DOCSLIB.ORG

Accelerating Innovation Through Education

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text
Accelerating Innovation Through Education Accelerating Innovation In the Era of Exponentials Dr. Chi-Foon Chan President and co-Chief Executive Officer, Synopsys, Inc. August 27, 2013 © Synopsys 2013 ASQED 1 Accelerating Technology Innovation Exciting time to be an Engineer The Era of Electronics Technology The Future Ahead © Synopsys 2013 ASQED 2 $1.76B FY12 Revenue System Design ~84 Offices Worldwide ~8,195 Employees ~4,431 Masters/ PhD Degrees Verification IP Implementation ~31% R&D/Revenue ~5,129 R&D Engineers Manufacturing ~1,100 Application Consultants ~1,889 Issued Patents Advanced Technology Leadership Delivers Benefits at Every Node © Synopsys 2013 ASQED© Synopsys 2013 3 What Happens in 204 Million Emails Sent >2 Million Search Queries 6 Million Facebook Views 1.3 Million Video Views And the Future Growth is Exponential Today, the number of the global networked devices = population By 2017, the number of devices the global as high as connected to IP networks will be 3x population © Synopsys 2013 ASQED© Synopsys 2013 4 Source: Cisco Systems, VNI Global Mobile Data Traffic Forecast Update 2013 and Intel SmartTech Blog Moore’s Law Continues… Transistor Count Trends 1.0E+12 256Gb MLC/128Gb SLC DRAM 128Gb MLC/64Gb SLC 1.0E+11 NAND Flash (SLC) 64Gb NAND Flash (MLC) 16Gb 8Gb 1.0E+10 Intel PC MPU 4Gb "Poulson" 4Gb 2Gb Intel Server MPU "Tukwila" "Broadwell" 1Gb Itanium 2 "Ivy Bridge" 1.0E+9 "Gulftown" Itanium 2 Core i7 "Bloomfield" 256Mb Core 2 Duo 64Mb 1.0E+8 Pentium 4 "Prescott" Itanium Pentium 4 16Mb Pentium III 1.0E+7 4Mb Pentium II Pentium Pro Pentium 1.0E+6 1Mb 80486 256Kb 80386 64Kb Transistors per Die Transistors 1.0E+5 80286 16Kb 4Kb 8086 1.0E+4 1Kb 8085 8080 8008 4004 1.0E+3 1.0E+2 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 00 02 04 06 08 10 12 14F 16F Year Source: Intel, SIA, IC Insights 2012 © Synopsys 2013 ASQED 5 Designs Are Larger and Faster 60,000 800 MHz 700 50,000 600 40,000 500 30,000 400 300 20,000 Clock Frequency Clock Gate Count, K Count, Gates Gate 200 10,000 100 0 0 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 Expon. (Gate Count, K Gates) Expon. (Clock Frequency, MHz) Source: Synopsys Global User Survey, 2002-2012 © Synopsys 2013 ASQED 6 Power Is a Growing Problem 1000 Leakage Power 800 Dynamic Power 2 600 W/cm 400 200 0 90nm 65nm 40nm 28nm 20nm Source: IBS © Synopsys 2013 ASQED 7 Functional Verification Costs Are Exploding $6.0B Engineering Effort IT Infrastructure for Verification $5.0B $4.0B $3.0B $2.0B $1.0B $0.0B 2011 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2012 2013 Source: VCS User Companies, Synopsys © Synopsys 2013 ASQED 8 Chip Development Costs Are Increasing $300 Chip Design $250 Software Dev. +116% $200 $150 +82% Cost ($M) Cost $100 +96% $50 +44% +75% +62% +54% $0 65nm (90M) 45/40nm (130M) 28nm (180M) 22/20nm (240M) 16/14nm (310M) Feature Dimension (Transistor Count) Source: IBS, December 2012 © Synopsys 2013 ASQED 9 100 150 200 250 300 350 400 450 500 ASQED © 2013 Synopsys 90nm 50 0 Q3'03 Q4'03 Q1'04 Q2'04 1 65nm Q3'04 10 st Q4'04 to at tapeout Q1'05 65nm Q2'05 Q3'05 Advanced Designs at Every Node Q4'05 45/40nm Q1'06 Advanced Q2'06 Q3'06 1 Q4'06 st to to at