2007 Financial Mario Rivas Analyst Day Executive Vice President, Computing Solutions Group December 13, 2007 Agenda

2007 Reflection

Computing Solutions Update

Roadmap Update

Summary

222 December 13, 2007 2007 Financial Analyst Day AMD Leading the Way

Performance and Across all the New form factors performance-per- screens of your life watt

Notebook and Emerging market desktop PC mix shift. Server consolidation. opportunities and convergence - x86

3 December 13, 2007 2007 Financial Analyst Day Customers Are Responding

2002 Today (12/2007) Customer Desktop Notebook Server/WS Desktop Notebook Server/WS

Dell

HP IBM-Lenovo Acer Toshiba N/A N/A Fujitsu/Fujitsu-Siemens Apple NEC Gateway/eMachines Sony N/A N/A Founder Tong Fang

Buys AMD CPU products Does not buy AMD CPU products Buys AMD graphics and/or chipset products

4 December 13, 2007 2007 Financial Analyst Day Design Win Momentum Continues

5 December 13, 2007 2007 Financial Analyst Day SW 2007 Reflection

Challenges • Quad-core execution • Some OEM server relationships delivered lower than expected • Q107 Channel engagement

Accomplishments • Worldwide notebook position strong and getting stronger • Leading in Retail North America – desktop and notebook • Overall market share growth • Continued growth in China • ASPs trending up • Platform solutions and performance benchmarks • Richer mix of solutions

666 December 13, 2007 2007 Financial Analyst Day AMD WW Revenue Dollars and Unit Market Share Desktop Notebook

27% 19% 26% 26% 17% 15%

Revenue Units Revenue Units

Server

15% 13.4% 12.8%

Desktop source: AMD Internal Estimates Notebook and Server source: PC Processors and Chipsets 4Q07, Mercury Research

Revenue Units

7 December 13, 2007 2007 Financial Analyst Day AMD PC Market Share: Greater China Unit Market Share

(Q1-Q3)

Source: IDC 8 December 13, 2007 2007 Financial Analyst Day 2008 Worldwide CSG Market Opportunity CPU & Chipset Revenue Dollars

Consumer Systems Commercial Systems Desktop Rev $6.6B Rev $9.3B

Notebook Rev $6.3B Rev $7.5B

Server & Rev $6.7B Workstation

9 December 13, 2007 2007 Financial Analyst Day Network of AMD Opteron™ Platforms

SC 1435 PowerEdge 2970 DL585 PowerEdge PowerEdge 2003 vs. 2008 T105 DL385 6950 X4600 DL365 X2200 DL145 X4500 BL465c X4200/4100 IBM eServer 325 BL685c X2100 xw9400 U20 & U40 WS xw4550

Blade X6220 E-9422R Blade X8420 E-9522R

E-9722R X3455 X3655 E-9232T

X3755 XT3™ LS21 XT4 LS41 1st Generation AMD Opteron™

G5450 RX220 AMD Validated RX330 S1 Solutions BladeFrame R5250 X630 S2 ES and EX

10 December 13, 2007 2007 Financial Analyst Day 2008 Worldwide CSG Market Opportunity CPU & Chipset Revenue Dollars

Consumer Systems Commercial Systems Desktop Rev $6.6B Rev $9.3B

Notebook Rev $6.3B Rev $7.5B

Server & Rev $6.7B Workstation

11 December 13, 2007 2007 Financial Analyst Day We Have Significantly Grown Our Commercial Client Platform Footprint PowerMate VL350 Mobile OptiPlex 740 ThinkCentre A60 i-Select Desktop 3000 J115 D5410 Vostro 1000 2002 Latitude 531 3000 J105 d323 dc5750 YangTian dx5150 QiTian bc1500 KaiTian Blade PC dx2250 DB-V50 dx2255 DB-V60 T5720 HP Compaq 6515b AMD HP Compaq 6715b Validated Solutions Esprimo E Series, E5615/6 AcerPower M6 Esprimo AcerPower 1000 P Series, TravelMate P5615/6 LifeBook S2210 7520/7220 Futro S400 LifeBook A3130 TravelMate TravelMate 5520/5220 FMV-D5120 Satellite Pro 4520/4220 A210 12 December 13, 2007 2007 Financial Analyst Day The State of Quad-Core

On track with some large installations of Products the Quad-Core AMD Opteron processor

The Quad-Core AMD Opteron shipments for the Texas Advanced Computing Center (TACC) supercomputing cluster at The University of Texas at Austin have been completed (16,000 pieces)

KISTI – Korea ICC – Poland TLCC – N.A.

