AMD Opteron\231 Processor Pricing
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Titan X Amd 1.2 V4 Ig 20210319
English TITAN X_AMD 1.2 Installation Guide V4 Parts List A CPU Water Block A A-1 BPTA-CPUMS-V2-SKA ..........1 pc A-1 A-2 A-2 Backplane assembly ..............1 set B Fittings B-1 BPTA-DOTFH1622 ...............4 pcs B-2 TA-F61 ...................................2 pcs B-3 BPTA-F95 ..............................2 pcs B-4 BP-RIGOS5 ...........................2 pcs B-5 TA-F60 ..................................2 pcs B-6 TA-F40 ..................................2 pcs C Accessory C-1 Hard tube ..............................2 pcs C-2 Fitting + soft tube ....................1 pc C-3 CPU set SCM3FL20 SPRING B SCM3F6 1mm Spacer Back Pad Paste Pad Metal Backplane M3x32mm Screw B-1 B-2 B-3 B-4 B-5 B-6 C C-1 Hard Tube ※ The allowable variance in tube length is ± 2mm C-2 Fitting + soft tube Bitspower reserves the right to change the product design and interpretations. These are subject to change without notice. Product colors and accessories are based on the actual product. — 1 — I. AMD Motherboard system 54 AMD SOCKET 939 / 754 / 940 IN 48 AMD SOCKET AM4 AMD SOCKET AM3 / AM3+ AMD SOCKET AM2 / AM2+ AMD SOCKET FM1 / FM2+ Bitspower Fan and DRGB RF Remote Controller Hub (Not included) are now available at microcenter.com DRGB PIN on Motherboard or other equipment. 96 90 BPTA-RFCHUB The CPU water block has a DRGB cable, which AMD SOCKET AM4 AMD SOCKET AM3 AM3+ / AMD SOCKET AM2 AM2+ / AMD SOCKET FM1 / FM2+ can be connected to the DRGB extension cable of the radiator fans. Fan and DRGB RF Remote Motherboard Controller Hub (Not included) OUT DRGB LED Do not over-tighten the thumb screws Installation (SCM3FL20). -
System Management BIOS (SMBIOS) Reference 6 Specification
1 2 Document Number: DSP0134 3 Date: 2011-01-26 4 Version: 2.7.1 5 System Management BIOS (SMBIOS) Reference 6 Specification 7 Document Type: Specification 8 Document Status: DMTF Standard 9 Document Language: en-US 10 System Management BIOS (SMBIOS) Reference Specification DSP0134 11 Copyright Notice 12 Copyright © 2000, 2002, 2004–2011 Distributed Management Task Force, Inc. (DMTF). All rights 13 reserved. 14 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 15 management and interoperability. Members and non-members may reproduce DMTF specifications and 16 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 17 time, the particular version and release date should always be noted. 18 Implementation of certain elements of this standard or proposed standard may be subject to third party 19 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 20 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 21 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 22 inaccurate identification or disclosure of such rights, owners or claimants. DMTF shall have no liability to 23 any party, in any manner or circumstance, under any legal theory whatsoever, for failure to recognize, 24 disclose, or identify any such third party patent rights, or for such party’s reliance on the standard or 25 incorporation -
Family 12H AMD Sempron Processor Product Data Sheet
Family 12h AMD Sempron™ Processor Product Data Sheet Publication # 50321 Revision: 3.00 Issue Date: December 2011 Advanced Micro Devices © 2011 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. The information contained herein may be of a preliminary or advance nature and is subject to change without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD Arrow logo, AMD PowerNow!, 3DNow!, AMD Virtualization, AMD-V, Sempron, and combinations thereof are trademarks of Advanced Micro Devices, Inc. -
Amd Athlon Ii X2 270 Manual
