Overview on Taiwan Semiconductor Industry (2020 Edition)
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Portfolio Holdings Listing Fidelity China Region Fund As of June 30
Portfolio Holdings Listing Fidelity China Region Fund DUMMY as of July 30, 2021 The portfolio holdings listing (listing) provides information on a fund’s investments as of the date indicated. Top 10 holdings information (top 10 holdings) is also provided for certain equity and high income funds. The listing and top 10 holdings are not part of a fund’s annual/semiannual report or Form N-Q and have not been audited. The information provided in this listing and top 10 holdings may differ from a fund’s holdings disclosed in its annual/semiannual report and Form N-Q as follows, where applicable: With certain exceptions, the listing and top 10 holdings provide information on the direct holdings of a fund as well as a fund’s pro rata share of any securities and other investments held indirectly through investment in underlying non- money market Fidelity Central Funds. A fund’s pro rata share of the underlying holdings of any investment in high income and floating rate central funds is provided at a fund’s fiscal quarter end. For certain funds, direct holdings in high income or convertible securities are presented at a fund’s fiscal quarter end and are presented collectively for other periods. For the annual/semiannual report, a fund’s investments include trades executed through the end of the last business day of the period. This listing and the top 10 holdings include trades executed through the end of the prior business day. The listing includes any investment in derivative instruments, and excludes the value of any cash collateral held for securities on loan and a fund’s net other assets. -
UNITED STATES SECURITIES and EXCHANGE COMMISSION Washington, D.C
Table of Contents UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-Q ☒ QUARTERLY REPORT PURSUANT TO SECTION 13 OR 15(D) OF THE SECURITIES EXCHANGE ACT OF 1934 For the quarterly period ended June 30, 2018 or ☐ TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(D) OF THE SECURITIES EXCHANGE ACT OF 1934 For the transition period from to Commission File Number 001-33387 GSI Technology, Inc. (Exact name of registrant as specified in its charter) Delaware 77-0398779 (State or other jurisdiction of incorporation or organization) (IRS Employer Identification No.) 1213 Elko Drive Sunnyvale, California 94089 (Address of principal executive offices, zip code) (408) 331-8800 (Registrant’s telephone number, including area code) Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days. Yes ☒ No ☐ Indicate by check mark whether the registrant has submitted electronically and posted on its corporate Web site, if any, every Interactive Data File required to be submitted and posted pursuant to Rule 405 of Regulation S-T during the preceding 12 months (or for such shorter period that the registrant was required to submit and post such files). Yes ☒ No ☐ Indicate by check mark whether the registrant is a large accelerated filer, an accelerated filer, a non-accelerated filer or a smaller reporting company. -
STOXX ASIA 1200 Selection List
STOXX ASIA 1200 Last Updated: 20200901 ISIN Sedol RIC Int.Key Company Name Country Currency Component FF Mcap (BEUR) Rank (FINAL)Rank (PREVIOUS) TW0002330008 6889106 2330.TW TW001Q TSMC TW TWD Y 295.1 1 1 KR7005930003 6771720 005930.KS KR002D Samsung Electronics Co Ltd KR KRW Y 195.5 2 2 JP3633400001 6900643 7203.T 690064 Toyota Motor Corp. JP JPY Y 143.3 3 3 HK0000069689 B4TX8S1 1299.HK HK1013 AIA GROUP HK HKD Y 104 4 4 JP3435000009 6821506 6758.T 682150 Sony Corp. JP JPY Y 82.6 5 6 JP3436100006 6770620 9984.T 677062 Softbank Group Corp. JP JPY Y 78.4 6 5 INE002A01018 6099626 RELI.BO IN0027 Reliance Industries Ltd IN INR Y 77.8 7 7 JP3236200006 6490995 6861.T 649099 Keyence Corp. JP JPY Y 66 8 8 INE040A01034 BK1N461 HDBK.BO IN00CH HDFC Bank Ltd IN INR Y 58.5 9 11 CNE1000002H1 B0LMTQ3 0939.HK CN0010 CHINA CONSTRUCTION BANK CORPCN H HKD Y 57.8 10 9 JP3970300004 BQRRZ00 6098.T JP503G RECRUIT HOLDINGS JP JPY Y 53.8 11 17 JP3756600007 6639550 7974.T 663955 Nintendo Co. Ltd. JP JPY Y 53.3 12 18 CNE1000003X6 B01FLR7 2318.HK CN0076 PING AN INSUR GP CO. OF CN 'H' CN HKD Y 51.5 13 10 JP3735400008 6641373 9432.T 664137 Nippon Telegraph & Telephone C JP JPY Y 50.2 14 16 HK0388045442 6267359 0388.HK 626735 Hong Kong Exchanges & Clearing HK HKD Y 50.1 15 12 JP3463000004 6870445 4502.T 687044 Takeda Pharmaceutical Co. Ltd. JP JPY Y 49.2 16 13 JP3481800005 6250724 6367.T 625072 Daikin Industries Ltd. -
