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Embedded Linux Systems with the Yocto Project™
OPEN SOURCE SOFTWARE DEVELOPMENT SERIES Embedded Linux Systems with the Yocto Project" FREE SAMPLE CHAPTER SHARE WITH OTHERS �f, � � � � Embedded Linux Systems with the Yocto ProjectTM This page intentionally left blank Embedded Linux Systems with the Yocto ProjectTM Rudolf J. Streif Boston • Columbus • Indianapolis • New York • San Francisco • Amsterdam • Cape Town Dubai • London • Madrid • Milan • Munich • Paris • Montreal • Toronto • Delhi • Mexico City São Paulo • Sidney • Hong Kong • Seoul • Singapore • Taipei • Tokyo Many of the designations used by manufacturers and sellers to distinguish their products are claimed as trademarks. Where those designations appear in this book, and the publisher was aware of a trademark claim, the designations have been printed with initial capital letters or in all capitals. The author and publisher have taken care in the preparation of this book, but make no expressed or implied warranty of any kind and assume no responsibility for errors or omissions. No liability is assumed for incidental or consequential damages in connection with or arising out of the use of the information or programs contained herein. For information about buying this title in bulk quantities, or for special sales opportunities (which may include electronic versions; custom cover designs; and content particular to your business, training goals, marketing focus, or branding interests), please contact our corporate sales depart- ment at [email protected] or (800) 382-3419. For government sales inquiries, please contact [email protected]. For questions about sales outside the U.S., please contact [email protected]. Visit us on the Web: informit.com Cataloging-in-Publication Data is on file with the Library of Congress. -
Semiconductor Contract Manufacturing Worldwide, 1997
t). Semiconductor Contract Manufacturing Worldwide—SCMS-WW to Re- Document Publication order Code Date Document Title Tab: Perspective • SCMS-WW-DP-9701 February 3, 1997 DQ Predicts: Semiconductor Contract Manufacturing in 1997 y a SCMS-WW-DP-9702 March 17, 1997 Telebriefing Summary: Is the Recovery Around the Corner in Wafer Fab Equipment? Or Will the Slowdow/n Extend into 1998? ^ a SCMS-WW-DP-9703 May 12, 1997 Semiconductor Contract Manufacturing W^fer Pricing Trends / a SCMS-WW-DP-9704 June 9, 1997 1996 Fabless Semiconductor Review v a SCMS-WW-DP-9705 June 16. 1997 System-Level Integration ASICs Add Embedded DFIAM y a SCMS-WW-DP-9706 July 21, 1997 Wafer Fab Equipment Market Forecast and Capacity Update • SCMS-WW-DP-9707 August 25, 1997 The Challenges of Embedded DRAM in ASICs: A Manufacturing K/" Economics Point of View • SCMS-WW-DP-9708 September 1, 1997 Capital Spending And Wafer Fab Equipment Midyear Forecast Update: Real Recovery in Progress? Or Is Another Stall in the Works'' ^-^ a SCMS-WW-DP-9709 December 1, 1997 Amkor Wafer Fabrication Services'^ • SCMS-WW-DP-9710 October 13, 1997 IBM Transfers First Copper Metallization Process into Production) a SCMS-WW-DP-9711 November 10, 1997 A Ride Down Intel's Pricing Escalator • SCMS-WW-DP-9712 December 22, 1997 Semiconductor Contract Manufacturing Wafer Pricing Trends: Fall 1997 y Tab: Market Trends a SCMS-WW-MT-9701 September 15, 1997 Midyear 1997 Forecast: Semiconductor Contract Manufacturing Tab: Market StatisUes a SCMS-WW-MS-9701 November 24, 1997 1996 Semiconductor Contract Manufacturing -
SUSTAINABLE INVESTMENT & ANALYSIS by J. TYLER RENZI A
Sustainable Investment and Analysis Item Type text; Electronic Thesis Authors Renzi, J. Tyler Publisher The University of Arizona. Rights Copyright © is held by the author. Digital access to this material is made possible by the University Libraries, University of Arizona. Further transmission, reproduction or presentation (such as public display or performance) of protected items is prohibited except with permission of the author. Download date 24/09/2021 04:29:36 Link to Item http://hdl.handle.net/10150/146637 Renzi, 1 SUSTAINABLE INVESTMENT & ANALYSIS By J. TYLER RENZI ________________________ A Thesis Submitted to The Honors College In Partial Fulfillment of the Bachelors degree With Honors in Finance The University of Arizona May 2010 Approved by: ______________________________ Dr. Sharon Garrison Department of Finance Renzi, 2 The University of Arizona Electric Theses and Dissertations Reproduction and Distribution Form Name: Renzi, John Tyler Degree Title: Bachelor’s in Business Administration Honors Area: Finance Date thesis submitted to Honors College: 05/05/2010 Title of Honors thesis: Sustainable Investment and Analysis The University of Arizona Library Release I hereby grant to the University of Arizona Library the nonexclusive worldwide right to reproduce and distribute my dissertation or thesis and abstract (herein, the “licensed materials”), in whole or in part, in any and all media of distribution and in any format in existence now or developed in the future. I represent and warrant to the University of Arizona that the licensed materials are my original work, that I am the sole owner of all rights in and to the licensed materials, and that none of the licensed materials infringe or violate the rights of others. -
