2020 / 1

® APR 2020 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES VOL 25, ISSUE 4 bandwidth in the automotive market. Christopher Mash, VP of Business De- Startup Profiles Next generation cars require multiple velopment (previously Senior Dir. layers of security protection to prevent, Automotive Apps, Product Definition Axonne detect, and adapt to evolving threats. The and Architecture at Marvell) Axonne was founded in early 2018 auto industry is increasingly adopting Craig Farnsworth, GM and Senior Dir. to develop connectivity solutions for Ethernet solutions and 2019 will see the of Engineering (previously Senior automotive and industrial applications. international standardization (IEEE) of Director of Digital Design at Peraso) The company has received funding multi-gigabit Ethernet bandwidth rates Ahmad Tavakoli, Sr. Director, Analog from Translink Capital. We believe for automotive applications. & Mixed-Signal Design (previously the company is developing automotive Sr. Hardware Engineer at Google and ethernet ICs. Ethernovia is developing an Ethernet Verily Life Sciences, and Sr. Director system sophisticated enough to process of Engineering at Aquantia) Gani Jusuf, Ph.D., Co-Founder and the bandwidth demands of future auto- 2050 Ringwood Ave Suite B CEO (previously VP of engineering motive systems by unifying in-vehicle San Jose, CA 95131 at Marvell) networks into an end to end Ethernet www.ethernovia.com William Lo, Co-Founder and CTO system. Ethernovia is developing an (previously VP, R&D Datacom En- Ethernet solution that will provide a gineering at Marvell) unified, standards-based solution built ONiO Sunnyvale, CA to meet automotive functional safety ONiO was founded in 2016 to develop www.axonne.com requirements. self-powered, battery-free solutions for the healthcare IoT market. Ramin Shirani, co-founder & CEO (pre- Ethernovia Continuous temperature monitoring is viously technical co-founder, Board Ethernovia was founded in April 2018 not a recent phenomenon; however, it’s Member and SVP of Engineering at to develop high-speed Ethernet solutions not common today because it is labor in- Aquantia. Before that, GM Ethernet for automotive market. tensive, expensive, and uncomfortable, Transceiver Group at Lucent Micro) Evolving autonomous technology Klaas Bult, GM Ethernovia BV and requires high bandwidth, secure, stan- VP Data Acquisition Engineering dardized Ethernet solutions. Advanced (Professor, Part-time Technische IN THIS ISSUE Driver-Assistance Systems (ADAS) Universiteit Delft. Previously an Startup Profiles...... 1 and increasing sensor bandwidth, driv- Independent Consultant with Analog People...... 3 en by high resolution camera growth, Design Consult BV and VP & CTO Funding ...... 4 is pushing the boundaries of network CE at Broadcom) Mergers & Acquisitions...... 5 SIA Global Sales ($B) SEMI’s N. American Equipment Billings Business & Financials...... 6 3000 30% 40 COVID-19...... 7 35 20% 2500

30 Market Research...... 9 10% 2000 25 Emerging Standards...... 9 0% 20 1500 Products...... 9 15 -10% Dollars (Millions) Dollars Y/Y Growth (%) Growth Y/Y 1000 10 Licensing & Partnerships...... 13 -20%

5 500 Design Wins...... 14 -30% 0 1/19 2/19 3/19 4/19 5/19 6/19 7/19 8/19 9/19 10/19 11/19 12/19 1/20 Company Earnings...... 14 0 -40% Feb-19 Mar-19 Apr-19 May-19 Jun-19 Jul-19 Aug-19 Sep-19 Oct-19 Nov-19 Dec-19 Jan-20 Feb-20 (final) (prelim) APAC-Other China Japan Europe America Billings Y/Y Growth % Stock Charts...... 15

Copyright © 2020, Pinestream Communications, Inc. Tel 781.647.8800 www.pinestream.com [email protected] 2 / APR 2020 SEMICONDUCTOR TIMES Startup Profiles added cost and inefficiency. But ONIO The IC has a RISC-V 16/32-bit architec- argues that the real issue is shelf life. A ture (RV32EMC) supporting high code (Continued from page 1) shelf life of 5 to 10 years means that 99% density with compressed instructions. leading to the disappearance of fever of the battery capacity was expended It run at 24MHz at 1.8V, 6MHz at 1.0V curves in modern medical care. ONiO from self-discharge during storage. and 1MHz at 0.8V. From 450mV to has developed the technology to allow 800mV, it supports asynchronous opera- everyone to access Continuous Tem- The ONiO smart patch is based on tion from ROM/RAM. The device has a perature in an affordable, reliable way. ONiO.zero, an ultra-low-power bat- range of peripherals including I2C, SPI, tery-free wireless MCU that uses energy UART, AES module, GPIO, program- With a smart adhesive patch, hub and harvesting technology. ONiO.zero sup- mable current source, 12-bit ADC and app working together, ONiO measures ports a wide range of power sources more. It has 1KB of mask ROM, 2KB continuous temperature of a fever, in- from multi-frequency RF bands support- RAM, and 8/16/32KB ULP Flash with corporates affects from environmental ing GSM and ISM to optional external support for 100k writes and reads down conditions, and creates patterns that sources like solar, piezoelectric, thermal to 850mV. While traditional solutions can be used to identify the nature of and voltaic cells. require over 15 external components and the illness, from serious infections and The internal RF Rectifier supports inductors, the ONiO.zero needs only 1 diseases such as meningitis, malaria and multiple frequencies (800/900/1800/ external component. pneumonia to common less dangerous 1900/2400MHz bands (ISM and GSM) illnesses, distinguishing between bac- with 40dBm sensitivity and a demodu- Kjetil Meisalm CEO & Founder (pre- terial and viral infections. lator chain for RX. The range depends viously Senior Product Marketing on the frequency and duty cycle of the Manager at Novelda) The ONiO smart patch is a small sensor energy bearer. As one application exam- Vemund Kval Bakken, CTO (previously in an adhesive bandage that attaches to ple, an RF beacon at +18 dBm at 1% TX Group Manager for System Architec- the forehead or other parts of the body. duty cycle achieves 3 - 5m range. The ture Group at Nordic Semiconductor) The smart patch securely transmits maximum range at maximum allowed encrypted health info wirelessly to the TX level is 10m. The internal power Runar Finanger, Chief Marketing ONiO hub for viewing in the mobile app. unit supports photovoltaic cells down to Officer & Founder (previously Se- The app also offers extended features to 400mV, pizoelectric and thermal (1.8V nior Product Marketing Manager at register when and how much antipyretic to 3.6V). Novelda) drugs is administered and record the Tobias Skylstad Kvernebo, Director of general condition of the person using ONiO.zero integrates a crystal-less Life Sciences ONiO. The hub also collects useful BTLE transmitter with programmable environmental data that may help care, output power (-40 to 0dBm), an IEEE Lille Grensen 3, 0159 Oslo such as room temperature and humidity. 802.15.4 UWB transmitter that runs Skippergata 14, 7042 Trondheim at 3.5GHz to 10GHz, and an optional Norway Running from any type of battery means 433MHz MICS radio transmitter for onio.com adding a step-down or boost circuit with medical devices.

