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Thermo-Mechanical Solutions in Electronic Packaging

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Thermo-Mechanical Solutions in Electronic Packaging THERMO-MECHANICAL SOLUTIONS IN ELECTRONIC PACKAGING: COMPONENT TO SYSTEM LEVEL by AALOK TRIVEDI Presented to the Faculty of the Graduate School of The University of Texas at Arlington in Partial Fulfillment of the Requirements for the Degree of MASTER OF SCIENCE IN MECHANICAL ENGINEERING THE UNIVERSITY OF TEXAS AT ARLINGTON August 2008 Copyright © by Aalok Trivedi 2008 All Rights Reserved This thesis is dedicated to my parents for their support and blessings ACKNOWLEDGEMENTS I express my sincere gratitude and appreciation to my graduate advisor Prof. Dereje Agonafer for his constant guidance, support and encouragement. I would like to acknowledge my industrial advisor, Dr. Gamal Refai-Ahmed, AMD Inc., for his expert guidance in addressing current industry issues. I also would like to thank Dr. Haji-Sheikh and Dr. Seiichi Nomura, for their time to be on my supervising committee. I am grateful to Henry Wong, for giving me an opportunity to work at Motorola Inc., Tempe, AZ, during Summer 2007, allowing me real time industry exposure. I extend thanks to my colleagues at Motorola, He Junru and late David Chau for their constant input during my stay there. Also off late, I had got into a close working relationship with CommScope Inc., Richardson, TX, and would like to thank Mark Hendrix for providing me with the opportunity and support. I also would like to thank Deepak Sivanandan, Nick Shliker and all my colleagues at CommScope for believing in me and helping me out in my day to day activities. I would like to thank my EMNSPC team mates who always have been supporting and helpful. My sincere thanks to Dr. Abhijit Kaisare and Nikhil Lakhkar for getting me grounded and going. Thanks to Ms. Sally Thompson for arranging things, may it be last minute arrangements. My roommates and friends, past and present have always been a great pleasure, non-ending support and fun to be with. July 10, 2008 iv ABSTRACT THERMO-MECHANICAL SOLUTIONS IN ELECTRONIC PACKAGING: FIRST TO SYSTEM LEVEL Aalok Trivedi, M.S. The University of Texas at Arlington, 2008 Supervising Professor: Dereje Agonafer Since the advent of the transistor and integrated circuit, the performance of electronic equipment has increased significantly while footprint of systems at all levels continues to decrease. Recently, the number of transistors on a high end microprocessor has exceeded a billion. All of the above has necessitated considerable improvement in cooling technology and associated reliability. In this era of high heat fluxes, air cooling still remains the primary cooling solution mainly due to its cost and ease of installation and operation. The primary goal of a good thermal design is to ensure that the chip can function at its rated frequency or speed while maintaining the junction temperature within the specified limit. With the focus on good thermal design, mechanical reliability related issues due to the weight of the heat sink on stresses induced on different components of the package also needs to be considered. With all this thermo-mechanical design going into at the first and the second level of the electronics design, leads to a system level problem. Owing to time-to-market requirements, CFD analysis allows to complete thermal optimization long before the product test can be made available bringing v about financial benefits and timely engineering support during product development. In this study, the development of a heat sink tester, analysis of effect of weight of heat sink assembly on mechanical reliability of WB-PBGA package, followed by a system level thermal solution for a telecommunication cabinet is presented. Part-1 of the thesis focuses on a component level problem, “Experimental and Computational Characterization of a Heat Sink Tester”. Use of heat sinks as a thermal solution is well documented in the literature. Previous work exists where uncertainty in heat transfer coefficient for the heat sink tester is calculated by detailed uncertainty analysis based on Monte- Carlo simulations [7]. In this study, the objective is to characterize a heat sink tester experimentally and computationally to see how these results correlate. Experimental characterization for commercially available heat sinks is done according to JEDEC JESD 16.1 [23] standards and is compared against the vendor specifications and computational results. To obtain computational results, a CFD tool IcepakTM is used to carry out the thermal analysis. The results thus obtained from experimental characterization, computational analysis and vendor specifications are used for benchmarking the heat sink tester. Part-2 of the thesis addresses a package level mechanical reliability issue, “Effect of Weight of