DOCSLIB.ORG

GLOBALFOUNDRIES 45Nm Defectifity Reduction Trends Exceeds

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
GLOBALFOUNDRIES 45Nm Defectifity Reduction Trends Exceeds Redefining the Foundry Model Panel Discussion at ITAC - GSA Norm Armour Vice President and General Manager, Fab 8 Overview The endless march of technology Increasing complexity and cost in manufacturing An industry in transition The shift from regional to global Creating a sustainable model Collaboration essential to innovation The next evolution in the industry From contract manufacturing to collaborative manufacturing April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 2 Leading-Edge Technology Adoption CPUs and GPUs still drive transitions, but wireless devices are not far behind 2009 Market Volume (No. of end-consumer devices) 1B 180nm+ 130nm 90nm 65nm 45nm 32nm Process linewidth Media Phone 500M MPU Set-Top Boxes IGP Chipset Digital Still 250M Cameras Smart Phone Discrete MP3 Players GPU Video game – Handheld & console 100M Personal & portable stereos Voice Only Phone Source: Bridge & GLOBALFOUNDRIES analysis, iSuppli Mobile Handset Tracker; iSuppli Consumer Platforms Market Tracker , Mercury Reports GPU, Gartner Reports GPU April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 3 Chip Design: An Industry in Transition Chipmakers need to keep pace with tech and focus on design …while the cost of manufacturing and R&D continue to grow 2003-2007 2008-2011 2012 onwards Increasing complexity Process R&D Cost Fab Start-up Cost USD Millions Comparison ~$1300M USD Millions ~$4.5 to $6.5B ~$600 ~$3.5 to to $4.5B $900M ~$310 ~$2.5 to to $3.0B $400M 90-65 nm 45-32 nm 22-12 nm 90-65 nm 45-32 nm 22-12 nm (1) Industry average for Logic process R&D; (2) Average capex of 300mm Logic fabs in World Fab Watch database. Source: In-Stat 1/07, World Fab Watch; analyst reports; press clippings. April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 4 The First Truly Global Foundry Global Manufacturing and Support Footprint Dresden, Germany Munich, Germany London, UK Yokohama, Saratoga, NY Japan Headquarters Shanghai, East China Si Valley, CA Fishkill, NY Hsinchu, Austin, TX Taiwan Singapore Manufacturing Centers Sales and Support Offices Saratoga, New York Dresden, Germany Singapore The New GLOBALFOUNDRIES Headquartered in Silicon Valley Singapore Approximately 10,000 employees Spanning three continents across 12 locations 300mm Fabs in Singapore, Germany, New York 200mm Fabs in Singapore One of the World’s Largest Foundries 2009 revenue of ~$2.5B US 150 Customers including many of the world’s largest IC companies The New Leader in Foundry Technology and Service Germany Substantial Time-to-volume advantage for advanced technologies New York Driving the Global Standard for new technologies Full foundry offering from mainstream to leading edge with Value-Added Solutions Committed to Best-in-Class customer service State-of-the-Art 300mm Fabs Fab 1 in Germany Fab 7 in Singapore Fab 8 in New York • 45nm and below • 130nm to 40nm • 28nm and below • 300mm wafers • 300mm wafers • 300mm wafers • 60,000 wafers/month • 50,000 wafers/month • 42,000 wafers/month • Production Now • Production Now •Groundbreaking July 2009 • Production ramping 2012 Global foundry capacity expansion minimizes geographic risk 200mm Fabs in Singapore Fab 2 Fab 3/5 Fab 6 Fab 3E • Production • Production • Production • Production Technology 0.6um-0.35um 0.35um-0.18um 0.18um-0.11um 0.18um • 50,000 • 54,000 • 45,000 • 34,000 Capacity wafers/month wafers/month wafers/month wafers/month • Production • Production • Production • Production Timing Now Now Now Now Automotive Qualified with High Voltage, Non-Volatile and RF Options A Model for Shared Innovation Shared objectives Early-stage leading-edge R&D Production-ready process technologies Shared investments Advanced manufacturing resources Diverse teams collaborating Face-to-face and virtual Shared returns Accelerated access to advanced technologies Experience from early, high-volume production to refine processes Rich partner/IP eco-system to support leading-edge adoption Collaborative Innovation in Action 2000 2002 2003 2004 2006 2008 2010 180nm 130nm 130nm 90nm 65nm 45nm 32/28nm Cu Interconnect Low-K dielectric SOI Strained-Si Multi-Strain Transistor Immersion Lithography Gate First HKMG Cu Cu A long list of technology “firsts” in volume manufacturing and customer products Ultra Low-K April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 10 Technologies and Value-Added Solutions High NVM (OTP, eFlash SiGe Logic RF CMOS Voltage MTP, E2PROM) SONOS BiCMOS SOI 22/20nm 32/28nm 45/40nm 65nm 90nm 0.13um 0.18um 0.25um 0.35um >0.5um In Development Available Note: Information above is subject to change, please contact