(NASDAQ: ASML) Recommendation: Long I Current Stock Price
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Remuneration Policy for the Board of Management of Asml Holding N.V
REMUNERATION POLICY FOR THE BOARD OF MANAGEMENT OF ASML HOLDING N.V. (VERSION 2021) Remuneration Policy for the Board of Management of ASML Holding N.V. (version 2021) Public Board of Management Remuneration Policy 2021 This remuneration policy for the Board of Management of ASML Holding N.V. (“BoM”) applies as from January 1, 2021 onwards. The remuneration policy was approved by the Supervisory Board (“SB”) of ASML, upon recommendation of its Remuneration Committee (“RC”) and adopted by the General Meeting (“GM”) on 29 April 2021. The Works Council exercised its right to cast its advisory vote prior to adoption. Remuneration as a strategic instrument The remuneration policy supports the long-term development and strategy of the Company in a highly dynamic environment, while aiming to fulfill all stakeholders’ requirements and keeping an acceptable risk profile. More than ever, the challenge for us is to drive technology, to serve our customers and to satisfy our stakeholders. These drivers are embedded in the identity, mission and values of ASML and its affiliated enterprises and are the backbone of the remuneration policy. The SB ensures that the policy and its implementation are linked to the Company’s objectives. The objective of the remuneration policy is to enable ASML to attract, motivate and retain qualified industry professionals for the BoM in order to define and achieve our strategic goals. The policy acknowledges the internal and external context as well as our business needs and long-term strategy. The policy is designed to encourage behavior that is focused on long-term value creation and the long-term interests and sustainability of the Company, while adopting the highest standards of good corporate governance. -
United States District Court for the Western District of Texas Waco Division
Case 6:20-cv-01211 Document 1 Filed 12/31/20 Page 1 of 83 UNITED STATES DISTRICT COURT FOR THE WESTERN DISTRICT OF TEXAS WACO DIVISION Ocean Semiconductor LLC, Civil Action No.: 6:20-cv-1211 Plaintiff JURY TRIAL DEMANDED v. PATENT CASE NVIDIA Corporation (“NVIDIA”), Defendant. COMPLAINT FOR PATENT INFRINGEMENT Plaintiff Ocean Semiconductor LLC (“Ocean Semiconductor” or “Plaintiff”) files this Complaint against NVIDIA Corporation (“NVIDIA” or “Defendant”), seeking damages and other relief for patent infringement, and alleges with knowledge to its own acts, and on information and belief as to other matters, as follows: NATURE OF THE ACTION 1. This is an action for patent infringement arising under the Patent Laws of the United States, 35 U.S.C. § 1 et seq. THE PARTIES 2. Plaintiff Ocean Semiconductor is a limited liability company organized and existing under the laws of the State of Delaware, and its registered agent for service of process in Delaware is Rita Carnevale, 717 N. Union Street, Wilmington, DE 19805. Case 6:20-cv-01211 Document 1 Filed 12/31/20 Page 2 of 83 3. On information and belief, Defendant NVIDIA is a corporation organized and existing under the laws of Delaware, with its principal place of business at 2701 San Tomas Expressway, Santa Clara, CA 95050. NVIDIA is registered with the State of Texas and may be served with process through its registered agent, Corporation Service Company d/b/a CSC- Lawyers Incorporating Service Company, 211 E. 7th St., Suite 620, Austin, TX 78701. On information and belief, NVIDIA has a regional office in this District, including at least at 11001 Lakeline Blvd., Building 2, Suite 100, Austin, TX 78717. -
Product Engineer Program Apply Now the Product/Test Engineers at Texas Instruments Are Powered by a Passion for Continual Improvement