Amd Athlon Ii X2 270 Manual Specifications. Please visit AMD Athlon II X2 215 (rev. C3) and AMD Athlon II X2 270 pages for more detailed specifications. Review, Differences, Benchmarks, Specifications, Comments Athlon II X2 270. CPUBoss recommends the AMD Athlon II X2 270 based on its. See full details. Specifications. Please visit AMD Athlon II X2 270 and AMD Athlon II X2 280 pages for more detailed specifications of both. Far Cry 4 on AMD Athlon x2 340(Dual Core) 4GB RAM HD 6570 PC Specifications. Specifications. Please visit AMD Athlon II X2 270 and AMD FX-6300 pages for more detailed specifications of both. AMD Athlon II x2 260 (3.2GHz) Although the specifications of this cpu list 74C as the max temp, i prefer to stick to the old "65C max" rule-of-thumb for amd cpus. Amd Athlon Ii X2 270 Manual Read/Download AMD Athlon II X2 270u. 2 GHz, Dual core. Front view of AMD Athlon II X2 270u. 5.9 Out of 10. VS Review, Differences, Benchmarks, Specifications, Comments. Photos of the AMD Athlon II X2 270 Black Edition from the KitGuru Price Comparison Engine. Specifications. Please visit AMD Athlon II X2 270 and AMD FX-4300 pages for more detailed specifications of both. SPECIFICATIONS : Model : AMD Athlon II X2 270. CPU Clock Speed : 3.4 GHz. Core : 2. Total L2 Cache : 2 MB Sockets : Socket AM2+,Socket AM3 Supported. up vote -5 down vote favorite. These are my specifications: AMD Athlon II x2 270 CPU, AMD 760g GPU, 4GB RAM. grand-theft-auto-5. -
2018 Annual Report on Form 10-K
2018 ANNUAL REPORT ON FORM 10-K MARCH 2019 DEAR SHAREHOLDERS: From the industry’s first 1GHz CPU to the world’s first GPU delivering a teraflop of computing power, AMD has always stood for pushing the boundaries of what is possible. A few years ago, we made several big bets to accelerate our pace of innovation, strengthen our execution, and enable AMD to deliver a leadership portfolio of computing and graphics processors capable of increasing our share of the $75 billion high-performance computing market. In 2018, we saw those bets begin to pay off as we delivered our second straight year of greater than 20% annual revenue growth and significantly improved our gross margin and profitability from the previous year. REVENUE GROSS MARGIN % R&D INVESTMENT EXPENSE/REVENUE % $ Billions $ Billions $6.5B 38% $1.43B 34% $5.3B 34% 33% $4.3B $1.20B 23% $1.01B 31% 2016 2017 2018 2016 2017 2018 2016 2017 2018 2016 2017 2018 Added $2.2B in revenue Significantly improved gross Increased R&D by more than Significant improvement over the last 2 years margin over last 2 years based 40% over the last 2 years in OPEX leverage on new product portfolio Our newest Ryzen™, EPYC™ and datacenter GPU products contributed more than $1.2 billion of revenue in 2018 and helped us gain share across our priority markets. In 2018, we added 3.9% points of desktop processor unit share, 5.3% points of notebook processor unit share and met our goal of exiting the year with mid-single digit server processor market share. -
I Processori Amd Trinity
UNIVERSITA’ DEGLI STUDI DI PADOVA __________________________________________________ Facoltà di Ingegneria Corso di laurea in Ingegneria Informatica I PROCESSORI AMD TRINITY Laureando Relatore Luca Marzaro Prof. Sergio Congiu ___________________________________________________________ ANNO ACCADEMICO 2012/2013 ii iii A Giulia, mamma, papà e Diego iv Indice 1. Introduzione 1 1.1 Cenni storici AMD . 1 1.2 Evoluzione del processore: dall' Am386 alle APU Trinity . 2 2. Trinity: Architettura 5 2.1 Introduzione . 5 2.2 Da Llano a Trinity: architettura Piledriver . 6 2.3 Graphics Memory Controller: architettura VLIW4 . 8 2.4 Un nuovo socket: FM2 . 12 3. Specifiche tecniche 15 3.1 Modelli e dati tecnici . 15 3.2 Comparazione con Llano e Intel core i3 . 17 4. Prestazioni 19 4.1 Introduzione . 19 4.2 Applicazioni multimediali . 22 4.3 Calcolo e compressione . 25 4.4 Consumi . 