Si2Si2 MemberMember ReportReport 20102010

InnovationInnovation ThroughThrough CollaborationCollaboration BoardBoard ofof DirectorsDirectors 20102010 -- 20112011 TermTerm

Apache Design Systems ARM AMD Vic Kulkarni John Goodenough Jim Miller Sr VP/General Manager of VP, Design Vice President, RTL Business Unit Technology & Automation Design Engineering

Cadence Design Systems IBM Charlie Huang Dr Leon Stok Rahul Goyal Senior Vice President VP, EDA Director, EDA Business and Chief Strategy Officer

National GLOBALFOUNDRIES LSI Semiconductor Mojy Chian Prabhakaran Krishnamurthy James Lin Senior VP, Design Senior Director, Design VP Technology Enablment Implementation Infrastructure Group

Synopsys Si2 John Chilton Steve Schulz Sr. VP & General Manager President & CEO LetterLetter fromfrom thethe ChairmanChairman

Prabhu Krishnamurthy - LSI Senior Director, Design Implementation Si2 Board of Directors Chair

As we turn the leaf on another successful year of collaboration at Si2, it is time to reflect on our collective accomplishments for 2010. Si2 started off the year approving the formation of a new coalition, "OpenPDK", with the goal of improving efficiency and interoperability for the creation of process design kits (PDKs), which are used universally across our industry. We are extremely pleased with the excitement that this new coalition has created, and we now have 15 member companies who are actively contributing to support the broad technical scope of OpenPDK. This scope includes an open process specification with reference implementation and plug-ins; enhanced, standardized symbols and parameters; CDF parameter and callback standards; PDK targeting support added to the OpenDFM standard; standard Pcell parameters; OpenAccess technology file enhancements; and a standardized SPICE socket.

2010 was also a strong year of progress for Si2's other coalitions. The OpenAccess Coalition released support for 32nm constraints and introduced multi-threading to the reference implementation. The OAC also initiated a new Extension Steering Group to approve community-based additions to the OpenAccess schema, use models, or software that do not require changes to the base standard. The DFM Coalition released the much-anticipated OpenDFM 1.0 standard to industry, complete with a reference implementation parser, plug-in generators, and suite of test cases to verify compatibility. Not only does OpenDFM standardize leading-edge DFM parameter checks, but testing by members has found it to be as much as 20x more efficient than existing DRC formats. The Low-Power Coalition published a best-practices Interoperability Guide for design teams using both CPF and UPF-1801 formats, completed work on CPF 2.0, and released a requirements document for enhanced power modeling standards. The Open Modeling TAB delivered extensions to Liberty to enable more consistent charac- terization and validation of macro-cell libraries.

This was also a milestone year for membership, with Si2 expanding its representation across the supply chain. As the representative of a large fabless corporation (LSI) to Si2's Board of Directors, I am very pleased that the Board now includes a leading foundry (GLOBALFOUNDRIES) among its elected members. The OpenAccess Coalition reached a new record high of 46 member companies in 2010, with the help of semiconductor market leaders such as Samsung, and . Founding membership in the OpenPDK Coalition included all major EDA vendors.

Because of an enduring value proposition to industry, Si2 has maintained financial stability even during difficult times in our global economy. Si2 managed finances well, maintaining it's strong 2009 fund balance and achiev- ing a 10% increase in revenues versus 2009. This provides a solid foundation to support the tremendous amount of coalition deliverables work that has been planned for 2011.

Going into 2011, Si2's focus will be on delivering tangible return on investment value to our membership and to the industry at large, not only with newer efforts such as OpenPDK, OpenDFM, and Open3D, but also estab- lished efforts that also require ongoing innovations in OpenAccess, low power flows, and open modeling. I am proud to serve as Chairman of this fine organization, and I call for your continued support to work alongside industry leaders to improve design flow integration and interoperability for us all. Through increased member- ship and participation, we can remove more barriers to reduce costs and further open market opportunity.

- PK - President’s Message

Si2 Steve Schulz, President & CEO

When do standards matter most to your business? Business goals vary: to enable or grow a market, increase share of a market, reduce internal costs, enable faster time-to-market, or steer an industry in a technology direction favorable to your products or methodologies.

The key to understanding when a standard becomes an important link to your business is to recognize scenarios where the exchange of data is (a) impeding efficient operations, or (b) impedes a desired business strategy. In the case of impeding operations, this usually takes the form of wasted manual effort affecting cost and/or schedule, or limits technical features of the product. In the second scenario, a desired business strategy (for users) may be to provide flexibility in choice of suppliers to adapt to changing market conditions. For suppliers, it opens up market opportunity with users who embrace open standards and in- creases focus on more differentiating areas of your product.

Next, assess the important attributes of a standard to support those objectives. These will be case-specific, however a standard should be extensible by design, tested with real-world use cases, enable leverage / consis- tency with other existing standards, and supported by reference code, training, and utilities to ease adoption. Standards with broad impact spanning across the design flow will yield a proportionally larger return on invest- ment (ROI) when adopted. When it comes to standards, the ROI business value actually increases as adoption grows, so a good investment in a standard now becomes an even better one as more of industry converges around it over time.