Source: ONiO

PETAiO Sales/Marketing/Customer Services PETAiO was founded in 2016 to devel- at Link-A-Media, which was acquired People op SSD controllers for distributed data by SKHynix for >$250M) center applications. Tim Ding, PETAiO Lingqi Zeng, Ph.D., VP of Technology ASM International has appointed Chairman, CEO and founder provided (previously a Director at SK Hynix Benjamin Loh as CEO, President seed funding. The company has offices memory solutions where he led and Chairman, succeeding Chuck in Santa Clara, China and South Korea. an R&D cross functional team in del Prado who has retired. From the Advanced ECC architecture, Flash late nineties until 2005 he worked for The company’s first product is Titani- memory technology, NAND man- Oerlikon, lastly as SVP responsible for um-DC, a PCIe Gen4x4, NVMe 1.4, 8 agement and FTL algorithms. Prior Asia. After that, he joined Veeco where channel SSD controller delivering 7GB/ to SK Hynix, he was Senior Manager his last position was EVP responsible sec sequential read, 6GB/sec sequential and ECC Architect at Link-A-Media) for Global Field Operations. He then write, 1.2 MIOPS random read and 280 Jongman Yoon, VP of Firmware (pre- moved to FEI Company in 2007 where KIOPS sustained random write (assum- viously led Samsung SSD FW he held various executive positions ing 3D-TLC Flash) with burst up to 1.2 development team. Also worked at culminating in COO. In 2015, he joined MIOPS. Titanium’s architecture and SK Hynix and Toshiba before taking VAT Vacuum Valves where, as Group implementation achieved the industry’s leadership positions at several start- Management Board member, he was smallest area and power for this class of ups developing SSD) responsible for worldwide Sales and part, according to the company, with a Fan Yang, VP of ASIC (previously in Marketing until late 2017. Loh’s re- 2 die size of 29.9 mm in TSMC 16/12nm charge of the CPU subsystem team at muneration package consists of a base FinFET, typical power of 2.75W and SK Hynix Memory Solutions) salary of €630,000 in combination peak power < 3.5W for an 8TB TLC Aldo Cometti, VP of Products (previ- with a long-term share incentive and a ously Senior Director in the CTO SSD configuration that can hit 100kI- short term cash incentive. OPS/W random read and 80kIOPS/W office of Western Digital) random mix. With total read latency of 4800 Patrick Henry Drive, #110 Cyient, a provider of technology 10uSec, Titanium-DC delivers best-in- Santa Clara, CA 95054 services and solutions, has appointed class performance at low queue depth Tel: 408.883.7382 Karthikeyan Natarajan as President for response-time sensitive applications. PETAiO.com and COO. Karthik previously headed the Integrated Engineering Services Thanks to its ‘4-able’ architecture Business for Tech Mahindra. (Flexible, Scalable, Configurable and Vulcan Semiconductor Customizable), PETAiO’s Titanium Vulcan Semiconductor was founded Efinix has appointed Harald Werner roadmap includes an upcoming Titani- in 2019 “to create innovative solutions as European Sales Director. Werner um-XP with 16 Flash channels and PCIe to power the next wave of industrial previously managed European Sales Gen4x8 for extreme performance and revolution, spanning robotics, autono- and Field Applications Engineering capacity. Titanium-XP will support up mous machines, industrial networking functions at Lattice. Efinix Trion to 64TB delivering 10GB/sec sequen- and control.” The company has open FPGAs, offering 4K to 200K logic tial read, 8GB/sec sequential write, 2 positions for people with experience in elements, have a small form-factor, system architecture, ASIC design and MIOPS random read and up to 2 MIOPS low-power, and are priced for high-vol- verification, networking technology, an- random write. ume production. alog mixed-signal design, motor control, The company has also demonstrated the firmware development, AI technologies LeddarTech has appointed Stéphane Titanium-XL architecture, which targets for sensor, audio, and video data pro- Rousseau as VP of Global Operations. low latency Flash and SCM with 2.7uS cessing. Dr. David Cheskis was appointed VP total ASIC Read latency. PETAiO has of Product Line Management. Michael Ivan Lee, Co-Founder & CEO (previ- completed Titanium-XL SoC design. Poulin, who has been with LeddarTech ously a VP at Marvell) Development was in concert with a for the past ten years, has been appoint- Eugene Lee, VP of Engineering & leading NAND OEM partner. Co-Founder ed VP of Strategic Partnerships and Lu Chang, Co-Founder (previously Sr. Corporate Development. He previously Tim Ding, Chairman, CEO, Founder was VP of Product Line Management. (Previously co-founder and CEO of Dir, CTO Office at OmniVision and Sr. Dir, Mobile Products at Marvell) David Moon was appointed Director TiDAL Systems, a SSD Controller of Automotive Products within the Santa Clara, CA company acquired by Micron in 2016 Product Line Management team. for ~$200M. Before that, VP of WW vulcansemi.com n

leadership roles at GCM, Interlink adverse environmental conditions, and People Electronics, Soligie (Molex), Starkey (Continued from page 3) its small size. Blickfeld will use the Labs, August Technology (Rudolph new financial resources to ramp up pro- MagnaChip’s CFO, EVP and Chief Technologies), NT International (En- duction, qualify its LiDAR sensors for Accounting Officer,Jonathan Kim, is tegris), and Rosemount (Emerson the automotive market and strengthen stepping down to pursue an executive Process Controls). the application development and sales opportunity outside of the semiconduc- teams for industrial markets. tor industry. The Company has initiated Western Digital has appointed David a search to identify a permanent CFO. Goeckeler as CEO and a member of Graphcore has secured an addition- Shinyoung Park has been promoted the Board of Directors. Goeckeler al $150 million in new capital. The to Chief Accounting Officer. Ms. Park previously served as EVP and GM of private placement has been made has been with MagnaChip since 2014, Cisco’s $34 billion Networking and by leading financial asset managers, most recently serving as Corporate Security Business. He succeeds Steve growth equity funds and investment Controller and as a member of the Milligan, who previously announced trusts and includes new investors n executive team. his intended retirement. Baillie Gifford, Mayfair Equity Part- ners and M&G Investments alongside The company’s strategic evaluation existing investors including Merian process continues to make progress, Funding Chrysalis, Ahren Innovation Capital, including having discussions with Amadeus Capital Partners and Sofina. multiple interested parties toward a Ayar Labs has received a strategic investment from Lockheed Martin An extension of Graphcore’s Series possible sale of its Foundry business D round, which closed in December and Fab 4, as well as consideration Ventures. The funds will be used to accelerate the commercialization of 2018, this new D2 round brings the of accretive business conversions and total investment in Graphcore to date other options related to that business. Ayar’s monolithic in-package optical I/O (MIPO) solution for applications to over $450 million at a valuation of NXP has appointed Kurt Sievers as that require high bandwidth, low la- $1.95 billion. Graphcore is extremely President and CEO succeeding Rick tency and power efficient short reach well capitalized, holding over $300M Clemmer, who has led NXP since interconnects. Focused application in cash reserves after this new invest- 2009. Since September 2018, Sievers areas are in AI, High Performance ment. has been President of NXP. Sievers Computing (HPC), and Digital Beam- Announced public customers include joined NXP in 1995, and rapidly moved forming radar. Ayar demonstrated its Microsoft, Citadel Securities, Carmot through a series of Marketing & Sales, monolithic electronic photonic Tera- Capital and Qwant. Microsoft Azure Product Definition & Development, PHY chiplet at the Supercomputing IPU-Cloud launched November 2019 Strategy and General Management 2019 conference and is now working and is open for customers. The Dell leadership positions across a broad with select semiconductor manufac- DSS8440 IPU Server for enterprise number of market segments. turers, OEM systems builders, and end users on sampling and co-design datacenter customers launched in No- Power Integrations has named Anita partnerships in 2020. vember 2019. Graphcore also launched Ganti to its board of directors. From the IPU-Bare Metal Cloud service in 2015 to 2019 she served as SVP of the Blickfeld has completed its Series A partnership with Cirrascale. Demand product engineering services organi- financing round led by the VC unit of for Graphcore’s Intelligence Processor zation of Wipro. From 2013 to 2015, Continental together with Wachstums- Unit products is increasing at existing she was VP of global technology at fonds Bayern, which is managed by and new customers and the outlook for Flex and from 2008 to 2013 she was Bayern Kapital, with participation of its business in Fiscal 2020 is extremely employed by TI, where she served as existing investors Fluxunit – OSRAM positive. GM of the company’s precision signal Ventures, High-Tech Gründerfonds, path division. TEV (Tengelmann Ventures) and Hailo, a provider of Deep Learning Unternehmertum Venture Capital processors, has raised $60 million SkyWater, a solely U.S.-based and Partners. in Series B funding led by existing U.S.-owned, DMEA-accredited investors and joined by key strategic Category 1A Trusted Foundry, has The solid-state sensor developed by investors including ABB Technology appointed Mark Litecky as Chief Blickfeld delivers high-resolution, Ventures, NEC and Latitude Ventures. Revenue Officer, a newly created 3D environmental data and stands out Hailo has raised $88 million to date. role. Litecky has held executive level due to its high performance, even in The Hailo-8 Deep Learning processor

