Basic Electronics Semiconductor —I
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LSK489 Application Note
LSK489 Application Note Low Noise Dual Monolithic JFET Bob Cordell Introduction For circuits designed to work with high impedance sources, ranging from electrometers to microphone preamplifiers, the use of a low-noise, high-impedance device between the input and the op amp is needed in order to optimize performance. At first glance, one of Linear Systems’ most popular parts, the LSK389 ultra-low-noise dual JFET would appear to be a good choice for such an application. The part’s high input impedance (1 T Ω) and low noise (1 nV/ √Hz at 1kHz and 2mA drain current) enables power transfer while adding almost no noise to the signal. But further examination of the LSK389’s specification shows an input capacitance of over 20pF. This will cause intermodulation distortion as the circuit’s input signal increases in frequency if the source impedance is high. This is because the JFET junction capacitances are nonlinear. This will be especially the case where common source amplifier arrangements allow the Miller effect to multiply the effective value of the gate-drain capacitance. Further, the LSK389’s input impedance will fall to a lower value as the frequency increases relative to a part with lower input capacitance. A better design choice is Linear Systems’ new offering, the LSK489. Though the LSK489 has slightly higher noise (1.5 nV/ √Hz vs. 1.0 nV/ √Hz) its much lower input capacitance of only 4pF means that it will maintain its high input impedance as the frequency of the input signal rises. More importantly, using the lower-capacitance LSK489 will create a circuit that is much less susceptible to intermodulation distortion than one using the LSK389. -
Non-Equilibrium Carrier Concentrations
ECE 531 Semiconductor Devices Lecture Notes { 06 Dr. Andre Zeumault Outline 1 Overview 1 2 Revisiting Equilibrium Considerations1 2.1 What is Meant by Thermal Equilibrium?........................1 2.2 Non-Equilibrium Carrier Concentrations.........................3 3 Recombination and Generation3 3.1 Generation.........................................3 4 Continuity Equations5 4.1 Minority Carrier Diffusion Equations...........................5 5 Quasi-Fermi Levels8 1 Overview So far, we have only discussed charge carrier concentrations under equilibrium conditions. Since no current can flow in thermal equilibrium, this particular case isn't much interest to us in trying to create electronic devices. Therefore, in this lecture, we discuss the situations and governing equations in which a charge carrier responds under non-equilibrium conditions. Topics to be covered include: • Recombination and Generation: An increase (generation) or decrease (recombination) in charge carrier concentrations away from or towards equilibrium. (e.g. due to absorption of light) • Current Continuity: Charge conservation, applied in the context of drift/diffusion. • Minority Carrier Diffusion Equations: Minority carrier diffusion in the presence of a large majority carrier concentration. • Quasi-Fermi Levels: Treating carrier densities under non-equilibrium conditions. 2 Revisiting Equilibrium Considerations 2.1 What is Meant by Thermal Equilibrium? When we discussed equilibrium charge carrier concentrations, it was argued that the production of charge carriers was thermally activated. This was shown to be true regardless of whether or not the semiconductor was intrinsic or extrinsic. When a semiconductor is intrinsic, the thermal energy necessary for charge carrier production is the bandgap energy EG, which corresponds to the energy needed to break a Silicon-Silicon covalent bond. -
PN Junction Is the Most Fundamental Semiconductor Device
Fundamentals of Microelectronics CH1 Why Microelectronics? CH2 Basic Physics of Semiconductors CH3 Diode Circuits CH4 Physics of Bipolar Transistors CH5 Bipolar Amplifiers CH6 Physics of MOS Transistors CH7 CMOS Amplifiers CH8 Operational Amplifier As A Black Box 1 Chapter 2 Basic Physics of Semiconductors 2.1 Semiconductor materials and their properties 2.2 PN-junction diodes 2.3 Reverse Breakdown 2 Semiconductor Physics Semiconductor devices serve as heart of microelectronics. PN junction is the most fundamental semiconductor device. CH2 Basic Physics of Semiconductors 3 Charge Carriers in Semiconductor To understand PN junction’s IV characteristics, it is important to understand charge carriers’ behavior in solids, how to modify carrier densities, and different mechanisms of charge flow. CH2 Basic Physics of Semiconductors 4 Periodic Table This abridged table contains elements with three to five valence electrons, with Si being the most important. CH2 Basic Physics of Semiconductors 5 Silicon Si has four valence electrons. Therefore, it can form covalent bonds with four of its neighbors. When temperature goes up, electrons in the covalent bond can become free. CH2 Basic Physics of Semiconductors 6 Electron-Hole Pair Interaction With free electrons breaking off covalent bonds, holes are generated. Holes can be filled by absorbing other free electrons, so effectively there is a flow of charge carriers. CH2 Basic Physics of Semiconductors 7 Free Electron Density at a Given Temperature E n 5.21015T 3/ 2 exp g electrons/ cm3 i 2kT 0 10 3 ni (T 300 K) 1.0810 electrons/ cm 0 15 3 ni (T 600 K) 1.5410 electrons/ cm Eg, or bandgap energy determines how much effort is needed to break off an electron from its covalent bond. -