Although it can be a valid business strategy to wait for a standard to become available for free, many strong market leaders repeatedly make the choice to engage early instead. There can be numerous reasons for this choice. First, if your company has internal methodologies or uses specific data that offers in-house advantages, it would be important to protect those advantages by ensuring the standard does not conflict with or minimize them. Second, if others developing the standard lack the expertise in your company's core strength areas, then your competition's needs would be met while yours may not. Furthermore, many executives tell us that working with other peer thought leaders makes for better and more creative engineers.

The process behind developing a standard may not seem too important at first. However, those with experience will tell you that these details can matter a great deal and can directly affect the company's ROI. Look for strictly non-discriminatory processes at all levels, broad representative participation, equally shared rights, control, and ownership of the technology, and strong legal protection for your company's IP portfolio.

Please make a conscious decision about participating in Si2 standards, since they may have a large impact on your business and future competitiveness. It is only through a balance of give-and-take in standards investment that our industry can continue to grow in capability and efficiency, and where the right standards at the right time can help us achieve critical mass in emerging "More Than Moore" technology areas (e.g., 3D die stacking). This essence is also well captured in Si2's tag line, "Innovation Through Collaboration". The members of Si2 believe in this model, and the business value of these investments, to help our industry move forward.

Sincerely,

Steven E. Schulz OpenAccessOpenAccess CoalitionCoalition

The OpenAccess Coalition is a community-driven initiative formed to enable the creation of tightly inte- grated flows involving best-in-class commercial and proprietary tools and intellectual property, neces- sary to support design of today's complex chips. This is done through an open-standard application programming interface (API) and reference database implementation supporting that API.

OpenAccess adoption has continued unabated in 2010, as proven by the number of companies who are either selling OpenAccess-based tools or are using OpenAccess- based flows in chip design. Coalition membership is at an all-time high of 46 mem- bers, up from 36 just one year ago. A broad membership and increased participation is important to continue to drive the evolution of OpenAccess to meet the needs of the entire industry.

Plans for 2011 include: Production release of SWIG-based scripting language bindings, and OpenAccess functionality and performance enhancements in line with the published roadmap (pending priority assessment and approval by the Coalition). MajorMajor AccomplishmentsAccomplishments -- 20102010 • A major DM4 release with several enhancements - Initial support for Multi-threading, based on a first set of well-understood use cases, as well as support for 32nm constraints natively in OpenAccess

• The Extensions Steering Group (ESG) was formed to encourage a new generation of functionality and input from multiple sources in the industry

• The Parasitics WG was kicked off to evaluate the OpenAccess parasitic model and represen- tation and determine possible enhancements to address the needs of leading-edge designs and technologies. The WG is currently seeking feedback on needed enhancements through a survey that is available on the Si2 web-site (https://www.si2.org/?page=1281)

OpenAccess Coalition Members Hewlett-Packard PDF Solutions, GmbH Agilent Technologies IBM Pulsic Limited Altera IC Manage Pyxis AnaGlobe Technology, Inc. Intel R3 Logic ANSYS Invarian Renesas Electronics Corporation Apache Design Solutions Jedat Atrenta Juspertor UG Silvaco AWR Corporation Magma Design Automation SpringSoft MatrixOne Ciranova Tanner Research Coupling Wave Solutions Mephisto Design Automation Teklatech A/S D2S Micro Magic Tela Innovations Dolphin Integration Nangate A/S Texas Instruments Entasys Design NXP Tool Corp. Gradient Design Automation Oracle Zuken Parallel Engines OpenAccessOpenAccess ScriptingScripting LanguagesLanguages ProjectProject

The OpenAccess Coalition Scripting Languages Working Group (WG), is creating interfaces between the OpenAccess API and popular open scripting languages. Working Group members include repre- sentatives from Agilent, Altera, AMD, Cadence, IBM, Intel, SpringSoft, Synopsys, and Voom.

The Working Group has created new bindings for four popular programming languages: , Python, Ruby and Tcl. Along with the existing C++ API, these new implementations of the OpenAccess API enable CAD developers and chip designers alike to easily extract and manipulate design data using their favorite scripting language.

Perl API Python API Ruby API Tcl API Language-Specific Bindings

Common Wrapper Architecture Type Mapping Type Mapping Type Mapping Type Mapping Type Mapping Type Mapping Type Mapping Type Mapping Interface

CommonEDA Programmer SWIG Framework Centric Common SWIG Framework

OpenAccess API C++ Programming Interface

The performance and usability of the new Scripting Languages Working Group bindings surpass previous open scripting language implementations. The Scripting Languages Working Group bind- ings are all based on the popular SWIG (www.swig.org) tool. This unified architecture eases mainte- nance and simplifies the addition of any of the many programming languages supported by SWIG.