Copyright © 2020, Pinestream Communications, Inc. Tel 781.647.8800 www.pinestream.com [email protected] SEMICONDUCTOR TIMES APR 2020 / 5 for edge devices features up to 26 in this series to $28 million. Investors FMCW chip and unprecedented long- TOPS performance. include Susquehanna International range LiDAR resolution. Utilizing Group, Morningside Group, SMiT, its second-generation FMCW silicon ON Semi has drawn down approx. Palm Commerce Holdings, Chariot photonics 4D+ Vision Chip to generate $1.17 billion from its revolving credit Gold, SV Tech Ventures, and Innolinks scans, SiLC was able to detect objects facility. The company has no immedi- Ventures. The company has raised more smaller than one and a half inches at a ate use of the funds and has made the than $38 million since it was founded range of nearly 200 meters, translating withdrawal out of abundance of caution in 2013. Earlier investors include Green to an effective resolution of around 0.01 to have access to sufficient liquidity City Ventures, u.life fund, Waterwood degrees vertically and horizontally. in an uncertain macroeconomic en- Growth Technology, Stanford-StartX vironment. With this withdrawal, the Fund, Inventec, CRCM Ventures, and Transphorm, a developer of high company has made full use of its $1.97 Tuesday Capital. reliability, high performance gallium billion revolving line of credit. nitride (GaN) semiconductors for Sensel’s touch technology offers power conversion, has raised $21.5 Quantum Machines, creator of the two functions in a single, ultra-thin million in a private placement equity first complete hardware and software sensor: position reporting with high financing. The financing was led by solution for the control and operation accuracy, and force sensing with the existing investors including an affiliate of quantum computers, has secured ability to measure force from 1g to of Kohlberg Kravis Roberts, a new $17.5M in funding to accelerate the al- 5kg independently for each contact strategic investor, Marelli, and new ready rapid adoption of the company’s point. It responds to any object (styli, institutional investors. B. Riley FBR Quantum Orchestration Platform. The paintbrushes, fingernails), works in was the lead placement agent and round was led by Avigdor Willenz and virtually any environment (underwater, Craig-Hallum Capital Group was the Harel with the participation of previ- with heavy gloves), and enables new co-placement agent. Montrose Capital ous backers TLV Partners and Battery form factors (foldable, flexible). It can Partners was the sponsor. Yole Dével- Ventures. QM’s Orchestration Platform be integrated behind a flexible AMO- oppement (“Yole”) predicts that GaN has already been adopted by multina- LED display, a non-display touchpad, power device revenues may approach tional corporations and startups at the steering wheel, or any surface area $400 million by 2023. forefront of quantum computing, with where a high-resolution force sensing many new paying customers joining experience is desired. Sensel is working Prior to the financing, Transphorm every month. with multiple OEMs to integrate its completed a reverse merger with Pen- SambaNova has raised $250 million in touch technology into next-gen con- insula Acquisition, a public Delaware Series C funding to further accelerate sumer products. corporation, whereby Transphorm the software capabilities of its next-gen became a wholly owned subsidiary of SiLC, developer of integrated sin- computing platform. The round was led Peninsula. Following the merger, Pen- gle-chip FMCW LiDAR solutions, has by BlackRock with participation from insula changed its name to Transphorm closed $12 million in seed funding led existing investors including GV, Intel and will continue the historical busi- by Dell Technologies Capital. Decent Capital, Walden International, WRVI ness of Transphorm. Previous members Capital, ITIC Ventures, and several Capital and Redline Capital. of Transphorm’s Board of Directors, prominent angel investors also par- David Kerko, Eiji Yatagawa, Brittany SambaNova offers an integrated HW ticipated. SiLC will use the funding Bagley, Mario Rivas and Dr. Umesh and SW solution with an architecture to scale its R&D and operations to Mishra will remain as directors of the optimized for dataflow from algorithms develop its frequency modulated con- Company. n to silicon, enabling a broad range of tinuous wave (FMCW) silicon photonic compute-intensive applications to run 4D+ Vision Chip platform. SiLC was from the datacenter to the edge. Its founded in 2018. Founder and CEO Mergers & Acquisitions reconfigurable dataflow architecture Mehdi Asghari was part of the execu- ams confirms the public offer for enables applications to drive optimized tive team that led Bookham to its IPO OSRAM is expected to close in Q2’20 hardware configurations. in 2000 and later joined the leadership team at Kotura, which was acquired by subject to receipt of the required re- Sensel, developer of touch interfaces Mellanox in 2013. maining regulatory clearances. ams with PressureGrid™ technology, has has increased its direct shareholding closed the second tranche of its Series At CES 2020, SiLC demonstrated in OSRAM to 23.4% funded from A financing, bringing the total raised the industry’s first fully-integrated existing cash resources, which further

M&A Nokia to expand its market footprint ate with major operating companies in (Continued from page 5) by addressing the optical connectivity semiconductors, telecom, energy and requirements of 5G, cloud and enter- life sciences. demonstrates the commitment to prise networking. Elenion was founded closing. in 2014 and is headquartered in New ST has signed an agreement to acquire York. a majority stake in Exagan, a Gallium Cypress has been informed by the Nitride (GaN) innovator. Exagan’s ex- Committee on Foreign Investment in Silicon Labs has entered into a defin- pertise in epitaxy, product development the United States (CFIUS) that CFIUS itive asset purchase agreement with and application know-how will broad- has completed its review of Cypress’s Redpine Signals to acquire the com- en and accelerate ST’s power GaN previously announced merger trans- pany’s Wi-Fi and Bluetooth business, roadmap and business for automotive, action with Infineon and determined development center in Hyderabad, industrial and consumer applications. that there are no unresolved national India, and extensive patent portfolio Terms were not disclosed. The trans- security concerns with respect to the for $308 million in cash. The Redpine action is funded with available cash. proposed merger. The merger remains Signals acquisition includes an at-scale The agreement also provides for the subject to receipt of regulatory approv- design center with approximately 200 acquisition by ST of the remaining al from China’s State Administration employees in Hyderabad, India. minority stake in Exagan 24 months for Market Regulation and other cus- after closing. n tomary closing conditions under the The integration of the Redpine Signals merger agreement. technology will accelerate Silicon Labs’ roadmap for Wi-Fi 6 silicon, Mellanox has reached a definitive software and solutions. The acquisi- Business agreement to acquire Titan IC, a de- tion also includes Bluetooth Classic Alchip, a high-performance ASIC veloper of network intelligence (NI) IP (including Extended Data Rate) for company, has opened its North Amer- and security technology to accelerate audio applications including wearables, ican headquarters in Milpitas, CA, led search and big data analytics across hearables, voice assistants and smart by Hioryuki Nagashima. Mr. Na- a broad range of applications in data speakers. gashima previously served in business centers worldwide. The acquisition development and business management will further strengthen Mellanox’s Silicon Labs expects the transaction to roles in Alchip’s Japan office. network intelligence capabilities deliv- add approx. $20 million in incremen- Alchip will focus on Hyperscalers, ered through the company’s advanced tal revenue on an annualized basis for OEMs and fabless IC companies. ConnectX and BlueField families of FY2020. The transaction will add ap- Initial demand has come from server SmartNIC and I/O Processing Unit proximately $15 million of non-GAAP farm and cloud computing companies (IPU) solutions. Titan IC’s team in operating expenses on an annualized seeking very tightly defined parameters Belfast, Northern Ireland will become basis. for AI and ML applications. Alchip the center of advanced network intel- was founded in 2003 and is publicly ligence R&D for Mellanox. Titan IC SK Siltron, a global maker of semi- traded on the Taiwan stock exchange. has worked with Mellanox for many conductor wafers, has completed the The company has designed ASICs for years to integrate Titan’s RXP regular $450 million acquisition of DuPont’s a number of global Fortune 500 com- expression processor into Mellanox’s Silicon Carbide Wafer (SiC Wafer) panies headquartered in the Far East, advanced line of BlueField IPUs. unit. The primary site for the business USA, and, more recently, Israel. is in Auburn, Mich., about 120 miles Nokia plans to acquire Elenion Tech- north of Detroit. SK Siltron is South MagnaChip has updated its financial nologies, a U.S.-based company Korea’s only producer of semiconduc- guidance for the first quarter ending focusing on silicon photonics. Elenion tor silicon wafers and one of the top five March 31, 2020. The Company raised develops highly integrated, low-cost global wafer manufacturers with annual its anticipated revenue guidance range silicon photonics technologies for sales of 1.542 trillion won, accounting to $187 to $197 million as compared short-reach and high-performance for about 17% of global silicon wafer to the previous guidance of $180 to optical interfaces and has pioneered sales (based on 300mm). The U.S. $195 million. a design toolset that enables a simpli- subsidiary, established in 2001, sells fied, low cost, scalable manufacturing silicon wafers to eight customers, in- Marvell’s net income includes a pre- process. Elenion’s expertise, design cluding Intel and Micron. SK Group is tax gain on sale of $1.1 billion from the platform and services will enable South Korea’s third-largest conglomer- divestiture of the Wi-Fi Connectivity