Product Engineer Program Apply Now The Product/Test Engineers at Texas Instruments are powered by a passion for continual improvement. Our solutions make a real difference, and yours will, too. We make the semiconductor product design process easier and faster, which helps our customers succeed in today's fast-paced marketplace. Opportunities are available in North America and Asia. About the job In this role, you will work on the development and implementation of strategies that achieve profitability targets on assigned TI product lines through a variety of new product development, cost reduction, capacity expansion and yield enhancement projects. You will serve as the primary point of contact for all operational aspects related to your assigned product portfolio, resolve customer quality and application issues, and facilitate cross- functional teams for problem solving. You will also take a leadership role to establish relationships with key contacts in TI wafer fabrication and assembly manufacturing sites to ensure strong communication and effective problem solving. About the program In this empowering, two-year rotation program, you will be on an accelerated development track that’s focused on the product development cycle. As a program participant, you will rotate through four six-month assignments centered on improving product efficiency and quality, which contributes directly to the company’s bottom line. Here, you will have the opportunity to establish solid customer relationships and make deep and meaningful connections. You will also have the chance to be mentored and develop strong collaboration skills through cross-functional group interaction and international travel. Program participants begin with a two-week orientation. -
From Sand to Circuits
From sand to circuits By continually advancing silicon technology and moving the industry forward, we help empower people to do more. To enhance their knowledge. To strengthen their connections. To change the world. How Intel makes integrated circuit chips www.intel.com www.intel.com/museum Copyright © 2005Intel Corporation. All rights reserved. Intel, the Intel logo, Celeron, i386, i486, Intel Xeon, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. 0605/TSM/LAI/HP/XK 308301-001US From sand to circuits Revolutionary They are small, about the size of a fingernail. Yet tiny silicon chips like the Intel® Pentium® 4 processor that you see here are changing the way people live, work, and play. This Intel® Pentium® 4 processor contains more than 50 million transistors. Today, silicon chips are everywhere — powering the Internet, enabling a revolution in mobile computing, automating factories, enhancing cell phones, and enriching home entertainment. Silicon is at the heart of an ever expanding, increasingly connected digital world. The task of making chips like these is no small feat. Intel’s manufacturing technology — the most advanced in the world — builds individual circuit lines 1,000 times thinner than a human hair on these slivers of silicon. The most sophisticated chip, a microprocessor, can contain hundreds of millions or even billions of transistors interconnected by fine wires made of copper. Each transistor acts as an on/off switch, controlling the flow of electricity through the chip to send, receive, and process information in a fraction of a second. -
Intel and ASML Reach Agreements to Accelerate Key Next-Generation Semiconductor Manufacturing Technologies
July 9, 2012 Intel and ASML Reach Agreements to Accelerate Key Next-Generation Semiconductor Manufacturing Technologies NEWS HIGHLIGHTS ● Intel commits €829 million (approximately $1.0 billion) to ASML's research and development programs to help accelerate deployment of new technologies for 450-millimeter (mm) wafers and extreme ultra-violet (EUV) lithography by as much as two years ● Intel to also initially purchase 10 percent of pre-transaction issued shares of ASML for €1.7 billion (approximately $2.1 billion) and commit to purchase an additional 5 percent of post-transaction issued shares as part of ASML's program to enable minority investments of up to a 25 percent equity stake to its largest customers ● R&D funding and equity investment agreements totaling €3.3 billion (approximately $4.1 billion) ● Continued research and development in the field of lithography is critical to the long-term growth of the semiconductor industry SANTA CLARA, Calif.--(BUSINESS WIRE)-- Intel Corporation today announced it has entered into a series of agreements with ASML Holding N.V. intended to accelerate the development of 450-millimeter (mm) wafer technology and extreme ultra-violet (EUV) lithography totaling €3.3 billion (approximately $4.1 billion). The objective is to shorten the schedule for deploying the lithography equipment supporting these technologies by as much as two years, resulting in significant cost savings and other productivity improvements for semiconductor manufacturers. To achieve this, Intel is participating in a multi-party development program that includes a cash contribution by Intel to fund relevant ASML research and development (R&D) efforts as well as equity investments in ASML. -