Chapter 7: AC Transistor Amplifiers
Chapter 7: Transistors, part 2 Chapter 7: AC Transistor Amplifiers The transistor amplifiers that we studied in the last chapter have some serious problems for use in AC signals. Their most serious shortcoming is that there is a “dead region” where small signals do not turn on the transistor. So, if your signal is smaller than 0.6 V, or if it is negative, the transistor does not conduct and the amplifier does not work. Design goals for an AC amplifier Before moving on to making a better AC amplifier, let’s define some useful terms. We define the output range to be the range of possible output voltages. We refer to the maximum and minimum output voltages as the rail voltages and the output swing is the difference between the rail voltages. The input range is the range of input voltages that produce outputs which are not at either rail voltage. Our goal in designing an AC amplifier is to get an input range and output range which is symmetric around zero and ensure that there is not a dead region. To do this we need make sure that the transistor is in conduction for all of our input range. How does this work? We do it by adding an offset voltage to the input to make sure the voltage presented to the transistor’s base with no input signal, the resting or quiescent voltage , is well above ground. In lab 6, the function generator provided the offset, in this chapter we will show how to design an amplifier which provides its own offset. -
A GUIDE to USING FETS for SENSOR APPLICATIONS by Ron Quan
Three Decades of Quality Through Innovation A GUIDE TO USING FETS FOR SENSOR APPLICATIONS By Ron Quan Linear Integrated Systems • 4042 Clipper Court • Fremont, CA 94538 • Tel: 510 490-9160 • Fax: 510 353-0261 • Email: [email protected] A GUIDE TO USING FETS FOR SENSOR APPLICATIONS many discrete FETs have input capacitances of less than 5 pF. Also, there are few low noise FET input op amps Linear Systems that have equivalent input noise voltages density of less provides a variety of FETs (Field Effect Transistors) than 4 nV/ 퐻푧. However, there are a number of suitable for use in low noise amplifier applications for discrete FETs rated at ≤ 2 nV/ 퐻푧 in terms of equivalent photo diodes, accelerometers, transducers, and other Input noise voltage density. types of sensors. For those op amps that are rated as low noise, normally In particular, low noise JFETs exhibit low input gate the input stages use bipolar transistors that generate currents that are desirable when working with high much greater noise currents at the input terminals than impedance devices at the input or with high value FETs. These noise currents flowing into high impedances feedback resistors (e.g., ≥1MΩ). Operational amplifiers form added (random) noise voltages that are often (op amps) with bipolar transistor input stages have much greater than the equivalent input noise. much higher input noise currents than FETs. One advantage of using discrete FETs is that an op amp In general, many op amps have a combination of higher that is not rated as low noise in terms of input current noise and input capacitance when compared to some can be converted into an amplifier with low input discrete FETs. -
Junction Field Effect Transistor (JFET)
Junction Field Effect Transistor (JFET) The single channel junction field-effect transistor (JFET) is probably the simplest transistor available. As shown in the schematics below (Figure 6.13 in your text) for the n-channel JFET (left) and the p-channel JFET (right), these devices are simply an area of doped silicon with two diffusions of the opposite doping. Please be aware that the schematics presented are for illustrative purposes only and are simplified versions of the actual device. Note that the material that serves as the foundation of the device defines the channel type. Like the BJT, the JFET is a three terminal device. Although there are physically two gate diffusions, they are tied together and act as a single gate terminal. The other two contacts, the drain and source, are placed at either end of the channel region. The JFET is a symmetric device (the source and drain may be interchanged), however it is useful in circuit design to designate the terminals as shown in the circuit symbols above. The operation of the JFET is based on controlling the bias on the pn junction between gate and channel (note that a single pn junction is discussed since the two gate contacts are tied together in parallel – what happens at one gate-channel pn junction is happening on the other). If a voltage is applied between the drain and source, current will flow (the conventional direction for current flow is from the terminal designated to be the gate to that which is designated as the source). The device is therefore in a normally on state. -
Chapter1: Semiconductor Diode
