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Qualcomm Makes First Call with Chips Using TSMC's 45 Nm Technology

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Qualcomm Makes First Call with Chips Using TSMC's 45 Nm Technology November 13, 2007 Qualcomm Makes First Call With Chips Using TSMC's 45 nm Technology - Advanced Semiconductor Process Technology Is Enabling Smaller, Faster, More Power-efficient Wireless Devices - SAN DIEGO, Nov. 13 /PRNewswire-FirstCall/ -- Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that it has made the first phone call on a 3G chip manufactured with 45 nanometer (nm) process technology. The next generation of CMOS semiconductor manufacturing, 45 nm technology enables chips that feature higher speeds, lower power consumption and enhanced integration, all with reduced die cost by providing more die per wafer. Qualcomm's call was made on the first 45 nm chips received from Taiwan Semiconductor Manufacturing Company (TSE: 2330, NYSE: TSM), the world's largest dedicated semiconductor foundry. "Thanks to our close strategic foundry partner relationship with TSMC, Qualcomm is able to leverage leading-edge semiconductor process technology to advance wireless communications," said Steve Mollenkopf, senior vice president of product management for Qualcomm CDMA Technologies. "This milestone call demonstrates our progress toward bringing to market a new generation of chips that will provide users with unprecedented performance and capabilities." "The first-time silicon success of Qualcomm's 3G product using TSMC's 45 nm process is a testament to the integrated foundry model that calls for end- to-end collaboration. The concurrent design and technology efforts between the two companies has resulted in faster time to market," said Mark Liu, senior vice president of operations II at TSMC. "The confluence of Qualcomm's excellent designs and TSMC's robust technologies and manufacturing will continue to assure future silicon success." Qualcomm recently taped out on its low-power-optimized 45 nm process using advanced immersion lithography and extreme low-k inter-metal dielectric material. This process technology provides competitive performance, as well as significant cost efficiency, decreased leakage and increased integration. The Company is also developing 40 nm process technology, which should deliver even greater benefits in semiconductor performance, cost and efficiency. Qualcomm Incorporated (http://www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2007 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM. Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of CDMA components on a timely and profitable basis, the extent and speed to which CDMA is deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 30, 2007, and most recent Form 10-Q. Qualcomm is a registered trademark of Qualcomm Incorporated. All other trademarks are the property of their respective owners. Qualcomm Contacts: Kira Lee Golin, Qualcomm CDMA Technologies Phone: 1-858-845-7571 Email: [email protected] Tina Asmar, Corporate Communications Phone: 1-858-845-5959 Email: [email protected] John Gilbert, Investor Relations Phone: 1-858-658-4813 Email: [email protected] SOURCE Qualcomm Incorporated.
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