Copyright © 2020, Pinestream Communications, Inc. Tel 781.647.8800 www.pinestream.com [email protected] SEMICONDUCTOR TIMES APR 2020 / 7 business to NXP. The Company re- ductor market in 2020, according to Analog Devices has withdrawn the ceived $1.7 billion in cash proceeds. IDC. The new IDC report analyzes the company’s outlook for the fiscal second The Company also completed an impact of the COVID-19 pandemic on quarter, ending May 2, 2020 due to the intra-entity asset transfer of certain of the global semiconductor market and COVID-19 pandemic. the Company’s IP to a subsidiary in provides a framework to evaluate the Singapore. The internal restructuring market impact through four scenarios Applied Materials is withdrawing resulted in an income tax benefit of that assess the range of possible out- its business outlook for Q2 fiscal approx. $763 million for Q4’FY20, comes. 2020, ending April 26, 2020, because which primarily captures the tax effect the evolving worldwide response to of future deductions. There is nearly an 80% chance for COVID-19 is impacting the compa- significant contraction in worldwide ny’s supply chain and manufacturing X-FAB is the first pure-play foundry to semiconductor revenues in 2020, in- operations. add internal SiC epitaxy capabilities. stead of a previously expected minor Cohu, a supplier of back-end semi- X-FAB is committed to further expand overall growth of 2%. There is still a conductor equipment and services, its SiC capacity with the 26k wafers one-in-five chance that a fast, strong is withdrawing its fiscal first quarter per month capacity at its Lubbock, bounce-back from COVID-19 in 2020 2020 financial guidance due to the TX facility. By offering an in-house is possible. On a global level, the heightened uncertainly relating to the epitaxy capability, X-FAB is taking COVID-19 crisis is just beginning, potential impact of COVID-19. Cohu control of an additional part of the with too many variables to immediately and several of its key suppliers have process chain. The company is also craft a single forecast in response. The manufacturing operations in the areas undertaking further investments in impact to technology supply chains in affected by the governments of Ma- characterization tools to improve the China are significant, but the timing of laysia and the Philippines “movement epi-layer quality and is working with the recovery is uncertain. the leading substrate manufacturers control” orders. to ensure the long-term continuity of At this time, IDC believes the most Cohu manufacturing in Malaysia and supply for essential raw materials. likely outcome for this event will be a the Philippines have received govern- year-over-year revenue growth rate of Xperi is raising its first quarter 2020 ment exemptions to maintain partial -6% for the worldwide semiconductor operations. However, due to the impact billings outlook from $100M-104M to market in 2020. IDC gives this scenario $108M -110M. Xperi has reached an across the supply chain, manufacturing a 54% probability. Under this scenario, output, other evolving global facility agreement with Toshiba to settle and the supply chain will start to recover, dismiss the pending litigation between disruptions as well as the uncertainty and quarantines and travel bans will of future government regulations, Tessera and Toshiba. Xperi has had a ease, over the summer. For the world- business relationship with Toshiba for Cohu is unable to quantify the impact wide semiconductor market, the impact to its fiscal first quarter 2020 financial more than two decades and is pleased will be $25.8 billion. to have reached a resolution of this guidance. dispute. Terms and conditions of the AMD expects the impact from FormFactor is withdrawing its fiscal n settlement were not disclosed. COVID-19 in Q1 to be modest, poten- first quarter 2020 financial outlook. tially resulting in revenue coming in at The company is complying with the the lower end of guidance of approx. “shelter-in-place” orders by temporar- COVID-19 $1.8 billion, plus or minus $50 million. ily ceasing on-site manufacturing at COVID-19 will have a significant Full year 2020 financial guidance re- its Livermore and San Jose facilities, effect on the worldwide semicon- mains unchanged. which may impact its ability to meet

2020 Worldwde Semiconductor Revenue Growth Forecast Scenarios

Technology Supply Global Disruption to Impact on Broader Tech Chain Recovery Economy & Tech Demand Industry & Initiatives Scenario 1: Decline -12% or more 1-3 months 9-12+ months 9-12+ months Scenario 2: Decline -3 to -6% 3-9 months 3-9 months 3-9 months Scenario 3: Growth +2% 1-3 months 3-9 months 3-9 months Scenario 4: Growth +6% or more 1-3 months 1-3 months 1-3 months Source: IDC, March 2020