Mercury reports more than 39K Quad-Core AMD Opteron processor units shipped in Q3’07

The key strategic OEM’s (Dell, HP, IBM and Sun) will be introducing a broad portfolio of Quad-Core AMD Opteron processor-based platforms starting in Q2 2008 The OEM’s are fully engaged and very focused in quickly bringing these products to market We continue to expect slight Server revenue growth in Q4 as Quad- Core sales will compensate for the decline of Dual-Core products

13 December 13, 2007 2007 Financial Analyst Day The State of Quad-Core

AMD is shipping hundreds of thousands Products of Quad-Core processors

AMD shipped tens of thousands of Quad-Core processors in Q3 ‘07

AMD is shipping hundreds of thousands of Quad-Core processors to the server and desktop segments

We are taking the most reasonable approach to deliver Quad-Core AMD Opteron processors as soon as possible

Our #1 goal is to accelerate volume ramp in Q1 ‘08

14 December 13, 2007 2007 Financial Analyst Day Birth of a New Category: Accelerated Processing Unit (APU)

Multiple homogenous Dual-Core AMD Products CPU CPU cores Phenom™ Processor

Multiple homogenous ATI Radeon™ HD GPU GPU cores 3800 Series

Northbridge with Chipset integrated graphics and AMD 790FX Chipset Southbridge I/O

Integration of CPU cores and various Codenamed “Swift” APU acceleration cores

15 December 13, 2007 2007 Financial Analyst Day Birth of a New Category: Accelerated Processing Unit (APU)

Products First APU Family: Codenamed “Swift”

Technology choices for higher Memory Controller confidence production ramp: • AMD “STARS” CPU Cores AMD “STARS” • GPU Core based on existing high-end CPU Cores discrete • Second 45nm product ® Full DirectX GPU • Current SOI design rules Core + UVD • “Griffin”-based Northbridge highly Cache leveraged PCIe Optimized design using more existing IP for less risk and faster time to market in 2H09

16 December 13, 2007 2007 Financial Analyst Day Spider Enthusiast Desktop Platform

The Most Scalable Products Enthusiast Platform Ever

True Quad-Core AMD Phenom™ Shared L3 Cache Platforms CPUs Cool’n’Quiet™ 2.0 HyperTransport™ 3.0

Quad Graphics Ready ATI Radeon HD DirectX® 10.1 & UVD 3800 Graphics PCI Express® 2.0 55nm

42 PCI Express® 2.0 Lanes AMD 790 Chipset Multi-Monitor CrossFireX™ Technology ~ 10W TDP AMD OverDrive™ Utility*

*Overclocking AMD processors will void associated product warranties and may cause damage to the processor and/or other system components.

17 December 13, 2007 2007 Financial Analyst Day Puma Commercial/Consumer Notebook Platform

Exceptional visual performance and power-efficient mobility Products Mobile optimized design Next Generation Dynamic core scaling of Architecture CPU cores and HyperTransport™ Platforms Hybrid Graphics Boosts graphics performance Power efficient in AC/DC w/PowerXpress modes

R6XX-based integrated or discrete GPU DirectX 10 & UVD HD-DVD and Blu-Ray playback

SB700 Flash Native NAND Flash support HyperFlash Flexible implementation

* UVD is not present in all GPUs. Please refer to product specs on ATI.AMD.COM for more information 18 December 13, 2007 2007 Financial Analyst Day Perseus Commercial Desktop Platform Plan

Superior stability and longevity, essential manageability and security, exceptional Products performance and power savings.