PART I ITEM 1. BUSINESS Industry We Are
PART I ITEM 1. BUSINESS Industry We are the world’s largest semiconductor chip maker, based on revenue. We develop advanced integrated digital technology products, primarily integrated circuits, for industries such as computing and communications. Integrated circuits are semiconductor chips etched with interconnected electronic switches. We also develop platforms, which we define as integrated suites of digital computing technologies that are designed and configured to work together to provide an optimized user computing solution compared to ingredients that are used separately. Our goal is to be the preeminent provider of semiconductor chips and platforms for the worldwide digital economy. We offer products at various levels of integration, allowing our customers flexibility to create advanced computing and communications systems and products. We were incorporated in California in 1968 and reincorporated in Delaware in 1989. Our Internet address is www.intel.com. On this web site, we publish voluntary reports, which we update annually, outlining our performance with respect to corporate responsibility, including environmental, health, and safety compliance. On our Investor Relations web site, located at www.intc.com, we post the following filings as soon as reasonably practicable after they are electronically filed with, or furnished to, the U.S. Securities and Exchange Commission (SEC): our annual, quarterly, and current reports on Forms 10-K, 10-Q, and 8-K; our proxy statements; and any amendments to those reports or statements. All such filings are available on our Investor Relations web site free of charge. The SEC also maintains a web site (www.sec.gov) that contains reports, proxy and information statements, and other information regarding issuers that file electronically with the SEC. -
Micron Technology Inc
MICRON TECHNOLOGY INC FORM 10-K (Annual Report) Filed 10/25/11 for the Period Ending 09/01/11 Address 8000 S FEDERAL WAY PO BOX 6 BOISE, ID 83716-9632 Telephone 2083684000 CIK 0000723125 Symbol MU SIC Code 3674 - Semiconductors and Related Devices Industry Semiconductors Sector Technology Fiscal Year 08/30 http://www.edgar-online.com © Copyright 2011, EDGAR Online, Inc. All Rights Reserved. Distribution and use of this document restricted under EDGAR Online, Inc. Terms of Use. UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-K (Mark One) ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended September 1, 2011 OR TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the transition period from to Commission file number 1-10658 Micron Technology, Inc. (Exact name of registrant as specified in its charter) Delaware 75-1618004 (State or other jurisdiction of incorporation or organization) (IRS Employer Identification No.) 8000 S. Federal Way, Boise, Idaho 83716-9632 (Address of principal executive offices) (Zip Code) Registrant's telephone number, including area code (208) 368-4000 Securities registered pursuant to Section 12(b) of the Act: Title of each class Name of each exchange on which registered Common Stock, par value $.10 per share NASDAQ Global Select Market Securities registered pursuant to Section 12(g) of the Act: None (Title of Class) Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. -
Intel® 80331 I/O Processor Design Guide Contents
Intel® 80331 I/O Processor Design Guide March 2005 Order Number:273823-003 Intel® 80331 I/O Processor Design Guide Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling1-800-548- 4725, or by visiting Intel's website at http://www.intel.com. AlertVIEW, AnyPoint, AppChoice, BoardWatch, BunnyPeople, CablePort, Celeron, Chips, CT Connect, CT Media, Dialogic, DM3, EtherExpress, ETOX, FlashFile, i386, i486, i960, iCOMP, InstantIP, Intel, Intel logo, Intel386, Intel486, Intel740, IntelDX2, IntelDX4, IntelSX2, Intel Create & Share, Intel GigaBlade, Intel -
Micron Technology Inc
