CMOS Logic Ics Usage Considerations
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How to Choose the Right Cable Category
How to Choose the Right Cable Category Why do I need a different category of cable? Not too long ago, when local area networks were being designed, each work area outlet typically consisted of one Category 3 circuit for voice and one Category 5e circuit for data. Category 3 cables consisted of four loosely twisted pairs of copper conductor under an overall jacket and were tested to 16 megahertz. Category 5e cables, on the other hand, had its four pairs more tightly twisted than the Category 3 and were tested up to 100 megahertz. The design allowed for voice on one circuit and data on the other. As network equipment data rates increased and more network devices were finding their way onto the network, this design quickly became obsolete. Companies wisely began installing all Category 5e circuits with often three or more circuits per work area outlet. Often, all circuits, including voice, were fed off of patch panels. This design allowed information technology managers to use any circuit as either a voice or a data circuit. Overbuilding the system upfront, though it added costs to the original project, ultimately saved money since future cable additions or cable upgrades would cost significantly more after construction than during the original construction phase. By installing all Category 5e cables, they knew their infrastructure would accommodate all their network needs for a number of years and that they would be ready for the next generation of network technology coming down the road. Though a Category 5e cable infrastructure will safely accommodate the widely used 10 and 100 megabit-per-second (Mbits/sec) Ethernet protocols, 10Base-T and 100Base-T respectively, it may not satisfy the needs of the higher performing Ethernet protocol, gigabit Ethernet (1000 Mbits/sec), also referred to as 1000Base-T. -
Hybrid Memristor–CMOS Implementation of Combinational Logic Based on X-MRL †
electronics Article Hybrid Memristor–CMOS Implementation of Combinational Logic Based on X-MRL † Khaled Alhaj Ali 1,* , Mostafa Rizk 1,2,3 , Amer Baghdadi 1 , Jean-Philippe Diguet 4 and Jalal Jomaah 3 1 IMT Atlantique, Lab-STICC CNRS, UMR, 29238 Brest, France; [email protected] (M.R.); [email protected] (A.B.) 2 Lebanese International University, School of Engineering, Block F 146404 Mazraa, Beirut 146404, Lebanon 3 Faculty of Sciences, Lebanese University, Beirut 6573, Lebanon; [email protected] 4 IRL CROSSING CNRS, Adelaide 5005, Australia; [email protected] * Correspondence: [email protected] † This paper is an extended version of our paper published in IEEE International Conference on Electronics, Circuits and Systems (ICECS) , 27–29 November 2019, as Ali, K.A.; Rizk, M.; Baghdadi, A.; Diguet, J.P.; Jomaah, J. “MRL Crossbar-Based Full Adder Design”. Abstract: A great deal of effort has recently been devoted to extending the usage of memristor technology from memory to computing. Memristor-based logic design is an emerging concept that targets efficient computing systems. Several logic families have evolved, each with different attributes. Memristor Ratioed Logic (MRL) has been recently introduced as a hybrid memristor–CMOS logic family. MRL requires an efficient design strategy that takes into consideration the implementation phase. This paper presents a novel MRL-based crossbar design: X-MRL. The proposed structure combines the density and scalability attributes of memristive crossbar arrays and the opportunity of their implementation at the top of CMOS layer. The evaluation of the proposed approach is performed through the design of an X-MRL-based full adder. -
Three-Dimensional Integrated Circuit Design: EDA, Design And
Integrated Circuits and Systems Series Editor Anantha Chandrakasan, Massachusetts Institute of Technology Cambridge, Massachusetts For other titles published in this series, go to http://www.springer.com/series/7236 Yuan Xie · Jason Cong · Sachin Sapatnekar Editors Three-Dimensional Integrated Circuit Design EDA, Design and Microarchitectures 123 Editors Yuan Xie Jason Cong Department of Computer Science and Department of Computer Science Engineering University of California, Los Angeles Pennsylvania State University [email protected] [email protected] Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota [email protected] ISBN 978-1-4419-0783-7 e-ISBN 978-1-4419-0784-4 DOI 10.1007/978-1-4419-0784-4 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939282 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com) Foreword We live in a time of great change. -
LDMOS for Improved Performance
