Market Dynamics Fuel Semiconductor Evolution

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Market Dynamics Fuel Semiconductor Evolution Global Semiconductor Alliance ENABLING THE AUTOMOTIVE DESIGN CHAIN WITH VIRTUALIZATION CLOUD COMPUTING EVOLUTION: DISRUPTING THE IT SUPPLY CHAIN IP INNOVATION: AT THE CORE OF CONSUMER ELECTRONICS DESIGN SHIFT IN CONSUMER FOCUS DRIVES EVOLUTION OF THE SEMICONDUCTOR INDUSTRY ONSHORE SILICON FOR LONG-TERM SUPPLY SECURITY: FOUNDRY SELECTION FOR MILITARY APPLICATIONS Market Dynamics Fuel Semiconductor Evolution Vol.17 No.2 June 2010 Published by GSA $60 (U.S.) 1 The First Truly Global Foundry Congratulations to the new GLOBALFOUNDRIES, the merged operations of GLOBALFOUNDRIES and Chartered. To our continued mutual success from your Global Customers and Partners ARTICLES CONTENTS 2 Enabling the Automotive Design Chain with Virtualization Frank Schirrmeister, Director, Product Marketing, System-level Solutions, Synopsys Inc. ACCELERATE THE Mark Williams, Director, Solutions Marketing, Synopsys Inc. GROWTH AND 6 Cloud Computing Evolution: Disrupting the IT Supply Chain Chris Weitz, Director, Technology Strategy and Architecture, Deloitte Consulting LLP INCREASE THE John La Bouff, Senior Manager, Deloitte Consulting LLP RETURN ON 10 IP Innovation: At the Core of Consumer Electronics Design Frank Ferro, Director, Marketing, Sonics Inc. INVESTED CAPITAL 15 Shift in Consumer Focus Drives Evolution of the Semiconductor Industry OF THE GLOBAL John Brewer, Vice President, Corporate and Business Development, SiGe Semiconductor SEMICONDUCTOR 19 Onshore Silicon for Long-term Supply Security: Foundry Selection for Military Applications INDUSTRY BY Kirk Peterson, CFD Foundry Manager, ON Semiconductor FOSTERING A MORE 24 Integrated Power Management Platforms: The Entry of Fabless Design Houses to Power Management System Design EFFECTIVE FABLESS Dr. Shye Shapira, Director, Research and Development, Power Management Platforms, TowerJazz Todd Mahlen, Director, Marketing, Power Management Platforms, TowerJazz ECOSYSTEM Dr. Avi Strum, Vice President and General Manager, Specialty Product Line, TowerJazz THROUGH 27 Multiplexed Energy Metering AFEs Ease ASIC Integration and Provide Significant Cost Reduction COLLABORATION, Christian Domingues, Analog Designer, Dolphin Integration INTEGRATION AND 31 The Convergence of Home, Office and Mobile Networking Dave Kelf, President and Chief Executive Officer, Sigmatix Inc. INNOVATION. 34 Cleantech: What It Means for Semiconductors Sanjay Krishnan, Business Manager, High-performance Analog Group, Maxim Integrated Products ▪▪Address the 36 How Many Pieces of Pie Do You Want? challenges and Michael Morgan, Industry Analyst, Mobile Devices, ABI Research enable industry-wide 38 Introduction to and Benefits of 3-D IC Technology solutions within Herb Reiter, President, eda2asic Consulting Inc. the supply chain, including intellectual property (IP), IN EVERY ISSUE electronic design automation 4 Semiconductor Member News (EDA)/design, wafer manufacturing, test 8 Foundry Focus and packaging 13 Back-End Alley ▪▪Provide a platform 17 Supply Chain Chronicles for meaningful 21 Global Market Trends global collaboration 26 Industry Reflections ▪▪Identify and 29 Global Insights articulate market opportunities 35 Private Showing 40 Innovator Spotlight ▪▪Encourage and support INTERESTED IN CONTRIBUTING TO THE GSA FORUM? entrepreneurship To contribute an article or submit product or company announcements, contact: Chelsea Boone, Managing Editor, [email protected]. To advertise, contact: Monica Dominguez, Advertising Executive, [email protected]. ▪▪Provide members with comprehensive FOR MORE INFORMATION CONTACT and unique market Lisa Tafoya, GSA Forum Executive Editor, [email protected] ▪ GSA ▪ 12400 Coit Road, Suite 650, intelligence Dallas, TX 75251 ▪▪phone 888.322.5195 ▪ fax 972.239.2292 MISSION AND VISION STATEMENT Enabling the Automotive Design Chain with Virtualization Frank Schirrmeister, Director, Product Marketing, System-level Solutions, Synopsys Inc. Mark Williams, Director, Solutions Marketing, Synopsys Inc. s recent headlines clearly indicate, the automotive industry Hardware IP providers are focused on component architecture is struggling to manage the exploding growth of electronics analysis and feature definition. The main objective is to get “designed Acontent and complexity. Already, 40 percent of vehicle cost in” by semiconductor houses. To achieve this, hardware IP providers is attributed to electronics and software, and 50 to 70 percent of must seek early feedback from their customers and perform early electronic control unit (ECU) development cost is due to software. As architecture analysis for hardware/software systems. While hardware a result of this dramatic increase in software content and complexity, IP providers have traditionally only focused