Application NOTE > — (10µin) (10µin) (20µin) (20µin) (20µin) > 0.5µm > 0.5µm > 0.5µm > 0.25µm > 0.25µm Roughness Target Surface Form No. 98567 (A4) R1 ©2008 Indium Corporation Indium ©2008 Flatness Target / BP Better than Better than Better than Better than Better than (0.0013”/1”) Accumulative (0.0011” / 1”) (0.0011” / 1”) (0.0011” / 1”) (0.0011” / 1”) 0.011mm/10mm 0.011mm/10mm 0.011mm/10mm 0.011mm/10mm 0.013mm/10mm Better than Better than Better than Better than Better than ( 0.001”/1”) Backing Plate (BP) Flatness ( 0.001” / 1”) ( 0.001” / 1”) ( 0.001” / 1”) ( 0.001” / 1”) 0.01mm/10mm 0.01mm/10mm 0.01mm/10mm 0.01mm/10mm 0.01mm/10mm process. The standard backing plate process. The standard ® ) 2 Better than Better than Better than Better than Better than (0.0002”/1”) (0.0002”/1”) (0.0002”/1”) (0.0002”/1”) (0.0005”/1”) Target Flatness 0.002mm/10mm 0.002mm/10mm 0.002mm/10mm 0.002mm/10mm 0.005mm/10mm (0.31”) (0.31”) ≥ 8mm ≥ 8mm (0.24”) (0.43”) (0.43”) ≥ 11mm ≥ 11 mm Thickness >= 6 mm (lower limit) Backing Plate • Indium-tin oxide (ITO) • Silicon • Silicon carbide (SiC) • Silicon dioxide (SiO • Titanium carbide (TiC) • Titanium nitride (TiN) • Zinc oxide (ZnO) Target ≥ 6mm ≥ 6mm ≥ 6mm (0.24”) (0.24”) (0.24”) (0.24”) (0.24”) ≥ 6 mm Thickness >= 6 mm (lower limit) See reverse side for NanoBond of Metal Sputtering Targets ) 3 O 2 Bond Area of Ceramic & Metal Sputtering Targets Sputtering & Metal of Ceramic (upper limits)* ® 2 diam ≤ 559mm (22”) diam ≤ 559mm (22”) diam ≤ 559mm (22”) diam ≤ 559mm (22”) diam ≤ 559mm (22”) width ≤ 559mm (22”) width ≤ 559mm (22”) width ≤ 559mm (22”) width ≤ 559mm (22”) width ≤ 559mm (22”) length ≤ 1067mm (42”) length ≤ 1067mm (42”) length ≤ 1067mm (42”) length ≤ 1067mm (42”) length ≤ 1067mm (42”) Singapore, Cheongju: +65 6268 8678 Suzhou, Shenzhen, Liuzhou: +86 (0)512 628 34900 Milton Keynes, Torino: +44 (0) 1908 580400 Utica, Clinton, Chicago: +1 315 853 4900 +TiB (silicon or carbon) sputtering targets. non-ceramic (silicon or carbon) ceramic and brittle can be used to bond 14 ®

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NanoBond Silicon bonded to molybdenum Silicon bonded to copper Other materials not listed below Borosilicate silicon dioxide Carbon graphite Target Material • Aluminum oxide (Al

NanoFoil Below are the incoming requirements for the standard NanoBond requirements for the standard Below are the incoming the solder and creating the bond. the solder and creating NanoFoil is placed between the pre-coated surfaces, pressure is applied, and the foil is activated, melting is activated, foil the and applied, is pressure surfaces, the pre-coated between placed is NanoFoil For this process, the solder is pre-applied to the target and backing plate and machined flat. Then the and backing plate and machined the solder is pre-applied to the target For this process, • Hafnium oxide • Carbon-graphite • Borosilicate glass • Boron carbide (B4C) • Aluminum-zinc oxide (AZO) • AlMgB Ceramics to which solder is applied with the aid of a heated ultrasonic wand: solder is applied with the aid of Ceramics to which aluminum, molybdenum, and stainless steel is also possible. and stainless steel is also aluminum, molybdenum, material used is copper unless otherwise stated. Bonding to other backing plate materials, such as to other backing plate materials, unless otherwise stated. Bonding material used is copper

*Larger bond areas are possible, please contact one of Indium Corporation’s Technical Support Engineers for more information Incoming requirements for standard products Application NOTE > — Flatness Target/BP (0.0015"/1' Better than Accumulative 0.015mm/10mm ©2008 Indium Corporation Indium ©2008 ”) prior to solder application Better than Copper-gallium Copper-indium-gallium Indium Indium-sodium Tin Metals to which no solder is applied Metals to which no solder (0.001"/1") Backing Plate (BP) Flatness 0.01mm/10mm m (100µ ”), since grit blasting chromium is hazardous process. The standard backing plate process. The standard ® Better than (0.001"/1") 0.01mm/10mm Target Flatness m (20µ described which are sold subject exclusively to written warranties and limitations thereon included in product packaging and invoices. Aluminum-titanium alloys Chromium** Iron-cobalt Manganese Manganese-iridium Molybdenum Nickel-chrome Nickel-titanium Niobium Stainless steel Tantalum Titanium Titanium-niobium Tungsten Tungsten-titanium Metals to which solder is applied Metals to which solder is applied with the aid of ultrasound* Thickness (lower limit) Backing Plate ≥ 6mm (0.24") Target Thickness (lower limit) ≥ 2.5mm (0.1") Aluminum Aluminum-copper Aluminum-silicon Aluminum-neodymium Other aluminum alloys Metals to which solder is applied Metals to which solder is applied agitation with the aid of mechanical See reverse side for NanoBond of Ceramic Sputtering Targets ≤ 559mm (22") ≤ 1067mm (42") Bond Area ≤ 559mm (22") of Ceramic & Metal Sputtering Targets Sputtering & Metal of Ceramic (upper limits)*** ® diam width length Singapore, Cheongju: +65 6268 8678 Suzhou, Shenzhen, Liuzhou: +86 (0)512 628 34900 Milton Keynes, Torino: +44 (0) 1908 580400 Utica, Clinton, Chicago: +1 315 853 4900 metal and metal/ceramic For this process, the metal and metal/ceramicsputtering targets. can be used to bond ®

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All metals listed above Target Material Cobalt Copper Copper-silver alloys Nickel Nickel-iron alloys Platinum Ruthenium Metals to which solder is applied Metals to which solder is applied with the aid of flux This Application Note is provided for general information only. It is not intended, This Application Note is provided for general information only. and shall not be construed, to warrant or guarantee the performance of the products stainless steel is also possible. stainless steel is material used is copper. Bonding to other backing plate materials, such as aluminum, molybdenum, and materials, such as aluminum, molybdenum, Bonding to other backing plate material used is copper. NanoFoil

Below are the incoming requirements for the standard NanoBond requirements for the standard Below are the incoming creating the bond. between the pre-coated surfaces, pressure is applied, and the foil is activated, melting the solder and and the foil is activated, melting surfaces, pressure is applied, between the pre-coated solder is pre-applied to the target and backing plate and machined flat. Then the NanoFoil is placed and machined flat. Then the NanoFoil to the target and backing plate solder is pre-applied NanoBond ***Larger Bond Areas are possible, please contact one of Indium Corporation’s Technical Support Engineers for more information *Standard procedure is to grit blast surfaces of these materials to a Ra roughness = 2.5µ Incoming requirements for standard products **Chromium has an incoming surface roughness requirement of Ra > 0.5µ