your GLOBALFOUNDRIES representative for the latest information Enabling Time-to-Market Leadership As complexity of chip design increases, 45/40nm Production Ramp manufacturing partnerships become 300mm Wafers Shipped per Quarter (1000’s) ever more critical Closely collaborative foundry relationships are essential to enabling smooth and rapid time to market 45nm GLOBALFOUNDRIES’ time-to-volume is unmatched in the foundry industry – 45nm ramp far ahead of rest of foundry industry – High-volume, complex x86 CPU drives yield learning for other customers 40nm - Other Leading – Initial 32nm HKMG production Foundries* running now in Fab 1 *Market data compiled by International Business Strategies 12 April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL Continued Innovation Demands a New Approach Design and manufacturing must work in unison Bringing a highly integrated model to foundry Extension of customer operations Early customer-foundry engagement Close collaboration, joint technology development Enable faster time to market Smooth ramps to mature yields Speed, accuracy, and agility Requires committed investment Technology, capacity, capabilities Enable global scale and service Design, technology and manufacturing tightly coupled for success of customer solutions April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 13 Fab 8, Moduel 1 Fab 8: March 2010 Fab 8: March 2010 Fab 8: possible campus build out design Campus 222.45 acres Fab8 m1 (Ph2) 2 le u d (90k sqft) o m 8 b a F Fab8 m1 (Ph1) (210k sqft) le3 Fab8 modu Module 1 currently under construction. There is room on the campus to build Modules 2 & 3, but those phases are not yet planned. Thank You! GLOBALFOUNDRIES, the GLOBALFOUNDRIES logo and combinations thereof are trademarks of GLOBALFOUNDRIES Inc. in the United States and/or other jurisdictions. Other names used in this presentation are for identification purposes only and may be trademarks of their respective owners. ©2010 GLOBALFOUNDRIES Inc. All rights reserved. Chip Design Increasing in Complexity Llano: One of the most complex dies ever created Advanced performance-enhancement and power-management techniques now required Complex manufacturing process 32nm SOI technology Gate First High-K Metal Gate 4 CPU cores High performance GPU >1 billion transistors >11 Metal layers >2nd generation immersion lithography Power management innovations (2.5W to 25W) April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 19 Continuous Innovation Required Innovation in thinking Performance-per-watt, battery life, parallel computing, virtualization, visual computing, small form factor Innovation in design Multiple cores, CPU/GPU integration, embedded memory, power management, system-level architecture Innovation in manufacturing and technology New materials, transistor structures, 3D stacking, immersion/EUV lithography, ultra-low k dielectrics, High-k Metal Gate Despite technical challenges, biggest hurdle to continued innovation is economics April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 20 Collaborative Approach to Advanced Technology Industry collaboration to drive the global standard for High K Metal Gate (HKMG) with seven world-leading product companies Total alignment in High K materials stack Detailed fabrication steps Specific design rules Specific transistor models Gate-First Design enabling ecosystem with Reference High-K Metal Gate Flows and IPs flowing from multiple industry leaders April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 21 The World’s First Truly Global Foundry Global Manufacturing Operations Fab 2, 3, 3e, 5, 6 Mainstream 200mm manufacturing campus Woodlands, Singapore Tampines, Singapore Fab 8 Future leading-edge 300mm manufacturing Saratoga County, NY Fab 1 Fab 7 Leading-edge 300mm Mainstream 300mm manufacturing campus manufacturing campus Dresden, Germany Woodlands, Singapore Fab 8 Fab 8: Why upstate New York? Education Economics Ecosystem Fab 8: July 2009 Fab 8: December 2009 Fab 8: Economic Impact Construction: 1.3 million square feet $880 million in construction costs 130 different construction bid packages 5 million man hours to complete 1,600 new construction jobs additional 2,700 local construction-related jobs Operations: 1,200 to 1,400 new direct manufacturing jobs annual payroll of more than $80 million 5,000 in-direct jobs, annual payroll of more than $200 million Total average annual payroll $288 million Fab 8: concrete foundation Fab 8: vertical concrete walls Fab 8: vertical concrete walls Fab 8: first steel roof trusses Fab 8: close-up of steel roof trusses Fab 8: Waffle Table Fab 8: March 2010 Fab 8: Rendering of Phase 1 ) -2 (27.9k m -2 Phase1 Phase2 potential Phase2 expansion completion - 300k ft : Fab 8 Fab 8: February 2010 Fab 8.