COVID-19 China, driven by COVID-19 fears and customer demand more than anticipat- (Continued from page 7) customers returning to work at a slower ed. Qorvo currently estimates revenue pace than anticipated. Its supply chain in the March quarter of approx. $770, its fiscal first quarter 2020 financial is also returning to normal operations or $50 million below the midpoint. outlook. at a slower pace than anticipated. However, the full impact of COVID-19 remains difficult to forecast. Infineon is withdrawing its outlook NXP provided an update to its Q1’20 for the 2020 fiscal year. Originally the revenue guidance due to potential Silicon Labs has updated financial company had anticipated to grow rev- impacts from COVID-19. NXP now guidance for the fiscal first quarter enues by 5% Y/Y (+/- 2%). The impact believes that its expectations for total 2020, ending April 4, 2020, due to es- of the coronavirus pandemic can result revenue in Q1’20 will be reduced due timated impacts from COVID-19. The in a deviation from this expectation to the impact of coronavirus. NXP has company now expects first quarter rev- and can lead to a noticeable decline seen lower than expected sell-through enue to be in the range of $200 to $205 in revenue compared to the last fiscal and order pushouts in both its distribu- million, down from prior guidance of year. For the current quarter ending tion channel and with direct customers. $209 to $219 million. on 31 March, revenue is expected to NXP has not seen any material order Silicon Motion provided an update come in around the lower end of the cancellations but currently expect the to its Q1’20 guidance due to potential guided range. impact to revenue in Q1 to be in the range of $50 to $150 million. impacts from the COVID-19 outbreak. Lam Research is withdrawing its Management now expects non-GAAP ON Semi provided an update to its first prior financial guidance for the fiscal revenue towards the low-end and quarter 2020 revenue outlook, which quarter ending March 29, 2020. The non-GAAP gross margin towards the incorporates the potential impact of California “shelter-in-place” order upper-end of the original guidance COVID-19. ON Semi anticipates that requires the Company to temporarily ranges issued on February 7, 2020. revenue for Q1’20 will be $1,275 to stop on-site work at its Fremont and Management originally expected non- $1,325 million, as compared to earlier Livermore locations for three weeks. GAAP revenue to be in the range of guidance of $1,355 to $1,405 million. Additionally, Lam has supply chain ac- $130 to $138 million and non-GAAP The company saw soft order trends in tivities in Malaysia, and the Malaysian gross margin to be in the range of 44% China in the weeks following Lunar government issued an order to close to 46%. New Year holidays, but orders have certain business activities temporarily. since picked up and the company has Skyworks has updated its outlook for The implementation of these orders not seen any significant cancellations. Q2’FY20 ending March 27, 2020 to prevents the Company from manufac- Its factories in China have returned to reflect the unanticipated impact that turing products at its Livermore and normal levels of operations after man- the COVID-19 outbreak. The com- Fremont, CA facilities and receiving datory shutdown following the end of pany now expects revenue between required parts from key suppliers. Lunar New Year holidays. $760 and $770 million, compared to the prior outlook of between $800 and Microchip is providing the following ON Semi intends to take restructuring $820 million. Although COVID-19 has business update for Q4’FY20. On Feb- measures expected to result in annual caused no significant disruption within ruary 4, 2020, as part of its Q4’FY20 cost savings of approx. $90 million Skyworks’ manufacturing operations to earnings call, Microchip issued quar- during Q1’20 to realign its investments. date, the current demand environment terly net sales guidance of up 2% to These targeted cost reductions are for its products has been negatively 9% sequentially, which was a wider structural in nature, and do not impact impacted by interruptions in global than usual range, to reflect uncertainty the company’s ability to respond to a supply chains. related to the public health situation in significant recovery in demand. China. Based on its current assessment, Veeco is withdrawing guidance for Microchip expects net sales for Q4 Qorvo provided updated financial Q1, ending March 31, 2020 due to the FY20 to be about flat sequentially. guidance for the fiscal 2020 Q4, ending California “shelter-in-place” directive March 28, 2020. On January 29, Qorvo related to the COVID-19 virus which Business in the Americas and Europe provided March 2020 quarterly reve- has rendered its San Jose facility and is trending towards original expecta- nue guidance of $800 to $840 million. possibly the facilities of certain cus- tions. However, the company sees very Since then, COVID-19 has impacted tomers unable to operate until April weak demand in Asia, especially in the smartphone supply chain and 7, 2020. n

Market Research by Intel, STMicro and Infineon. In fiber. The demonstration leveraged Worldwide sales of semiconductors Japan, fab equipment spending growth Infinera’s ICE6 technology in a Groove were $35.4 billion for the month of will be negligible at almost 2% in 2020 (GX) Series platform transmitting January 2020, a decrease of 0.3% from and bump up to nearly 4% in 2021, 800G using 64QAM with probabilis- Kioxia/Western the January 2019 total of $35.5 billion with investments by tic constellation shaping (PCS). This Digital Sony Micron and 2.2% less than the December 2019 , and leading the record-breaking achievement was total of $36.2 billion, reports the SIA. way. Lagging the pack, the Americas accomplished using Corning’s state- will spend less in 2020 than in 2019, of-the-art TXF fiber, an ITU-T G.654.E Global fab equipment spending with fab equipment investments plung- compliant, ultra-low-loss, silica-core promises to rebound from its 2019 ing 24% to $6.2 billion, and extend the fiber with large effective area. ICE6 downturn and see a modest recovery downturn with a 4% decline in 2021. combines Infinera’s sixth-generation this year before a sharp uptick drives photonic IC with its in-house-devel- EDA industry revenue record investments in 2021, reports increased oped 7nm dual-channel 800G per-wave SEMI. The report shows a slow recov- 2.2% for Q4’19 to $2,626 million, FlexCoherent DSP. ery in 2020, –3% YoY growth to $57.8 compared to $2,570 million in Q4’18, ESD Alliance Intel billion, owing in large part to an 18% reports the . For 2019, has successfully integrated its expected slump in 1H’20 from 2H’19. the EDA industry revenue reached 1.6 Tbps silicon photonics engine The picture should brighten in 2H’20 $10.2 billion, an 8.3% increase over with its 12.8 Tbps programmable as a recovery starts to take hold. 2018 and the tenth consecutive year of Ethernet switch. The co-packaged growth. Companies that were tracked switch optimized for hyperscale data The COVID-19 outbreak has eroded employed 45,416 professionals in centers brings together the essential fab equipment spending in China in Q4’19, an increase of 6.1% compared technology building blocks from Intel 2020, prompting downward revisions. to the 42,790 employed in Q4’18, and and its Barefoot Networks Division. Despite continuing headwinds from up 1% compared to Q3’19. The integrated switch package uses the virus, China equipment spending a P4-programmable Barefoot Tofino will grow about 5% YoY to over $12 CAE generated revenue of $874.4 mil- 2 switch ASIC co-packaged with 1.6 billion this year and surge 22% YoY, lion in Q4’19, a 1% increase compared Tbps silicon photonics engines from or $15 billion, in 2021. Investments to Q4’18. IC Physical Design & Veri- Intel’s Silicon Photonics Product Divi- by Samsung, SK Hynix, SMIC and fication revenue was $466.4 million, a sion. Intel acquired Barefoot Networks YMTC will drive the growth. 3.9% decrease. PCB & MCM revenue in 2019 to accelerate its delivery of was $295.3 million, an increase of Ethernet-based fabrics. Powered by TSMC and Micron invest- 19.4%. Semiconductor IP revenue ments, Taiwan will be the top region totaled $900.6 million, a 4% increase. The silicon photonics interconnect plat- in spending in 2020 with nearly $14 Services revenue was $89.6 million, a form features 1.6 Tbps photonic engines billion in equipment investments but decrease of 15%. realized as 4 ports of 400GBase-DR4 drop to third in 2021 with over $13 interfaces. The engines are modular billion in spending, a 5% decline. In The Americas, EDA’s largest region, arrays of transceivers built around 2020, Korea will rank second in fab purchased $1125.6 million of EDA integrated silicon photonics chips equipment spending on the strength products and services in Q4’19, a with on-chip lasers and high-speed of investments by Samsung and SK decrease of 2.9% compared to Q4’18. modulators and detectors, representing Hynix, logging 31% growth, to $13 Revenue in EMEA increased 31% the evolution of the silicon photonics billion, before jumping to the top with to $445.1 million. Japan revenue de- platform that has shipped in more than a 26% advance, to $17 billion, in 2021. creased 6% to $211.4 million. APAC 3 million units of 100G pluggable revenue decreased 0.2% to $844.2 transceivers and powers the 200G and Southeast Asia (mainly Singapore) n will also register robust growth (33% million. 400G pluggable modules ramping to YoY, to $2.2 billion) in 2020 and 26% volume this year. n in 2021. Emerging Trends Of all regions, Europe/Mideast will Infinera and Corning delivered an 800 Products show the strongest equipment spending Gbps single wavelength with Infinera’s AMD detailed plans for its next phase growth with a surge of more than 50% sixth-generation Infinite Capacity of growth driven by multi-generation- to $3.7 billion in 2020 and match that Engine (ICE6) technology across 800 al high-performance CPU and GPU gain in 2021 on the back of investments kilometers on Corning’s TXF optical roadmaps and aggressive technology