Monthly Holdings: U.S. Technology Leaders Strategy
J.P. Morgan U.S. Technology Leaders Strategy As of August 31, 2021 Sector Ticker Security Name Percent Autos & Transportation VRM VROOM INC 0.72% TSLA TESLA INC 2.59% Autos & Transportation Sub Total 3.31% CASH & CASH EQUIVALENTS USD United States Dollar 1.83% CASH & CASH EQUIVALENTS Sub Total 1.83% Consumer Cyclical BKNG BOOKING HOLDINGS INC 1.55% Consumer Cyclical Sub Total 1.55% Financial Services SHOP SHOPIFY INC - CLASS A 0.42% SQ SQUARE INC - A 1.44% PYPL PAYPAL HOLDINGS INC 1.74% Financial Services Sub Total 3.60% Industrial Cyclical APH AMPHENOL CORP-CL A 1.34% Industrial Cyclical Sub Total 1.34% Insurance LMND LEMONADE INC 0.88% Insurance Sub Total 0.88% Media NFLX NETFLIX INC 0.75% UBER UBER TECHNOLOGIES INC 1.08% SNAP SNAP INC - A 1.13% TTD TRADE DESK INC/THE -CLASS A 1.20% TTWO TAKE-TWO INTERACTIVE SOFTWRE 1.38% AMZN AMAZON.COM INC 1.57% ESTC ELASTIC NV 1.64% ROKU ROKU INC 1.71% LYFT LYFT INC-A 1.74% MELI MERCADOLIBRE INC 1.75% DIS WALT DISNEY CO/THE 1.84% TWTR TWITTER INC 2.10% GOOG ALPHABET INC-CL C 4.37% FB FACEBOOK INC-CLASS A 4.67% Media Sub Total 26.92% Pharm/MedTech DXCM DEXCOM INC 1.46% Pharm/MedTech Sub Total 1.46% Semi & Hardware AMBA AMBARELLA INC 0.39% OLED UNIVERSAL DISPLAY CORP 0.65% CFLT CONFLUENT INC-CLASS A 0.87% AMAT APPLIED MATERIALS INC 0.92% J.P. Morgan U.S. Technology Leaders Strategy As of August 31, 2021 Sector Ticker Security Name Percent RBLX ROBLOX CORP -CLASS A 0.95% AFRM AFFIRM HOLDINGS INC 1.07% CREE CREE INC 1.12% MRVL MARVELL TECHNOLOGY INC 1.19% ENTG ENTEGRIS INC 1.31% MKSI MKS INSTRUMENTS INC -
Po R Tfo Lio C O M M En Ta
2Q21 Global & International Equity Global Research Growth Equity Market Environment • Global equity markets ended the second quarter with solid gains, despite concerns about the strength of the economic recovery. • Progress on vaccine distribution brightened the prospect that the pandemic is nearing an end and that reopenings of various parts of the economy would progress. However, some countries, particularly emerging markets nations, continued to experience delays in vaccine rollouts. • Rising inflation and the prospect of higher interest rates triggered volatility in markets, where leadership fluctuated between stocks perceived as value oriented and those perceived as growth oriented. Anxiety about the potential for rate hikes eased after the Federal Reserve (Fed) reiterated it is in no rush to tighten monetary policy. Performance Summary For the quarter ended June 30, 2021, the Portfolio outperformed its benchmark, the MSCI All Country World Growth IndexSM. The strong performance of select consumer and communications holdings lifted relative results. Conversely, weak stock selection within the health care and financials sectors weighed on results. PORTFOLIO For detailed performance information, please contact a Janus Henderson Institutional team representative. Portfolio Discussion On an individual stock basis, top relative contributors included software firm Adobe. The stock benefited from quarterly earnings results that surpassed consensus COMMENTARY estimates across all areas of the business on both the top and bottom lines. We view the continued strong demand that Adobe has enjoyed in its creative, document and experience cloud business segments as supportive of our thesis that growth is sustainable beyond the pandemic. The Blackstone Group also contributed. Notable increases in fee-related earnings and solid fundraising helped the investment firm log strong first quarter financial results. -