Load more

Recommended publications
  • Going Vertical: a New Integration Era in the Semiconductor Industry Table of Contents
    Going vertical: A new integration era in the semiconductor industry Table of contents 01 Executive overview Integration in the 02 semiconductor industry Strategic options for 03 semiconductor companies Moving forward: what semiconductor 04 companies must consider today Going vertical: A new integration era in the semiconductor industry 2 Executive overview Like many industries, the semiconductor industry is not immune to waves of diversification and consolidation through inorganic and organic growth. While inflection points with large-scale systemic changes in the value chain are relatively rare, our perspective is that there is a systemic change currently trending in the industry. Since the inception of the industry, semiconductor companies have recognized the value of technology. Accordingly, the market has rewarded semiconductor companies for specializing in distinct parts of the value chain by developing technological advantages by investing in R&D and by scaling technology through horizontal integration. This way of working transformed an industry that was initially vertically integrated (semiconductor design, semiconductor manufacturing, and system integration) into an ecosystem focused on specific areas of design, manufacturing, and/or systems. In the past five years, business value in some segments has moved from underlying technology to specific use cases to better monetize end-customer data and experience. • 5G, automotive, AI, cloud, system integration and hardware-software integration System integrators and software and cloud platform companies are no longer just important customers for the semiconductor industry—they are directly expanding into multiple upstream areas. • Taking advantage of silicon and system design • Control more of the technology stack • Optimize system performance • Improve the customer experience This vertical integration trend is distinctly different from the vertical integration which occurred at the inception of the semiconductor and integrated device manufacturing industry more than 50 years ago.
    [Show full text]
  • A Study of the Foundry Industry Dynamics
    A Study of the Foundry Industry Dynamics by Sang Jin Oh B.S. Industrial Engineering Seoul National University, 2003 SUBMITTED TO THE MIT SLOAN SCHOOL OF MANAGEMENT IN PARTIAL FULFILLMENT OF THE REQUIREMENTS FOR THE DEGREE OF MASTER OF SCIENCE IN MANAGEMENT STUDIES AT THE MASSACHUSETTS INSTITUTE OF TECHNOLOGY ARCHVES JUNE 2010 MASSACHUSETTS INSTiUTE OF TECHNOLOGY © 2010 Sang Jin Oh. All Rights Reserved. The author hereby grants MIT permission to reproduce JUN 082010 and to distribute publicly paper and electronic LIBRARIES copies of this thesis document in whole or in part in any medium now known and hereafter created. Signature of Author Sang Jin Oh Master of Science in Management Studies May 7, 2010 Certified by (7 Michael A. Cusumano SMR Distinguished Professor of Management Thesis Supervisor Accepted by (I Michael A. Cusumano Faculty Director, M.S. in Management Studies Program MIT Sloan School of Management A Study of the Foundry Industry Dynamics By Sang Jin Oh Submitted to the MIT Sloan School of Management On May 7, 2010 In Partial Fulfillment of the Requirements for the Degree of Master of Science in Management Studies Abstract In the process of industrial evolution, it is a general tendency that companies which specialize in a specific value chain have emerged. These companies should construct a business eco-system based on their own platform to compete successfully with vertically integrated companies and other specialized companies. They continue to sustain their competitive advantage only when they share their ability to create value with other eco-system partners. The thesis analyzes the dynamics of the foundry industry.