Heat Sink Assembly on Mechanical Reliability of a WB-PBGA package”. In this study, a stress analysis of described package is carried out to study the effect of weight of heat sink assembly on the mechanical reliability of the package. A three dimensional finite element model of WB-PBGA package and Printed Wiring Board (PWB) is solved numerically to predict the stresses induced and assess their impact on the mechanical integrity on different components of the package, which is accomplished by using a commercial analysis tool ANSYSTM. Die and C4 interconnect stresses are examined to evaluate package reliability. Stresses induced within the die and C4 interconnect are examined for different heat sink materials and variation of force developed by different heat sink attachments such as clip-on and screw-on types. Finally vi recommendations are made regarding choice of heat sink material and clip force for overall heat sink assembly design. Finally, part-3 of this study presents thermal solution to a system level problem, “Compact Modeling of a Telecommunication Cabinet”. The objective of this study is to present an overview of techniques to minimize the computational time for complex designs such as heat exchangers used in telecommunication cabinets. The discussion herein presents the concepts which lead to developing a compact model of the heat exchanger, reducing the mesh count and thereby the computation time, without compromising the acceptability of the results. Compact modeling, selective meshing, and replacing sub-components with simplified equivalent models all help reduce the overall model size. The model thus developed is compared to a benchmark case without the compact model. Given that the validity of compact models is not generalized, it is expected that this methodology can address this particular class of problems in telecommunications systems. The CFD code FLOTHERMTM by Flomerics is used to carry out the analysis. vii TABLE OF CONTENTS ACKNOWLEDGEMENTS………………………………………………………………………. iv ABSTRACT………………………………………………………………………………………. v TABLE OF CONTENTS………………………………………………………………………… viii LIST OF ILLUSTRATIONS……………………………………………………………………. xii LIST OF TABLES………………………………………………………………………………... xv NOMENCLATURE………………………………………………………………………………. xvi Chapter Page 1. INTRODUCTION…………..………………………………………..………... 1 1.1 What is Electronic Packaging?..………………………………………… 1 1.2 Why Electronic Packaging?..……….…………………………………… 1 1.3 Packaging Levels…………………………………………………………. 3 1.4 Power Trends in Electronics…………....………………………………. 4 1.5 Thermal Management………………………………………………….... 6 1.5.1 First Level Package Cooling……………………………..…. 7 1.5.2 Second Level Package Cooling…………………………..… 7 1.5.3 Third or System Level Package Cooling………………….. 7 1.6 Mechanical Integrity of the Package…..………………………………… 8 1.7 Computational Fluid Dynamics in Electronic Packaging……………… 8 PART-1 EXPERIMENTAL AND COMPUTATIONAL CHARACTERIZATION OF A HEAT SINK TESTER 2. INTRODUCTION………………..………………………………………………… 11 2.1 Background…………………………….………………………………… 11 viii 2.2 Thermal Management……………..……………………………………… 12 2.3 Research Overview………….…………………………………………… 12 3. COMPUTATIONAL MODEL………..………………………………………………. 15 3.1 Computational Model Description………………………………………. 15 3.2 Icepak Modeling…..……………………………………………………… 16 3.3 Meshing……………………………….…………………………………… 17 4. EXPERIMENTAL VALIDATION………………………………………..………... 19 4.1 Airflow Chamber Configuration………………………………………… 19 4.2 Test Setup…………………....……….…………………………………… 20 4.3 Experimental Test Procedure……………………………………………. 20 4.4 Commercial Heat Sinks Tested...……………...………………………. 21 4.5 Calculations…………………………………………………………..…... 22 5. RESULTS AND DISCUSSIONS…………………………………….……………. 23 5.1 Area Effect on Heat Transfer….………………………………………… 23 5.2 Experimental Results……....……….…………………………………… 24 5.3 Computational and Experimental Results Validation………………… 26 5.4 Inferences……………………………………………...…………………. 27 6. CONCLUSION……………………..………………………………….……………. 29 PART-2 EFFECT OF WEIGHT OF HEATSINK ASSEMBLY ON MECHANICAL RELIABILITY OF A WIRE BONDED PLASTIC BALL GRID ARRAY PACAKGE 7. INTRODUCTION………………..…………………………………………………. 31 7.1 Background…………………………….…………………………………. 31 7.2 Research Overview…..……………….…………………………………. 32 7.3 Package Description….……………….…………………………………. 33 8. COMPUTATIONAL MODEL………..………………………………………………. 35 8.1 Modeling Methodology…………..………………………………………. 35 ix 8.2 Heat Sink Assembly……………………………………………………… 38 8.2.1 Heat Sink Weight………………………………………….….. 38 8.2.2 Heat Sink Mounting Techniques…………………….……… 39 8.2.2.1 Clip-on Type…………...………………….……… 39 8.2.2.2 Screw-on Type…………...………………….……… 40 8.3 Meshing……………………………….…………………………………… 41 9. RESULTS AND DISCUSSIONS………………………………………..………... 42 10. SUMMARY AND CONCLUSION….……………………………….……………. 49 PART-3 COMPACT MODELING OF A TELECOMMUNICATION CABINET 11. INTRODUCTION………………..…………………………………………………. 52 11.1 Introduction…………………………….………………………………….
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