Products Architecture to enhance GPU to GPU 2-socket and 1-socket platforms avail- (Continued from page 9) connectivity and is optimized for ma- able. Altra is sampling now and will be chine learning and high-performance in production in mid-2020. investments. AMD has shipped more computing applications. The follow-up than 260 million Zen x86 cores in CDNA 2 architecture will support 3rd Anokiwave announced the commer- its Ryzen and EPYC processors. The Infinity Architecture to enable next-gen cial high-volume availability of the company plans to introduce the first exascale-class supercomputers. industry’s most advanced and complete processors based on its next-gen Zen portfolio of Silicon ICs for mmW 5G, 3 core in late 2020. The Zen 4 core is AMD is continuing to gain traction according to the company. The latest currently in design and is targeted to with its 2nd-gen EPYC processors. In generation brings a complete RF signal use a 5nm process. 2020, AMD expects more than 150 chain solution for all mmW bands in EPYC processor-powered cloud in- play (24/26 GHz, 28 GHz, and 37/39 AMD unveiled plans to expand its stances and 140 server platforms to GHz) to the market while providing chiplet and die stacking leadership, be available. AMD expects to ramp extensive functionality that simplifies including new X3D packaging that com- its 7nm Zen 2-based 3rd-gen Ryzen the active antenna array design. The bines chiplets and hybrid 2.5D and 3D processors designed for desktops and scalable architecture underpinning die stacking to deliver more than a 10x notebooks across the consumer and the mmW 5G IC family supports ev- increase in bandwidth density. AMD commercial segments. AMD is on erything from mmW 5G macro-cells rd announced its upcoming 3 gen AMD track to deliver the first Zen 3-based to small-cells to customer premises Infinity Architecture with optimized Ryzen product in 2020. Extending the equipment (CPE). Anokiwave’s mmW CPU and GPU memory coherency performance of the Radeon RX 5000 IC portfolio is fabricated in GLOBAL- that can enable significant performance series, RDNA 2-based Navi 2X GPUs FOUNDRIES RF SOI process. improvements and simplify software will bring uncompromised 4K gaming, programming for accelerated comput- new features including hardware-based Cadence announced that software for ing by allowing the CPU and GPU to ray tracing support and a significant Cadence Tensilica HiFi DSPs has been seamlessly and coherently share the performance uplift. optimized to efficiently execute Ten- same memory. sorFlow Lite for Microcontrollers, part Ampere has begun shipping the Am- of the TensorFlow end-to-end open- To address the growing number and pere Altra processor, the first 80-core source platform for machine learning diversity of GPU workloads, AMD has server CPU and the first cloud native from Google. a multi-generational roadmap to deliver CPU for modern cloud and edge com- two optimized graphics architectures puting data centers. Ampere Altra is Cartesiam announced NanoEdge AI for gaming and data center compute the company’s next-gen cloud-focused Studio, the first IDE that enables ma- markets: product and first in a new class of CPUs chine learning and inference directly rolling out on an annual basis. The Altra on Arm Cortex-M MCUs. It’s the only The AMD Radeon DNA (AMD processor delivers 80 cores up to 210W. solution that can run both machine RDNA) architecture was designed Altra is a 64-bit Arm processor based learning and inference in the micro- for gaming and is currently powering on the Arm Neoverse N1 platform and controller, according to the company. It the AMD Radeon RX 5000 series is fabricated on TSMC’s advanced N7 enables the execution of unsupervised GPUs. The next-gen RDNA 2 archi- process technology. learning, inference and prediction on tecture is planned to deliver a 50% the device edge, opening new classes performance-per-watt improvement. Altra features up to 80 single-threaded of small, low-power, low-cost devices It will support hardware-accelerated cores in a 1P and 160 cores in a 2P to AI. NanoEdge AI Studio has been ray tracing, variable rate shading and platform. It has 8 channels of DDR4- tested and deployed successfully at a other advanced features. The first 3200 at 2 DPC, supporting up to 4 TB number of European and US compa- RDNA 2-based products are expected memory per socket, 128 PCIe Gen4 nies. to launch in late 2020. lanes in 1P and 192 PCIe Gen4 lanes in 2P platforms, CCIX for coherent CYNORA has debuted its first com- The new AMD Compute DNA (AMD accelerator attach, and two 128 -bit mercial product, a fluorescent blue CDNA) architecture is designed to SIMD units. emitter that promises to significantly accelerate data center compute work- improve the efficiency of Organic Light loads. The first-generation CDNA Ampere Altra is already shipping to Emitting Diode (OLED) displays used architecture, planned to launch later customers, including many of the in mobile phones, laptops, TVs, and this year, includes 2nd gen AMD Infinity top cloud service providers with both other applications. The emission layers

Copyright © 2020, Pinestream Communications, Inc. Tel 781.647.8800 www.pinestream.com [email protected] SEMICONDUCTOR TIMES APR 2020 / 11 determine the overall performance of Inphi is sampling its new Spica 800G Q2. Richardson RFPD, an Arrow the OLED stack and exert a strong 7nm PAM4 DSP, the world’s first Electronics company, has entered influence on power consumption. 800Gbps or 8x100Gbps PAM4 DSP into a global franchise agreement with Blue is the least efficient emitter. With to enable 800G optical transceiver MixComm. next-gen displays like QD OLEDs modules in QSFP-DD800 or OSFP using blue emitters only, the need for formfactors. The new low power, Taoglas and MixComm have formed a ultra-high-efficiency options is even PAM4 DSP with integrated 56GBaud technology partnership and co-devel- more urgent. driver, enables either 2x400Gbps or oped a 5G new radio (NR) mmWave 8x100Gbps optical modules with smart antenna subsystem covering the The product, known as the cyBlue- 100Gbps per lane electrical interfaces. 26.5-29.5 GHz band. The subsystem Booster, employs an advanced can support both infrastructure and IoT molecular design and is >15% more Mellanox announced that customer OEMs’ integration of 5G NR devices efficient than comparative emitters. shipments of SN4000 Ethernet switch- and is ideal for small cells, repeaters It can be easily integrated into exist- es have commenced. The SN4000 and customer-premises equipment ing OLED stacks and is available in family is powered by Mellanox Spec- (CPE) designs. multiple shades of blue for application trum-3, the world’s best performing, The co-development is based on customization. The product is the first most scalable, and most flexible 12.8 Taoglas’ KHA16.23C smart antenna on a technology roadmap that will later Tbps Ethernet switch ASIC, according subsystem. It includes Taoglas’ patent include green and blue emitters based to the company. SN4000 platforms pending design that has been integrat- on the company’s TADF materials come in flexible formfactors support- ed with MixComm’s SUMMIT 2629 platform. ing a combination of up to 32 ports of 400GbE, 64 ports of 200GbE and 128 Front End IC. The KHA16.23C is a 2D antenna array integrated into EPC has introduced an 80V, 12.5A ports of 100/50/25/10GbE. a multi-layer PCB that contains the power stage IC designed for 48V Over the last several years, with the RFICs and 16 antenna elements; layers DC-DC conversion. The EPC2152 is Spectrum and Spectrum-2 product provided for power optimization and a single-chip driver plus eGaN FET lines, Mellanox has steadily grown its thermal control, digital control, and RF half-bridge power stage using EPC’s market share in the 100GbE top-of-rack feed lines all in footprint of 53x84 mm. GaN IC technology. Input logic inter- Ethernet switch segment, according to Depending on device implementation, face, level shifting, bootstrap charging Crehan Research. As of the most recent the Taoglas design is scalable with and gate drive buffer circuits along reported quarter, Mellanox moved up to arrays up to 1024 elements. with eGaN output FETs configured as the fourth overall position worldwide a half-bridge are integrated within a in this segment, with over 7% market Samsung has successfully shipped monolithic chip. When operated in a segment share. one million 10nm-class (D1x) DDR4 48V to 12V buck converter at 1 MHz DRAM modules based on EUV lithog- switching frequency, the EPC2152 MixComm has unveiled its first raphy technology. Samsung is the first ePower Stage achieves a peak effi- production device, the SUMMIT to adopt EUV in DRAM production to ciency above 96% with a solution that 2629 beamforming front-end, which overcome challenges in DRAM scal- is 33% smaller in size on the PCB integrates novel power amplifiers, ing. EUV technology reduces repetitive compared to an equivalent multi-chip low noise amplifiers, T/R switching, steps in multi-patterning and improves discrete implementation. beamformers, calibration, gain con- patterning accuracy, enabling enhanced trol, beam table memory, temperature performance and greater yields as well The EPC2152 is the first offering in and power telemetry, and high-speed as shortened development time. what will be a wide-range family of SPI control for a front-end module integrated power stages available in with optimal partitioning for 5G in- EUV will be fully deployed in Sam- chip scale packages as well as multi- frastructure. The device is fabricated sung’s future generations of DRAM, chip quad flat modules. Within a year, on GLOBALFOUNDRIES’ 45RFSOI starting with its fourth-generation the family will fill out with products process. The SUMMIT 2629 operates 10nm-class (D1a) or the highly-ad- capable of operating at high frequency from 26.5-29.5GHz and is the first in a vanced 14nm-class, DRAM. Samsung up to 3 to 5 MHz range as well as high family of MixComm mmWave devic- expects to begin volume production of current from 15A to 30A per power es. SUMMIT features efficiency more D1a-based DDR5 and LPDDR5 next stage. than 2X better than existing solutions, year, which would double manufac- according to the company. Sample in turing productivity of the 12-inch D1x wafers.