Semiconductor Times, April 2020
SEMICONDUCTOR TIMES APR 2020 / 1 ® APR 2020 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES VOL 25, ISSUE 4 bandwidth in the automotive market. Christopher Mash, VP of Business De- Startup Profiles Next generation cars require multiple velopment (previously Senior Dir. layers of security protection to prevent, Automotive Apps, Product Definition Axonne detect, and adapt to evolving threats. The and Architecture at Marvell) Axonne was founded in early 2018 auto industry is increasingly adopting Craig Farnsworth, GM and Senior Dir. to develop connectivity solutions for Ethernet solutions and 2019 will see the of Engineering (previously Senior automotive and industrial applications. international standardization (IEEE) of Director of Digital Design at Peraso) The company has received funding multi-gigabit Ethernet bandwidth rates Ahmad Tavakoli, Sr. Director, Analog from Translink Capital. We believe for automotive applications. & Mixed-Signal Design (previously the company is developing automotive Sr. Hardware Engineer at Google and ethernet ICs. Ethernovia is developing an Ethernet Verily Life Sciences, and Sr. Director system sophisticated enough to process of Engineering at Aquantia) Gani Jusuf, Ph.D., Co-Founder and the bandwidth demands of future auto- 2050 Ringwood Ave Suite B CEO (previously VP of engineering motive systems by unifying in-vehicle San Jose, CA 95131 at Marvell) networks into an end to end Ethernet www.ethernovia.com William Lo, Co-Founder and CTO system. Ethernovia is developing an (previously VP, R&D Datacom En- Ethernet solution that will provide a gineering at Marvell) unified, standards-based solution built ONiO Sunnyvale, CA to meet automotive functional safety ONiO was founded in 2016 to develop www.axonne.com requirements. -
2019 Corporate Governance Evaluation Results in Taiwan
2019 Corporate Governance Evaluation Results in Taiwan Conducted by the Securities and Futures Institute Entrusted by Taiwan Stock Exchange Corporation & Taipei Exchange Despite all reasonable care given in the screening process to ensure objectivity, the SFI bears no responsibility in case of any damage or loss incurred from use of the evaluation results. April 30, 2020 2019 Corporate Governance Evaluation Results in Taiwan About the “Corporate Governance Evaluation System” In response to the market need for enhanced corporate governance reforms, the Financial Supervisory Commission ("FSC") issued the "Corporate Governance Roadmap" in December 2013 and the new one in April 2018, aiming to accelerate the implementation of corporate governance among Taiwanese listed companies, assist them with sound development and boost market confidence. According to the roadmaps, the implementation of corporate governance evaluation is one of the major projects with the goal of investors and enterprises better understanding the performance of corporate governance by comparing the evaluation results among companies. In 2014, the Taiwan Stock Exchange Corporation (“TWSE”) and the Taipei Exchange (“TPEx”) launched the “Corporate Governance Evaluation System”, conducted by the Securities and Futures Institute (“SFI”) annually. The FSC believes this evaluation system will make companies take corporate governance more seriously, encourage healthy competition among companies and cultivate a culture that companies voluntarily improve their corporate governance. 2019 is the sixth year of the evaluation and the results have been published on April 30, 2020.The industry differentiation was also taken into account and the evaluation results were released both on a listing market basis and on an industry by industry basis. -