    [Show full text]
  • Semiconductors: a Changing of the Guard
    Semiconductors: A Changing of the Guard Richard Spalton MA, CFA Investment Manager Semiconductors: A Changing of the Guard “While an early chip from the 1970s could fit thousands of micrometre-sized transistors, today’s most advanced chips are a complex web of billions of transistors, the smallest of which are just 10nm. To get some idea of how small that is: your fingernails grew 10nm in the time it took to read the previous sentence.”1 Background One of the key enablers of technological progress has been the constantly shrinking size of the transistors on semiconductor chips. Smaller transistors mean that the same number of computations can be completed faster, more efficiently and at lower cost. This concept was famously outlined by Gordon Moore, co-founder of Intel, who in 1965 wrote what became known as Moore’s Law. The manufacturing process for a particular size of transistor is called a process node. Shifting to a new node is highly complex and involves significant capital expenditure. In July 2020 Intel announced that their transition to the 7 nanometre node was running a year behind schedule. This delay will have a significant impact on Intel and its competitors. This announcement marks a changing of the guard in the semiconductor market, with leadership shifting away from Intel towards Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics. Scale Matters Assessing the future prospects of a company requires an assessment of its industry. Manufacturing semiconductors is highly capital intensive – the industry spends USD 100bn per annum on capital expenditure. Companies also need to spend substantial amounts on R&D because each process node is more complex than the last.
    [Show full text]
  • AI Chips: What They Are and Why They Matter
    APRIL 2020 AI Chips: What They Are and Why They Matter An AI Chips Reference AUTHORS Saif M. Khan Alexander Mann Table of Contents Introduction and Summary 3 The Laws of Chip Innovation 7 Transistor Shrinkage: Moore’s Law 7 Efficiency and Speed Improvements 8 Increasing Transistor Density Unlocks Improved Designs for Efficiency and Speed 9 Transistor Design is Reaching Fundamental Size Limits 10 The Slowing of Moore’s Law and the Decline of General-Purpose Chips 10 The Economies of Scale of General-Purpose Chips 10 Costs are Increasing Faster than the Semiconductor Market 11 The Semiconductor Industry’s Growth Rate is Unlikely to Increase 14 Chip Improvements as Moore’s Law Slows 15 Transistor Improvements Continue, but are Slowing 16 Improved Transistor Density Enables Specialization 18 The AI Chip Zoo 19 AI Chip Types 20 AI Chip Benchmarks 22 The Value of State-of-the-Art AI Chips 23 The Efficiency of State-of-the-Art AI Chips Translates into Cost-Effectiveness 23 Compute-Intensive AI Algorithms are Bottlenecked by Chip Costs and Speed 26 U.S. and Chinese AI Chips and Implications for National Competitiveness 27 Appendix A: Basics of Semiconductors and Chips 31 Appendix B: How AI Chips Work 33 Parallel Computing 33 Low-Precision Computing 34 Memory Optimization 35 Domain-Specific Languages 36 Appendix C: AI Chip Benchmarking Studies 37 Appendix D: Chip Economics Model 39 Chip Transistor Density, Design Costs, and Energy Costs 40 Foundry, Assembly, Test and Packaging Costs 41 Acknowledgments 44 Center for Security and Emerging Technology | 2 Introduction and Summary Artificial intelligence will play an important role in national and international security in the years to come.
    [Show full text]
  • The Impact of China's Policies on Global Semiconductor
    Moore’s Law Under Attack: The Impact of China’s Policies on Global Semiconductor Innovation STEPHEN EZELL | FEBRUARY 2021 China’s mercantilist strategy to grab market share in the global semiconductor industry is fueling the rise of inferior innovators at the expense of superior firms in the United States and other market-led economies. That siphons away resources that would otherwise be invested in the virtuous cycle of cutting-edge R&D that has driven semiconductor innovation for decades. KEY TAKEAWAYS ▪ No industry has an innovation dynamic quite like the semiconductor industry, where “Moore’s Law” has held for decades: The number of transistors on a microchip doubles about every two years, producing twice the processing power at half the cost. ▪ The pattern persists because the semiconductor industry vies with biopharmaceuticals to be the world’s most R&D-intensive industry—a virtuous cycle that depends on one generation of innovation to finance investment in the next. ▪ To continue heavy investment in R&D and CapEx, semiconductor firms need access to large global markets where they can compete on fair terms to amortize and recoup their costs. When they face excess, non-market-based competition, innovation suffers. ▪ China’s state-directed strategy to vault into a leadership position in the semiconductor industry distorts the global market with massive subsidization, IP theft, state-financed foreign firm acquisitions, and other mercantilist practices. ▪ Inferior innovators thus have a leg up—and the global semiconductor innovation curve is bending downward. In fact, ITIF estimates there would be 5,100 more U.S. patents in the industry annually if not for China’s innovation mercantilist policies.