MICRON TECHNOLOGY INC FORM 10-K (Annual Report) Filed 10/26/10 for the Period Ending 09/02/10 Address 8000 S FEDERAL WAY PO BOX 6 BOISE, ID 83716-9632 Telephone 2083684000 CIK 0000723125 Symbol MU SIC Code 3674 - Semiconductors and Related Devices Industry Semiconductors Sector Technology Fiscal Year 03/10 http://www.edgar-online.com © Copyright 2010, EDGAR Online, Inc. All Rights Reserved. Distribution and use of this document restricted under EDGAR Online, Inc. Terms of Use. UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-K (Mark One) ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the fiscal year ended September 2, 2010 OR TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 For the transition period from to Commission file number 1-10658 Micron Technology, Inc. (Exact name of registrant as specified in its charter) Delaware 75 -1618004 (State or other jurisdiction of (IRS Employer incorporation or organization) Identification No.) 8000 S. Federal Way, Boise, Idaho 83716 -9632 (Address of principal executive offices) (Zip Code) Registrant ’s telephone number, including area code (208) 368 -4000 Securities registered pursuant to Section 12(b) of the Act: Title of each class Name of each exchange on which registered Common Stock, par value $.10 per share NASDAQ Global Select Market Securities registered pursuant to Section 12(g) of the Act: None (Title of Class) Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. -
Everything Matters
Everything intel.com/go/responsibility Matters Global Citizenship Report 2003 Contents Executive Summary 3 Everything Adds Up Corporate Performance 4 Organizational Profile 6 Everywhere Matters 8 Stakeholder Relationships 10 Performance Summary 11 Goals & Targets 12 Ethics & Compliance 13 Economic Performance Environment, Health & Safety 14 Every Effort Contributes 16 Performance Indicators 18 Inspections & Compliance 19 Workplace Health & Safety 20 Environmental Footprint 22 Product Ecology 23 EHS Around the World Social Programs & Performance 24 Everyone Counts 26 Workplace Environment 31 Everyone Has a Say 32 Diversity 34 Education 36 Technology in the Community 37 Contributing to the Community 38 External Recognition 39 Intel: 35 Years of Innovation GRI Content Table Section # GRI Section Intel Report Reference Page # 1.1 Vision & Strategy Executive Summary 3 1.2 CEO Statement Executive Summary 3 2.1– 2.9 Organizational Profile Organizational Profile, Stakeholder Relationships 4–9 2.10– 2.16 Report Scope Report Scope & Profile 2 2.17– 2.22 Report Profile Report Scope & Profile 2 3.1– 3.8 Structure & Governance Ethics & Compliance 12 3.9– 3.12 Stakeholder Engagement Stakeholder Relationships 8–9 3.13– 3.20 Overarching Policies & Management Systems Ethics & Compliance, For More Information 12, 40 4.1 GRI Content Index GRI Content Table 2 Performance Summary 2003 Performance, 2004 Goals & Targets 10–11 5.0 Economic Performance Indicators Economic Performance 13 5.0 Environmental Performance Indicators Environment, Health & Safety 14– 23 5.0 Social Performance Indicators Social Programs & Performance 24–37 Report Scope and Profile: This report, addressing Intel’s worldwide operations, was published in May 2004. The report contains data from 2001 through 2003. -
Computer Architectures an Overview
Computer Architectures An Overview PDF generated using the open source mwlib toolkit. See http://code.pediapress.com/ for more information. PDF generated at: Sat, 25 Feb 2012 22:35:32 UTC Contents Articles Microarchitecture 1 x86 7 PowerPC 23 IBM POWER 33 MIPS architecture 39 SPARC 57 ARM architecture 65 DEC Alpha 80 AlphaStation 92 AlphaServer 95 Very long instruction word 103 Instruction-level parallelism 107 Explicitly parallel instruction computing 108 References Article Sources and Contributors 111 Image Sources, Licenses and Contributors 113 Article Licenses License 114 Microarchitecture 1 Microarchitecture In computer engineering, microarchitecture (sometimes abbreviated to µarch or uarch), also called computer organization, is the way a given instruction set architecture (ISA) is implemented on a processor. A given ISA may be implemented with different microarchitectures.[1] Implementations might vary due to different goals of a given design or due to shifts in technology.[2] Computer architecture is the combination of microarchitecture and instruction set design. Relation to instruction set architecture The ISA is roughly the same as the programming model of a processor as seen by an assembly language programmer or compiler writer. The ISA includes the execution model, processor registers, address and data formats among other things. The Intel Core microarchitecture microarchitecture includes the constituent parts of the processor and how these interconnect and interoperate to implement the ISA. The microarchitecture of a machine is usually represented as (more or less detailed) diagrams that describe the interconnections of the various microarchitectural elements of the machine, which may be everything from single gates and registers, to complete arithmetic logic units (ALU)s and even larger elements. -
Wen-Mei William Hwu