Emerging Markets Social Core Equity Portfolio As of March 31, 2021 (Updated Monthly) Source: State Street Holdings Are Subject to Change
Emerging Markets Social Core Equity Portfolio As of March 31, 2021 (Updated Monthly) Source: State Street Holdings are subject to change. The information below represents the portfolio's holdings (excluding cash and cash equivalents) as of the date indicated, and may not be representative of the current or future investments of the portfolio. The information below should not be relied upon by the reader as research or investment advice regarding any security. This listing of portfolio holdings is for informational purposes only and should not be deemed a recommendation to buy the securities. The holdings information below does not constitute an offer to sell or a solicitation of an offer to buy any security. The holdings information has not been audited. By viewing this listing of portfolio holdings, you are agreeing to not redistribute the information and to not misuse this information to the detriment of portfolio shareholders. Misuse of this information includes, but is not limited to, (i) purchasing or selling any securities listed in the portfolio holdings solely in reliance upon this information; (ii) trading against any of the portfolios or (iii) knowingly engaging in any trading practices that are damaging to Dimensional or one of the portfolios. Investors should consider the portfolio's investment objectives, risks, and charges and expenses, which are contained in the Prospectus. Investors should read it carefully before investing. Your use of this website signifies that you agree to follow and be bound by the terms and conditions of use in the Legal Notices. Notional Market Asset Cumulative Row Id Security Name Amount USD Value USD Weight Weight Equity 1,719,683,770.89 100.000% 1 TENCENT HOLDINGS LTD COMMON STOCK HKD.00002 76,575,311.59 4.453% 4.453% 2 SAMSUNG ELECTRONICS CO LTD COMMON STOCK KRW100.0 53,443,287.97 3.108% 7.561% 3 TAIWAN SEMICONDUCTOR SP ADR ADR 43,810,912.00 2.548% 10.108% 4 ALIBABA GROUP HOLDING SP ADR ADR USD.000025 39,731,031.55 2.310% 12.419% 5 TAIWAN SEMICONDUCTOR MANUFAC COMMON STOCK TWD10. -
Micron: NAND Flash Architecture and Specification Trends
NAND Flash Architecture and Specification Trends Michael Abraham ([email protected]) Applications Engineering Manager Micron Technology, Inc. Santa Clara, CA USA August 2009 1 Abstract As NAND Flash continues to shrink, page sizes, block sizes, and ECC requirements are increasing while data retention, endurance, and performance are decreasing. These changes impact systems including random write performance and more. Learn how to prepare for these changes and counteract some of them through improved block management techniques and system design. This presentation also discusses some of the tradeoff myths – for example, the myth that you can directly trade ECC for endurance Santa Clara, CA USA August 2009 2 NAND Flash: Shrinking Faster Than Moore’s Law 200 100 Logic 80 DRAM on (nm) ii 60 NAND Resolut 40 Micron 32Gb NAND (34nm) 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 Semiconductor International, 1/1/2007 Santa Clara, CA USA August 2009 3 Memory Organization Trends Over time, NAND block size is increasing. • Larger page sizes increase sequential throughput. • More pages per block reduce die size. 4,194,304 1,048,576 262,144 65,536 16,384 4,096 1, 024 256 64 16 Block size (B) Data Bytes per Page Pages per Block Santa Clara, CA USA August 2009 4 Consumer-grade NAND Flash: Endurance and ECC Trends Process shrinks lead to less electrons ppgger floating gate. ECC used to improve data retention and endurance. To adjust for increasing RBERs, ECC is increasing exponentially to achieve equivalent UBERs. For consumer applications, endurance becomes less important as density increases. -
A Brief Introduction to Tsmc
