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F20325 Technology Trend: NAND & Emerging Memory

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F20325 Technology Trend: NAND & Emerging Memory C-9 / FLASH Technology Track F20325 Technology Trend: NAND & Emerging Memory Jeongdong Choe Ph. D. Senior Technical Fellow TechInsights Santa Clara, CA November 2020 Contents ❑ 3D NAND FLASH Technology Roadmap ❑ 3D NAND FLASH Technology ▪ Samsung, Micron, Intel, KIOXIA, Western Digital, SK Hynix, YMTC ▪ Process, Design, Engineering: Trend & Comparison ❑ Emerging Memory & Embedded Memory Technology Roadmap ❑ MRAM: Everspin, Samsung/Sony, Avalanche ❑ eFLASH, eDRAM Santa Clara, CA 2 November 2020 3D NAND FLASH Technology Roadmap ✓ 3D NAND N+1 16XL (COP) Samsung: 16XL or 192L KIOXIA: 112L SK Hynix: 176L Micron: 128L (CTF) Intel: 144L (FG) YMTC: 128L ✓ Fast NVM Samsung: Z-NAND KIOXIA: XL-FLASH Micron: XPoint X100 Intel: Optane XPoint2 (DCPMM200) Ver. 2020-V7 TechInsights Jeongdong Choe Santa Clara, CA 3 November 2020 NAND FLASH Components: iPhone, Galaxy Ver. 2020-V6 TechInsights Jeongdong Choe Santa Clara, CA 4 November 2020 3D NAND FLASH Components: China Phones Santa Clara, CA 5 November 2020 No More 2D NAND Devices? ❑ 2D NAND Today 1 mm Samsung N1z 14nm 2D NAND Ver. 2020-V2 TechInsights Jeongdong Choe Santa Clara, CA 6 November 2020 3D NAND Architecture Ver. 2020-V5 TechInsights Jeongdong Choe Santa Clara, CA 7 November 2020 3D NAND Building Santa Clara, CA 8 November 2020 3D NAND Bit Density Trend Ver. 2020-V6 TechInsights Jeongdong Choe SK Hynix Santa Clara, CA 9 November 2020 3D NAND Expectation in Future (IRDS) Ver. 2020-V3 TechInsights Jeongdong Choe Santa Clara, CA 10 November 2020 3D NAND Bit Cost Ver. 2020-V3 TechInsights Jeongdong Choe Santa Clara, CA 11 November 2020 3D NAND Cell Architecture YMTC 64L BEOL NAND Array Ver. 2020-V3 Periphery TechInsights Jeongdong Choe Santa Clara, CA 12 November 2020 3D NAND Architecture: CuA, PUC, Xtacking Ver. 2020-V4 TechInsights Jeongdong Choe Santa Clara, CA 13 November 2020 3D NAND Engineering Trend: Tech. Node Ver. 2020-V4 TechInsights Jeongdong Choe Santa Clara, CA 14 November 2020 3D NAND Engineering Trend: Area Efficiency Ver. 2020-V5 TechInsights Jeongdong Choe Santa Clara, CA 15 November 2020 3D NAND Engineering Trend: Si Channel Thickness Santa Clara, CA 16 November 2020 3D NAND Architecture: SK Hynix Ver. 2020-V2 TechInsights Jeongdong Choe Santa Clara, CA 17 November 2020 YMTC 3D NAND Application Ver. 2020-V3 TechInsights Jeongdong Choe Gloway YCT512GS3-S7 YMTC SC001 UNIC Security USB Pro SSD 512GB SSD 1TB Intel 64L YMTC PC005 SSD 512GB YMTC 32L YMTC 64L Intel 64L Santa Clara, CA 18 November 2020 3D NAND Architecture: YMTC Xtacking Ver. 2020-V2 TechInsights Jeongdong Choe Santa Clara, CA 19 November 2020 3D NAND Architecture: Deck Interface Santa Clara, CA 20 November 2020 Emerging Memory Technology/Product Roadmap Ver. 2020-V4 TechInsights Jeongdong Choe Santa Clara, CA 21 November 2020 Emerging Memory: Everspin MRAM Technology ❑ Everspin MRAM Structure ❑ 3rd Gen. STT-MRAM: p-MTJ Ver. 2020-V2 TechInsights Jeongdong Choe Santa Clara, CA 22 November 2020 Emerging Memory: Samsung MRAM Technology Ver. 2020-V4 TechInsights Jeongdong Choe Santa Clara, CA 23 November 2020 Emerging Memory: Avalanche Technology ❑ Example Product Renesas M3008204 IC 8Mb (1M x 8) SPI Quad I/O QPI 54MHz 8-DFN (5x6) Santa Clara, CA Die Markings Die Image (Top-M) Die Image (Bpoly) 24 November 2020 eFLASH: TSMC, UMC ❑ TSMC eFLASH ✓ Ex.: Appollo2 MCU 2nd generation ✓ The AQM-Apollo_11 die ✓ 40 nm ULP CMOS process ✓ WL, CG, FG, EG ❑ UMC eFLASH ✓ Ex.: Microsemi PolarFire MPF300T Mid-Range FPGA ✓ 28 nm LP eFLASH ✓ 2T-cell SONOS with CSL ✓ CG + SG, SONOS used ✓ ONO with 4nm/4nm/4nm thickness Santa Clara, CA 25 November 2020 eDRAM Technology: IBM, Intel Santa Clara, CA 26 November 2020 Thank You! Everything You Need To Know For Success Santa Clara, CA November 2020 27.
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