tapeout Q1'07 45/40nm Q2'07 32/28nm Q3'07 Tapeout Q4'07 Q1'08 Q2'08 Q3'08 Q4'08 1 st Counts Q1'09 to to at tapeout 22/20nm 32/28nm Q2'09 Q3'09 Q4'09 Q1'10 Q2'10 Q3'10 16/14nm Q4'10 Q1'11 1 st to to at tapeout Q2'11 22/20nm Q3'11 Q4'11 Q1'12 Q2'12 10nm Q3'12 Q4'12 Q1'13 Q2'13 08 09 10 11 12 Companies Working Hard to Differentiate Recession Recovery Uncertainty © Synopsys 2013 ASQED© Synopsys 2013 11 Semi Snapshot as of 7/23/2013 Source: IC Insights Report, August 02, 2013. © Synopsys 2013 ASQED 12 Source: IC Insights Report, August 02, 2013. © Synopsys 2013 ASQED 13 Buys Buys Forces Driving Buys - Wireless Consolidation Buys Buys Semiconductor • Critical Mass Buys MODEM Shaping Buys • Differentiation the Buys Industry • Collaboration Buys Buys Buys Accelerating Buys Buys Innovation Buys © Synopsys 2013 ASQED 14 Accelerating Technology Innovation Differentiation The Era of Electronics TechnologyTechnology The Future Ahead © Synopsys 2013 ASQED 16 Prototyping Enables Earlier Software Development Traditional Flow Software Development Software Stack Product Support & Maintenance Synopsys Hardware Integration Development & Test Virtual Effort Development Prototype Time to Market Time in Market With Virtual Prototyping Higher Prototype Productivity A simulation model for the targeted hardware Software Earlier Higher Integration TTM Quality & Test Development Effort Development Hardware Product Support & Maintenance Time to Market Time in Market © Synopsys 2013 ASQED 17 Increasing Use of Silicon IP and Silicon IP Subsystems Graphics Application Processors Application Application Graphic RAM RAM ROM Processor CPU CPU Core(s) LVDS, Etc Specialty I/O Specialty I/O Flash Flash Storage RAM RAM RAM RAM Interface Memory I/Fs On-Chip Bus DDR DDR memory On-Chip Bus Interface & Others RAM RAM RAM RAM Memories & Logic Libraries Basic Peripherals (UARTs/Timers) Headset Jack Analog Interfaces Audio Microphone Interface / Video Audio Codecs I/F Data Video Codecs Converters Deeply Analog embedded USB PCIe SATA HDMI MIPI processors * Small boxes are standard cell library elements. © Synopsys 2013 ASQED 18 3rd Party IP Usage Will Continue Increasing Design to Double Through 2017 Complexity 2017 2012 Consumer Escalating Design Costs Wireless Communication Data Processing Shorter Time Window for New Product Overall 3rd party Automotive design IP use Launch in 2012 Industrial Overall 3rd party design IP use Strong Growth Wired Communication in 2017 in 3rd Party 0% 15% 30% 45% 60% 75% 90% IP Usage Percentage of 3rd Party IP Block Source: Gartner, Semi IP Market, March 2013 © Synopsys 2013 ASQED© Synopsys 2013 19 Evolution of Implementation Technology 2002 2005 2009 2011 2012 “Correlation” “Look-Ahead” “In-Design” “Exploration” “Co-Design” Synthesis Synthesis Synthesis Synthesis Synthesis Design Planning Place & Place & Place & Place & Signoff Signoff Signoff Signoff Signoff Custom Place & Route Route Route Route Route DRC / LVS DRC / LVS DRC / LVS DRC / LVS DRC / LVS © Synopsys 2013 ASQED 20 Below 22nm Requires Advanced Solutions FinFET Double Patterning (DPT) • Density / • Power Integration • Performance • Performance • Power Power Area 3D-IC Delivering • Density / Integration More Performance • Power Performance with Less Power • Performance in a Smaller Area © Synopsys 