Stability, Causality, and Passivity in Electrical Interconnect Models Piero Triverio, Student Member, IEEE, Stefano Grivet-Talocia, Senior Member, IEEE, Michel S
This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. IEEE TRANSACTIONS ON ADVANCED PACKAGING 1 Stability, Causality, and Passivity in Electrical Interconnect Models Piero Triverio, Student Member, IEEE, Stefano Grivet-Talocia, Senior Member, IEEE, Michel S. Nakhla, Fellow, IEEE, Flavio G. Canavero, Fellow, IEEE, and Ramachandra Achar, Senior Member, IEEE Abstract—Modern packaging design requires extensive signal matrix of some electrical interconnect or the impedance of a integrity simulations in order to assess the electrical performance power/ground distribution network. This first step leads to a set of the system. The feasibility of such simulations is granted only of tabulated frequency responses of the structure under inves- when accurate and efficient models are available for all system parts and components having a significant influence on the signals. tigation. Then, a suitable identification procedure is applied to Unfortunately, model derivation is still a challenging task, despite extract a model from the above tabulated data. This second step the extensive research that has been devoted to this topic. In fact, aims at providing a simplified mathematical representation of it is a common experience that modeling or simulation tasks some- the input–output system behavior, which can be employed in a times fail, often without a clear understanding of the main reason. suitable simulation computer aided-design (CAD) environment This paper presents the fundamental properties of causality, stability, and passivity that electrical interconnect models must for system analysis, design, and prototyping. For instance, satisfy in order to be physically consistent.
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