Stable and available CPU and Platforms Superior Stability chipset roadmaps and Longevity Extended warranty common AMD64 architecture

Essential Open standards approach with Manageability DASH and TPM and Security AMD-V™ and EVP Enable customer to meet new Energy Star requirement Energy Efficiency Cool’n’Quiet™ 2.0 45W and 65W max processors

Do more in less time with Exceptional multi-core processors Power savings for lower Performance operational costs Future-ready

19 December 13, 2007 2007 Financial Analyst Day Cartwheel Mainstream Consumer Platform

Connectivity, Extendibility and Usability Products for the Mainstream Consumer

UVD & Video-post Platforms processing HD Video Native HDMI/HDCP support

Multi-Monitor CrossfireX ™ AMD 780 Chipset Energy Efficient PCI Express 2.0

Common UI for all entertainment AMD Live!™ Explorer Leverages CPU and GPU performance

Native quad- and triple- Multi-Core Processing quad core Cool ‘n’ Quiet™ 2.0

20 December 13, 2007 2007 Financial Analyst Day Server/Workstation Roadmap

65 nm 45nm

Platform Segment 2007 2008 2009

“Barcelona”“Barcelona” “Shanghai”“Shanghai” “Montreal”“Montreal” Quad-CoreQuad-Core Quad-CoreQuad-Core Octal-Octal- & & Quad-Quad- ••512K512K L2/CoreL2/Core ••512K512K L2/CoreL2/Core CoreCore CPU ••2M2M L3L3 ••6M6M L3L3 ••1M1M L2/coreL2/core ••RDDR2RDDR2 ••RDDR2RDDR2 ••6-12M6-12M L3L3 ••3x3x HyperTransport™HyperTransport™ 1 1 ••3x3x HyperTransportHyperTransport 1 1 ••DDR-3DDR-3 ••AMD-V™AMD-V™ ••AMD-VAMD-V ••4x4x HyperTransportHyperTransport 3 3 ••IPCIPC EnhancementsEnhancements ••AMD-VAMD-V

NvidiaNvidia nForce nForce Pro Pro 36003600 AMDAMD RD890SRD890S Chipset BroadcomBroadcom HT-2100/HT-1100HT-2100/HT-1100 AMDAMD RD870SRD870S AMDAMD SB700SSB700S

Workstation:Workstation: R600R600 ATIATI FireGL™FireGL™ and and ATIATI FireMV™FireMV™ Workstation:Workstation: R700R700 ATIATI FireGLFireGL GPU && ATIATI FireFire MVMV Server:Server: ATIATI ES-1000ES-1000 Server:Server: ATIATI ES-1000ES-1000 Enterprise DP/MP Platforms Enterprise

Socket F (1207) Socket G3 “Piranha” Platform Socket F (1207) Socket G3 “Piranha” ••HyperTransport™HyperTransport™ 1 1 ••HyperTransportHyperTransport 3 3 ••DDR-2DDR-2 ••DDR-3DDR-3 (Direct(Direct oror Buffered)Buffered)

21 December 13, 2007 2007 Financial Analyst Day AMD Notebook Platform Roadmap 2008-2009

Platform 2008 2009 Segment “Puma” Platform “Shrike” Platform “Griffin”“Griffin” “Swift”“Swift” CPU/APU •• Mobile Mobile OptimizedOptimized MemoryMemory ControllerController •• Gen Gen 33 “STARS”“STARS” CPU CPU CoreCore •• Power Power OptimizedOptimized HyperTransportHyperTransport TMTM 3.03.0 •1•1 GPUGPU CoreCore •Enhanced•Enhanced •• DDR3 DDR3 AMDAMD PowerNow!PowerNow!TMTMtechnologytechnology •• 45nm 45nm •S1•S1 •FS1•FS1

RS780MRS780M Chipset SB700SB700 NextNext GenerationGeneration SouthbridgeSouthbridge

M8xM8x Discrete M9xM9x GPU HybridHybrid GraphicsGraphics

802.11802.11 a/b/g/na/b/g/n 802.11802.11 a/b/g/na/b/g/n 3G3G Infrastructure 3G3G DASHDASH DASHDASH UWBUWB

