C-9 / FLASH Technology Track F20325 Technology Trend: NAND & Emerging Memory
Jeongdong Choe Ph. D. Senior Technical Fellow TechInsights
Santa Clara, CA November 2020 Contents
❑ 3D NAND FLASH Technology Roadmap ❑ 3D NAND FLASH Technology ▪ Samsung, Micron, Intel, KIOXIA, Western Digital, SK Hynix, YMTC ▪ Process, Design, Engineering: Trend & Comparison ❑ Emerging Memory & Embedded Memory Technology Roadmap ❑ MRAM: Everspin, Samsung/Sony, Avalanche ❑ eFLASH, eDRAM
Santa Clara, CA 2 November 2020 3D NAND FLASH Technology Roadmap
✓ 3D NAND N+1 16XL (COP) Samsung: 16XL or 192L KIOXIA: 112L SK Hynix: 176L Micron: 128L (CTF) Intel: 144L (FG) YMTC: 128L
✓ Fast NVM Samsung: Z-NAND KIOXIA: XL-FLASH Micron: XPoint X100 Intel: Optane XPoint2 (DCPMM200)
Ver. 2020-V7 TechInsights Jeongdong Choe
Santa Clara, CA 3 November 2020 NAND FLASH Components: iPhone, Galaxy
Ver. 2020-V6 TechInsights Jeongdong Choe
Santa Clara, CA 4 November 2020 3D NAND FLASH Components: China Phones
Santa Clara, CA 5 November 2020 No More 2D NAND Devices?
❑ 2D NAND Today
1 mm Samsung N1z 14nm 2D NAND
Ver. 2020-V2 TechInsights Jeongdong Choe
Santa Clara, CA 6 November 2020 3D NAND Architecture
Ver. 2020-V5 TechInsights Jeongdong Choe
Santa Clara, CA 7 November 2020 3D NAND Building
Santa Clara, CA 8 November 2020 3D NAND Bit Density Trend
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SK Hynix
Santa Clara, CA 9 November 2020 3D NAND Expectation in Future (IRDS)
Ver. 2020-V3 TechInsights Jeongdong Choe
Santa Clara, CA 10 November 2020 3D NAND Bit Cost
Ver. 2020-V3 TechInsights Jeongdong Choe
Santa Clara, CA 11 November 2020 3D NAND Cell Architecture
YMTC 64L
BEOL
NAND Array
Ver. 2020-V3 Periphery TechInsights Jeongdong Choe
Santa Clara, CA 12 November 2020 3D NAND Architecture: CuA, PUC, Xtacking
Ver. 2020-V4 TechInsights Jeongdong Choe
Santa Clara, CA 13 November 2020 3D NAND Engineering Trend: Tech. Node
Ver. 2020-V4 TechInsights Jeongdong Choe
Santa Clara, CA 14 November 2020 3D NAND Engineering Trend: Area Efficiency
Ver. 2020-V5 TechInsights Jeongdong Choe
Santa Clara, CA 15 November 2020 3D NAND Engineering Trend: Si Channel Thickness
Santa Clara, CA 16 November 2020 3D NAND Architecture: SK Hynix
Ver. 2020-V2 TechInsights Jeongdong Choe
Santa Clara, CA 17 November 2020 YMTC 3D NAND Application
Ver. 2020-V3 TechInsights Jeongdong Choe Gloway YCT512GS3-S7 YMTC SC001 UNIC Security USB Pro SSD 512GB SSD 1TB
Intel 64L YMTC PC005 SSD 512GB
YMTC 32L YMTC 64L Intel 64L
Santa Clara, CA 18 November 2020 3D NAND Architecture: YMTC Xtacking
Ver. 2020-V2 TechInsights Jeongdong Choe
Santa Clara, CA 19 November 2020 3D NAND Architecture: Deck Interface
Santa Clara, CA 20 November 2020 Emerging Memory Technology/Product Roadmap
Ver. 2020-V4 TechInsights Jeongdong Choe
Santa Clara, CA 21 November 2020 Emerging Memory: Everspin MRAM Technology
❑ Everspin MRAM Structure ❑ 3rd Gen. STT-MRAM: p-MTJ
Ver. 2020-V2 TechInsights Jeongdong Choe
Santa Clara, CA 22 November 2020 Emerging Memory: Samsung MRAM Technology
Ver. 2020-V4 TechInsights Jeongdong Choe
Santa Clara, CA 23 November 2020 Emerging Memory: Avalanche Technology
❑ Example Product
Renesas M3008204 IC 8Mb (1M x 8) SPI Quad I/O QPI 54MHz 8-DFN (5x6)
Santa Clara, CA Die Markings Die Image (Top-M) Die Image (Bpoly) 24 November 2020 eFLASH: TSMC, UMC
❑ TSMC eFLASH
✓ Ex.: Appollo2 MCU 2nd generation ✓ The AQM-Apollo_11 die ✓ 40 nm ULP CMOS process ✓ WL, CG, FG, EG
❑ UMC eFLASH
✓ Ex.: Microsemi PolarFire MPF300T Mid-Range FPGA ✓ 28 nm LP eFLASH ✓ 2T-cell SONOS with CSL ✓ CG + SG, SONOS used ✓ ONO with 4nm/4nm/4nm thickness
Santa Clara, CA 25 November 2020 eDRAM Technology: IBM, Intel
Santa Clara, CA 26 November 2020 Thank You!
Everything You Need To Know For Success Santa Clara, CA November 2020 27