30 5. Considerazioni finali 35 vi INDICE Bibliografia 37 Capitolo 1 Introduzione 1.1 Cenni storici AMD AMD (Advanced Micro Devices) è una multinazionale americana produttrice di semiconduttori la cui sede si trova a Sunnyvale in California. La peculiarità di tale azienda è la produzione di microprocessori, workstation e server, di chip grafici e di chipset. Si classifica seconda al mondo Figura 1.1: Jerry Sanders nella produzione di microprocessori con architettuta x86 dopo Intel. Il primo maggio 1969 Jerry Sanders (vedi Figura 1.1) e sette amici fondano la AMD. Sei anni più tardi, lanciano nel mercato la prima memoria RAM marchiata AMD, la Am9102 e presentano AMD 8080, una variante dell'INTEL 8080 che lancia l'azienda nel mondo dei microprocessori. Dal 1980 AMD si impone come uno dei principali concorrenti di Intel nel mercato dei processori x86- compatibili. -
Communication Theory II
Microprocessor (COM 9323) Lecture 2: Review on Intel Family Ahmed Elnakib, PhD Assistant Professor, Mansoura University, Egypt Feb 17th, 2016 1 Text Book/References Textbook: 1. The Intel Microprocessors, Architecture, Programming and Interfacing, 8th edition, Barry B. Brey, Prentice Hall, 2009 2. Assembly Language for x86 processors, 6th edition, K. R. Irvine, Prentice Hall, 2011 References: 1. Computer Architecture: A Quantitative Approach, 5th edition, J. Hennessy, D. Patterson, Elsevier, 2012. 2. The 80x86 Family, Design, Programming and Interfacing, 3rd edition, Prentice Hall, 2002 3. The 80x86 IBM PC and Compatible Computers, Assembly Language, Design, and Interfacing, 4th edition, M.A. Mazidi and J.G. Mazidi, Prentice Hall, 2003 2 Lecture Objectives 1. Provide an overview of the various 80X86 and Pentium family members 2. Define the contents of the memory system in the personal computer 3. Convert between binary, decimal, and hexadecimal numbers 4. Differentiate and represent numeric and alphabetic information as integers, floating-point, BCD, and ASCII data 5. Understand basic computer terminology (bit, byte, data, real memory system, protected mode memory system, Windows, DOS, I/O) 3 Brief History of the Computers o1946 The first generation of Computer ENIAC (Electrical and Numerical Integrator and Calculator) was started to be used based on the vacuum tube technology, University of Pennsylvania o1970s entire CPU was put in a single chip. (1971 the first microprocessor of Intel 4004 (4-bit data bus and 2300 transistors and 45 instructions) 4 Brief History of the Computers (cont’d) oLate 1970s Intel 8080/85 appeared with 8-bit data bus and 16-bit address bus and used from traffic light controllers to homemade computers (8085: 246 instruction set, RISC*) o1981 First PC was introduced by IBM with Intel 8088 (CISC**: over 20,000 instructions) microprocessor oMotorola emerged with 6800. -
Upgrading and Repairing Pcs, 21St Edition Editor-In-Chief Greg Wiegand Copyright © 2013 by Pearson Education, Inc
Contents at a Glance Introduction 1 1 Development of the PC 5 2 PC Components, Features, and System Design 19 3 Processor Types and Specifications 29 4 Motherboards and Buses 155 5 BIOS 263 UPGRADING 6 Memory 325 7 The ATA/IDE Interface 377 AND 8 Magnetic Storage Principles 439 9 Hard Disk Storage 461 REPAIRING PCs 10 Flash and Removable Storage 507 21st Edition 11 Optical Storage 525 12 Video Hardware 609 13 Audio Hardware 679 14 External I/O Interfaces 703 15 Input Devices 739 16 Internet Connectivity 775 17 Local Area Networking 799 18 Power Supplies 845 19 Building or Upgrading Systems 929 20 PC Diagnostics, Testing, and Maintenance 975 Index 1035 Scott Mueller 800 East 96th Street, Indianapolis, Indiana 46240 Upgrading.indb i 2/15/13 10:33 AM Upgrading and Repairing PCs, 21st Edition Editor-in-Chief Greg Wiegand Copyright © 2013 by Pearson Education, Inc. Acquisitions Editor All rights reserved. No part of this book shall be reproduced, stored