DOCSLIB.ORG

United Microelectronics Corporation 2020 Annual Report Annual Report

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
United Microelectronics Corporation 2020 Annual Report Annual Report United Microelectronics Corporation 2020 Annual Report Printed on February 24, 2021 UMC Annual Report Information Can Be Accessed from the Following Websites: https://www.umc.com https://mops.twse.com.tw Annual Report TSE Code: 2303 NYSE Symbol: UMC 2020 Spokesperson Fab 8F Securities Dealing Institution Chitung Liu 3 Li-Hsin 6th Rd., Hsinchu Science Park, Hsinchu, Horizon Securities Co., Ltd. Senior Vice President and Taiwan 30078, R.O.C. Stock Registration Department Chief Financial Officer 886 (3) 578 2258 3F, No.236 Hsin-Yi Rd. Sec. 4, Taipei, Taiwan 886 (2) 2658 9168 10680, R.O.C. [email protected] Fab 8S 886 (2) 2326 8818 16 Creation 1st Rd., Hsinchu Science Park, http://www.honsec.com.tw Acting Spokesperson(s) Hsinchu, Taiwan 30077, R.O.C. Jinhong Lin 886 (3) 578 2258 ADR Depositary and Registrar Finance Division J.P. Morgan Depositary Receipts Senior Director Fab 12A 383 Madison Avenue, 11th Floor 886 (2) 2658 9168 18, 20 Nan-Ke 2nd Rd., & 57 Nan-Ke 3rd Rd., New York, NY 10179, U.S.A. [email protected] Southern Taiwan Science Park, Sinshih, Tainan, General Contact：1 (800) 990 1135 Taiwan 74147, R.O.C. Outside the USA：1 (651) 453 2128 David Wong 886 (6) 505 4888 http://www.adr.com Finance Division Manager Singapore Branch ADR Exchange Marketplace 886 (2) 2658 9168 3 Pasir Ris Drive 12, Singapore 519528 NYSE Euronext [email protected] 65 6213 0018 11 Wall Street, New York, NY 10005, U.S.A. Subsidiary in Mainland China Headquarters 1 (212) 656 3000 HJ 3 Li-Hsin 2nd Rd., Hsinchu Science http://www.nyse.com 333 Xinghua St., Suzhou Industrial Park, Suzhou, Park, Hsinchu, Taiwan 30078, R.O.C. Ticker/Search Code: UMC 886 (3) 578 2258 Jiangsu Province 215025, P.R.C. 0512 65931299 Euro Convertible Bond Exchange Taipei Office Marketplace Subsidiary in Mainland China 8F, 68 Sec. 1, Neihu Rd., Taipei, Taiwan Singapore Exchange Securities Trading USCXM 11493, R.O.C. Limited 899 Wan Jia Chun Road, Xiang’an District, Xiamen, 886 (2) 2658 9168 2 Shenton Way Fujian Province, P.R.C. #02-02 SGX Centre 1 0592 7687888 Fab 8A Singapore 068804 3, 5 Li-Hsin 2nd Rd., Hsinchu Science 65 6236 8888 Subsidiary in Japan Park, Hsinchu, Taiwan 30078, R.O.C. USJC http://www.sgx.com 886 (3) 578 2258 ECB Search Code: ISIN XS1228110000 3-1 Kinko-cho, Kanagawa-ku, Yokohama, Kanagawa, Japan Fab 8C & Fab 8D Auditors 81 45 620 2682 6, 8 Li-Hsin 3rd Rd., Hsinchu Science Ernst & Young, Taiwan Park, Hsinchu, Taiwan 30078, R.O.C. Wan-Ju Chiu, Hsin-Min Hsu Wavetek 886 (3) 578 2258 9F, No. 333, Sec. 1 Keelung Road, 10 Chuangxin 1st Rd., Hsinchu Science Park, Taipei, Taiwan 11012, R.O.C. Fab 8E Baoshan Township, Hsinchu, 886 (2) 2757 8888 17 Li-Hsin Rd., Hsinchu Science Park, Taiwan 30076, R.O.C. http://www.ey.com Hsinchu, Taiwan 30078, R.O.C. 886 (3) 578 1259 886 (3) 578 2258 Corporate Website https://www.umc.com United Microelectronics Corporation | Annual Report 2020 Table of Contents Letter to Shareholders 4 Capital Overview 99 100 Capital and Shares Corporate Profile 8 106 Issuance of Corporate Bonds 9 Corporate Profile and Date of Establishment 111 Preferred Shares 10 Corporate Milestones 112 American Depositary Receipts 114 Employee Stock Option Handling Status 114 Issuance of New Restricted Employee Shares Corporate Governance Report 13 115 Status of New Shares Issuance in Connection with 14 Corporate Organization Mergers and Acquisitions 16 Directors’ and Managers’ Information 115 Financing Plans and Execution Status 37 Corporate Governance Practices 93 Certified Public Accountant (CPA) Fee Information Operations Overview 120 93 Information of CPA Change 121 Business Activities 93 