Desktop Nanofabrication with Massively Multiplexed Beam Pen Lithography
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Nanolithography Activity in the Group: BG Group and AKR Group Has Extensive Activities in the Area of Nanolithography
Nanolithography activity in the group: BG group and AKR group has extensive activities in the area of nanolithography. The work is done in a Clean room of the centre which has been established with support from the Nanomission Projects. The clean room is class 10,000 class room which is maintained at class 1000 in specific areas. The facilities in the clean room allow optical lithography, electron beam lithography (EBL) and focused ion beam (FIB) lithography. Visit of the Honourable Union Minister for Science and Technology and Earth rd Science to the Bose Centre Clean room on 3 May, 2015 (Standing in front of Helios machine, 2nd from left ) One of the activities that is carried out on a routine basis is to integrate sub- 100nm nanowire of any material produced by bottom-up approach like chemical route or physical/chemical vapour deposition to a single nanowire device connected to 2 or 4 probes. Integrating the rich materials base of bottom-up approach with nano-lithograhic process is regularly done . For attaching nanowires to prefabricated contact pads for opt-electronic or electronic measurements in addition to EBL –lift off, FIB or Focused electron beam deposited metals (Pt or W) are also used. The group has done extensive work in the area of interface physics. Cross-sectional lamella using ion-beam lithographic technique is done on regular basis. WO 3/Pt/Si 30 µµµm TEM Lamella preparation of a nanowire grown Omni probe lifting off the sample on substrate using Ion-beam lithography Interface analysis of X-TEM Specimen: Partially/non aligned NWs- Interface cross section c Ankita Ghatak, Samik Roy Moulik Barnali Ghosh, RSC Adv. -
Maskless Lithography Using Silicon Oxide Etch- Stop Layer Induced by Megahertz Repetition Femtosecond Laser Pulses
Maskless lithography using silicon oxide etch- stop layer induced by megahertz repetition femtosecond laser pulses Amirkianoosh Kiani,1 Krishnan Venkatakrishnan,1 Bo Tan,2,* and Venkat Venkataramanan3 1Department of Mechanical and Industrial Engineering, Ryerson University, 350 Victoria Street, Toronto, Ontario M5B 2K3, Canada 2Department of Aerospace Engineering, Ryerson University, 350 Victoria Street, Toronto, Ontario M5B 2K3, Canada 3Institute for Optical Sciences, University of Toronto, 60, St. George Street, Suite 331, Toronto, Ontario M5S 1A7, Canada *[email protected] Abstract: In this study we report a new method for maskless lithography fabrication process by a combination of direct silicon oxide etch-stop layer patterning and wet alkaline etching. A thin layer of etch-stop silicon oxide of predetermined pattern was first generated by irradiation with high repetition (MHz) ultrafast (femtosecond) laser pulses in air and at atmospheric pressure. The induced thin layer of silicon oxide is used as an etch stop during etching process in alkaline etchants such as KOH. Our proposed method has the potential to enable low-cost, flexible, high quality patterning for a wide variety of application in the field of micro- and nanotechnology, this technique can be leading to a promising solution for maskless lithography technique. A Scanning Electron Microscope (SEM), optical microscopy, Micro-Raman, Energy Dispersive X-ray (EDX) and X- ray diffraction spectroscopy were used to analyze the silicon oxide layer induced by laser pulses. ©2011 Optical Society of America OCIS codes: (220.3740) Lithography; (220.4000) Microstructure fabrication; (320.7090) Ultrafast lasers; (350.3850) Materials processing; (350.5340) Photothermal effects. References and links 1. -
Maskless Laser-Write Lithography of A-Si:H TFT Passive Pixel Sensor for Hemispherical Imager By
Maskless Laser-Write Lithography of a-Si:H TFT Passive Pixel Sensor for Hemispherical Imager by Geonwook Yoo A dissertation submitted in partial fulfillment of the requirements for the degree of Doctor of Philosophy (Electrical Engineering) in The University of Michigan 2011 Doctoral Committee: Professor Jerzy Kanicki, Chair Professor Peter F. Green Professor Kensall D. Wise Associate Professor Jamie D. Phillips © Geonwook Yoo 2011 Acknowledgements I sincerely appreciate Prof. Jerzy Kanicki, my research advisor and doctoral committee chair, for his support and guidance throughout my graduate study. It was a great and precious opportunity for me to work with him on this exciting project. I am deeply grateful for my doctoral committee members, Prof. Kensall D. Wise, Prof. Peter