in a retrieval Rick Kughen system, or transmitted by any means, electronic, mechanical, photocopying, Development Editor recording, or otherwise, without written permission from the publisher. No patent Todd Brakke liability is assumed with respect to the use of the information contained herein. Managing Editor Although every precaution has been taken in the preparation of this book, the Sandra Schroeder publisher and author assume no responsibility for errors or omissions. Nor is any Project Editor liability assumed for damages resulting from the use of the information contained Mandie Frank herein. Copy Editor ISBN-13: 978-0-7897-5000-6 Sheri Cain ISBN-10: 0-7897-5000-7 Indexer Library of Congress Cataloging-in-Publication Data in on file. -
AMD FX Cpus Now Faster Than Ever—Unlocked Performance with Maximum Cores
How to Sell the New AMD FX CPUs Now Faster than Ever—Unlocked Performance with Maximum Cores Who’s it for? Gamers and Enthusiasts who want the most out of their PC. Sell it in 5 seconds. More Cores. More Speed. Unlocked1 More Cores > Up to 8 Cores > Only 8 Core Desktop Processor—2 cores more than Intel1 Maximum Speed > Up to 4.2GHz Turbo Clock Speed > Latest Technology and Worlds Highest Frequencies2 Unlocked & Overclockable > Get the Maximum Tunable Performance > Go up to 5.0 GHz with aggressive cooling solutions from AMD3 Sell it in 60 seconds. Unlocked Performance for Less Money1,4 Performance Ferocious power right out of the box. > The groundbreaking AMD FX 8-Core Processor Black Edition comes unlocked. No premium to pay. No code to input.Just unrestrained, overclocked power right away.4 > Groundbreaking technology. Epic performance. > This next-generation architecture takes 8-core processing to a new level. Test the limits to play harder and get more done. Speed The need for speed. AMD FX Processors—Unlocked and overclocked.4 > Incredible speed out of the box and more in the tank; AMD Turbo CORE Technology automatically kicks in, boosting performance to a user’s varied workload. > The sky’s the limit with this processor’s massive headroom. Go up to 5.0 GHz with aggressive cooling solutions from AMD.5 Price Price and performance that keeps getting better and more bang for your buck. Unlocked technology.4 Unbelievable pricing. > With more speed than ever and more aggressive price points – New AMD FX Processors raise the bar for 8-core computing. -
AMD's Early Processor Lines, up to the Hammer Family (Families K8
AMD’s early processor lines, up to the Hammer Family (Families K8 - K10.5h) Dezső Sima October 2018 (Ver. 1.1) Sima Dezső, 2018 AMD’s early processor lines, up to the Hammer Family (Families K8 - K10.5h) • 1. Introduction to AMD’s processor families • 2. AMD’s 32-bit x86 families • 3. Migration of 32-bit ISAs and microarchitectures to 64-bit • 4. Overview of AMD’s K8 – K10.5 (Hammer-based) families • 5. The K8 (Hammer) family • 6. The K10 Barcelona family • 7. The K10.5 Shanghai family • 8. The K10.5 Istambul family • 9. The K10.5-based Magny-Course/Lisbon family • 10. References 1. Introduction to AMD’s processor families 1. Introduction to AMD’s processor families (1) 1. Introduction to AMD’s processor families AMD’s early x86 processor history [1] AMD’s own processors Second sourced processors 1. Introduction to AMD’s processor families (2) Evolution of AMD’s early processors [2] 1. Introduction to AMD’s processor families (3) Historical remarks 1) Beyond x86 processors AMD also designed and marketed two embedded processor families; • the 2900 family of bipolar, 4-bit slice microprocessors (1975-?) used in a number of processors, such as particular DEC 11 family models, and • the 29000 family (29K family) of CMOS, 32-bit embedded microcontrollers (1987-95). In late 1995 AMD cancelled their 29K family development and transferred the related design team to the firm’s K5 effort, in order to focus on x86 processors [3]. 2) Initially, AMD designed the Am386/486 processors that were clones of Intel’s processors. -