UMC’s Chairman, Presidents, Chief Financial Officer, and 128 Overview of Market, Production, and Sales Managers in Charge of Its Finance and Accounting Operations Did Not Hold Any Positions in UMC’s Independent Auditing Firm or Its 134 Employees Affiliates in the Most Recent Year 135 Environmental Expenditure Information 94 Change in Shareholding of Directors, Managers and Major 135 Labor Relations Shareholders Who Own 10% or More of UMC Shares 139 Major Contracts 96 Relationship Among the Top 10 Shareholders 97 Shares Held by the Company, Directors, Managers and Companies Directly or Indirectly Controlled by the Company, and the Comprehensive Shareholding Ratio Based on Combined Calculation 2 Review of Financial Position, Operating 141 Financial Review 182 Results, Risk Management 183 Condensed Balance Sheets 142 Financial Position 185 Condensed Statements of Comprehensive Income 143 Financial Performance 187 Financial Analysis 144 Cash Flow 191 Audit Committee’s Review Report 144 Major Capital Expenditures from Recent Years and 192 Financial Statements – Consolidated Impact on Company’s Finance and Business 269 Financial Statements – Parent Company 144 Main Reasons and Improvement Plans for Recent Annual Reinvestment Policies and Profit or Loss, and Investment Plans for the Coming Year 145 Risk Management and Evaluation 154 Other Necessary Supplements Social Responsibility 155 156 Description of Corporate Social Responsibility 158 About Social Charity 162 Environmental Protection, Safety and Health Management Instructions Special Disclosures 168 169 Summary of Affiliated Enterprises 181 Issuance of Private Placement Securities 181 Acquisition or Disposal of UMC Shares by Subsidiaries 181 Other Necessary Supplements 181 Disclosures of Events Which May Have a Significant Influence on Stockholders’ Equity or Share Price, in Compliance with Item 3, Paragraph 2 in Article 36 of the Securities and Exchange Law of the R.O.C. 3 Dear Shareholders, In 2020, global confirmed cases and deaths from COVID-19 continued to rise, dealing the economy a major setback and significantly impacting people’s lives. UMC’s management team addressed this unsteady situation by imposing corporate safety policies that met or exceeded those set forth by the government, confronting the epidemic head-on with our employees and working together to maintain normal operations and stable growth. 2020 Business Summary After adjusting UMC’s business strategy, the company has transformed Advanced Technologies Development into a semiconductor foundry leader focusing on specialty technologies. UMC’s advanced technology platforms including 14FFC (14nm FinFET We accomplished this by first strengthening the company’s financial Compact), 22nm ultra-low power (22ULP), 22nm ultra-low leakage structure, then expanding production capacity in a cost-competitive (22ULL) and 28nm High Performance Compact (28HPC+) process manner and optimizing our product portfolio. Examining the current technologies have already entered production. 28HPC+ was designed results reveals solid performance in the areas of strategic positioning, to support image signal processor (ISP) in 2020 and is undergoing an technology, production capacity, yield, profitability and sustainable engineering upgrade for 2021. Other newly released processes in 2020 operation. UMC’s 2020 revenue grew 19% over the prior year. Our include mmWave using 55nm, 40nm and 28nm to fulfill high performance foundry segment shipped a total of 8.9 million 8-inch equivalent wafers and low power product requirements for mobile devices, Internet of for the year, growing 24% YoY. Capacity utilization reached 97% in Things (IoT), 5G, automotive electronics and industrial radar that use 2020, growing 8% YoY. Full year revenue reached NTD 176.8 billion, mmWave. with 