Wafer Fabrication: Factory Performance and Analysis Series: the Springer International Series in Engineering and Computer Science, Vol
L.F. Atherton, R.W. Atherton Wafer Fabrication: Factory Performance and Analysis Series: The Springer International Series in Engineering and Computer Science, Vol. 339 This book is concerned with wafer fabrication and the factories that manufacture microprocessors and other integrated circuits. With the invention of the transistor in 1947, the world as we knew it changed. The transistor led to the microprocessor, and the microprocessor, the guts of the modern computer, has created an epoch of virtually unlimited information processing. The electronics and computer revolution has brought about, for better or worse, a new way of life. This revolution could not have occurred without wafer fabrication, and its associated processing technologies. A microprocessor is fabricated via a lengthy, highly-complex sequence of chemical processes. The success of modern chip manufacturing is a miracle of technology and a tribute to the hundreds of engineers who have contributed to its development. This book will delineate the magnitude of the accomplishment, and present methods to analyze and predict the performance of the factories that make the chips. The set of topics covered juxtaposes several disciplines of engineering. A primary subject is the chemical engineering aspects of the electronics industry, an industry typically thought to be strictly 1996, XX, 468 p. an electrical engineer's playground. The book also delves into issues of manufacturing, operations performance, economics, and the dynamics of material movement, topics often considered the domain of industrial engineering and operations research. Hopefully, Printed book we have provided in this work a comprehensive treatment of both the technology and the factories of wafer fabrication. -
Advanced Micro Devices (AMD)
Strategic Report for Advanced Micro Devices, Inc. Tad Stebbins Andrew Dialynas Rosalie Simkins April 14, 2010 Advanced Micro Devices, Inc. Table of Contents Executive Summary ............................................................................................ 3 Company Overview .............................................................................................4 Company History..................................................................................................4 Business Model..................................................................................................... 7 Market Overview and Trends ...............................................................................8 Competitive Analysis ........................................................................................ 10 Internal Rivalry................................................................................................... 10 Barriers to Entry and Exit .................................................................................. 13 Supplier Power.................................................................................................... 14 Buyer Power........................................................................................................ 15 Substitutes and Complements............................................................................ 16 Financial Analysis ............................................................................................. 18 Overview ............................................................................................................ -
NXP Welcomes E. Meurice As New Non-Executive Director