TSMC commits itself to providing its customers with the best quality and most comprehensive services. LETTER TO SHAREHOLDERS Dear Shareholders, Year 2004 was a banner year for TSMC. We again set new records for revenues and earnings, while continuing to lead the semiconductor dedicated foundry sector. Our production accounted for more than 7% of the total value of the world's semi- conductor output. TSMC's performance was anchored in our "Trinity of Strength": strength in technology development and deployment, strength in manufacturing capacity and efficiency, and strength in building customer partnerships. For example: ● TSMC cumulatively shipped over one million wafers (8-inch equivalent) in 0.13-micron technology. SM ● TSMC's Nexsys 90nm, the world's first 12-inch, low-k, 90-nanometer process to reach full production, was adopted in more than 30 customer products after one year's ramp, and achieved product yields ahead of internal goals. ● TSMC served more than 300 customers and produced more than 5,000 products in our fabs. With its core manufacturing and logistics competencies, TSMC's experience in integrating front-end design and back-end turn- key services has helped customers resolve many daunting challenges in advanced chips designed with our 90nm technology. We collaborate closely with customers, enabling them to deliver their products on time and to achieve success in their end markets. Financial Strength and Results TSMC broke new records in both revenues and net income in 2004. Revenue reached NT$255.9 billion, an increase of 26.8% compared with the previous record set in 2003. Net income was NT$92.32 billion, an increase of 95.3% compared with 2003 results, while fully diluted earnings per share were NT$3.97 (US$0.59 per ADS unit), an increase of 96.8 %. -
Year 2016, Based on the Findings of a Self-Evaluation
1. Spokesperson Jessica Chiou-Jii Huang Vice President, Finance Center Tel: 886-3-567-8168 E-mail: [email protected] 2. Deputy Spokesperson Wan-Shou Wen Executive Vice President, Memory IC Manufacturing Business Group Tel: 886-3-567-8168 E-mail:[email protected] Yuan-Mou Su Vice President, Sales Center Tel: 886-3-567-8168 E-mail: [email protected] 3. Company Address and Telephone Headquarters and Taichung Site: No. 8, Keya 1st Rd.,Daya Dist., Central Taiwan Science Park, Taichung City 428, Taiwan, R.O.C. Tel: 886-4-2521-8168 Jhubei Office: No.38, Gaotie 1st Rd., Jhubei City, Hsinchu County 30273, Taiwan R.O.C. Tel:886-3-5678168 Wenxing LAB: No.186, Sec. 2, Wenxing Rd., Jhubei City, Hsinchu County 30274, Taiwan R.O.C. Tel:886-3-5678168 Taipei Office: 2F, No.192, Jingye 1st Rd., Zhongshan Dist., Taipei City 104, Taiwan, R.O.C. 26F, No.1, Songzhi Rd., Xinyi Dist., Taipei City 110, Taiwan, R.O.C. Tel: 886-2-8177-7168 4. Common Stock Transfer Office Stock Registrar and Transfer Office, Winbond Electronics Corp. 8F, No.398, Xingshan Rd., Neihu Dist., Taipei City 114, Taiwan, R.O.C. Tel:886-2-2790-5885 Website: http://stock.walsin.com 5. Auditor Deloitte & Touche Kuo-Tyan Hong and Ker-Chang Wu 12F, No. 156, Sec. 3, Min-Sheng E. Rd., Taipei, 105, Taiwan, R.O.C Tel: 886-2-2545-9988 Website: http://www.deloitte.com.tw 6. Overseas Securities Listing Exchange and Information Luxembourg Stock Exchange Website: http://www.bourse.lu 7. -
GMO Trust Semiannual Report August 31, 2020
GMO Trust Semiannual Report August 31, 2020 Climate Change Fund Cyclical Focus Fund Emerging Domestic Opportunities Fund Emerging Markets Fund International Equity Fund Quality Fund Resources Fund Risk Premium Fund Tax-Managed International Equities Fund U.S. Equity Fund U.S. Small Cap Value Fund Beginning on January 1, 2021, as permitted by regulations adopted by the Securities and Exchange Commission, GMO expects that paper copies of each Fund’s annual and semiannual reports to shareholders will no longer be sent by mail, unless you specifically request paper copies of the reports by writing or calling GMO Shareholder Services at the address or phone number below or by contacting your financial intermediary, such as a broker or agent. Instead, reports will be available on a website, and you will be notified by mail each time a report is posted and provided with a website link to access the report. If you already