22.05% gross margin rate and 12.45% operating margin rate. Profit attributable to the parent company was NTD 29.19 billion or an Specialty Process Technologies Pipeline earnings per share of NTD 2.42. In 2020, UMC invested NTD 12.9 billion For specialty processes, UMC’s 28nm high voltage (HV) platform was in R&D. The cash based capex in 2020 was USD 1 billion, which was the industry’s first such technology to enter mass production and is being mainly invested in new R&D process equipment and production capacity utilized for driver ICs used in high resolution organic light-emitting display expansion at Southern Taiwan Science Park Fab 12A, Xiamen Fab 12X (AMOLED) panels. 22nm embedded high voltage (22eHV) development and Suzhou Fab 8N, as well as product mix optimization across all fabs. is also underway and on schedule. 4 Letter to Shareholders Our Radio Frequency Silicon On Insulator (RFSOI) technology has met the stringent requirements of all 4G/5G mobile phones for RF switches. Currently, 90nm RFSOI is in mass production with 55nm RFSOI under development. At the same time, 40nm RFSOI development has begun with the intent to capture the 5G/mmWave mega-trend. For embedded flash memory technology (eFlash), 40nm SST has been introduced into mass production, while 28nm SST development progress is in line with expectations and will fulfill the demand for IoT products. 40nm Resistive Random Access Memory (ReRAM) has entered mass production. Development of 22nm Resistive Random Access Memory (ReRAM) and 22nm Embedded Magneto-resistive Random Access Memory (eMRAM) technologies are progressing as planned and will be designed into Al Internet of Things (AIoT) applications. In addition, we are actively investing in the development of gallium nitride (GaN) and microwave platforms to penetrate high-efficiency power component and 5G microwave component markets. Growing Intellectual Property Portfolio Facing intense global competition, UMC has paid special attention patents and IP protection. The overall number of patents granted to UMC has maintained steady growth. A total of 484 domestic and foreign patents were obtained in 2020,
Load more

Recommended publications
  • (NASDAQ: ASML) Recommendation: Long I Current Stock Price
    ASML Holding NV (NASDAQ: ASML) Recommendation: Long I Current stock price: $651 I 5-year target price: $245 / $1,039 / $1,371 (Bear / Base / Bull) All financial and valuation information is presented in Euro Shradha Mani I sm4843 I [email protected] I April 22, 2021 ASML is a market leader (almost a monopoly) in lithography equipment, an advanced, precision technology which is essential to the manufacture of semiconductor chips. In turn, semiconductors power our phones, computers, automobiles and are basically the foundation of technology as we know it today. Thus, the semiconductor industry (customers of ASML) is poised for strong secular growth. “We provide our customers with everything they need – hardware, software and services – to mass produce patterns on silicon, allowing them to increase the value and lower the cost of a chip.” ASML’s essential position in the semiconductor ecosystem, and its product lines are described below1: . Lithography systems that print the tiny features that form the basis of a microchip with precision. These systems can be new or refurbished. o Extreme Ultraviolet Lithography Systems o Deep Ultraviolet Lithography Systems . Metrology and Inspection Systems measure the quality of patterns on chips and help locate and analyze chip defects . Computational Lithography algorithms optimize the manufacturing process to minimize defects . Customer Support and Service What does ASML do i.e. how does it earn revenue and who are the company’s customers ? Revenue disaggregation 2018 2019 2020 Extreme UV lithography