Chapter1: Semiconductor Diode. Electronics I Discussion Eng.Abdo Salah Theoretical Background: • The semiconductor diode is formed by doping P-type impurity in one side and N-type of impurity in another side of the semiconductor crystal forming a p-n junction as shown in the following figure. At the junction initially free charge carriers from both side recombine forming negatively c harged ions in P side of junction(an atom in P -side accept electron and be comes negatively c harged ion) and po sitive ly c harged ion on n side (an atom in n-side accepts hole i.e. donates electron and becomes positively charged ion)region. This region deplete of any type of free charge carrier is called as depletion region. Further recombination of free carrier on both side is prevented because of the depletion voltage generated due to charge carriers kept at distance by depletion (acts as a sort of insulation) layer as shown dotted in the above figure. Working principle: When voltage is not app lied acros s the diode , de pletion region for ms as shown in the above figure. When the voltage is applied be tween the two terminals of the diode (anode and cathode) two possibilities arises depending o n polarity of DC supply. [1] Forward-Bias Condition: When the +Ve terminal of the battery is connected to P-type material & -Ve terminal to N-type terminal as shown in the circuit diagram, the diode is said to be forward biased. The application of forward bias voltage will force electrons in N-type and holes in P -type material to recombine with the ions near boundary and to flow crossing junction. -
The P-N Junction (The Diode)
Lecture 18 The P-N Junction (The Diode). Today: 1. Joining p- and n-doped semiconductors. 2. Depletion and built-in voltage. 3. Current-voltage characteristics of the p-n junction. Questions you should be able to answer by the end of today’s lecture: 1. What happens when we join p-type and n-type semiconductors? 2. What is the width of the depletion region? How does it relate to the dopant concentration? 3. What is built-in voltage? How to calculate it based on dopant concentrations? How to calculate it based on Fermi levels of semiconductors forming the junction? 4. What happens when we apply voltage to the p-n junction? What is forward and reverse bias? 5. What is the current-voltage characteristic for the p-n junction diode? Why is it different from a resistor? 1 From previous lecture we remember: What happens when you join p-doped and n-doped pieces of semiconductor together? When materials are put in contact the carriers flow under driving force of diffusion until chemical potential on both sides equilibrates, which would mean that the position of the Fermi level must be the same in both p and n sides. This results in band bending: - + - + + - - Holes diffuse + Electrons diffuse The electrons will diffuse into p-type material where they will recombine with holes (fill in holes). And holes will diffuse into the n-type materials where they will recombine with electrons. 2 This means that eventually in vicinity of the junction all free carriers will be depleted leaving stripped ions behind, which would produce an electric field across the junction: The electric field results from the deviation from charge neutrality in the vicinity of the junction. -
Basic DC Motor Circuits
Basic DC Motor Circuits Living with the Lab Gerald Recktenwald Portland State University [email protected] DC Motor Learning Objectives • Explain the role of a snubber diode • Describe how PWM controls DC motor speed • Implement a transistor circuit and Arduino program for PWM control of the DC motor • Use a potentiometer as input to a program that controls fan speed LWTL: DC Motor 2 What is a snubber diode and why should I care? Simplest DC Motor Circuit Connect the motor to a DC power supply Switch open Switch closed +5V +5V I LWTL: DC Motor 4 Current continues after switch is opened Opening the switch does not immediately stop current in the motor windings. +5V – Inductive behavior of the I motor causes current to + continue to flow when the switch is opened suddenly. Charge builds up on what was the negative terminal of the motor. LWTL: DC Motor 5 Reverse current Charge build-up can cause damage +5V Reverse current surge – through the voltage supply I + Arc across the switch and discharge to ground LWTL: DC Motor 6 Motor Model Simple model of a DC motor: ❖ Windings have inductance and resistance ❖ Inductor stores electrical energy in the windings ❖ We need to provide a way to safely dissipate electrical energy when the switch is opened +5V +5V I LWTL: DC Motor 7 Flyback diode or snubber diode Adding a diode in parallel with the motor provides a path for dissipation of stored energy when the switch is opened +5V – The flyback diode allows charge to dissipate + without arcing across the switch, or without flowing back to ground through the +5V voltage supply. -
An Integrated Semiconductor Device Enabling Non-Optical Genome Sequencing
