C-9 / FLASH Technology Track F20325 Technology Trend: NAND & Emerging Memory

Jeongdong Choe Ph. D. Senior Technical Fellow TechInsights

Santa Clara, CA November 2020 Contents

❑ 3D NAND FLASH Technology Roadmap ❑ 3D NAND FLASH Technology ▪ Samsung, Micron, , , , SK Hynix, YMTC ▪ Process, Design, Engineering: Trend & Comparison ❑ Emerging Memory & Embedded Memory Technology Roadmap ❑ MRAM: Everspin, Samsung/, Avalanche ❑ eFLASH, eDRAM

Santa Clara, CA 2 November 2020 3D NAND FLASH Technology Roadmap

✓ 3D NAND N+1 16XL (COP) Samsung: 16XL or 192L KIOXIA: 112L SK Hynix: 176L Micron: 128L (CTF) Intel: 144L (FG) YMTC: 128L

✓ Fast NVM Samsung: Z-NAND KIOXIA: XL-FLASH Micron: XPoint X100 Intel: Optane XPoint2 (DCPMM200)

Ver. 2020-V7 TechInsights Jeongdong Choe

Santa Clara, CA 3 November 2020 NAND FLASH Components: iPhone, Galaxy

Ver. 2020-V6 TechInsights Jeongdong Choe

Santa Clara, CA 4 November 2020 3D NAND FLASH Components: China Phones

Santa Clara, CA 5 November 2020 No More 2D NAND Devices?

❑ 2D NAND Today

1 mm Samsung N1z 14nm 2D NAND

Ver. 2020-V2 TechInsights Jeongdong Choe

Santa Clara, CA 6 November 2020 3D NAND Architecture

Ver. 2020-V5 TechInsights Jeongdong Choe

Santa Clara, CA 7 November 2020 3D NAND Building

Santa Clara, CA 8 November 2020 3D NAND Bit Density Trend

Ver. 2020-V6 TechInsights Jeongdong Choe

SK Hynix

Santa Clara, CA 9 November 2020 3D NAND Expectation in Future (IRDS)

Ver. 2020-V3 TechInsights Jeongdong Choe

Santa Clara, CA 10 November 2020 3D NAND Bit Cost

Ver. 2020-V3 TechInsights Jeongdong Choe

Santa Clara, CA 11 November 2020 3D NAND Cell Architecture

YMTC 64L

BEOL

NAND Array

Ver. 2020-V3 Periphery TechInsights Jeongdong Choe

Santa Clara, CA 12 November 2020 3D NAND Architecture: CuA, PUC, Xtacking

Ver. 2020-V4 TechInsights Jeongdong Choe

Santa Clara, CA 13 November 2020 3D NAND Engineering Trend: Tech. Node

Ver. 2020-V4 TechInsights Jeongdong Choe

Santa Clara, CA 14 November 2020 3D NAND Engineering Trend: Area Efficiency

Ver. 2020-V5 TechInsights Jeongdong Choe

Santa Clara, CA 15 November 2020 3D NAND Engineering Trend: Si Channel Thickness

Santa Clara, CA 16 November 2020 3D NAND Architecture: SK Hynix

Ver. 2020-V2 TechInsights Jeongdong Choe

Santa Clara, CA 17 November 2020 YMTC 3D NAND Application

Ver. 2020-V3 TechInsights Jeongdong Choe Gloway YCT512GS3-S7 YMTC SC001 UNIC Security USB Pro SSD 512GB SSD 1TB

Intel 64L YMTC PC005 SSD 512GB

YMTC 32L YMTC 64L Intel 64L

Santa Clara, CA 18 November 2020 3D NAND Architecture: YMTC Xtacking

Ver. 2020-V2 TechInsights Jeongdong Choe

Santa Clara, CA 19 November 2020 3D NAND Architecture: Deck Interface

Santa Clara, CA 20 November 2020 Emerging Memory Technology/Product Roadmap

Ver. 2020-V4 TechInsights Jeongdong Choe

Santa Clara, CA 21 November 2020 Emerging Memory: Everspin MRAM Technology

❑ Everspin MRAM Structure ❑ 3rd Gen. STT-MRAM: p-MTJ

Ver. 2020-V2 TechInsights Jeongdong Choe

Santa Clara, CA 22 November 2020 Emerging Memory: Samsung MRAM Technology

Ver. 2020-V4 TechInsights Jeongdong Choe

Santa Clara, CA 23 November 2020 Emerging Memory: Avalanche Technology

❑ Example Product

Renesas M3008204 IC 8Mb (1M x 8) SPI Quad I/O QPI 54MHz 8-DFN (5x6)

Santa Clara, CA Die Markings Die Image (Top-M) Die Image (Bpoly) 24 November 2020 eFLASH: TSMC, UMC

❑ TSMC eFLASH

✓ Ex.: Appollo2 MCU 2nd generation ✓ The AQM-Apollo_11 die ✓ 40 nm ULP CMOS process ✓ WL, CG, FG, EG

❑ UMC eFLASH

✓ Ex.: Microsemi PolarFire MPF300T Mid-Range FPGA ✓ 28 nm LP eFLASH ✓ 2T-cell SONOS with CSL ✓ CG + SG, SONOS used ✓ ONO with 4nm/4nm/4nm thickness

Santa Clara, CA 25 November 2020 eDRAM Technology: IBM, Intel

Santa Clara, CA 26 November 2020 Thank You!

Everything You Need To Know For Success Santa Clara, CA November 2020 27