F. Green, and Prof. Jamie D. Phillips for their help in completing my thesis. I also truly thank Daniela Radtke at Fraunhofer Institute for Applied Optics and Precision Engineering in Germany, Tae-Kyung Won at AKT America, Inc., Sandro Tedde at Siemens AG TC, and Werner Salewski at Heidelberg Instrument. A large portion of the success of this work is attributed to their collaboration and advice. My special thanks belong to Daniela for her help on laser-write lithography. I express my gratitude to all LNF staffs, especially to Brian VanDerElzen. I thank my current and previous group members: Gwanghyeon Baek, Dr. Hojin Lee, Dr. Alex Kuo, Dr. Tze-ching Fung, Dr. Charlene Chen, and Dennis Feng. It was their support and friendship that helped me to get through the course of graduate study. In addition I am very grateful to all my seniors and friends both in U.S and Korea for their belief and support. -
Bilayer, Nanoimprint Lithography Brian Faircloth Nuvonyx, Inc., Bridgeton, Missouri 63044 Henry Rohrs Washington University, St
Bilayer, nanoimprint lithography Brian Faircloth Nuvonyx, Inc., Bridgeton, Missouri 63044 Henry Rohrs Washington University, St. Louis, Missouri 63130 Richard Tiberio Cornell University, Ithaca, New York 14853 Rodney Ruoff Washington University, St. Louis, Missouri 63130 Robert R. Krchnaveka) Rowan University, Glassboro, New Jersey 08028 ͑Received 3 May 1999; accepted 21 April 2000͒ Nanoimprint lithography has been shown to be a viable means of patterning polymer films in the sub-100 nm range. In this work, we demonstrate the use of a bilayer resist to facilitate the metal liftoff step in imprinter fabrication. The bilayer resist technology exhibits more uniform patterns and fewer missing features than similar metal nanoparticle arrays fabricated with single layer resist. The bilayer resist relies upon the differential solubility between poly͑methyl methacrylate͒ and poly͑methyl methacrylate methacrylic acid copolymer͒. Evidence is presented that shows the technique has a resolution of better than 10 nm. © 2000 American Vacuum Society. ͓S0734-211X͑00͒03104-8͔ I. INTRODUCTION tion demonstrated in the polymer resist layer. The formation of patterned metal layers is one application. Finely patterned Due to the inevitable transition from the microelectronic metal layers are used as interconnects in integrated circuits. to the nanoelectronic age, the demand for sub-100 nm fea- They can also be used as catalysts for subsequent layer ture sizes in lithographic techniques will increase greatly. As growth. If the subsequent metal layers cannot readily be current devices rapidly approach the 100 nm barrier, the mi- etched, e.g., due to crystalline dependent etching rates, an croelectronics industry is considering several technologies to additive approach such as liftoff is desirable. -
Electron Beam Lithography for Nanofabrication
Departament de Física, Facultat de Ciències Universitat Autònoma de Barcelona January 2008 ElectronElectron beambeam lithographylithography forfor NanofabricationNanofabrication PhD Thesis by Gemma Rius Suñé Directed by Francesc Pérez-Murano and Joan Bausells Institut de Microelectrònica de Barcelona -------------------------------------------- The cover image corresponds to a PMMA residual found after the stripping of the resist layer. Even though it seems a new planet, it is 1µm in diameter. -------------------------------------------- This memory reflects part of the work performed at the Nanofabrication Laboratory of the IMB–CNM during the past 5 years, based on Electron Beam Lithography (EBL). Nanofabrication is a very active area of research, as can be noticed from the number of publications that appear continuously and from the number of running R&D projects. Most of the work is realized in the framework of three European research projects. Novopoly project deals with the development of new polymer materials for applications in micro and nano systems. The development of a new EBL resist is framed in this project. Within NaPa, Emerging Nanopatterning methods, the development of NEMS fabrication with EBL is used to realise discrete nanomechanical devices. They are used to characterize the performance of resonating nanostructures and signal enhancement is achieved by their integration in CMOS circuits. The aim of Charpan is the development of a new patterning tool based on several charged particle species. The incidence of charged particle beams on devices is studied to evaluate potential effects induced during fabrication. Carbon nanotube (CNT) based devices contribute to some tasks of national projects Crenatun and Sensonat. In particular, the technology for fabrication of high performance CNT field-effect transistors and their preparation for sensing applications is established. -