2013 ASQED 21 FinFET Technology Must Be Supported Across the Entire SoC Design Process Process Develop. Characterization Design Implementation IP TCAD Circuit Simulation Custom Design Implementation >= DPT spacing C 1 V0 C2 C 3 Trench M0 Contact Fin C4 Gate Fin Sourc Drain e C5 Substrate 3D Lithography Extraction Physical Verification Signoff © Synopsys 2013 ASQED 22 Low Power Design Advanced Techniques Multi-Voltage Power Gating DVFS, AVFS SoC Design (Shutdown) Advanced multi-voltage Requires techniques Advanced Well Biasing Clock Gating Low-VDD Mainstream Standby intent-driven EN FF techniques LT Low Power CLK ICG Techniques Gate-Level Opt. Architect. Opt. Multi--Threshold a b THTH Synthesis-based c LowLow VV 16 bit 64 bit d optimization Ripple 90 366 CLA 100 405 THTH Leakage Current techniques Leakage Current Nominal V Carry Skip 108 437 THTH a High V c Carry Select 161 711 b DelayDelay Carry Save 218 1323 d Basic © Synopsys 2013 ASQED© Synopsys 2013 23 The Problem in Verification Is Time & Cost Heavy Setup and Debug Activity Heavy Regression Activity Issue is Engr. Resource and Time Issue is Compute Cost and Time 2 3 1 Verification Debug Faster Reuse Automation Simulation Project Time Bugs Found Compute Cycles © Synopsys 2013 ASQED 24 Comprehensive SoC Verification Platform Manages Time-to-market & Verification Complexity Technology Must Address • Performance • Digital • Capacity • Low-Power • Accuracy • AMS • Productivity • HW/SW • Standards © Synopsys 2013 ASQED 25 Accelerating Technology Innovation Collaboration 1. Industry The Era of Electronics 2. University 3. Government Technology The Future Ahead © Synopsys 2013 ASQED 26 Environmental Legal Ethical Technology Economics Different Disciplines © Synopsys 2013 ASQED 27 The Morals and the Machine Economist Teaching robots right from wrong June 2, 2012 Economist.com © Synopsys 2013 ASQED 28 A Car or a Computer on Four Wheels? California becomes latest state to OK driverless cars September 25, 2012 Sources: USA TODAY, California becomes latest state to OK driverless cars, September 25, 2012. The Economist, Look, no hands, September 1, 2012. © Synopsys 2013 ASQED 29 The New Green Hub Shifting Gears to Sustainable Development Source: Ecofriend.com – Urban Reforestation: Sky-bridges & green connectors to give a new skyline to Kuala Lumpur © Synopsys 2013 ASQED 30 Purpose + Plan + Our Part How will we impact the future and accelerate innovation? Economy Technology Environmental Legal, Ethical Responsibility © Synopsys 2013 ASQED 31 Thank You © Synopsys 2013 ASQED 32 .
Load more

Recommended publications
  • Microcode Revision Guidance August 31, 2019 MCU Recommendations
    microcode revision guidance August 31, 2019 MCU Recommendations Section 1 – Planned microcode updates • Provides details on Intel microcode updates currently planned or available and corresponding to Intel-SA-00233 published June 18, 2019. • Changes from prior revision(s) will be highlighted in yellow. Section 2 – No planned microcode updates • Products for which Intel does not plan to release microcode updates. This includes products previously identified as such. LEGEND: Production Status: • Planned – Intel is planning on releasing a MCU at a future date. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment.