AMD Raven Ridge
DELIVERING A NEW LEVEL OF VISUAL PERFORMANCE IN AN SOC AMD “RAVEN RIDGE” APU Dan Bouvier, Jim Gibney, Alex Branover, Sonu Arora Presented by: Dan Bouvier Corporate VP, Client Products Chief Architect AMD CONFIDENTIAL RAISING THE BAR FOR THE APU VISUAL EXPERIENCE Up to MOBILE APU GENERATIONAL 200% MORE CPU PERFORMANCE PERFORMANCE GAINS Up to 128% MORE GPU PERFORMANCE Up to 58% LESS POWER FIRST “Zen”-based APU CPU Performance GPU Performance Power HIGH-PERFORMANCE AMD Ryzen™ 7 2700U 7th Gen AMD A-Series APU On-die “Vega”-based graphics Scaled GPU Managed Improved Upgraded Increased LONG BATTERY LIFE and CPU up to power delivery memory display package Premium form factors reach target and thermal bandwidth experience performance frame rate dissipation efficiency density 2 | AMD Ryzen™ Processors with Radeon™ Vega Graphics - Hot Chips 30 | * See footnotes for details. “RAVEN RIDGE” APU AMD “ZEN” x86 CPU CORES CPU 0 “ZEN” CPU CPU 1 (4 CORE | 8 THREAD) USB 3.1 NVMe PCIe FULL PCIe GPP ----------- ----------- Discrete SYSTEM 4MB USB 2.0 SATA GFX CONNECTIVITY CPU 2 CPU 3 L3 Cache X64 DDR4 HIGH BANDWIDTH SOC FABRIC System Infinity Fabric & MEMORY Management SYSTEM Unit ACCELERATED Platform Multimedia Security MULTIMEDIA Processor Engines AMD GFX+ 1MB L2 EXPERIENCE X64 DDR4 (11 COMPUTE UNITS) Cache Video Audio Sensor INTEGRATED CU CU CU CU CU CU Display Codec ACP Fusion Controller Next SENSOR Next Hub FUSION HUB CU CU CU CU CU AMD “VEGA” GPU UPGRADED DISPLAY ENGINE 3 | AMD Ryzen™ Processors with Radeon™ Vega Graphics - Hot Chips 30 | SIGNIFICANT DENSITY INCREASE “Raven Ridge” die BGA Package: 25 x 35 x 1.38mm Technology: GLOBALFOUNDRIES 14nm – 11 layer metal Transistor count: 4.94B 59% 16% Die Size: 209.78mm2 more transistors smaller die than prior generation “Bristol Ridge” APU 4 | AMD Ryzen™ Processors with Radeon™ Vega Graphics - Hot Chips 30 | * See footnotes for details. -
SMBIOS Specification
1 2 Document Identifier: DSP0134 3 Date: 2019-10-31 4 Version: 3.4.0a 5 System Management BIOS (SMBIOS) Reference 6 Specification Information for Work-in-Progress version: IMPORTANT: This document is not a standard. It does not necessarily reflect the views of the DMTF or its members. Because this document is a Work in Progress, this document may still change, perhaps profoundly and without notice. This document is available for public review and comment until superseded. Provide any comments through the DMTF Feedback Portal: http://www.dmtf.org/standards/feedback 7 Supersedes: 3.3.0 8 Document Class: Normative 9 Document Status: Work in Progress 10 Document Language: en-US 11 System Management BIOS (SMBIOS) Reference Specification DSP0134 12 Copyright Notice 13 Copyright © 2000, 2002, 2004–2019 DMTF. All rights reserved. 14 DMTF is a not-for-profit association of industry members dedicated to promoting enterprise and systems 15 management and interoperability. Members and non-members may reproduce DMTF specifications and 16 documents, provided that correct attribution is given. As DMTF specifications may be revised from time to 17 time, the particular version and release date should always be noted. 18 Implementation of certain elements of this standard or proposed standard may be subject to third party 19 patent rights, including provisional patent rights (herein "patent rights"). DMTF makes no representations 20 to users of the standard as to the existence of such rights, and is not responsible to recognize, disclose, 21 or identify any or all such third party patent right, owners or claimants, nor for any incomplete or 22 inaccurate identification or disclosure of such rights, owners or claimants.