    [Show full text]
  • 劉炯朗教授prof. Chung-Laung Liu 簡介biography
    劉炯朗教授 Prof. Chung-Laung Liu 台灣清華大學蒙民偉榮譽講座教授 William Mong Honorary Chair Professor of Computer Science In National Tsing Hua University 簡 介 Biography 劉炯朗教授，台灣成功大學理學學士，美國麻省理工學院理學碩士和理學博士。先後於麻省 理工學院、伊利諾大學、台灣清華大學等知名高校任教，服務教育界逾四十年，現任台灣清 華大學蒙民偉榮譽講座教授。過往曾任高校領導職務包括：伊利諾大學（香檳校區）助理副 校長（1996-1998）及台灣清華大學校長（1998-2002）。 劉教授的專業領域涵蓋超大型集成電路的電腦輔助設計、電腦輔助教學、實時系統、系統組 合的優化、離散數學等。迄今為止，已發表一百八十餘篇學術論文，出版了八部學術專著。 此外，還出版了七部中文散文集。2005 年至今，劉教授還為新竹 IC975 廣播電台每週主持一 期人文科技節目。 劉教授曾當選台灣中研院院士、電子電機工程師學會(IEEE)會士以及計算機協會(ACM)傑出 會員，同時亦出任多間台灣高科技公司、教育及慈善機構的董事會成員。他曾榮獲澳門大學 和台灣政治大學頒授的榮譽博士學位，亦曾獲電機電子工程師學會及其分會頒發的多個奬項， 如電子設計自動化學會的菲爾‧卡夫曼獎、實時系統技術委員會技術成就獎、電路系統學會 技術成就獎以及教育勳章等殊榮。 C. L. Liu received his B. Sc. degree at the National Cheng Kung University in Taiwan, and his S. M. and Sc. D. degrees from the Massachusetts Institute of Technology. His teaching career spans over forty years, at MIT, the University of Illinois at Urbana Champaign, and the National Tsing Hua University, where he is now the William Mong Honorary Chair Professor of Computer Science. His academic administrative duties include serving as Associate Provost at the University of Illinois at Urbana Champaign from 1996 to 1998, and as President of the National Tsing Hua University from 1998 to 2002. His research areas are: computer-aided design of VLSI circuits, computer-aided instruction, real-time systems, combinatorial optimization, and discrete mathematics. He has published over 180 technical papers, and 8 technical books. In addition, he has published seven books which are essay collections in Chinese. He serves on the Boards of a number of high tech companies and educational and charitable foundations in Taiwan. Since 2005, he hosts a weekly radio show on Technology and Humanities in the radio station IC975 in Hsinchu. He is a member of Academia Sinica, and a Fellow of IEEE and ACM.
    [Show full text]
  • Product Engineer Program Apply Now the Product/Test Engineers at Texas Instruments Are Powered by a Passion for Continual Improvement
    Product Engineer Program Apply Now The Product/Test Engineers at Texas Instruments are powered by a passion for continual improvement. Our solutions make a real difference, and yours will, too. We make the semiconductor product design process easier and faster, which helps our customers succeed in today's fast-paced marketplace. Opportunities are available in North America and Asia. About the job In this role, you will work on the development and implementation of strategies that achieve profitability targets on assigned TI product lines through a variety of new product development, cost reduction, capacity expansion and yield enhancement projects. You will serve as the primary point of contact for all operational aspects related to your assigned product portfolio, resolve customer quality and application issues, and facilitate cross- functional teams for problem solving. You will also take a leadership role to establish relationships with key contacts in TI wafer fabrication and assembly manufacturing sites to ensure strong communication and effective problem solving. About the program In this empowering, two-year rotation program, you will be on an accelerated development track that’s focused on the product development cycle. As a program participant, you will rotate through four six-month assignments centered on improving product efficiency and quality, which contributes directly to the company’s bottom line. Here, you will have the opportunity to establish solid customer relationships and make deep and meaningful connections. You will also have the chance to be mentored and develop strong collaboration skills through cross-functional group interaction and international travel. Program participants begin with a two-week orientation.