    [Show full text]
  • Class-Action Lawsuit
    Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 1 of 279 Steve D. Larson, OSB No. 863540 Email: [email protected] Jennifer S. Wagner, OSB No. 024470 Email: [email protected] STOLL STOLL BERNE LOKTING & SHLACHTER P.C. 209 SW Oak Street, Suite 500 Portland, Oregon 97204 Telephone: (503) 227-1600 Attorneys for Plaintiffs [Additional Counsel Listed on Signature Page.] UNITED STATES DISTRICT COURT DISTRICT OF OREGON PORTLAND DIVISION BLUE PEAK HOSTING, LLC, PAMELA Case No. GREEN, TITI RICAFORT, MARGARITE SIMPSON, and MICHAEL NELSON, on behalf of CLASS ACTION ALLEGATION themselves and all others similarly situated, COMPLAINT Plaintiffs, DEMAND FOR JURY TRIAL v. INTEL CORPORATION, a Delaware corporation, Defendant. CLASS ACTION ALLEGATION COMPLAINT Case 3:20-cv-00863-SI Document 1 Filed 05/29/20 Page 2 of 279 Plaintiffs Blue Peak Hosting, LLC, Pamela Green, Titi Ricafort, Margarite Sampson, and Michael Nelson, individually and on behalf of the members of the Class defined below, allege the following against Defendant Intel Corporation (“Intel” or “the Company”), based upon personal knowledge with respect to themselves and on information and belief derived from, among other things, the investigation of counsel and review of public documents as to all other matters. INTRODUCTION 1. Despite Intel’s intentional concealment of specific design choices that it long knew rendered its central processing units (“CPUs” or “processors”) unsecure, it was only in January 2018 that it was first revealed to the public that Intel’s CPUs have significant security vulnerabilities that gave unauthorized program instructions access to protected data. 2. A CPU is the “brain” in every computer and mobile device and processes all of the essential applications, including the handling of confidential information such as passwords and encryption keys.
    [Show full text]
  • Multiprocessing Contents
    Multiprocessing Contents 1 Multiprocessing 1 1.1 Pre-history .............................................. 1 1.2 Key topics ............................................... 1 1.2.1 Processor symmetry ...................................... 1 1.2.2 Instruction and data streams ................................. 1 1.2.3 Processor coupling ...................................... 2 1.2.4 Multiprocessor Communication Architecture ......................... 2 1.3 Flynn’s taxonomy ........................................... 2 1.3.1 SISD multiprocessing ..................................... 2 1.3.2 SIMD multiprocessing .................................... 2 1.3.3 MISD multiprocessing .................................... 3 1.3.4 MIMD multiprocessing .................................... 3 1.4 See also ................................................ 3 1.5 References ............................................... 3 2 Computer multitasking 5 2.1 Multiprogramming .......................................... 5 2.2 Cooperative multitasking ....................................... 6 2.3 Preemptive multitasking ....................................... 6 2.4 Real time ............................................... 7 2.5 Multithreading ............................................ 7 2.6 Memory protection .......................................... 7 2.7 Memory swapping .......................................... 7 2.8 Programming ............................................. 7 2.9 See also ................................................ 8 2.10 References .............................................
    [Show full text]
  • The Intel X86 Microarchitectures Map Version 2.0
    The Intel x86 Microarchitectures Map Version 2.0 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • Variant: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128
    [Show full text]
  • Informatyka 1, Studia Niestacjonarne I Stopnia Dr Inż
    Informatyka 1, studia niestacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 5 2/59 Plan wykładu nr 5 Informatyka 1 Język C § pętla for, operatory ++ i – Klasyfikacja systemów komputerowych (Flynna) Architektura von Neumanna i architektura harwardzka Politechnika Białostocka --WydziałWydział Elektryczny Budowa komputera § jednostka centralna Elektrotechnika, semestr II, studia niestacjonarne I stopnia § płyta główna Rok akademicki 2018/2019 § procesor (mikroarchitektury) Wykład nr 5 (05.04.2019) dr inż. Jarosław Forenc Informatyka 1, studia niestacjonarne I stopnia dr inż. Jarosław Forenc Informatyka 1, studia niestacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 5 3/59 Rok akademicki 2018/2019, Wykład nr 5 4/59 Język C --sumasuma kolejnych 10 liczb: 1+2+…+10 Język C --sumasuma kolejnych 100 liczb: 1+2+…+100 Suma wynosi: 55 Suma wynosi: 5050 #include <stdio.h> #include <stdio.h> int main(void ) int main(void ) { { int suma; int suma=0, i; suma = 1 + 2 + 3 + 4 + 5 + 6 + 7 + 8 + 9 + 10; for (i=1; i<=100; i=i+1) suma = suma + i; printf("Suma wynosi: %d\n" ,suma); printf("Suma wynosi: %d\n" ,suma); return 0; } return 0; } Informatyka 1, studia niestacjonarne I stopnia dr inż. Jarosław Forenc Informatyka 1, studia niestacjonarne I stopnia dr inż. Jarosław Forenc Rok akademicki 2018/2019, Wykład nr 5 5/59 Rok akademicki 2018/2019, Wykład nr 5 6/59 Język C --pętlapętla for Język C --pętlapętla for Najczęściej stosowana postać pętli for for (wyr1; wyr2; wyr3) wyr1 instrukcja int i; for (i = 0; i < 10; i = i + 1) NIE wyr 2 ≠ 0 instrukcja wyr1 , wyr2 , wyr3 - dowolne wyrażenia w języku C TAK Instrukcja zostanie wykonana 10 razy Instrukcja: instrukcja (dla i = 0, 1, 2, … 9 ) § prosta - jedna instrukcja Funkcje pełnione przez wyrażenia zakończona średnikiem wyr3 § złożona - jedna lub kilka instrukcji objętych nawiasami klamrowymi for (inicjalizacja ;test ;aktualizacja ) instrukcja Informatyka 1, studia niestacjonarne I stopnia dr inż.