Maskless Exposure Device for Photolithography
International Master’s Degree Programme In Biomedical Engineering DHANESH KATTIPPARAMBIL RAJAN MASKLESS EXPOSURE DEVICE FOR PHOTOLITHOGRAPHY MASTER OF SCIENCE THESIS Examiners: Professor Jukka Lekkala, Professor Jari Hyttinen Subject approved by the Faculty Council on 5th March 2008 by the Faculty of Science and Environmental Engineering II ABSTRACT TAMPERE UNIVERSITY OF TECHNOLOGY International Master’s Degree Programme in Biomedical Engineering KATTIPPARAMBIL RAJAN, DHANESH: Maskless Exposure Device for Photolithography Master of Science Thesis, 96 Pages. May 2008 Major: Medical Physics Examiners: Professor Jukka Lekkala, Professor Jari Hyttinen Keywords: lithography, maskless lithography, MEMS production Photolithography plays a consequential role in transferring patterns from photomasks to substrates and thereby is an important tool in semiconductor, IC, MEMS and many microstructures’ production. The photomasks are preprinted prior to the photolithographic procedure with certain layouts, and these layouts are transferred to surfaces of materials like silicon during the lithography and finally these surfaces undergo chemical processes by which three dimensional micro features are formed. Therefore photomasks containing specific layouts are the inevitable components in the entire procedure, but unfortunately those are expensive in its nature together with time consuming production formalities. Some of the successful attempts to remove these difficulties are cost effective photomasks and maskless lithography. A system named ‘Maskless Exposure Device’ (MED) is introduced here as my thesis related research and it is intended to replace the expensive photomasks. The device transfers images and layouts created on a computer, easily and effortlessly to different substrate surfaces and can be repeatedly used in photolithography by introducing new drawings on the computer screen and thereby, MED is nothing but a maskless lithographic technique. -
High-Throughput Plasmonic Nanolithography
UC Berkeley UC Berkeley Electronic Theses and Dissertations Title High-Throughput Plasmonic Nanolithography Permalink https://escholarship.org/uc/item/93c7w34j Author Pan, Liang Publication Date 2010 Peer reviewed|Thesis/dissertation eScholarship.org Powered by the California Digital Library University of California High-Throughput Plasmonic Nanolithography by Liang Pan A dissertation submitted in partial satisfaction of the requirements for the degree of Doctor of Philosophy in Engineering-Mechanical Engineering in the Graduate Division of the University of California, Berkeley Committee in charge: Professor David B. Bogy, Co-Chair Professor Xiang Zhang, Co-Chair Professor Roberto Horowitz Professor Ming Wu Fall 2010 High-Throughput Plasmonic Nanolithography ©2010 by Liang Pan Abstract High-Throughput Plasmonic Nanolithography by Liang Pan Doctor of Philosophy in Engineering-Mechanical Engineering University of California, Berkeley Professor David B. Bogy, Co-Chair Professor Xiang Zhang, Co-Chair The conventional projection-type photolithography approach to nanoscale manufacturing is facing possibly insurmountable challenges, especially to invent novel technical solutions that remain economical for the next generation of semi-conductor integrated circuits. Although extreme ultra violet (EUV) lithography with the next generation photo-masks and 193-nm immersion lithography with double patterning are expected to deliver 22 nm and smaller nodes, it still cannot effectively address the reliability and cost issues required for mass production. Maskless nanolithography is a potentially agile and cost effective approach, but most of the current solutions have throughputs that are too low for manufacturing purposes. This dissertation reports a new low-cost high-throughput approach to maskless nanolithography that uses an array of plasmonic lenses (PL) that "fly" above the rotating surface to be patterned, concentrating short wavelength surface plasmons into sub-100 nm spots. -
2020 EUVL Workshop – Abstracts