    [Show full text]
  • AU OPTRONICS CORP Form SD Filed 2018-05-31
    SECURITIES AND EXCHANGE COMMISSION FORM SD Specialized Disclosure Report Filing Date: 2018-05-31 SEC Accession No. 0000950103-18-006801 (HTML Version on secdatabase.com) FILER AU OPTRONICS CORP Business Address 1 LI HSIN RD 2 CIK:1172494| IRS No.: 000000000 SCIENC BASED INUSTRIAL Type: SD | Act: 34 | File No.: 001-31335 | Film No.: 18869971 PARK SIC: 3674 Semiconductors & related devices HSIN CHU 300 TAIWAN F5 00000 852-2514-7600 Copyright © 2018 www.secdatabase.com. All Rights Reserved. Please Consider the Environment Before Printing This Document UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM SD Specialized Disclosure Report (Exact Name of Registrant as Specified in Its Charter) TAIWAN, REPUBLIC OF CHINA 001-31335 Not Applicable (State or other jurisdiction of incorporation or organization) (Commission File Number) (IRS Employer Identification No.) 1 LI-HSIN ROAD 2 HSINCHU SCIENCE PARK HSINCHU, TAIWAN REPUBLIC OF CHINA (Address of principal executive offices) Benjamin Tseng Chief Financial Officer 1 Li-Hsin Road 2 Hsinchu Science Park Hsinchu, Taiwan Republic of China Telephone No.: +886-3-500-8800 Facsimile No.: +886-3-564-3370 Email: [email protected] (Name and telephone, including area code, of the person to contact in connection with this report) Check the appropriate box to indicate the rule pursuant to which this form is being filed, and provide the period to which the information in this form applies: Rule 13p-1 under the Securities Exchange Act (17 CFR 240.13p-1) under the Exchange Act for the reporting period from ☒ January 1 to December 31, 2017. Copyright © 2018 www.secdatabase.com.
    [Show full text]
  • A Report on Semiconductor Foundry Access by US Academics (Discussion Held at a Meeting Virtually Held at the National Science Foundation on Dec 16, 2020)
    A Report on Semiconductor Foundry Access by US Academics (Discussion held at a meeting virtually held at the National Science Foundation on Dec 16, 2020) Organizers: Sankar Basu1, Erik Brunvand2, Subhasish Mitra3, H.-S. Philip Wong4 Scribes: Sayeef Salahuddin5, Shimeng Yu6 1 NSF, [email protected] 2 NSF, [email protected] 3 Stanford University, [email protected] 4 Stanford University, [email protected] 5 University of California, Berkeley, [email protected] 6 Georgia Institute of Technology, [email protected] 2 Executive Summary Semiconductor technology and microelectronics7 is a foundational technology that without its continued advancement, the promises of artificial intelligence (AI), 5G/6G communication, and quantum computing will never be realized in practice. Our nation’s economic competitiveness, technology leadership, and national security, depend on our staying at the forefront of microelectronics. We must accelerate the pace of innovation and broaden the pool of researchers who possess research capability in circuit design and device technologies, and provide a pathway to translate these innovations to industry. This meeting has brought to the fore the urgent need for access to semiconductor foundry and design ecosystem to achieve these goals. Microelectronics is a field that requires sustained and rapid innovations, especially as the historical rate of progress following a predictable path, is no longer guaranteed as it had been in the past. Yet, there are many plausible paths to move forward, and the potential for further advances is immense. There is a future in system integration of heterogeneous technologies that requires end-to-end co-design and innovation. Isolated push along silos, such as miniaturization of components, will be inadequate.