elected to receive shareholder reports electronically, you will not be affected by this change and you need not take any action. If you are a direct investor, you may elect to receive shareholder reports and other communications from the Fund electronically by contacting GMO Shareholder Services or if you own your shares through a financial intermediary, you may contact your financial intermediary. Beginning January 1, 2019, you may elect to receive all future reports in paper free of charge. If you invest through a financial intermediary, you can contact your financial intermediary to request to continue to receive paper copies of your shareholder reports or you can follow instructions included with this disclosure. -
2018, but We Are Not Done by Any Means
Dear Shareholders, Today, we are pleased to review a year which includes numerous positive fundamental developments. At Himax Technologies, we pride ourselves not only on defending our position as the market leader in our sector, in terms of quality, reliability, and execution, but also on our ability to pair aggressive development aspirations with creating long-term shareholder value. In this regard, we believe we have accomplished a great deal in 2018, but we are not done by any means. 2018 was a year of new developments in our technology sector and our markets. At Himax Technologies, we have successfully leveraged our strengths to navigate both market dynamics as well as company specific opportunities to deliver a solid year of growth for shareholders. Further, we proactively initiated and executed several strategic initiatives to strengthen our operation and streamline R&D investments. We believe these proactive strategies reinforced our status in the marketplace and further strengthened our ability to defend our position as a market leader. Additionally, our execution in 2018 positions us for future growth well beyond 2018. Despite a challenging global economic environment, we are more optimistic about the opportunities ahead as several of our industry-leading technologies are at or nearing key inflection points. As a result, we expect to enter a period of substantial growth in the near future. Now, let me briefly go through each of our major business segments. Being a global leader in the display driver IC (DDIC) segment, we have been benefiting from China’s continued capacity expansion of its panel manufacturing as well as the Chinese smartphone makers’ rapid overseas expansion. -
Onfi Overview
An Update Jim Cooke NAND Marketing Micron Technology, Inc. Thursday, August 6, 2009 Outline . ONFi Overview . ONFi Provides Speed Enhancements . The Path to Higher Performance Santa Clara, CA USA August 2009 2 Thursday, August 6, 2009 Why ONFi ? . NAND was the only commodity memory with no standard interface . The Open NAND Flash Interface (ONFi) Workgroup was formed in May 2006 to drive standardization for the raw NAND Flash interface . ONFi has been busy… Santa Clara, CA USA August 2009 3 Thursday, August 6, 2009 Why ONFi ? . NAND was the only commodity memory with no standard interface . The Open NAND Flash Interface (ONFi) Workgroup was formed in May 2006 to drive standardization for the raw NAND Flash interface . ONFi has been busy… ONFi 1.0 (Dec ’06) Defined a standard electrical and protocol interface for NAND, including the base command set. Santa Clara, CA USA August 2009 3 Thursday, August 6, 2009 Why ONFi ? . NAND was the only commodity memory with no standard interface . The Open NAND Flash Interface (ONFi) Workgroup was formed in May 2006 to drive standardization for the raw NAND Flash interface . ONFi has been busy… ONFi 1.0 (Dec ’06) (Jul ’07) DefinedBlock a standard Abstracted electrical and protocol NAND interface for NAND,1.0 includingDefined the a managed base command NAND set.solution that utilizes the raw NAND interface. Santa Clara, CA USA August 2009 3 Thursday, August 6, 2009 Why ONFi ? . NAND was the only commodity memory with no standard interface . The Open NAND Flash Interface (ONFi) Workgroup was formed in May 2006 to drive standardization for the raw NAND Flash interface .