Products With a data transfer rate up to 10x on a 28nm process, UNISOC 8910DM higher than BLE, the SR1000 series’ conforms to both R13 LTE Cat.1bis (Continued from page 11) 10 Mbps capability suits content-rich and GSM, with uplink rates of 5Mbps Sanan IC, a wafer foundry with an applications, such as video streaming, and downlink rates of 10Mbps. By advanced compound semiconductor where high bandwidth low latency seamlessly switching between 2G and technology platform, has expanded links are essential. LTE, it ensures a smooth transition for its optical portfolio. Using the most 2G IoT devices while greatly extending advanced materials and foundry sup- The SR1000 operates in the unlicensed the service life of 2G users’ equipment ply network, Sanan IC will provide 3.1GHz to 10.6GHz frequency range after upgrades for LTE. So far UNISOC the global optical market with large- using a wide spectrum low power 8910DM has been adopted by leading scale foundry services for customized density, transmitting at levels that module manufacturers such as China vertical-cavity surface-emitting lasers may be perceived as noise to other re- Mobile IoT, Fibocom, Longsung, (VCSEL) and arrays, along with ceivers. The SR1000 series comprises MeiG, and Neoway. standard products for optical commu- two pin-identical product variants, the nication applications. According to SR1010 for 3.1GHz to 6GHz, and the Xilinx announced Versal Premium, the LightCounting, the optical transceiver SR1020 for 6GHz to 9.5GHz. third series in the Versal ACAP portfo- market will rise at a 15% CAGR from lio. The Versal Premium series features The SR1000 targets short-range 2020 through 2024. Additionally, Yole highly integrated, networked and pow- wireless connectivity applications, Développement expects the global 3D er-optimized cores and the industry’s including gaming peripherals and AR/ imaging and sensing market to expand highest bandwidth and compute density VR headsets, smart home devices and from $5 billion in 2019 to $15 billion in on an adaptable platform. battery-less IoT sensors. The SR1000 2025, a 20% CAGR during this period. series can also be used for a variety of Developed on TSMC’s 7nm process, Sanan IC is China’s first 6-inch com- ranging and positioning applications. Versal Premium combines software pound semiconductor wafer foundry. Spark provides SW stacks for P2P and programmability with dynamically The company was founded in 2014 and Star protocol stacks and is evaluating configurable hardware acceleration is based in Xiamen City in the Fujian standard stacks for mesh. and pre-engineered connectivity and Province of China, operating as a sub- security features to enable a faster time- Production silicon is out of TSMC, with sidiary of Sanan Optoelectronics. The to-market. The Versal Premium series qualification expected in July. Samples company develops and provides GaAs, delivers up to 3X higher throughput are available now; production in Q3. GaN, SiC, and InP foundry services. compared to current generation FP- High volume production is anticipated GAs, with built-in Ethernet, Interlaken, SPARK Microsystems has intro- in 2022. Future plans include evolving and cryptographic engines that enable duced the SR1000 series of low power the transceiver, an SoC variant, and fast and secure networks. The series ultra-wide band (UWB) wireless trans- support for legacy protocols. Spark doubles the compute density of current- ceiver ICs. The SR1000 series offers has 22 patent filings with 9 granted. ly deployed mainstream FPGAs and an extremely low latency symmetrical The company has raised more than provides the adaptability to keep pace bi-directional short-range (100m) data $6 million in funding plus more than with increasingly diverse and evolving link coupled with ultra-low power $6 million in grants and in-kind ser- cloud and networking workloads. consumption and provides high qual- vices, and plans to seek additional ity of service. Compared to Bluetooth funding in mid-2021. Sanjay Jha, The Versal Premium series is built on Low Energy (BLE), which typically previously COO of Qualcomm and a foundation of the currently shipping has an airtime of a few milliseconds CEO of Motorola Mobility, recently Versal AI Core and Versal Prime ACAP causing noticeable latency of tens of joined SPARK’s board of directors. series. New and unique to Versal Pre- milliseconds, the SR1000 can send Fares Mubarak, CEO, fares.mubara@ mium are 112Gbps PAM4 transceivers, 1 kb of data in only 50 µs, yielding sparkmicro.com multi-hundred gigabit Ethernet and significantly shorter wireless latency Interlaken connectivity, high-speed UNISOC has debuted UNISOC in a wide range of applications, such cryptography, and PCIe Gen5 with 8910DM, the first IoT wide area as audio streaming. built-in DMA, supporting both CCIX chip platform that is compliant with and CXL. The SPARK transceiver’s power con- Cat.1bis, according to the company. sumption, typically 1nJ / bit, is also This solution has completed field test Channelized Ethernet cores deliver up significantly lower than BLE, typically and certification across 45 countries to 5Tb/s of throughput in a minimized 40x lower when operating at 1 Mbps. and 157 operators worldwide. Based footprint and high-speed cryptography