2020 EUVL Workshop June 7-11, 2020 Held Online Workshop Abstracts 2020 EUVL Workshop 2020 EUVL Workshop Sponsors Organized by Vivek Bakshi (EUV Litho, Inc.), Chair Patrick Naulleau (CXRO), Co-Chair www.euvlitho.com 1 2020 EUVL Workshop Contents Abstracts by Paper Numbers ________________________________________ 4 www.euvlitho.com 2 2020 EUVL Workshop Abstracts (Listed by Paper number) www.euvlitho.com 3 2020 EUVL Workshop P1 Lithographic Performance of The First Entirely Dry Process for EUV Lithography Mohammed Alvi1, Dictus Dries1, Richard Gottscho1, Kevin Gu1, Benjamin Kam1, Siva Kanakasabapathy1, Da Li1, Jeffrey Marks1, Katie Nardi1, Thad Nicholson1, Yang Pan1, Daniel Peters1, Al Schoepp1, Nader Shamma1, Easwar Srinivasan1, Samantha Tan1, Clint Thomas1, Boris Volosskiy1, Tim Weidman1*, Rich Wise1, William Wu1, Jun Xue1, Jengyi Yu1, Christophe Fouqu2, Rolf Custers2, Jara Garcia Santaclara2, Michael Kubis2, Gijsbert Rispens2, Lidia van Lent-Protasova2, Mircea Dusa3, Patrick Jaenen3, and Abhinav Pathak3 1LAM Reserach 2ASML 3IMEC The lithographic performance of a new entirely dry EUV photoresist platform will be described. Photoresist films are applied using reactive organometallic precursors in a vapor phase process that provides uniform, homogeneous films stable to air and visible light. EUV exposure and subsequent bake steps induce crosslinking and densification, while unexposed areas remain hydrophobic and freely soluble in common organic solvents. This has facilitated the extensive characterization of lithographic patterning performance using NXE-3400 tools at both IMEC and ASML – initially employing conventional (solvent based) negative tone development (NTD). In contrast to typical spin-on processes, dry deposited film thickness appears insensitive to substrate surface chemistry, making applied film thickness easily controlled/proportional to deposition time. -
Large-Area Nanoimprint Lithography and Applications
Chapter 3 Large-Area Nanoimprint Lithography and Applications Hongbo Lan Additional information is available at the end of the chapter http://dx.doi.org/10.5772/intechopen.72860 Abstract Large-area nanoimprint lithography (NIL) has been regarded as one of the most prom- ising micro/nano-manufacturing technologies for mass production of large-area micro/ nanoscale patterns and complex 3D structures and high aspect ratio features with low cost, high throughput, and high resolution. That opens the door and paves the way for many commercial applications not previously conceptualized or economically feasible. Great progresses in large-area nanoimprint lithography have been achieved in recent years. This chapter mainly presents a comprehensive review of recent advances in large- area NIL processes. Some promising solutions of large-area NIL and emerging methods, which can implement mass production of micro-and nanostructures over large areas on various substrates or surfaces, are described in detail. Moreover, numerous industrial- level applications and innovative products based on large-area NIL are also demon- strated. Finally, prospects, challenges, and future directions for industrial scale large- area NIL are addressed. An infrastructure of large-area nanoimprint lithography is proposed. In addition, some recent progresses and research activities in large-area NIL suitable for high volume manufacturing environments from our Labs are also intro- duced. This chapter may provide a reference and direction for the further explorations and studies of large-area micro/nanopatterning technologies. Keywords: large-area nanoimprint lithography, large-area micro/nanopatterning, full wafer NIL, roller-type NIL, roll-to-plate NIL, roll-to-roll NIL 1. -
SPM Nanolithography Workshop
NISTIR 7040 Workshop Summary Report: Scanning Probe Nanolithography Workshop A workshop sponsored by the Precision Engineering Division, Manufacturing Engineering Laboratory, NIST, under a Research Cooperation Agreement on advanced lithography of functional nanostructures signed in 2001 by the National Microelectronics Center of Spain (CNM), the National Institute of Advanced Industrial Science & Technology (AIST) of Japan, and NIST. John A. Dagata National Institute of Standards & held at Technology NIST, Gaithersburg MD 20899 Hiroshi Yokoyama on National Institute of Advanced November 12 – 13, 2002 Industrial Science & Technology of Japan Francesc Perez-Murano National Microelectronics Center of Spain U.S. DEPARTMENT OF COMMERCE Technology Administration National Institute of Standards & Technology Manufacturing Engineering Laboratory Gaithersburg MD 20899 January 2003 2 EXECUTIVE SUMMARY A workshop on Scanning Probe Microscope (SPM)-based Nanolithography was held at NIST Gaithersburg on November 24-25, 2002. The meeting was sponsored by the Precision Engineering Division, Manufacturing Engineering Laboratory, NIST, under a Research Cooperation Agreement on advanced lithography of functional nanostructures signed in 2001 by the National Microelectronics Center of Spain (CNM), the National Institute of Advanced Industrial Science & Technology (AIST) of Japan, and NIST. The workshop program focused on fundamental studies in nanoscience, the kinetics and modeling of SPM oxidation, and applications to nanotechnology, Fundamental studies included discussions of current measurement during SPM oxidation, measurement of charge & density variation in SPM oxides, control & understanding of the meniscus shape, and 3-D multiphysics modeling of electrostatics, transport, and chemical reaction during SPM oxidation. Applications to nanotechnology included the fabrication of nano-electronics, nano-photonics, nano- electromechanical, and microfluidic devices and systems. -