    [Show full text]
  • From Sand to Circuits
    From sand to circuits By continually advancing silicon technology and moving the industry forward, we help empower people to do more. To enhance their knowledge. To strengthen their connections. To change the world. How Intel makes integrated circuit chips www.intel.com www.intel.com/museum Copyright © 2005Intel Corporation. All rights reserved. Intel, the Intel logo, Celeron, i386, i486, Intel Xeon, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. 0605/TSM/LAI/HP/XK 308301-001US From sand to circuits Revolutionary They are small, about the size of a fingernail. Yet tiny silicon chips like the Intel® Pentium® 4 processor that you see here are changing the way people live, work, and play. This Intel® Pentium® 4 processor contains more than 50 million transistors. Today, silicon chips are everywhere — powering the Internet, enabling a revolution in mobile computing, automating factories, enhancing cell phones, and enriching home entertainment. Silicon is at the heart of an ever expanding, increasingly connected digital world. The task of making chips like these is no small feat. Intel’s manufacturing technology — the most advanced in the world — builds individual circuit lines 1,000 times thinner than a human hair on these slivers of silicon. The most sophisticated chip, a microprocessor, can contain hundreds of millions or even billions of transistors interconnected by fine wires made of copper. Each transistor acts as an on/off switch, controlling the flow of electricity through the chip to send, receive, and process information in a fraction of a second.
    [Show full text]
  • Apple U1 Ultra Wideband (UWB) Analysis
    Apple U1 Ultra Wideband (UWB) Analysis Product Brief – October 2019 techinsights.com All content © 2019. TechInsights Inc. All rights reserved. GLOBAL LEADER IN IP & TECHNOLOGY INTELLIGENCE By revealing the innovation others can’t inside advanced technology products, we prove patent value and drive the best Intellectual Property (IP) and technology investment decisions Technology Intelligence Intellectual Property Services We help decision makers in semiconductor, system, financial, We help IP Professionals in global technology companies, and communication service provider companies: licensing entities and legal firms to: • Discover what products are winning in the highest- • Build higher quality, more effective patents growth markets and why • Identify patents of value and gather evidence of use to • Spot or anticipate disruptive events, including the demonstrate this value entrance of new players • Obtain accurate data for planning a potential defensive • Understand state-of-the-art technology strategy or assertion case through independent, objective analysis • Make better portfolio management decisions to invest, • Make better, faster product decisions with greater abandon, acquire or divest confidence • Understand their competition, identify strategic partners, • Understand product costs and bill of materials acquisition targets and business threats 2 All content © 2019. TechInsights Inc. All rights reserved. TechInsights has been publishing technology analysis for 30 years, enabling our customers to advance their intellectual property
    [Show full text]
  • Operational Highlights
    078 079 5.1 Business Activities 5.2 Technology Leadership ●Developed integrated fan-out on substrate (InFO-oS) Gen-3, which provides more chip partition integration with larger 5.1.1 Business Scope 5.2.1 R&D Organization and Investment package size and higher bandwidth As the founder and a leader of the dedicated semiconductor foundry segment, TSMC provides a full range of integrated In 2020, TSMC continued to invest in research and ●Expanded 12-inch Bipolar-CMOS-DMOS (BCD) technology semiconductor foundry services, including the most advanced process technologies, leading specialty technologies, the most development, with total R&D expenditures amounting to 8.2% portfolio on 90nm, 55nm and 22nm, targeting a variety of comprehensive design ecosystem support, excellent manufacturing productivity and quality, advanced mask technologies, and of revenue, a level that equals or exceeds the R&D investment fast-growing applications of mobile power management ICs 3DFabricTM advanced packaging and silicon stacking technologies, to meet a growing variety of customer needs. The Company of many other leading high-tech companies. with various levels of integration strives to provide the best overall value to its customers and views customer success as TSMC’s own success. As a result, TSMC has ●Achieved technical qualification of 28nm eFlash for gained customer trust from around the world and has experienced strong growth and success of its own. Faced with the increasingly difficult challenge to continue automobile electronics and micro controller units (MCU) extending Moore’s Law, which calls for the doubling of applications 5.1.2 Customer Applications semiconductor computing power every two years, TSMC has ●Began production of 28nm resistive random access memory focused its R&D efforts on offering customers first-to-market, (RRAM) as a low-cost solution for the price sensitive IoT TSMC manufactured 11,617 different products for 510 customers in 2020.
