Laser Processing of Materials: Fundamentals, Applications And

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Laser Processing of Materials: Fundamentals, Applications And Springer Series in materials science 139 Springer Series in materials science Editors: R. Hull C. Jagadish R.M. Osgood, Jr. J. Parisi Z. Wang H. Warlimont The Springer Series in Materials Science covers the complete spectrum of materials physics, including fundamental principles, physical properties, materials theory and design. Recognizing the increasing importance of materials science in future device technologies, the book titles in this series reflect the state-of-the-art in understanding and controlling the structure and properties of all important classes of materials. Please view available titles in Springer Series in Materials Science on series homepage http://www.springer.com/series/856 Peter Schaaf Editor Laser Processing of Materials Fundamentals, Applications and Developments With110Figures 123 Editor Professor Dr. Peter Schaaf TU Ilmenau, Institut fur¨ Werkstofftechnik undInstitutfur¨ Mikro- und Nanotechnologien Gustav-Kirchhoff-Str. 5, 98693 Ilmenau, Germany E-mail: [email protected] Series Editors: ProfessorRobertHull Professor Jurgen¨ Parisi University of Virginia Universitat¨ Oldenburg, Fachbereich Physik Dept. of Materials Science and Engineering Abt. Energie- und Halbleiterforschung Thornton Hall Carl-von-Ossietzky-Straße 9–11 Charlottesville, VA22903-2442, USA 26129 Oldenburg, Germany Professor Chennupati Jagadish Dr. Zhiming Wang Australian National University University of Arkansas Research School of Physics and Engineering Department of Physics J4-22, Carver Building 835W.DicknsonSt. Canberra ACT 0200, Australia Fayetteville, AR 72701, USA ProfessorR.M.Osgood,Jr. Professor Hans Warlimont Microelectronics Science Laboratory DSL Dresden Material-Innovation GmbH Department of Electrical Engineering Pirnaer Landstr. 176 Columbia University 01257 Dresden, Germany Seeley W. Mudd Building New York, NY 10027, USA Springer Series in Materials Science ISSN 0933-033X ISBN 978-3-642-13280-3 e-ISBN 978-3-642-13281-0 DOI 10.1007/978-3-642-13281-0 Springer Heidelberg Dordrecht London New York Library of Congress Control Number: 2010931835 © Springer-Verlag Berlin Heidelberg 2010 This work is subject to copyright. All rights are reserved, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproductiononmicrofilmorinanyotherway,andstorageindatabanks.Duplicationofthispublicationor parts thereof is permitted only under the provisions of the German Copyright Law of September 9, 1965, in its current version, and permission for use must always be obtained from Springer. Violations are liableto prosecution under the German Copyright Law. The use of general descriptive names, registered names, trademarks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. Cover design:eStudioCalamarSteinen Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Preface The most recent and most promising developments in laser materials processing are described on an graduate/scientist level. The book emphasizes the practical applications in modern materials and material applications. Laser Materials Processing has made tremendous progress and is now at the forefront of industrial and medical applications. The book describes these recent advances in smart and nanoscaled materials going well beyond the traditional cut- ting and welding applications. As no analytical methods are described, the examples are really going into the details of what nowadays is possible by employing lasers for sophisticated materials processing, giving rise to achievements not possible by conventional materials processing. All contributing authors have year long practical experience in laser materi- als processing and are working in the field at the forefront of the research and technological applications. The help of the Springer team in the creation of this book is gratefully acknowl- edged. Ilmenau Peter Schaaf May 2010 v . Contents 1 Introduction .................................................................... 1 Peter Schaaf References ....................................................................... 3 2 Basics of Lasers and Laser Optics ........................................... 5 Michelle Shinn 2.1 Introduction ............................................................... 5 2.2 Optical Processes.......................................................... 5 2.3 Time Dependence ......................................................... 8 2.3.1 Q-Switching....................................................... 8 2.3.2 Mode-Locking .................................................... 9 2.3.3 Ultrashort Pulse Generation ...................................... 9 2.3.4 Harmonic Generation ............................................. 9 2.4 Free-Electron Lasers ...................................................... 10 2.5 Laser Optics ............................................................... 12 2.5.1 Optical Propagation............................................... 13 2.5.2 Sizing Optical Elements and Other Tricks of the Trade ........ 14 2.5.3 Fiber Optics ....................................................... 14 2.5.4 Managing Diffraction............................................. 15 2.5.5 The Aspheric Lens Beamshaper ................................. 15 2.5.6 Holographic Optical Elements ................................... 16 2.5.7 Laser Damage ..................................................... 17 2.5.8 Optical Modeling Software....................................... 19 2.6 Conclusions ............................................................... 19 References ....................................................................... 19 3 Fundamentals of Laser-Material Interactions .............................. 21 Ettore Carpene, Daniel Höche, and Peter Schaaf 3.1 Basic Considerations...................................................... 21 3.2 Laser ....................................................................... 22 3.3 Heat in Solids: Electronic and Lattice Dynamics........................ 23 vii viii Contents 3.4 Laser-Material Interactions ............................................... 27 3.4.1 Single Photon and Multi-Photon Processes ..................... 27 3.4.2 Laser Reflection and Absorption ................................. 28 3.4.3 Temperature Profiles.............................................. 31 3.5 Phenomena Occurring on the Target Surface ............................ 35 3.5.1 Vaporization....................................................... 35 3.5.2 Recondensation ................................................... 36 3.5.3 Plasma Formation................................................. 37 3.5.4 Laser Supported Absorption Waves.............................. 39 3.6 Material Transport Phenomena ........................................... 42 3.7 Conclusions ............................................................... 44 References ....................................................................... 44 4 Laser–Plasma Interactions.................................................... 49 Ion N. Mihailescu and Jörg Hermann 4.1 Introduction ............................................................... 49 4.2 Fundamentals of Laser–Plasma Interaction .............................. 50 4.3 Processes in Nanosecond Laser–Plasma Interactions ................... 55 4.3.1 Laser-Induced Gas Breakdown .................................. 55 4.3.2 Plasma Shielding During Laser Material Processing ........... 59 4.3.3 Laser-Supported Absorption Waves ............................. 63 4.3.4 Plasma Shutter for Optical Limitation ........................... 66 4.4 Plasma Interactions with Femtosecond Laser Pulses.................... 69 4.4.1 Laser Beam Filamentation ....................................... 69 4.4.2 Generation of XUV Radiation by Laser Plasma ................ 75 4.4.3 Plasma Mirror ..................................................... 80 4.5 Conclusion ................................................................ 83 References ....................................................................... 84 5 Laser Ablation and Thin Film Deposition .................................. 89 Christof W. Schneider and Thomas Lippert 5.1 Pulsed Laser Ablation..................................................... 89 5.2 Lasers Used for Laser Ablation .......................................... 91 5.3 Initial Ablation Processes and Plume Formation ........................ 92 5.3.1 Femtosecond Laser Irradiation ................................... 93 5.3.2 Nanosecond Laser Irradiation .................................... 93 5.4 Plume Expansion.......................................................... 94 5.4.1 Plume Expansion in Vacuum ..................................... 94 5.4.2 Plume Expansion into a Background Gas ....................... 94 5.4.3 Imaging............................................................ 95 5.4.4 Kinetic Energy of Plume Species ................................ 97 5.4.5 Thin Film Growth................................................. 98 Contents ix 5.5 Laser Ablation of Polymers ..............................................104 5.5.1 Ablation Mechanism..............................................105 5.5.2 Polymer Film Ablation ...........................................106 5.5.3 Film Pattern Transfer .............................................107
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