And Nanolithography Techniques and Their Applications
Review on Micro- and Nanolithography Techniques and their Applications Alongkorn Pimpin* and Werayut Srituravanich** Department of Mechanical Engineering, Faculty of Engineering, Chulalongkorn University, Pathumwan, Bangkok 10330, Thailand E-mail: [email protected]*, [email protected]** Abstract. This article reviews major micro- and nanolithography techniques and their applications from commercial micro devices to emerging applications in nanoscale science and engineering. Micro- and nanolithography has been the key technology in manufacturing of integrated circuits and microchips in the semiconductor industry. Such a technology is also sparking revolutionizing advancements in nanotechnology. The lithography techniques including photolithography, electron beam lithography, focused ion beam lithography, soft lithography, nanoimprint lithography and scanning probe lithography are discussed. Furthermore, their applications are summarized into four major areas: electronics and microsystems, medical and biotech, optics and photonics, and environment and energy harvesting. Keywords: Nanolithography, photolithography, electron beam lithography, focused ion beam lithography, soft lithography, nanoimprint lithography, scanning probe lithography, dip-pen lithography, microsystems, MEMS, nanoscience, nanotechnology, nano-engineering. ENGINEERING JOURNAL Volume 16 Issue 1 Received 18 August 2011 Accepted 8 November Published 1 January 2012 Online at http://www.engj.org DOI:10.4186/ej.2012.16.1.37 DOI:10.4186/ej.2012.16.1.37 1. Introduction For decades, micro- and nanolithography technology has been contributed to the manufacturing of integrated circuits (ICs) and microchips. This advance in the semiconductor and IC industry has led to a new paradigm of the information revolution via computers and the internet. Micro- and nanolithography is the technology that is used to create patterns with a feature size ranging from a few nanometers up to tens of millimeters. -
Extreme Ultraviolet Photoelectron Spectroscopy on Fluorinated Monolayers: Towards Nanolithography on Monolayers
Journal of Photopolymer Science and Technology Volume 33, Number 2 (2020) 229 -234 Ⓒ 2020SPST Communication Extreme Ultraviolet Photoelectron Spectroscopy on Fluorinated Monolayers: towards Nanolithography on Monolayers Olivier Lugier1, Alessandro Troglia1, Najmeh Sadegh1, Luc van Kessel2, Roland Bliem1,3, Nicola Mahne4, Stefano Nannarone4, and Sonia Castellanos1* 1Advanced Research Center for Nanolithography, Science Park 106, 1098XG Amsterdam, the Netherlands 2 Delft University of Technology, Department of Imaging Physics, Lorentzweg 1, 2628 CJ Delft, The Netherlands 3 Institute of Physics, University of Amsterdam, Science Park 904, 1098XH Amsterdam, The Netherlands 4 CNR-IOM, 34149 Trieste, Italy *[email protected] The semiconductor industry plans to keep fabricating integrated circuits, progressively decreasing there features size, by employing extreme ultraviolet lithography (EUVL). With this method, new designs and concepts for photoresist materials need to be conceived. In this work, we explore an alternative concept to the classic photoresist material by using an organic self-assembled monolayer (SAM) on a gold substrate. The monolayer, composed of a richly fluorinated thiol sensitive to low-energy electrons, is adsorbed on the Au substrate which acts as main EUV-absorber and as the source of photoelectrons and secondary electrons. We investigate the stability of the SAM adsorbed on gold towards EUV radiation by means of in-situ photoelectron spectroscopy. The photoelectron spectra indicate that the monolayer attenuates a significant amount of primary electrons generated in the gold layer. The spectral evolution upon EUV irradiation indicates that the SAM loses a significant amount of its initial fluorine content (ca. 40% at 200 mJ/cm2). We attribute these chemical changes mostly to the interaction with the electrons generated in the thiol/Au system.