Redefining the Foundry Model Panel Discussion at ITAC - GSA Norm Armour Vice President and General Manager, Fab 8 Overview

ƒ The endless march of technology ƒ Increasing complexity and cost in manufacturing ƒ An industry in transition ƒ The shift from regional to global

ƒ Creating a sustainable model ƒ Collaboration essential to innovation ƒ The next evolution in the industry ƒ From contract manufacturing to collaborative manufacturing

April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 2 Leading-Edge Technology Adoption

CPUs and GPUs still drive transitions, but wireless devices are not far behind 2009 Market Volume (No. of end-consumer devices) 1B 180nm+ 130nm 90nm 65nm 45nm 32nm Process linewidth Media Phone

500M

MPU Set-Top Boxes IGP Chipset

Digital Still 250M Cameras Smart Phone Discrete MP3 Players GPU Video game – Handheld & console 100M Personal & portable stereos Voice Only Phone

Source: Bridge & GLOBALFOUNDRIES analysis, iSuppli Mobile Handset Tracker; iSuppli Consumer Platforms Market Tracker , Mercury Reports GPU, Gartner Reports GPU April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 3 Chip Design: An Industry in Transition

ƒ Chipmakers need to keep pace with tech and focus on design ƒ …while the cost of manufacturing and R&D continue to grow

2003-2007 2008-2011 2012 onwards Increasing complexity Process R&D Cost Fab Start-up Cost USD Millions Comparison ~$1300M USD Millions ~$4.5 to $6.5B ~$600 ~$3.5 to to $4.5B $900M ~$310 ~$2.5 to to $3.0B $400M 90-65 nm 45-32 nm 22-12 nm 90-65 nm 45-32 nm 22-12 nm

(1) Industry average for Logic process R&D; (2) Average capex of 300mm Logic fabs in World Fab Watch database. Source: In-Stat 1/07, World Fab Watch; analyst reports; press clippings.

April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 4 The First Truly Global Foundry

Global Manufacturing and Support Footprint

Dresden, Germany Munich, Germany

London, UK Yokohama, Saratoga, NY Japan Headquarters Shanghai, East China Si Valley, CA Fishkill, NY Hsinchu, Austin, TX Taiwan

Singapore

Manufacturing Centers Sales and Support Offices Saratoga, New York Dresden, Germany Singapore The New GLOBALFOUNDRIES

ƒ Headquartered in Silicon Valley Singapore ƒ Approximately 10,000 employees ƒ Spanning three continents across 12 locations ƒ 300mm Fabs in Singapore, Germany, New York ƒ 200mm Fabs in Singapore

ƒ One of the World’s Largest Foundries ƒ 2009 revenue of ~$2.5B US ƒ 150 Customers including many of the world’s largest IC companies

ƒ The New Leader in Foundry Technology and Service Germany ƒ Substantial Time-to-volume advantage for advanced technologies New York ƒ Driving the Global Standard for new technologies ƒ Full foundry offering from mainstream to leading edge with Value-Added Solutions ƒ Committed to Best-in-Class customer service State-of-the-Art 300mm Fabs

Fab 1 in Germany Fab 7 in Singapore Fab 8 in New York

• 45nm and below • 130nm to 40nm • 28nm and below

• 300mm wafers • 300mm wafers • 300mm wafers • 60,000 wafers/month • 50,000 wafers/month • 42,000 wafers/month

• Production Now • Production Now •Groundbreaking July 2009 • Production ramping 2012

Global foundry capacity expansion minimizes geographic risk 200mm Fabs in Singapore

Fab 2 Fab 3/5 Fab 6 Fab 3E

• Production • Production • Production • Production Technology 0.6um-0.35um 0.35um-0.18um 0.18um-0.11um 0.18um

• 50,000 • 54,000 • 45,000 • 34,000 Capacity wafers/month wafers/month wafers/month wafers/month

• Production • Production • Production • Production Timing Now Now Now Now

Automotive Qualified with High Voltage, Non-Volatile and RF Options A Model for Shared Innovation

ƒ Shared objectives ƒ Early-stage leading-edge R&D ƒ Production-ready process technologies

ƒ Shared investments ƒ Advanced manufacturing resources ƒ Diverse teams collaborating ƒ Face-to-face and virtual

ƒ Shared returns ƒ Accelerated access to advanced technologies ƒ Experience from early, high-volume production to refine processes ƒ Rich partner/IP eco-system to support leading-edge adoption Collaborative Innovation in Action

2000 2002 2003 2004 2006 2008 2010 180nm 130nm 130nm 90nm 65nm 45nm 32/28nm

Cu Interconnect Low-K dielectric SOI Strained-Si Multi-Strain Transistor Immersion Lithography Gate First HKMG

Cu Cu A long list of technology “firsts” in volume manufacturing and customer products Ultra Low-K

April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 10 Technologies and Value-Added Solutions

High NVM (OTP, eFlash SiGe Logic RF CMOS Voltage MTP, E2PROM) SONOS BiCMOS SOI

22/20nm

32/28nm

45/40nm

65nm

90nm

0.13um

0.18um

0.25um

0.35um

>0.5um

In Development Available

Note: Information above is subject to change, please contact your GLOBALFOUNDRIES representative for the latest information Enabling Time-to-Market Leadership