22 December 13, 2007 2007 Financial Analyst Day Commercial Mainstream Platform Roadmap 2008-2009

Platform Segment 2008 2009

“Perseus”“Perseus” Platform Platform “Kodiak”“Kodiak” Platform Platform “Toliman”“Toliman” and and “Kuma”“Kuma” “Propus”“Propus” “Heka” “Heka” and and •Quad,•Quad, TripleTriple andand DualDual CoreCore “Regor” CPU “Regor” •65nm •65nm •• Quad Quad andand TripleTriple CoreCore •2M L3 •2M L3 •45nm•45nm •DDR2 • DDR2 •• DDR3 DDR3 •HT 3.0 •HT 3.0 •HT•HT 3.03.0 •AMD-V •AMD-V •AMD-V•AMD-V •AM2+ Package •AM2+ Package •• AM3 AM3 PackagePackage

RS780RS780 RS780RS780 Chipset SB700SB700 SB700+SB700+

OptionalOptional R6xxR6xx FamilyFamily OptionalOptional R7xxR7xx FamilyFamily HybridHybrid GraphicsGraphics HybridHybrid GraphicsGraphics GPU Commercial Desktop

Windows Vista Premium Logo capable Windows Vista Premium Logo capable AM3AM3 MotherboardsMotherboards AM2+ Motherboards Infrastructure AM2+ Motherboards PlannedPlanned EnergyEnergy StarStar 4.04.0 TierTier Planned Energy Star 4.0 Compliance Planned Energy Star 4.0 Compliance 22 ComplianceCompliance DASH 1.0, TPM DASH 1.0, TPM DASHDASH 1.x,1.x, TPMTPM

23 December 13, 2007 2007 Financial Analyst Day Consumer Mainstream Platform Roadmap 2008-2009

Platform Segment 2008 2009

“Cartwheel”“Cartwheel” Platform Platform “Cartwheel”“Cartwheel” Refresh Refresh PlatformPlatform “Toliman”“Toliman” and and “Kuma”“Kuma” “Propus” “Heka” and “Regor” CPU “Propus” “Heka” and “Regor” •• Quad,Quad, Triple,Triple, DualDual CoreCore •• Quad,Quad, Triple,Triple, DualDual CoreCore •• 65nm 65nm •• 45nm 45nm •• DDR2 DDR2 •DDR3• DDR3 •HT•HT 3.03.0 •HT•HT 3.03.0 •AMD-V™•AMD-V™ •AMD-V•AMD-V •AM2+•AM2+ PackagePackage •• AM3 AM3 PackagePackage

RS780RS780 RS780RS780 Chipset SB700SB700 SB800SB800

OptionalOptional R6xxR6xx FamilyFamily OptionalOptional R7xxR7xx FamilyFamily HybridHybrid GraphicsGraphics HybridHybrid GraphicsGraphics GPU Mainstream Desktop

VistaVista PremiumPremium LogoLogo capablecapable AM3AM3 MotherboardsMotherboards Infrastructure AM2+AM2+ MotherboardsMotherboards PlannedPlanned EnergyEnergy StarStar 4.04.0 PlannedPlanned EnergyEnergy StarStar 4.04.0 ComplianceCompliance ComplianceCompliance

24 December 13, 2007 2007 Financial Analyst Day Consumer Enthusiast Platform Roadmap 2008-2009

Platform Segment 2007 2008 2009 “Spider”“Spider” Platform Platform “Leo”“Leo” Platform Platform “Leo”“Leo” Refresh Refresh PlatformPlatform AMDAMD Phenom™Phenom™ “Deneb”“Deneb” and and ••QuadQuad CoreCore “Propus” CPU “Propus” “Deneb”“Deneb” and and “Propus”“Propus” •65nm •65nm •• QuadQuad andand TripleTriple CoreCore •• QuadQuad andand TripleTriple CoreCore •DDR2 •DDR2 •• 45nm 45nm •• 45nm 45nm ••HTHT 3.03.0 •• DDR2 DDR2 •• DDR3 DDR3 •2MB Shared L3 •2MB Shared L3 •HT•HT 3.03.0 •HT•HT 3.03.0 •AM2+ Package •AM2+ Package •AMD-V•AMD-V •AMD-V•AMD-V •AM2+•AM2+ PackagePackage •• AM3 AM3 PackagePackage