    [Show full text]
  • The Intel X86 Microarchitectures Map Version 2.2
    The Intel x86 Microarchitectures Map Version 2.2 P6 (1995, 0.50 to 0.35 μm) 8086 (1978, 3 µm) 80386 (1985, 1.5 to 1 µm) P5 (1993, 0.80 to 0.35 μm) NetBurst (2000 , 180 to 130 nm) Skylake (2015, 14 nm) Alternative Names: i686 Series: Alternative Names: iAPX 386, 386, i386 Alternative Names: Pentium, 80586, 586, i586 Alternative Names: Pentium 4, Pentium IV, P4 Alternative Names: SKL (Desktop and Mobile), SKX (Server) Series: Pentium Pro (used in desktops and servers) • 16-bit data bus: 8086 (iAPX Series: Series: Series: Series: • Variant: Klamath (1997, 0.35 μm) 86) • Desktop/Server: i386DX Desktop/Server: P5, P54C • Desktop: Willamette (180 nm) • Desktop: Desktop 6th Generation Core i5 (Skylake-S and Skylake-H) • Alternative Names: Pentium II, PII • 8-bit data bus: 8088 (iAPX • Desktop lower-performance: i386SX Desktop/Server higher-performance: P54CQS, P54CS • Desktop higher-performance: Northwood Pentium 4 (130 nm), Northwood B Pentium 4 HT (130 nm), • Desktop higher-performance: Desktop 6th Generation Core i7 (Skylake-S and Skylake-H), Desktop 7th Generation Core i7 X (Skylake-X), • Series: Klamath (used in desktops) 88) • Mobile: i386SL, 80376, i386EX, Mobile: P54C, P54LM Northwood C Pentium 4 HT (130 nm), Gallatin (Pentium 4 Extreme Edition 130 nm) Desktop 7th Generation Core i9 X (Skylake-X), Desktop 9th Generation Core i7 X (Skylake-X), Desktop 9th Generation Core i9 X (Skylake-X) • New instructions: Deschutes (1998, 0.25 to 0.18 μm) i386CXSA, i386SXSA, i386CXSB Compatibility: Pentium OverDrive • Desktop lower-performance: Willamette-128
    [Show full text]
  • 2 Basic Compiler Optimizations.Pdf
    What’s New for Intel compilers 19.1? Advance Support for Intel® Architecture – Use Intel compiler to generate optimized code for Intel Atom® processor through Intel® Xeon® Scalable processor and Intel® Xeon Phi™ processor families Achieve Superior Parallel Performance – Vectorize & thread your code (using OpenMP*) to take full advantage of the latest SIMD-enabled hardware, including Intel® Advanced Vector Extensions 512 (Intel® AVX-512) What’s New in C++ What’s New in Fortran Initial C++20, and full C++ 17 enabled Substantial Fortran 2018 support ▪ Enjoy advanced lambda and constant expression support ▪ Enjoy enhanced C-interoperability features for effective mixed language ▪ Standards-driven parallelization for C++ developers development Initial OpenMP* 5.0, and full OpenMP* 4.5 ▪ Use advanced coarray features to parallelize your modern Fortran code support Initial OpenMP* 5.0, and substantial OpenMP* 4.5 ▪ Modernize your code by using the latest parallelization support specifications ▪ Customize your reduction operations by user-defined reductions 2 Optimization Notice Copyright © 2020, Intel Corporation. All rights reserved. *Other names and brands may be claimed as the property of others. Common optimization options Linux* Disable optimization -O0 Optimize for speed (no code size increase) -O1 Optimize for speed (default) -O2 High-level loop optimization -O3 Create symbols for debugging -g Multi-file inter-procedural optimization -ipo Profile guided optimization (multi-step build) -prof-gen -prof-use Optimize for speed across the entire program (“prototype switch”) -fast same as: fast options definitions changes over time! -ipo –O3 -no-prec-div –static –fp-model fast=2 -xHost) OpenMP support -qopenmp Automatic parallelization -parallel Optimization Notice Copyright © 2020, Intel Corporation.