ƒ As complexity of chip design increases, 45/40nm Production Ramp manufacturing partnerships become 300mm Wafers Shipped per Quarter (1000’s) ever more critical ƒ Closely collaborative foundry relationships are essential to enabling

smooth and rapid time to market 45nm ƒ GLOBALFOUNDRIES’ time-to-volume is unmatched in the foundry industry – 45nm ramp far ahead of rest of foundry industry – High-volume, complex x86 CPU drives yield learning for other customers 40nm - Other Leading – Initial 32nm HKMG production Foundries* running now in Fab 1

*Market data compiled by International Business Strategies 12 April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL Continued Innovation Demands a New Approach

Design and manufacturing must work in unison ƒBringing a highly integrated model to foundry ƒ Extension of customer operations ƒ Early customer-foundry engagement ƒ Close collaboration, joint technology development ƒEnable faster time to market ƒ Smooth ramps to mature yields ƒ Speed, accuracy, and agility ƒRequires committed investment ƒ Technology, capacity, capabilities ƒ Enable global scale and service

Design, technology and manufacturing tightly coupled for success of customer solutions

April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 13 Fab 8, Moduel 1 Fab 8: March 2010 Fab 8: March 2010 Fab 8: possible campus build out design

Campus 222.45 acres

Fab8 m1 (Ph2) 2 le u d (90k sqft) o m 8 b a F

Fab8 m1 (Ph1) (210k sqft) le3 Fab8 modu

Module 1 currently under construction. There is room on the campus to build Modules 2 & 3, but those phases are not yet planned. Thank You!

GLOBALFOUNDRIES, the GLOBALFOUNDRIES logo and combinations thereof are trademarks of GLOBALFOUNDRIES Inc. in the United States and/or other jurisdictions. Other names used in this presentation are for identification purposes only and may be trademarks of their respective owners.

©2010 GLOBALFOUNDRIES Inc. All rights reserved. Chip Design Increasing in Complexity

Llano: One of the most complex dies ever created ƒ Advanced performance-enhancement and power-management techniques now required ƒ Complex manufacturing process ƒ 32nm SOI technology ƒ Gate First High-K Metal Gate ƒ 4 CPU cores ƒ High performance GPU ƒ >1 billion transistors ƒ >11 Metal layers ƒ >2nd generation immersion lithography ƒ Power management innovations (2.5W to 25W)

April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 19 Continuous Innovation Required

ƒ Innovation in thinking ƒ Performance-per-watt, battery life, parallel computing, virtualization, visual computing, small form factor ƒ Innovation in design ƒ Multiple cores, CPU/GPU integration, embedded memory, power management, system-level architecture ƒ Innovation in manufacturing and technology ƒ New materials, transistor structures, 3D stacking, immersion/EUV lithography, ultra-low k dielectrics, High-k Metal Gate

Despite technical challenges, biggest hurdle to continued innovation is economics

April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 20 Collaborative Approach to Advanced Technology

ƒ Industry collaboration to drive the global standard for High K Metal Gate (HKMG) with seven world-leading product companies

ƒ Total alignment in ƒ High K materials stack ƒ Detailed fabrication steps ƒ Specific design rules ƒ Specific transistor models Gate-First ƒ Design enabling ecosystem with Reference High-K Metal Gate Flows and IPs flowing from multiple industry leaders

April 29, 2010 GLOBALFOUNDRIES CONFIDENTIAL 21 The World’s First Truly Global Foundry

Global Manufacturing Operations Fab 2, 3, 3e, 5, 6 Mainstream 200mm manufacturing campus Woodlands, Singapore Tampines, Singapore

Fab 8 Future leading-edge 300mm manufacturing Saratoga County, NY

Fab 1 Fab 7 Leading-edge 300mm Mainstream 300mm manufacturing campus manufacturing campus Dresden, Germany Woodlands, Singapore Fab 8 Fab 8: Why upstate New York?

Education Economics

Ecosystem Fab 8: July 2009 Fab 8: December 2009 Fab 8: Economic Impact

ƒ Construction: ƒ 1.3 million square feet ƒ $880 million in construction costs ƒ 130 different construction bid packages ƒ 5 million man hours to complete ƒ 1,600 new construction jobs ƒ additional 2,700 local construction-related jobs ƒ Operations: ƒ 1,200 to 1,400 new direct manufacturing jobs ƒ annual payroll of more than $80 million ƒ 5,000 in-direct jobs, ƒ annual payroll of more than $200 million ƒ Total average annual payroll $288 million Fab 8: concrete foundation Fab 8: vertical concrete walls Fab 8: vertical concrete walls Fab 8: first steel roof trusses Fab 8: close-up of steel roof trusses Fab 8: Waffle Table Fab 8: March 2010 Fab 8: Rendering of Phase 1 Fab 8: potential Phase2 expansion completion - 300k ft-2 (27.9k m-2)

P

h

a

s

e

1

P

h

a

s

e

2 Fab 8: February 2010 Fab 8