    [Show full text]
  • Photonic Integrated Circuit Design in a Foundry+Fabless Ecosystem Muhammad Umar Khan , Member, IEEE, Yufei Xing, Yinghao Ye , and Wim Bogaerts , Senior Member, IEEE
    IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, VOL. 25, NO. 5, SEPTEMBER/OCTOBER 2019 8201014 Photonic Integrated Circuit Design in a Foundry+Fabless Ecosystem Muhammad Umar Khan , Member, IEEE, Yufei Xing, Yinghao Ye , and Wim Bogaerts , Senior Member, IEEE (Invited Paper) Abstract—A foundry-based photonic ecosystem is expected to (SiN), germanium-on-silicon, germanium-on-silicon nitride and become necessary with increasing demand and adoption of photon- silicon-on-silicon nitride. All these material systems are compat- ics for commercial products. To make foundry-enabled photonics ible with CMOS fabrication facilities and processes and support a real success, the photonic circuit design flow should adopt known concepts from analog and mixed signal electronics. Based on the densely integrated circuits, so we can categorize all of them as similarities and differences between the existing photonic and the silicon photonics. Among these silicon photonics material sys- standardized electronics design flow, we project the needs and evo- tems, the SOI is by far the most mature and the most widely lution of the photonic design flow, such as schematic driven design, used platform. It provides the highest possible integration den- accurate behavioral models, and yield prediction in the presence of sity with the highest potential for high-volume manufacturing. fabrication variability. However, the manufacturing volumes for even the most used Index Terms—CMOS, photonic integrated circuits(PICs), SOI platform fall still several orders of magnitude short of those foundry, fabless design, photonics ecosystem, process design kit in CMOS electronics. To give an idea, few tens of thousands of (PDK), circuit design, design flow.
    [Show full text]
  • TSMC Files Complaints Against Globalfoundries in U.S., Germany
    TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm Its Technology Leadership and to Protect Its Customers and Consumers Worldwide Hsinchu, Taiwan R.O.C., Oct 1, 2019 - TSMC, the world’s leading global innovator in semiconductor manufacturing, filed multiple lawsuits on September 30, 2019 against GlobalFoundries in the United States, Germany and Singapore for its ongoing infringement of 25 TSMC patents by at least its 40nm, 28nm, 22nm, 14nm, and 12nm node processes. In the complaints, TSMC demands injunctions to stop GlobalFoundries’ manufacture and sale of infringing semiconductor products. TSMC also seeks substantial monetary damages from GlobalFoundries for its sale of infringing semiconductor products and unlawful use of TSMC’s patented semiconductor technologies. The 25 TSMC patents in the complaints relate to a diverse set of technologies, including FinFET designs, shallow trench isolation techniques, double patterning methods, advanced seal rings and gate structures, and innovative contact etch stop layer designs. These specific technologies cover the core features of mature and advanced semiconductor manufacturing processes. The patents at issue comprise just a small portion of TSMC’s extensive portfolio that numbers more than 37,000 granted patents worldwide. TSMC was ranked one of the top 10 companies for U.S. patent grants last year, for the third consecutive year. TSMC pioneered the dedicated semiconductor foundry model, enabling an entire fabless IC design industry worth hundreds of billions of dollars in the United States. Furthermore, TSMC plays a critical role in facilitating the global semiconductor supply chain. For example, TSMC collaborates with dozens of U.S.-based equipment suppliers, intellectual property (IP) core providers and electronic design automation (EDA) vendors.