    [Show full text]
  • Microcode Revision Guidance April2 2018 MCU Recommendations the Following Table Provides Details of Availability for Microcode Updates Currently Planned by Intel
    microcode revision guidance april2 2018 MCU Recommendations The following table provides details of availability for microcode updates currently planned by Intel. Changes since the previous version are highlighted in yellow. LEGEND: Production Status: • Planning – Intel has not yet determined a schedule for this MCU. • Pre-beta – Intel is performing early validation for this MCU. • Beta – Intel has released this production signed MCU under NDA for all customers to validate. • Production – Intel has completed all validation and is authorizing customers to use this MCU in a production environment. • Stopped – After a comprehensive investigation of the microarchitectures and microcode capabilities for these products, Intel has determined to not release microcode updates for these products for one or more reasons including, but not limited to the following: • Micro-architectural characteristics that preclude a practical implementation of features mitigating Variant 2 (CVE-2017-5715) • Limited Commercially Available System Software support • Based on customer inputs, most of these products are implemented as “closed systems” and therefore are expected to have a lower likelihood of exposure to these vulnerabilities. Pre-Mitigation Production MCU: • For products that do not have a Production MCU with mitigations for Variant 2 (Spectre), Intel recommends using this version of MCU. This does not impact mitigations for Variant 1 (Spectre) and Variant 3 (Meltdown). STOP deploying these MCU revs: • Intel recommends to discontinue using these select versions of MCU that were previously released with mitigations for Variant 2 (Spectre) due to system stability issues. • Lines with “***” were previously recommended to discontinue use. Subsequent testing by Intel has determined that these were unaffected by the stability issues and have been re-released without modification.
    [Show full text]
  • Intel: Manufacturing, Chip Design Expertise Driving Innovation and Integration, Historic Change to Computers
    Intel: Manufacturing, Chip design Expertise Driving Innovation and Integration, Historic Change to Computers SAN FRANCISCO, Sep 22, 2009 (BUSINESS WIRE) -- Intel Corporation executives today said Moore's Law, driven by Intel's advances in 32 and 22 nanometer (nm)-manufacturing technologies, is leading to a broader and faster pace of "innovation and integration." Future Intel(R) Atom(TM), Core(R) and Xeon(R) processors and System on Chip (SoC) products will make computers smaller, smarter, more capable and easier to use. For example, among a number of other innovations on tap, Intel will integrate graphics into some of its future chip products for the first time ever. "Over the past 40 years, the opportunities enabled by Moore's Law have gone beyond just impressive performance increases," said Sean Maloney, executive vice president and general manager of the Intel Architecture Group. "The rapidly increasing number of transistors and processor instructions we add have made possible the integration of more and more capabilities and features within our processors. This has driven an incredible amount of innovation throughout the industry, with the real winners being the consumers, gamers and businesses which buy these Intel-based computers." Next Generation Processors - Westmere and Sandy Bridge In his Intel Developer Forum keynote, Maloney demonstrated a Westmere-based PC that showed a marked increase in responsiveness on simple, everyday tasks such as Web-surfing with multiple windows open. Moreover, Westmere is Intel's first 32nm processor, and historic in that it is the first-ever Intel processor to integrate graphics die right into the processor's package.