> Submitted to IEEE Transactions on Electron Devices < Final MS # 8011B 1 Extended-p+ Stepped Gate (ESG) LDMOS for Improved Performance M. Jagadesh Kumar, Senior Member, IEEE and Radhakrishnan Sithanandam Abstract—In this paper, we propose a new Extended-p+ Stepped Gate (ESG) thin film SOI LDMOS with an extended-p+ region beneath the source and a stepped gate structure in the drift region of the LDMOS. The hole current generated due to impact ionization is now collected from an n+p+ junction instead of an n+p junction thus delaying the parasitic BJT action. The stepped gate structure enhances RESURF in the drift region, and minimizes the gate-drain capacitance. Based on two- dimensional simulation results, we show that the ESG LDMOS exhibits approximately 63% improvement in breakdown voltage, 38% improvement in on-resistance, 11% improvement in peak transconductance, 18% improvement in switching speed and 63% reduction in gate-drain charge density compared with the conventional LDMOS with a field plate. Index Terms—LDMOS, silicon on insulator (SOI), breakdown voltage, transconductance, on- resistance, gate charge I. INTRODUCTION ATERALLY double diffused metal oxide semiconductor (LDMOS) on SOI substrate is a promising Ltechnology for RF power amplifiers and wireless applications [1-5]. In the recent past, developing high voltage thin film LDMOS has gained importance due to the possibility of its integration with low power CMOS devices and heterogeneous microsystems [6]. But realization of high voltage devices in thin film SOI is challenging because floating body effects affect the breakdown characteristics. Often, body contacts are included to remove the floating body effects in RF devices [7]. -
Advanced MOSFET Structures and Processes for Sub-7 Nm CMOS Technologies
Advanced MOSFET Structures and Processes for Sub-7 nm CMOS Technologies By Peng Zheng A dissertation submitted in partial satisfaction of the requirements for the degree of Doctor of Philosophy in Engineering - Electrical Engineering and Computer Sciences in the Graduate Division of the University of California, Berkeley Committee in charge: Professor Tsu-Jae King Liu, Chair Professor Laura Waller Professor Costas J. Spanos Professor Junqiao Wu Spring 2016 © Copyright 2016 Peng Zheng All rights reserved Abstract Advanced MOSFET Structures and Processes for Sub-7 nm CMOS Technologies by Peng Zheng Doctor of Philosophy in Engineering - Electrical Engineering and Computer Sciences University of California, Berkeley Professor Tsu-Jae King Liu, Chair The remarkable proliferation of information and communication technology (ICT) – which has had dramatic economic and social impact in our society – has been enabled by the steady advancement of integrated circuit (IC) technology following Moore’s Law, which states that the number of components (transistors) on an IC “chip” doubles every two years. Increasing the number of transistors on a chip provides for lower manufacturing cost per component and improved system performance. The virtuous cycle of IC technology advancement (higher transistor density lower cost / better performance semiconductor market growth technology advancement higher transistor density etc.) has been sustained for 50 years. Semiconductor industry experts predict that the pace of increasing transistor density will slow down dramatically in the sub-20 nm (minimum half-pitch) regime. Innovations in transistor design and fabrication processes are needed to address this issue. The FinFET structure has been widely adopted at the 14/16 nm generation of CMOS technology. -
Physical Structure of CMOS Integrated Circuits
Physical Structure of CMOS Integrated Circuits Dae Hyun Kim EECS Washington State University References • John P. Uyemura, “Introduction to VLSI Circuits and Systems,” 2002. – Chapter 3 • Neil H. Weste and David M. Harris, “CMOS VLSI Design: A Circuits and Systems Perspective,” 2011. – Chapter 1 Goal • Understand the physical structure of CMOS integrated circuits (ICs) Logical vs. Physical • Logical structure • Physical structure Source: http://www.vlsi-expert.com/2014/11/cmos-layout-design.html Integrated Circuit Layers • Semiconductor – Transistors (active elements) • Conductor – Metal (interconnect) • Wire • Via • Insulator – Separators Integrated Circuit Layers • Silicon substrate, insulator, and two wires (3D view) Substrate • Side view Metal 1 layer Insulator Substrate • Top view Integrated Circuit Layers • Two metal layers separated by insulator (side view) Metal 2 layer Via 12 (connecting M1 and M2) Insulator Metal 1 layer Insulator Substrate • Top view Connected Not connected Integrated Circuit Layers Integrated Circuit Layers • Signal transfer speed is affected by the interconnect resistance and capacitance. – Resistance ↑ => Signal delay ↑ – Capacitance ↑ => Signal delay ↑ Integrated Circuit Layers • Resistance – = = = Direction of • : sheet resistance (constant) current flows ∙ ∙ • : resistivity (= , : conductivity) 1 – Material property (constant) – Unit: • : thickess (constant) Ω ∙ • : width (variable) • : length (variable) Cross-sectional area = • Example ∙ – : 17. , : 0.13 , : , : 1000 • = 17.1 -
Modeling and Estimation of Crosstalk Across a Channel with Multiple, Non-Parallel Coupling and Crossings of Multiple Aggressors in Practical PCBS