    [Show full text]
  • ATREG Thought-Leadership Series
    ATREG Thought-Leadership Series The Inflection Point Macro Forces & Emerging Trends That Will Reshape The Semiconductor Industry Through 2016 July 2013 “It is difficult to make predictions, especially about the future.” Second Edition Generally attributed to Niels Henrik David Bohr, Danish physicist and Nobel Prize winner (1922) The Inflection Point Macro Forces & Emerging Trends That Will Reshape The Semiconductor Industry Through 2016 Contents Principal Investigator 3 Executive Summary 4 Background On Semiconductor Manufacturing 7 Macro Trends Driving Change 9 The Inflection Point: Emerging Trends 14 What The Future Might Look Like 25 Opportunities For Semiconductor Firms 28 Conclusion 31 Principal Investigator ACKNowledGEMENts ATREG would like to express its thanks and gratitude to the many talented members of the ATREG team who dedicated their time, knowledge, and This paper authored by ATREG is the first in a series of hard work to the creation of this paper broad assessments of the semiconductor industry and the based on unique market data collected by predictions for changes to come over the next three years. ATREG over the past decade. Our views about the future are unvarnished. We have been rigorous in our analysis by using large data sets to support our conclusions. We have suggested four possible futures that may emerge and have looked at implications for each of these scenarios. Headquartered in Seattle, USA, ATREG (www.atreg.com) is a global firm that advises the world’s largest and most reputable companies in the semiconductor industry and related technology verticals. The industry is subject to volatility, major capital investments, unpredictable market demand, rapidly evolving technologies, fierce global competition, and consolidation.
    [Show full text]
  • Could Looming Chip Supply Issues Derail the Mobile Market?
    June 13 , 2012 J.Gold Associates LLC, 6 Valentine Road, Northborough, MA 01532, USA www.jgoldassociates.com +1-508-393-5294 Could Looming Chip Supply Issues Derail The Mobile Market? Over the past several years, the semiconductor market has changed from a primarily vertically integrated model (e.g., ownership of design through manufacturing) to one of chip design efforts separated from production (the foundry model). This has allowed many new entrants into the market that no longer needed to raise incredible sums to build and operate their own fabs. But can process technology and production keep pace with the needs of the mobile market or is trouble on the horizon? With state of the art fabs now costing $5B-$10B each, the “fabless” model has provided an advantage to many smallish firms with great ideas for chips, but no means to build advanced production facilities. It also created mega-fab companies (e.g., TSMC, Samsung, Global Foundries) that were able to invest in facilities and sell their production capacity to all comers. This fundamental shift of the supply chain created the vibrant and highly competitive chip market we see today. For example, the ARM-based mobile ecosystem could not exist without this commodity fab model with Qualcomm, Nvidia and even Apple using this path. And even the veteran AMD, who long maintained its own production facilities, has divested its manufacturing to concentrate all of its resources on competitive designs (primarily aimed at Intel). However, the foundry model has recently shown strains that could derail, or at the very least restrict the growth of the mobile market.
    [Show full text]
  • 'Find a Zero: Which Billion Dollar Company Will Be Bankrupt by 2020'
    ‘Find a Zero: Which Billion Dollar Company Will be Bankrupt by 2020’ ABSTRACT: we contend that Advanced Micro Devices Inc., (AMD) one of Silicon Valley’s semiconductor success stories, will file for bankruptcy by 2020. Since 2008, this legacy company has survived by slashing operating expenses, spinning off its manufacturing business and transitioning away from its core PC business to “growth markets”. While it may be succeeding in marketing its turnaround narrative to the market, we see ADM at a point of no return. We identify a toxic combination comprising an uncompetitive product portfolio, technological leap forwards by competitors, several structural challenges, poor positioning due to an ineffective strategy and a worsening balance sheet. While it is bagging some wins, the clock is ticking and AMD will be unable to drive profitability in industries where product leadership, rather than merely pricing, determines success. Participants: Bardavid, Toby; Pedretti, Ivan; Presa Perez, Aessandro 1 TABLE OF CONTENTS I. COMPANY OVERVIEW 3 II. STRUCTURAL CHALLENGES PUSHING AMD TOWARDS BANKRUPTCY 4 A. INDUSTRY DYNAMYCS: WHERE WINNER TAKES IT ALL 4 B. KEY INDUSTRY TRENDS 5 C. MANUFACTURING CAPABILITIES: ONLY FOR THE DEEP POCKETS 7 D. RESTRUCTURING TRANSITION: ELUSIVE GROWTH AVENUES 8 D. NO TRUCE IN THE BUDGET SEGMENT AS COMPETITION INTENSIFIES 9 III. BUSINESS FUNDAMENTALS FALLING APART 10 A. PRODUCT PIPELINE: NOT MUCH EXCITEMENT AHEAD 10 B. INNOVATION CONSTRAINED: NO R&D, NO PARTY 12 C. TECHNOLOGY BETS – MISUNDERSTANDING THE POTENTIAL 13 D. MICROSOFT & SONY ILLUSORY WIN: A BITE FROM THE WRONG APPLE 14 IV. VALUATION AND FINANCIALS 17 A. LIQUIDITY ANALYSIS 17 B.