    [Show full text]
  • Intel I7 Core Processor – a New Order Processor Level
    © 2014 IJIRT | Volume 1 Issue 6 | ISSN : 2349-6002 Intel i7 core processor – A new order processor level Arpit Yadav ; Anurag Parmar; Abhishek Sharma Electronics and Communication Engineering ABSTRACT: The paper bestowed up here may be a higher and economical compactibility , advanced complete exposure to the exactly used technologies in response towards the users demand. Now, the Intel i7 core processor.Intel i7 processor may be a fresh question arise why solely Intel core? .. Intel on the market and latest core processor gift within the Penrynmicroarchitecture includes Core a pair of market. It uses all the new technologies gift with within family of the processors that was the primary thought the corporative world. it's redesigned by a high repetitive quality of software package technocrats so it's . Intel microarchitecture isbased on the 45nm subtle style of all of the core processors gift.Intel Core i7 fabrication method. this enables Intel to create the sometimes applies to any or all families of desktop and next performance vary of processorsthat apace portable computer 64-bit x86-64processors that uses the consumes similar or less power than the antecedently Westmere , Nehalaem , Ivy , Sandy Bridge and also the generation processors. Intel Core primarily may be a Haswell microarchitectures. The Core i7 complete brand that Intel uses for the assorted vary of middle principally targets all the business and high-end to high-end customers and business based mostly shopper markets for each desktop and portable microprocessors. Generally, processors computer computers, and is distinguished from the oversubscribed within the name of Core square (entry-level consumer)Core i3, (mainstream consumer) Core i5, and (server and workstation) Xeon brands.
    [Show full text]
  • Why Should Intel Channel Partners Transition to Sandy Bridge?
    Legal Notices and Important Information Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. Go to: http://www.intel.com/products/processor_number Performance results are based on certain tests measured on specific computer systems. Any difference in system hardware, software or configuration will affect actual performance. Configurations: see Appendix A. For more information go to http://www.intel.com/performance Intel® Hyper-Threading Technology requires an Intel® HT Technology enabled system, check with your PC manufacturer. Performance will vary depending on the specific hardware and software used. Not available on Intel® Core™ i5-750. For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading Intel® Turbo Boost Technology requires a system with Intel® Turbo Boost Technology capability. Consult your PC manufacturer. Performance varies depending on hardware, software and system configuration. For more information, visit http://www.intel.com/technology/turboboost This document contains information on products in the design phase of development. For more information on Intel® Advanced Vector Extensions see http://software.intel.com/sites/avx/ Intel, the Intel logo, Intel Core, Core, Core Inside, are trademarks of Intel Corporation in the U.S. and other countries. All products, computer systems, dates, and figures specified are preliminary based on current
    [Show full text]
  • Camp Marketing Consultancy
    Camp Marketing Consultancy Power Dimensions of Economic Freedom. Law Int l Express Int l Express e e Understanding artificial acceleration - systematic concentration – targeted financial misappropriation iCore 9 Gulftown Desktop & Xeon Westmere EP 5600 Series 2 way Economic assessment calculated on Intel through press signal that is RICO Collusion by Model “Science is basically concerned with investigating how and why things are as they are. Science, in fact, is organized knowledge about the world, not organized knowledge about itself”. Stafford Beer, University of Manchester; Decision & Control, 1966 Mike Bruzzone, Camp Marketing Consultancy, [email protected], 415/250-4652 FTC Submission 7/23/2012 Camp Marketing Consultancy “The latest wave of new competition laws is taking place in countries where the domestic economy has some similarities to the United States when Competition law was first enacted. Many of these countries, like the United States of the 1890’s, have economies that are dominated by large firms. In the transitional economies, the giant firms tend to be leftovers from colonial governments, state enterprise formed by socialist governments, or government favoritism based on Crony capitalism. Regardless of the reasons for the dominance of these oversized firms they will not survive if they are disciplined by competitive market forces. As a result some of these firms are likely to fail when faced by market competition and competition laws, others will have to change dramatically in order to survive. The question of what institutions are necessary to create a market economy has provoked a great deal of discussion that is reflected in academic and popular literature.
    [Show full text]