Copyright © 2020, Pinestream Communications, Inc. Tel 781.647.8800 www.pinestream.com [email protected] SEMICONDUCTOR TIMES APR 2020 / 13 engines provide up to 1.6Tb/s of en- 28nm, and 22nm STT-MRAM devel- system partners and cloud companies. crypted line-rate throughput and support opment and manufacturing processes The Credo CMS50216 supports the for AES-GCM-256/128, MACsec, and and have now updated their agreement IEEE 802.1AE Media Access Con- IPsec. The Versal Premium series has to set the terms for a future project on troller Security (MACsec) and Internet over 120TB/s of on-chip memory band- an advanced 12nm FinFET MRAM Protocol Security (IPSec) standard for width, coupled with the customizable solution. 10G through 400G port interconnects. memory hierarchy. The Versal Premium series will begin sampling with early Everspin is in production of discrete Marvell is working with SSD vendor access customers in 1H’21. n STT-MRAM solutions on 40 and KIOXIA and ODMs Foxconn-Ingra- 28nm, including its 1Gb DDR4 device. sys and Accton to bring its Ethernet GF has achieved initial production of Bunch of Flash (EBOF) technology to Licensing & Partnerships embedded MRAM (eMRAM) on its market. The EBOF architecture offers BrainChip announced that Socionext 22FDX platform. Everspin has already an Ethernet fabric to scale flash and will offer customers an AI Platform shipped over 125M units of discrete optimally disaggregate storage from that includes the BrainChp Akida AI MRAM products to date and has over compute. Marvell’s EBOF platforms SoC. BrainChip’s AI technology pro- 1000 customers. incorporate Marvell’s NVMe over Fabrics (NVMe-oF) Ethernet SSD vides a complete ultra-low power AI GT Advanced Technologies (GTAT) Edge Network for vision, audio, and controllers, NVMe-oF Ethernet SSD and ON Semi have executed a five- converter controllers and Prestera CX smart transducers without the need for year agreement, valued at a potential a host processor or external memory. 8500 family of switches with Storage of $50 million. GTAT will supply its Aware Flow Engine technology. Socionext has played an important role CrystX silicon carbide (SiC) material in the implementation of BrainChip’s to ON Semi. High-growth applications Marvell’s EBOF technology is de- Akida IC, which required the engi- such as EV traction systems, hybrid and signed to replace the Just a Bunch neering teams from both companies to plug-in EVs, solar and energy storage, of Flash (JBOF) architecture, which work in concert. Akida samples to be and EV charging all require a robust uses a PCIe fabric, by integrating the available in Q3. supply of SiC material. ON Semi will Ethernet network interface directly CMC Microsystems has signed an use GTAT’s 150mm SiC crystal to into the flash drive. Compared to the agreement with GLOBALFOUND- make its SiC wafers to further accel- existing JBOF architecture, Marvell’s RIES that will provide access to GF’s erate its role as a vertically integrated EBOF architecture can deliver 3X the FinFET, RF SOI, FDX, SiGe, and supplier within the SiC supply chain performance while consuming lower Silicon Photonics platforms for CMC supply. power and enabling greater than 65% TCO savings. researchers at more than 60 Canadian Inomize selected Synopsys’ sili- universities and colleges, in addition to con-proven DesignWare 56G Ethernet The Foxconn-Ingrasys EBOF plat- academic and commercial users glob- PHY IP to accelerate development of form is a 2U chassis with 24 SSDs in ally. CMC customers will have access Inomize’s high-performance comput- a U.2 formfactor and 48 SSDs in an to the GF GlobalShuttle Multi-Project ing, software-defined radio (SDR), and EDSFF E1.S formfactor. The Accton Wafer (MPW) program as well as ded- power-efficient communications SoC. EBOF platform is a 2U chassis that icated prototype and production runs in can accommodate 24 SSDs in a U.2 GF technologies. Innovium, a provider of high-perfor- or EDSFF E1.S and EDSFF E1.L (9.5 mance switching solutions for data CMC has already announced support mm) formfactor. Customer samples in centers, and Credo, a provider of se- early Q2. for GlobalShuttle MPW fabrication rial connectivity solutions, announced runs, and several designs are being successful interoperability of Credo’s Nokia and Marvell are working to- fabricated on different GF technolo- MACsec chip family with Innovium’s gether to develop 5G multi-RAT (Radio gies. Many new services will be added 12.8Tbps TERALYNX 7 switch silicon. Access Technology) silicon innova- in 2020. This interoperability enables a MACsec tions, including multiple generations Everspin announced an amendment of enabled 1RU, 32 x 400G switch using of custom silicon and infrastructure its Spin-transfer Torque (STT-MRAM) Innovium’s 12.8Tbps TERALYNX 7 processors to further expand the range joint development agreement with switch silicon and Credo’s dual 400G of Nokia ReefShark chipsets available GLOBALFOUNDRIES. Everspin CMS50216 MACsec chip. Both these for 5G solutions. The companies are and GF have been partners on 40nm, products have been adopted by leading developing a new generation of custom

Licensing & Partnerships anticipated to provide inherent radi- ready to support TSMC’s next-gen 5nm (N5) process technology. (Continued from page 13) ation-hardened characteristics. AND was founded in 2008 and is based in This new gen CoWoS technology can SoC and infrastructure processors Austin, Texas. combining Nokia’s wireless technology accommodate multiple logic SoC dies, and up to 6 cubes of high-bandwidth with Marvell’s multi-core Arm pro- ST announced the FDA901 class-D memory (HBM), offering as much cessor platforms. These new chipsets audio amplifier IC, with a semicon- as 96GB of memory. It also provides are designed to be deployed in several ductor design that incorporates the bandwidth of up to 2.7 terabytes per building blocks of the Nokia AirScale audio design expertise of Alps Alpine, second, 2.7X faster than TSMC’s previ- radio access solution, as part of Nokia’s a major Japanese manufacturer of car ously offered CoWoS solution in 2016. 5G “Powered by ReefShark” portfolio. audio equipment and information com- munication equipment. The new chip Broadcom defined the complex top- SkyWater and Applied Novel Devic- aims to contribute to the creation of es have entered into a licensing and die, interposer and HBM configuration multi-function, high-fidelity car audio while TSMC developed the manufac- manufacturing agreement to offer an systems that fuse the high efficiency of improved standard process flow for turing process to maximize yield and class-D amplifiers with the high-quality performance and meet the unique chal- Si power MOSFETs. The partnership sound of ST’s class-AB amplifiers. will enable AND to bring new power lenges of the 2X reticle size interposer. devices to market based on its patented TSMC developed a mask-stitching The FDA901 is in volume production. process enabling expansion beyond full technologies and SkyWater’s high vol- For many years, Alpine Electronics has ume manufacturing capabilities. The reticle size, to bring this enhancement collaborated closely with ST. Starting to volume production. n licensing agreement will also enable from the adoption in 39 models of SkyWater to offer the technology as Alpine’s “ALL New BigX series” a standard foundry process flow with after-market car navigation system to near zero reverse recovery charge to Design Wins be released in 1H’20, the FDA901 will Pixelworks’ fifth generation visual improve system-level performance for expand its market to several major car low-voltage (12V – 30V) applications. processor is in the new OPPO Find X2 makers. series smartphones. As the inaugural AND’s high-performance Si power devices launched under the recently TSMC MOSFETs are based on novel channel has collaborated with announced collaboration agreement Broadcom and substrate engineering to improve on enhancing the Chip-on- between the two companies, the Find critical figure of merits of the power Wafer-on-Substrate (CoWoS) platform X2 and Find X2 Pro push visual per- MOSFET. These products offer low to support the industry’s first and larg- formance boundaries in smartphones est 2X reticle size interposer. With an with the integration of the first 120Hz RDSon combined with low output 2 capacitance/charge, low gate drive area of approx. 1,700mm , this next variable refresh rate display and the lat- down to 2.5V and an industry-first near generation CoWoS interposer tech- est Pixelworks processor and software, zero reverse recovery charge, enabling nology significantly boosts computing featuring content-optimized motion low switching losses. The thin body power for advanced HPC systems by processing and an always-HDR video design makes the devices more robust supporting more SoCs as well as being experience. n against temperature variations and is Company Financials – March Releases

Next Qtr Current Qtr Last Qtr Yr-ago Qtr Sales Company Symbol Outlook Sales Net Margin GM Sales Net GM Sales Net GM Growth Qtr Ending Ambarella AMBA $52-57M 57 -13.0 -23% 58% 68 -4.3 58% 51 -4.5 60% 12% 4Q20 31-Jan Broadcom AVGO $5.55-5.85B 5858 311.0 5% 56% 5776 818.0 55% 5789 471.0 55% 1% 1Q20 2-Feb ChipMos IMOS n/a 186 16.7 9% 23% 174 15.0 21% 166 17.4 23% 12% 4Q19 31-Dec Dialog DLG $220-250M 381 44.8 12% 50% 409 68.2 49% 431 57.9 49% -12% 4Q19 31-Dec Everspin MRAM $9.5-9.9M 10 -3.1 54% 9 -3.7 47% 12 -3.5 44% -21% 4Q19 31-Dec Immersion IMMR n/a 12 1.0 9% 99% 11 -1.4 99% 11 -3.1 99% 6% 4Q19 31-Dec Kopin KOPN n/a 6 -7.3 -116% 19% 6 -6.6 23% 6 -10.0 72% 3% 4Q19 28-Dec Marvell MRVL $680M +5% 718 1772.7 247% 42% 663 -82.5 51% 745 -260.7 43% -4% 4Q20 1-Feb Micron MU $4.6-5.2B 4797 405.0 8% 28% 5144 491.0 27% 5835 1619.0 49% -18% 2Q20 27-Feb Semtech SMTC $125-135M 138 2.9 2% 61% 141 14.0 61% 160 13.7 62% -14% 4Q20 26-Jan

Philadelphia SOX Index TSMC – Foundry Barometer

Micron – DRAM Barometer WD / SanDisk – FLASH Barometer

Intel Broadcom

NVIDIA Xilinx

4 Axonne – Automotive Ethernet ICs

4 Ethernovia – Automotive Ethernet ICs

4 ONiO – Battery-Free Wireless MCU

4 PETAiO – SSD Controllers for Data Centers

4 Vulcan Semiconductor – Unknown

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