NXP Welcomes E. Meurice as New Non-Executive Director March 28, 2014 EINDHOVEN, THE NETHERLANDS -- (Marketwired) -- 03/28/14 -- NXP Semiconductors N.V. (NASDAQ: NXPI) announced that today's Extraordinary General Meeting of Shareholders resolved to appoint Mr. Eric Meurice as non-executive director in the Board of Directors, effective April 1, 2014. Mr. Meurice is until March 31, 2014 the Chairman of ASML Holding NV, the world's leading provider of lithography systems for the semiconductor industry. From 2004 to 2013 he was the CEO of ASML. Mr. Meurice also gained extensive technology experience in the semiconductor industry between 1984 and 1994, first at Intel, in the micro-controller group, and then at ITT Semiconductors Group, a leader then in video and audio DSP integrated circuits. "I am excited to be able to welcome Eric Meurice as non-executive director," said Sir Peter Bonfield, Chairman of the Board of Directors of NXP. "He brings a tremendous amount of semiconductor industry expertise and experience to our Board of Directors. With his appointment, the majority of our board consists of independent directors." About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $4.82 billion in 2013. Find out more at www.nxp.com. Forward-looking Statements This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations and market data, as well as other statements that are not historical facts. -
Daily Chip Clips
EQUITY RESEARCH INDUSTRY UPDATE January 22, 2021 Daily Chip Clips SUMMARY TECHNOLOGY/SEMICONDUCTORS & COMPONENTS ■ EUV Equipment to Boost ASML Sales in 2021 (Digitimes) ■ Qualcomm Rolls Out New 7nm 5G Smartphone Chip (EE Times) ■ MediaTek Launches 6nm 5G SoC Chips (Digitimes) ■ Nehalem Lead Architect Returns to Intel, Inspired by New CEO (Tom's Hardware) KEY POINTS ■ With TSMC and Samsung Electronics stepping up the development of their sub-5nm process technologies, ASML will continue to see strong extreme ultraviolet (EUV) lithography equipment sales boost its overall revenue this year, according to market sources. TSMC is expected to acquire about 18 sets of EUV equipment in 2021, said the sources, adding that Samsung and Intel will also make further purchases of such tools to advance their manufacturing technologies. ■ Qualcomm has rolled out its new Snapdragon 870 series to further enhance its 5G smartphone chip lineup. The new 5G chip is built using TSMC's 7nm process technology. The 870 5G mobile platform is a follow-on to the flagship Snapdragon 865 Plus, which features a Qualcomm Kryo 585 CPU prime core clock speed of up to 3.2 GHz. ■ MediaTek has unveiled its new Dimensity 1200 and 1100 5G smartphone SoC series built using 6nm process technology. MediaTek disclosed that the new Dimensity 1200 has already received TUV Rheinland certification for its 5G performance, with tests covering 72 real-world scenarios. The certification verifies that the chipset provides reliable, high-performance 5G connectivity and offers users high-quality 5G experiences across a wide variety of scenarios, the chipmaker said. ■ In a sign that Intel's efforts to rebuild its engineering corps might be swift under the new incoming CEO, Glenn Hinton, the lead architect of Intel's Nehalem processors and several other programs, announced that he is returning to the company after a three-year retirement. -
Monthly Holdings: U.S. Large Cap Equity Strategy
J.P. Morgan U.S. Large Cap Equity Strategy As of August 31, 2021 Sector Ticker Security Name Percent Autos & Transportation UNP UNION PACIFIC CORP 1.23% NSC NORFOLK SOUTHERN CORP 1.50% Autos & Transportation Sub Total 2.74% Basic Materials PPG PPG INDUSTRIES INC 0.86% LIN LINDE PLC 2.18% Basic Materials Sub Total 3.05% Big Banks & Brokers BAC BANK OF AMERICA CORP 1.29% SCHW SCHWAB (CHARLES) CORP 1.31% AXP AMERICAN EXPRESS CO 1.64% WFC WELLS FARGO & CO 1.88% MS MORGAN STANLEY 2.29% Big Banks & Brokers Sub Total 8.41% CASH & CASH EQUIVALENTS USD United States Dollar 1.07% CASH & CASH EQUIVALENTS Sub Total 1.07% Consumer Cyclical HLT HILTON WORLDWIDE HOLDINGS IN 0.77% BKNG BOOKING HOLDINGS INC 1.46% Consumer Cyclical Sub Total 2.23% Consumer Stable MDLZ MONDELEZ INTERNATIONAL INC-A 0.80% PEP PEPSICO INC 1.11% Consumer Stable Sub Total 1.91% Energy COP CONOCOPHILLIPS 0.59% PXD PIONEER NATURAL RESOURCES CO 0.91% Energy Sub Total 1.49% Financial Services WEX WEX INC 0.96% FISV FISERV INC 1.52% PYPL PAYPAL HOLDINGS INC 2.45% MA MASTERCARD INC - A 2.53% Financial Services Sub Total 7.47% Health Services & Systems UNH UNITEDHEALTH GROUP INC 2.77% Health Services & Systems Sub Total 2.77% Industrial Cyclical SWK STANLEY BLACK & DECKER INC 0.67% AME AMETEK INC 0.74% DE DEERE & CO 0.88% WCN WASTE CONNECTIONS INC 0.91% IR Ingersoll Rand INC COMMON STOCK 0.99% ETN EATON CORP PLC 1.06% J.P. Morgan U.S.