Scholars' Mine Doctoral Dissertations Student Theses and Dissertations Fall 2014 Modeling and estimation of crosstalk across a channel with multiple, non-parallel coupling and crossings of multiple aggressors in practical PCBS Arun Reddy Chada Follow this and additional works at: https://scholarsmine.mst.edu/doctoral_dissertations Part of the Electrical and Computer Engineering Commons Department: Electrical and Computer Engineering Recommended Citation Chada, Arun Reddy, "Modeling and estimation of crosstalk across a channel with multiple, non-parallel coupling and crossings of multiple aggressors in practical PCBS" (2014). Doctoral Dissertations. 2338. https://scholarsmine.mst.edu/doctoral_dissertations/2338 This thesis is brought to you by Scholars' Mine, a service of the Missouri S&T Library and Learning Resources. This work is protected by U. S. Copyright Law. Unauthorized use including reproduction for redistribution requires the permission of the copyright holder. For more information, please contact [email protected]. MODELING AND ESTIMATION OF CROSSTALK ACROSS A CHANNEL WITH MULTIPLE, NON-PARALLEL COUPLING AND CROSSINGS OF MULTIPLE AGGRESSORS IN PRACTICAL PCBS by ARUN REDDY CHADA A DISSERTATION Presented to the Faculty of the Graduate School of the MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY In Partial Fulfillment of the Requirements for the Degree DOCTOR OF PHILOSOPHY in ELECTRICAL ENGINEERING 2014 Approved Jun Fan, Advisor James L. Drewniak Daryl Beetner Richard E. Dubroff Bhyrav Mutnury 2014 ARUN REDDY CHADA All Rights Reserved iii ABSTRACT In Section 1, the focus is on alleviating the modeling challenges by breaking the overall geometry into small, unique sections and using either a Full-Wave or fast equivalent per-unit-length (Eq. PUL) resistance, inductance, conductance, capacitance (RLGC) method or a partial element equivalent circuit (PEEC) for the broadside coupled traces that cross at an angle. -
Characterization of the Cmos Finfet Structure On
CHARACTERIZATION OF THE CMOS FINFET STRUCTURE ON SINGLE-EVENT EFFECTS { BASIC CHARGE COLLECTION MECHANISMS AND SOFT ERROR MODES By Patrick Nsengiyumva Dissertation Submitted to the Faculty of the Graduate School of Vanderbilt University in partial fulfillment of the requirements for the degree of DOCTOR OF PHILOSOPHY in Electrical Engineering May 11, 2018 Nashville, Tennessee Approved: Lloyd W. Massengill, Ph.D. Michael L. Alles, Ph.D. Bharat B. Bhuva, Ph.D. W. Timothy Holman, Ph.D. Alexander M. Powell, Ph.D. © Copyright by Patrick Nsengiyumva 2018 All Rights Reserved DEDICATION In loving memory of my parents (Boniface Bimuwiha and Anne-Marie Mwavita), my uncle (Dr. Faustin Nubaha), and my grandmother (Verediana Bikamenshi). iii ACKNOWLEDGEMENTS This dissertation work would not have been possible without the support and help of many people. First of all, I would like to express my deepest appreciation and thanks to my advisor Dr. Lloyd Massengill for his continual support, wisdom, and mentoring throughout my graduate program at Vanderbilt University. He has pushed me to look critically at my work and become a better research scholar. I would also like to thank Dr. Michael Alles and Dr. Bharat Bhuva, who have helped me identify new paths in my research and have been a constant source of ideas. I am also very grateful to Dr. W. T. Holman and Dr. Alexander Powell for serving on my committee and for their constructive comments. Special thanks go to Dr. Jeff Kauppila, Jeff Maharrey, Rachel Harrington, and Tim Haeffner for their support with test IC designs and experiments. I would also like to thank Dennis Ball (Scooter) for his tremendous help with TCAD models. -
Federal Communications Commission FCC 98-221 Federal
Federal Communications Commission FCC 98-221 Federal Communications Commission Washington, D.C. 20554 In the Matter of ) ) 1998 Biennial Regulatory Review -- ) Modifications to Signal Power ) Limitations Contained in Part 68 ) CC Docket No. 98-163 of the Commission's Rules ) ) ) ) ) NOTICE OF PROPOSED RULEMAKING Adopted: September 8, 1998 Released: September 16, 1998 Comment Date: 30 days from date of publication in the Federal Register Reply Comment Date: 45 days from date of publication in the Federal Register By the Commission: Commissioner Furchtgott-Roth issuing a separate statement. I. INTRODUCTION 1. In this proceeding, we seek to make it possible for customers to download data from the Internet more quickly. Our proposal, if adopted, could somewhat improve the transmission rates experienced by persons using high speed digital information products, such as 56 kilobits per second (kbps) modems, to download data from the Internet. Currently, our rules limiting the amount of signal power that can be transmitted over telephone lines prohibit such products from operating at their full potential. We believe these signal power limitations can be relaxed without causing interference or other technical problems. Therefore, we propose to relax the signal power limitations contained in Part 68 of our rules and explore the benefits and harms, if any, that may result from this change. This change would allow Pulse Code Modulation (PCM) modems, which are used by Internet Service Providers (ISPs) and other online information service providers to transmit data to consumers, to operate at higher signal powers. This modification will allow ISPs and other online information service providers to transmit data at moderately higher speeds to end-users. -
QUARTER-3-CSS-9-MODULE-7.Pdf