    [Show full text]
  • Perspectives on the Semiconductor Industry
    San Jose State University SJSU ScholarWorks Faculty Publications, School of Management School of Management 1-1-2008 Historical, Entrepreneurial and Supply Chain Management: Perspectives on the Semiconductor Industry William Y. Jiang San Jose State University, [email protected] X. Quan S. Zhou Follow this and additional works at: https://scholarworks.sjsu.edu/org_mgmt_pub Part of the Business Commons Recommended Citation William Y. Jiang, X. Quan, and S. Zhou. "Historical, Entrepreneurial and Supply Chain Management: Perspectives on the Semiconductor Industry" International Journal of Innovation and Technology Management (2008): 1-18. https://doi.org/10.1142/S0219877010001805 This Article is brought to you for free and open access by the School of Management at SJSU ScholarWorks. It has been accepted for inclusion in Faculty Publications, School of Management by an authorized administrator of SJSU ScholarWorks. For more information, please contact [email protected]. Historical, Entrepreneurial and Supply Chain Management Perspectives on the Semiconductor Industry William Y. Jiang, Xiaohong Quan, Shu Zhou San José State University, Department of Organization and Management San José, CA 95192-0070 USA Abstract This paper studies the semiconductor industry from three perspectives: historical, entrepreneurial and supply chain management. After a brief introduction, the paper begins by tracing the history and evolution of the semiconductor industry including the two seminal enterprises: Shockley Semiconductor Laboratory and Fairchild Semiconductor. Starting from the invention of the transfer resistor (transistor) by three Nobel laureates (John Bardeen, Walter Houser Brattain and William Shockley), the founding of the “most successful failure” in Silicon Valley, Shockley Semiconductor Laboratory and the Fairchild Eight, the paper discusses some earliest entrepreneurial attempts in the industry and how these attempts influenced over seventy semiconductor companies in Silicon Valley, including Intel Corporation, National Semiconductor and Advanced Micro Devices.
    [Show full text]
  • 2002 Annual Report United Microelectronics Corporation
    United Microelectronics Corporation 2002 Annual Report Corporate Information Spokesperson Chitung Liu Finance Division Director 886 (2) 2700 6999 [email protected] Deputy Spokesperson Sandy Yen The Chairman and President’s Office Senior Manager 886 (2) 2700 6999 [email protected] Sheng Yui Wang Finance Division Deputy Director 886 (2) 2700 6999 [email protected] Printed on March 25, 2003 United Microelectronics Corporation 2002 Annual Report Annual Report Contents 4 Letter to Shareholders 8 Corporate Overview 32 Operations Overview 50 Unconsolidated Financial Review 92 Consolidated Financial Review 138 Review and Analysis of Financial Position, Operating Results, and Risk Management and Evaluation 144 Special Disclosures 156 US GAAP Adjusted Financial Statements 2 3 Corporate Overview Financial Review Review and Analysis of Financial Position, Operating 9 Corporate Profile Unconsolidated Financial Review Results, and Risk Manage- ment and Evaluation 11 Corporate Organization 51 Condensed Balance Sheets 18 Capital and Shares 52 Condensed Statements of 139 Analysis of Financial Position Income 24 Corporate Bonds 140 Analysis of Operating Results 53 Financial Analysis 27 Preferred Stock 141 Liquidity Analysis 54 Supervisors’ Report 28 American Depositary 142 Major Capital Expenditures Receipts 55 Report of Independent and Sources of Funding Auditors 30 Employee Stock Option 143 Analysis for Investment Certificates 56 Balance Sheets 143 Risk Management and 58 Statements of Income Evaluation 59 Statements of Changes in Operations Overview
    [Show full text]