    [Show full text]
  • Timeline of the Semiconductor Industry in South Portland
    Timeline of the Semiconductor Industry in South Portland Note: Thank you to Kathy DiPhilippo, Executive Director/Curator of the South Portland Historical Society and Judith Borelli, Governmental Relations of Texas Inc. for providing some of the information for this timeline below. Fairchild Semiconductor 1962 Fairchild Semiconductor (a subsidiary of Fairchild Camera and Instrument Corp.) opened in the former Boland's auto building (present day Back in Motion) at 185 Ocean Street in June of 1962. They were there only temporarily, as the Western Avenue building was still being constructed. 1963 Fairchild Semiconductor moves to Western Avenue in February 1963. 1979 Fairchild Camera and Instrument Corp. is acquired/merged with Schlumberger, Ltd. (New York) for $363 million. 1987 Schlumberger, Ltd. sells its Fairchild Semiconductor Corp. subsidiary to National Semiconductor Corp. for $122 million. 1997 National Semiconductor sells the majority ownership interest in Fairchild Semiconductor to an investment group (made up of Fairchild managers, including Kirk Pond, and Citcorp Venture Capital Ltd.) for $550 million. Added Corporate Campus on Running Hill Road. 1999 In an initial public offering in August 1999, Fairchild Semiconductor International, Inc. becomes a publicly traded corporation on the New York Stock Exchange. 2016 Fairchild Semiconductor International, Inc. is acquired by ON Semiconductor for $2.4 billion. National Semiconductor 1987 National Semiconductor acquires Fairchild Semiconductor Corp. from Schlumberger, Ltd. for $122 million. 1995 National Semiconductor breaks ground on new 200mm factory in December 1995. 1996 National Semiconductor announces plans for a $600 million expansion of its facilities in South Portland; construction of a new wafer fabrication plant begins. 1997 Plant construction for 200mm factory completed and production starts.
    [Show full text]
  • TSMC Integrated Fan-Out (Info) Package Apple A10
    Electronic Costing & Technology Experts 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected] www.systemplus.fr September 2016 – Version 1 – Written by Stéphane ELISABETH DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Return to TOC Glossary 1. Overview / Introduction 4 – A10 Die Analysis 57 – Executive Summary – A10 Die View, Dimensions & Marking – Reverse Costing Methodology – A10 Die Cross-Section – A10 Die Process Characteristics 2. Company Profile 7 – Comparison with previous generation 65 – Apple Inc. – A9 vs. A10 PoP – Apple Series Application processor – A9 vs. A10 Process – Fan-Out Packaging – TSMC Port-Folio 4. Manufacturing Process Flow 70 – TSMC inFO packaging – Chip Fabrication Unit – Packaging Fabrication Unit 3. Physical Analysis 15 – inFO Reconstitution Flow – Physical Analysis Methodology – iPhone 7 Plus Teardown 17 5. Cost Analysis 81 – A10 Die removal – Synthesis of the cost analysis – A10 Package-on-Package Analysis 23 – Main steps of economic analysis – A10 Package View, Dimensions – Yields Hypotheses – A10 Package XRay View – Die Cost Analysis 86 – A10 Package Opening – Wafer Cost – A10 Package Marking – Die Cost – A10 Package Cross-Section – inFO Packaging Cost Analysis 90 – A10 Package Cross-Section – Adhesive & Passivation – Packaging Wafer Cost – A10 package cross-Section - TIVs – Packaging Cost per process Steps – A10 package cross-Section – Solder Balls – Component Cost – A10 package cross-Section – RDL – Land-Side Decoupling Capacitor Analysis 48 6.