Republic of the Philippines Department of Education Regional Office IX, Zamboanga Peninsula Zest for Progress Zeal of Partnership 9 TLE/TVL Computer Systems Servicing Quarter 3- Module 7 Terminate /Connect Electrical Wiring/ Electronic Circuits Name of Learner: _____________________ Grade & Section: _____________________ Name of School: ______________________ 1 TLE/TVL– Grade 9 Computer System Servicing Alternative Delivery Mode Quarter III – Module 7: Terminate/ Connect electrical wiring/electronic circuits First Edition, 2020 Republic Act 8293, section 176 states that: No copyright shall subsist in any work of the Government of the Philippines. However, prior approval of the government agency or office wherein the work is created shall be necessary for exploitation of such work for profit. Such agency or office may, among other things, impose as a condition the payment of royalties. Borrowed materials (i.e., songs, stories, poems, pictures, photos, brand names, trademarks, etc.) included in this module are owned by their respective copyright holders. Every effort has been exerted to locate and seek permission to use these materials from their respective copyright owners. The publisher and authors do not represent nor claim ownership over them. Published by the Department of Education Secretary: Leonor Magtolis Briones Undersecretary: Diosdado M. San Antonio Development Team of the Module Writer: Hazel P. Bacasmo Reviewer: Evelyn C. Labad EdD, Nilda Y. Galaura EdD Editor: James L. Colaljo MAEM Illustrators: Myrlan R. Realiza Jezel Joy D. Cabrera Layout Artist: Myrlan R. Realiza Jezel Joy D. Cabrera Management Team: SDS: Ma. Liza R. Tabilon EdD, CESO V ASDS: Judith V. Romaguera EdD OIC-ASDS: Ma. Judelyn J. Ramos EdD OIC-ASDS: Armando P. -
Basics of CMOS Logic Ics Application Note
Basics of CMOS Logic ICs Application Note Basics of CMOS Logic ICs Outline: This document describes applications, functions, operations, and structure of CMOS logic ICs. Each functions (inverter, buffer, flip-flop, etc.) are explained using system diagrams, truth tables, timing charts, internal circuits, image diagrams, etc. ©2020- 2021 1 2021-01-31 Toshiba Electronic Devices & Storage Corporation Basics of CMOS Logic ICs Application Note Table of Contents Outline: ................................................................................................................................................. 1 Table of Contents ................................................................................................................................. 2 1. Standard logic IC ............................................................................................................................. 3 1.1. Devices that use standard logic ICs ................................................................................................. 3 1.2. Where are standard logic ICs used? ................................................................................................ 3 1.3. What is a standard logic IC? .............................................................................................................. 4 1.4. Classification of standard logic ICs ................................................................................................... 5 1.5. List of basic circuits of CMOS logic ICs (combinational logic circuits) -
Zerox Algorithms with Free Crosstalk in Optical Multistage Interconnection Network
(IJACSA) International Journal of Advanced Computer Science and Applications, Vol. 4, No. 2, 2013 ZeroX Algorithms with Free crosstalk in Optical Multistage Interconnection Network M.A.Al-Shabi Department of Information Technology, College of Computer, Qassim University, KSA. Abstract— Multistage interconnection networks (MINs) have is on the time dilation approach to solve the optical crosstalk been proposed as interconnecting structures in various types of problem in the omega networks, a class of self-routable communication applications ranging from parallel systems, networks, which is topologically equivalent to the baseline, switching architectures, to multicore systems and advances. butterfly, cube networks et[10]. The time dilation approach Optical technologies have drawn the interest for optical solves the crosstalk problem by ensuring that only one signal is implementation in MINs to achieve high bandwidth capacity at allowed to pass through each switching element at a given time the rate of terabits per second. Crosstalk is the major problem in the network [11][12]. Typical MINs consist of N inputs, N with optical interconnections; it not only degrades the outputs and n stages with n=log N. Each stage is numbered performance of network but also disturbs the path of from 0 to (n-1), from left to right and has N/2 Switching communication signals. To avoid crosstalk in Optical MINs many Elements (SE). Each SE has two inputs and two outputs algorithms have been proposed by many researchers and some of the researchers suppose some solution to improve Zero connected in a certain pattern. Algorithm. This paper will be illustrated that is no any crosstalk The critical challenges with optical multistage appears in Zero based algorithms (ZeroX, ZeroY and ZeroXY) in interconnections are optical loss, path dependent loss and using refine and unique case functions.