on hardware, today, they meeting quality and reliability standards today requires analysis and need to ensure that their components—like processors—interact diagnosis of complex hardware/software problems and a change in appropriately with the software that’s executing on them early in the development methodology. process, or even provide essential software support. In addition, the automotive industry is challenged by an increasing Semiconductor suppliers have similar concerns in terms of need to reduce design cycle times and cost. Results from a 2008 conducting component architecture analysis and improving the Dupont study showed that 32 percent of respondents indicated that likelihood of being “designed in” by their customers—the sub- “cost reduction” was the number one challenge facing the automotive system suppliers. Even more so than hardware IP providers, they are design and engineering community. When asked what improvement expected to take full responsibility for device drivers and operating would be needed to strengthen the industry, an overwhelming 53 system (OS) porting to their chips. As a result, they are increasingly percent of users responded with “increase[d] collaboration across the concerned about delivering software as early as possible. They are value/design chain.” seeking new ways to advance software development to earlier project When combining these results with the increasing amount of stages and to increase software development productivity. electronics content in vehicles and the dominance of processor-based Sub-system suppliers are mostly concerned about the quality, electronics within that content, software becomes the central issue to reliability and cost of their sub-systems. Given the large percentage which the challenges of cost reduction and collaboration must relate. of ECU cost contributed by software development, early start of software development and its productivity are of special concern The Automotive Design Chain to sub-system suppliers. Before committing to semiconductor Figure 1 shows a simplified diagram of the automotive design chain. providers, they like to validate the architecture of ECUs and their It is comprised of hardware intellectual property (IP) providers, semiconductor content. Overall, sub-system suppliers have the semiconductor vendors, sub-system suppliers and system integrators. following concerns: reducing product development cycle time; All of them interact with software suppliers of IP and tools, and improving quality by testing as much as possible and using more have specific technical and business concerns when it comes to systematic test methodologies; improving software development collaboration and interaction amongst them. productivity and reducing cost by shortening bench time; and Figure 1. Automotive Design Chain reducing the need for hardware prototypes. Finally, system integrators are concerned about software Software IP / Software Suppliers Independent Software Developers: development productivity, quality, reliability and cost. They must Operating Systems: WindRiver, Linux, ecos, itron Development Tools: WindRiver, Lauterbach, Greenhills, Etas, DSpace do software integration often across multiple communicating ECUs. The earlier they can get access to software development environments System Integrators Companies Hardware IP Semiconductor Sub-system Suppliers with models representing what the supply chain will provide to Processors: ARM, MIPS, Bosch BMW PPC, X86, Tensilica, ARC, Continental Toyota ST MeP, CEVA Magneti Marelli Honda them, the better! Freescale Interconnect: Arteris, Denso GM Infineon Sonics, Silistix Delphi Chrysler ... Peripherals: Synopsys, Visteon Ford Virtualization—Dealing with Embedded Software Denali ... ... Mechatronic systems, or systems with interaction between mechanical components, electronics and software, represent the most complex, daunting challenges in the automotive design chain Processor & Sub-system Hardware Developers today. The interaction between all of these domains and the resulting Users & IP Developer Programmers number of variants that must be analyzed make it impractical to wait 2 for a true prototype to start the verification process. Virtual platforms and deploy virtual platforms and models. Software development have been used for some time to allow for the early development of platforms typically support the SystemC TLM 2.0 interface software on a virtualized version of the target hardware. Application Programming Interface (API) standard and include a A virtual platform is a fully functional computer model of a SystemC simulator. Similarly, mechatronic style platforms typically hardware design that encompasses a single- or multi-core system- utilize the very high-speed IC hardware description language-analog/ on-chip (SOC),
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