AMDAMD 7-Series7-Series AMDAMD 790FX,790FX, 790790 andand 770770 RD8xxRD8xx FamilyFamily Chipset Multi-MonitorMulti-Monitor ATIATI chipsetschipsets SB800SB800 CrossFireX™CrossFireX™ AMDAMD Overdrive™Overdrive™ SB700SB700 PCIPCI ExpressExpress 2.02.0

ATIATI RadeonRadeon HD HD 38003800 ATIATI R6xxTMR6xxTM ATIATI R7xxR7xx FamilyFamily GPU SeriesSeries ATIATI CrossFireXCrossFireX with with GDDR3/GDDR4 RD790 Enthusiast Desktop GDDR3/GDDR4 RD790 DX10.1DX10.1 && UVDUVD

WindowsWindows Vista®Vista® Premium Premium WindowsWindows Vista®Vista® Premium Premium AM3AM3 MotherboardsMotherboards LogoLogo capablecapable LogoLogo capablecapable IOMMUIOMMU I/OI/O VirtualizationVirtualization Infrastructure AM2+AM2+ MotherboardsMotherboards AM2+AM2+ MotherboardsMotherboards HyperTransport™HyperTransport™ 3.0 3.0 HyperTransport™HyperTransport™ 3.0 3.0 HyperTransport™HyperTransport™ 3.0 3.0

25 December 13, 2007 2007 Financial Analyst Day 2008 Summary

We will…

11 …Get quad-core execution on track

22 …Focus heavily on roadmap execution

33 …Drive platform value and portfolio growth

44 …Grow share and ASPs to increase margins

55 …Optimize supply chain and capacity

26 December 13, 2007 2007 Financial Analyst Day Cautionary Statement These presentations contain forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current expectations, assumptions and beliefs and involve numerous risks and uncertainties that could cause actual results to differ materially from expectations. These forward-looking statements should not be relied upon as predictions of future events as we cannot assure you that the events or circumstances reflected in these statements will be achieved or will occur. Forward-looking statements in these presentations relate to, among other things, product and technology introduction schedules, product features, future manufacturing capacity plans, manufacturing yields, manufacturing strategy, average selling price, gross margins and operating margins. The material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: that Intel Corporation’s pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities targeting the company’s business will prevent attainment of the company’s current plans; the company will require additional funding and may not be able to raise funds on favorable terms or at all; the company’s cost reduction efforts will not be effective; customers stop buying the company’s products or materially reduce their operations or demand for its products; the company will be unable to develop, launch and ramp new products and technologies in the volumes and mix required by the market and at mature yields on a timely basis; the company’s competitors, customers and suppliers may take actions that will negate the anticipated benefits of the company’s acquisition of ATI; demand for computers and consumer electronics products and, in turn, demand for the company’s products will be lower than currently expected; global business and economic conditions will worsen; there will be unexpected variations in market growth and demand for the company’s products and technologies in light of the product mix that it may have available at any particular time or a decline in demand; the company will be unable to transition to advanced manufacturing process technologies in a timely and effective way, consistent with planned capital expenditures; the company will be unable to maintain the level of investment in research and development and capacity that is required to remain competitive; and the company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will under-utilize its microprocessor manufacturing facilities.

Because our actual results may differ materially from our plans and expectations today, we encourage you to review our filings with the Securities and Exchange Commission, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended September 29, 2007.

27 December 13, 2007 2007 Financial Analyst Day Trademark Attribution

AMD, the AMD Arrow logo and combinations thereof are trademarks of Advanced Micro Devices, Inc. in the United States and/or other jurisdictions. Other names used in this presentation are for identification purposes only and may be trademarks of their respective owners.

©2007 Advanced Micro Devices, Inc. All rights reserved.

28 December 13, 2007 2007 Financial Analyst Day