Wen-mei William Hwu PERSONAL INFORMATION Office: Home: Coordinated Science Laboratory 2709 Bayhill Drive 1308 West Main Street, Champaign, Illinois, 61822-7988 Urbana, Illinois, 61801-2307 (217) 359-8984 (217) 244-8270 (217) 333-5579 (FAX) Email: [email protected] EDUCATION Ph.D., Computer Science,1987, University of California, Berkeley B.S., Electrical Engineering, 1983, National Taiwan University, Taiwan CURRENT POSITION Professor and Sanders III Advanced Micro Devices, Inc., Endowed Chair, Electrical and Computer Engineering; Research Professor of Coordinated Science Laboratory, University of Illinois, Urbana-Champaign (UIUC). Chief Technology Officer and Co-Founder, MulticoreWare, Sunnnyvale, California, St. Louis, Missouri, Champaign, Illinois, Chennai, India, Chang-Chun and Beijing, China. Chief Scientist, Parallel Computing Institute, University of Illinois at Urbana-Champaign Board Member, Personify, Inc., Champaign, IL PROFESSIONAL EXPERIENCE September 2016 to present Co-Director (with Jinjun Xiong of IBM) of the IBM-Illinois Center for Cognitive Computing Systems Research, funded by IBM at a total of $8M for five years. The center funds a total of 30+ researchers working on hardware, software, and algorithms for building cognitive computing systems for innovative AI applications. June 2010 to present Co-Director (with Mateo Valero) of the PUMPS Summer School in Barcelona jointly offered by UIUC and the Universitat Politècnica de Catalunya. The summer school has been attended by about 100 faculty and graduate students worldwide every year to study the advanced parallel algorithm techniques for manycore computing systems. June 2008 to present Principle Investigator of the UIUC CUDA Center of Excellence, funded by NVIDIA at over $2.0 M in cash and equipment. -
Normal File for Office 2009 & 2010
Intel Corporation, incorporated in 1968, designs and manufactures integrated digital technology platforms. A platform consists of a microprocessor and chipset. The Company sells these platforms primarily to original equipment manufacturers (OEMs), original design manufacturers (ODMs), and industrial and communications equipment manufacturers in the computing and communications industries. The Company’s platforms are used in a range of applications, such as personal computers (PCs) (including Ultrabook systems), data centers, tablets, smartphones, automobiles, automated factory systems and medical devices. The Company also develops and sells software and services primarily focused on security and technology integration. In February 2013, it acquired ProFUSION-Comercio e Prestacao de Servicos em Tecnologia da Informacao Ltda. In May 2013, Intel Corp acquired Aepona Ltd. Effective July 16, 2013, Intel Corp acquired Omek Interactive Ltd. Effective August 15, 2013, Intel Corp acquired Fujitsu Semiconductor Wireless Products Inc, from Fujitsu Semiconductor Ltd, a wholly owned subsidiary of Fujitsu Ltd. In February 2014, M/A-COM Technology Solutions Holdings Inc announced that its subsidiary Mindspeed Technologies Inc completed the sale of assets of its wireless infrastructure business unit to Intel Corporation. On January 31, 2011, the Company acquired Wireless Solutions (WLS) business of Infineon Technologies AG. On February 28, 2011, the Company acquired McAfee, Inc. In August 2011, the Company formed a wholly owned subsidiary, Intel Federal LLC. During the year ended December 31, 2011, it sold the remaining interest in Micron. On February 2012, QLogic Corp. sold the product lines and certain assets associated with its InfiniBand business to the Company. In May 2012, Cray Inc. completed the sale of its interconnect hardware development program and related intellectual property to the Company. -
Intel® Teach Program Getting Started Course
Intel® Teach Program Getting Started Course Master Teacher Edition v.2.0 Intel® Teach Program Getting Started Course The Getting Started curriculum materials were developed by Intel Corporation in cooperation with the Institute of Computer Technology (ICT), a nonprofit organization. Programs of the Intel® Education Initiative are funded by the Intel Foundation and Intel Corporation. Copyright © 2007 Intel Corporation. All rights reserved. Intel, the Intel logo, Intel Education Initiative, and Intel Teach Program are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Version 2.0 Welcome to the Intel® Teach Program Getting Started Course. Thanks to teachers like you, over 4 million educators worldwide have made technology learning more compelling and more relevant. Dedicated teachers nurture the innovative potential in young people, preparing them to step into a world where an understanding of technology can help shape their success. Like you, Intel is passionate about education, because we know it is the foundation for innovation and opportunity. So, on behalf of Intel, I want to thank you for participating in this course. Since 1999, the Intel Teach Program has helped educators in more than 40 countries. Our programs are built for educators by educators, and they combine best practices with the power of technology. We live in a global economy where each one of us is increasingly challenged to analyze information, collaborate, and communicate ideas using an ever-changing array of technology. We hope our materials help prepare you to succeed in this competitive environment.