    [Show full text]
  • Central and Local Governments Work Hand-In-Hand to Safeguard Well
    Central and Local Governments Work Hand-In-Hand to Safeguard Well- Being of Schoolchildren 13 Counties and Cities Commended for Excellence in Health Promotion Efforts (Photo/Text: Li Hsiu-I, Division of Student Affairs and School Security) The Ministry of Education, Ministry of Health and Welfare, county and city governments, experts and academics, and school communities are working together on the Health Promoting School Program, which brings together resources in the interest of a diverse range of measures aimed at improving the health of school children. An awards ceremony was held at National Taiwan Normal University on March 31, 2021, to commend 13 counties and cities that have achieved outstanding results in health promotion in 2019. New Taipei City, Taoyuan City, and Changhua County were awarded the Distinguished Honor Award, while Keelung City, Taipei City, Hsinchu County, Hsinchu City, Taichung City, Chiayi County, Tainan City, Kaohsiung City, Yilan Country, and Taitung County were awarded the Excellent Honor Award. Distinguished Honor Award winner New Taipei City has identified schools with health screening data not meeting national standards as High Priority Schools and further determined school-specific health-related issues. The city government has also carried out health promotion efforts and provided students with a full range of health services through the use of effective strategies and consolidation of resources from various public and private organizations. In addition, board games have been used in workshops for teachers in school clusters covered by the National Health Insurance (NHI) scheme for educators to learn about NHI-related knowledge and skills through a gamefied approach.
    [Show full text]
  • 2008 Corporate Social Responsibility Report
    Table of Contents Overview 2 4.3 Managing Contractors’ ESH 32 4.4 Helping Suppliers Improve Delivery and Message from the Chairman Quality 32 and Chief Executive Officer 3 4.5 Ensuring Supplier Compliance 33 Corporate Profile 4 4.6 SCM Forum and Excellent Supplier Award 33 4.7 Customer Service and Satisfaction 34 2. An Introduction to TSMC 4 2.2 Market/Business Summary 5 Social Contribution 35 2.3 Business Activities 7 5. A Platform for Sharing Sustainability 36 2.4 Financial Highlights 7 5.2 Commitment to Education 37 2.5 Corporate Developments 8 5.3 Promotion of Arts and Culture 40 2.6 Awards Received in the Reporting Period 8 5.4 Community Building 40 2.7 International Sustainability Indexes 9 5.5 TSMC Employee Volunteer Program 42 2.8 Membership in Industry Associations 9 2.9 Stakeholder Identification and Environmental Protection 44 Communication 9 6. Green Management Organization and System 44 2.0 Investor Engagement 10 6.2 Climate Change and Greenhouse Gas (GHG) 2.11 Corporate Governance 11 Reduction 47 6.3 Green Building 49 Employee 14 6.4 Green Product 51 3. Employment 14 6.5 Water Resource Management 52 3.2 Employee Development 16 6.6 Pollution Prevention 53 3.3 Compensation and Benefits 17 6.7 Ecological Preservation 57 3.4 Employee Relations 18 6.8 Green Promotion Activities 57 3.5 Work and Life Integration Program 20 6.9 Environmental Compliance Record 59 3.6 Corporate Security and Risk Control 21 3.7 Safety and Health 21 Appendix 60 Independent Assurance Opinion Statement 61 Supply Chain Management 30 Global Reporting Initiative (GRI) Sustainability 4.
    [Show full text]