ARTICLE doi:10.1038/nature10242 An integrated semiconductor device enabling non-optical genome sequencing Jonathan M. Rothberg1, Wolfgang Hinz1, Todd M. Rearick1, Jonathan Schultz1, William Mileski1, Mel Davey1, John H. Leamon1, Kim Johnson1, Mark J. Milgrew1, Matthew Edwards1, Jeremy Hoon1, Jan F. Simons1, David Marran1, Jason W. Myers1, John F. Davidson1, Annika Branting1, John R. Nobile1, Bernard P. Puc1, David Light1, Travis A. Clark1, Martin Huber1, Jeffrey T. Branciforte1, Isaac B. Stoner1, Simon E. Cawley1, Michael Lyons1, Yutao Fu1, Nils Homer1, Marina Sedova1, Xin Miao1, Brian Reed1, Jeffrey Sabina1, Erika Feierstein1, Michelle Schorn1, Mohammad Alanjary1, Eileen Dimalanta1, Devin Dressman1, Rachel Kasinskas1, Tanya Sokolsky1, Jacqueline A. Fidanza1, Eugeni Namsaraev1, Kevin J. McKernan1, Alan Williams1, G. Thomas Roth1 & James Bustillo1 The seminal importance of DNA sequencing to the life sciences, biotechnology and medicine has driven the search for more scalable and lower-cost solutions. Here we describe a DNA sequencing technology in which scalable, low-cost semiconductor manufacturing techniques are used to make an integrated circuit able to directly perform non-optical DNA sequencing of genomes. Sequence data are obtained by directly sensing the ions produced by template-directed DNA polymerase synthesis using all-natural nucleotides on this massively parallel semiconductor-sensing device or ion chip. The ion chip contains ion-sensitive, field-effect transistor-based sensors in perfect register with 1.2 million wells, which provide confinement and allow parallel, simultaneous detection of independent sequencing reactions. Use of the most widely used technology for constructing integrated circuits, the complementary metal-oxide semiconductor (CMOS) process, allows for low-cost, large-scale production and scaling of the device to higher densities and larger array sizes. -
Multidisciplinary Design Project Engineering Dictionary Version 0.0.2
Multidisciplinary Design Project Engineering Dictionary Version 0.0.2 February 15, 2006 . DRAFT Cambridge-MIT Institute Multidisciplinary Design Project This Dictionary/Glossary of Engineering terms has been compiled to compliment the work developed as part of the Multi-disciplinary Design Project (MDP), which is a programme to develop teaching material and kits to aid the running of mechtronics projects in Universities and Schools. The project is being carried out with support from the Cambridge-MIT Institute undergraduate teaching programe. For more information about the project please visit the MDP website at http://www-mdp.eng.cam.ac.uk or contact Dr. Peter Long Prof. Alex Slocum Cambridge University Engineering Department Massachusetts Institute of Technology Trumpington Street, 77 Massachusetts Ave. Cambridge. Cambridge MA 02139-4307 CB2 1PZ. USA e-mail: [email protected] e-mail: [email protected] tel: +44 (0) 1223 332779 tel: +1 617 253 0012 For information about the CMI initiative please see Cambridge-MIT Institute website :- http://www.cambridge-mit.org CMI CMI, University of Cambridge Massachusetts Institute of Technology 10 Miller’s Yard, 77 Massachusetts Ave. Mill Lane, Cambridge MA 02139-4307 Cambridge. CB2 1RQ. USA tel: +44 (0) 1223 327207 tel. +1 617 253 7732 fax: +44 (0) 1223 765891 fax. +1 617 258 8539 . DRAFT 2 CMI-MDP Programme 1 Introduction This dictionary/glossary has not been developed as a definative work but as a useful reference book for engi- neering students to search when looking for the meaning of a word/phrase. It has been compiled from a number of existing glossaries together with a number of local additions. -
Vlsi Design Lecture Notes B.Tech (Iv Year – I Sem) (2018-19)
VLSI DESIGN LECTURE NOTES B.TECH (IV YEAR – I SEM) (2018-19) Prepared by Dr. V.M. Senthilkumar, Professor/ECE & Ms.M.Anusha, AP/ECE Department of Electronics and Communication Engineering MALLA REDDY COLLEGE OF ENGINEERING & TECHNOLOGY (Autonomous Institution – UGC, Govt. of India) Recognized under 2(f) and 12 (B) of UGC ACT 1956 (Affiliated to JNTUH, Hyderabad, Approved by AICTE - Accredited by NBA & NAAC – ‘A’ Grade - ISO 9001:2015 Certified) Maisammaguda, Dhulapally (Post Via. Kompally), Secunderabad – 500100, Telangana State, India Unit -1 IC Technologies, MOS & Bi CMOS Circuits Unit -1 IC Technologies, MOS & Bi CMOS Circuits UNIT-I IC Technologies Introduction Basic Electrical Properties of MOS and BiCMOS Circuits MOS I - V relationships DS DS PMOS MOS transistor Threshold Voltage - VT figure of NMOS merit-ω0 Transconductance-g , g ; CMOS m ds Pass transistor & NMOS Inverter, Various BiCMOS pull ups, CMOS Inverter Technologies analysis and design Bi-CMOS Inverters Unit -1 IC Technologies, MOS & Bi CMOS Circuits INTRODUCTION TO IC TECHNOLOGY The development of electronics endless with invention of vaccum tubes and associated electronic circuits. This activity termed as vaccum tube electronics, afterward the evolution of solid state devices and consequent development of integrated circuits are responsible for the present status of communication, computing and instrumentation. • The first vaccum tube diode was invented by john ambrase Fleming in 1904. • The vaccum triode was invented by lee de forest in 1906. Early developments of the Integrated Circuit (IC) go back to 1949. German engineer Werner Jacobi filed a patent for an IC like semiconductor amplifying device showing five transistors on a common substrate in a 2-stage amplifier arrangement.