"I used the OpenAccess Perl binding on multiple applications in a demanding production environ- ment," commented independent consultant John McGehee. "It leverages the existing C++ API structure and OpenAccess documentation, and allows me to quickly develop applications in my clients' choice of ."

The beta release is available now at si2.org for download by OpenAccess Coalition member compa- nies. The working group is recruiting more interested companies to add new languages and ex- change other information. If you can contribute, please contact Nick English at Si2 for more informa- tion.( http://www.si2.org/?page=3) OpenPDKOpenPDK CoalitionCoalition

The OpenPDK Coalition was founded in mid-2010 with the goal of defining a set of open standards to allow an OpenPDK to be created once and then translated into specific EDA vendor tools and specific foundry formats. This will allow an OpenPDK to be as portable across foundries and as agnostic to EDA tools as possible. The Si2 OpenPDK will enable greater efficiency in PDK development, verification and delivery; and will provide equivalent support to all foundries, all EDA tool vendors, all IP providers, and all end users.

The goals for the OpenPDK Coalition for 2011 include: Publish roadmap and re- lease standards for process specs, symbols, CDF and callbacks.

A schema and data model for an Open Process structure with defined relationships between the objects will be published as a UML model for Coalition use as well as an XML representation for storing actual process data for use in automating design flows. The Coalition is also creating en- abling collateral to support adoption among member companies.

MajorMajor AccomplishmentsAccomplishments -- 20102010

• Coalition and structures established, staffed with member representatives

• Started 2 working groups and posted 2 Request For Technology documents to focus on standards for process specs, symbols, Component Description Format (CDF) and callbacks

• Received a contribution of a UML model describing the structure and relationships of an Open Process Specification. The working group is currently editing and expanding the model

• Received two symbol contributions totaling 87 symbols covering the most popular device and schematic symbols. This standard symbol set will continue to grow

OpenPDK Coalition Members AnaGlobe Technology, Inc. National Semiconductor Cadence Design Systems NXP Global Foundries Pulsic Limited IBM Corporation Silvaco Intel Corporation SpringSoft Magma Design Automation STMicroelectronics Mentor Graphics Synopsys Mun EDA GmbH LowLow PowerPower CoalitionCoalition

The Low-Power Coalition (LPC) will deliver enhanced capabilities in low-power (IC) design flows in particular relating to specifications of low-power design intent, architectural tradeoffs, logical/physical implementation, design verification and testability.

The LPC continues to move forward with standards, flows and other supporting materials to support low power design. The Si2 CPF standard has been in produc- tion use for four years worldwide. The CPF-IEEE1801 Interoperability Guide and new Si2 standards to represent the next version of CPF were developed in 2010.

Plans for 2011 include: Release CPF 2.0 as an open Si2 standard as well as a parser to enable adoption, and update the Interoperability Guide to align with CPF 2.0. They also plan to release an enhancement to the power modeling requirements specification that will include variability modeling.

Major Accomplishments - 2010

• Wide acceptance of CPF 1.0 and 1.1 in hundreds of companies world-wide with many production design starts and tapeouts in 2010 based on this proven Si2 Standard

• Release of the Interoperability Guide to industry to support interoperability between CPF 1.1 and IEEE1801-2009

• Completion of work on CPF 2.0 prior to standardization

• Release of power modeling requirements specification phases 1 & 2 for non mutually exclusive states (non-mutex) and atomic modeling of high level IP blocks

Low Power Coalition Members Apache Design Solutions IBM Corporation ARM LSI Corporation Atrenta Magma Design Automation Cadence Design Systems Renesas Electronics Corporation Calypto Design Systems Synopsys Entasys Design Design for Manufacturability Coalition

Design for Manufacturability design flows have become increasingly critical as normal excursions in semiconductor manufacturing result in significant variations for yield, power and performance at 45 nm process nodes and below. Both Process limited yield (PLY) and Circuit limited yield (CLY). lower manufacturing profits since these circuits must be scrapped or sold at a discount because they miss the power and/or performance targets of a nominal device.

In response to these issues, the Design for Manufacturability Coalition (DFMC) has developed a standard interface format that describes a comprehensive set of DFM parameters that can verify that a circuit will meet it's profit targets. The DFM parameters are defined in an open-source and extensible standard format called OpenDFM which provides a common set of DFM parameters to a wide variety of physical verification and analysis tools dramatically improving the interface between EDA vendors and silicon foundries.

Plans for 2011 include: Release OpenDFM 1.1 with Targeting and Edge Operations as an open Si2 standard; Define an XML-like data structure to hold the parameters necessary for the extraction of both device and parasitic parameters. The XML data structure will be a superset of the mostly commonly used formats to specify the physical process parameters required for extraction.

Major Accomplishments - 2010

• OpenDFM 1.0 released as an open Si2 standard

• The OpenDFM Parser with plug-in interface to connect to proprietary DRC formats was developed and is available to DFMC members. The release also included several dozen test cases to support member adoption

• The definition of OpenDFM 1.1 with Targeting and Edge Operations was prepared for its 60 day IP review cycle before its release as a standard

• Formation of the OPEX Working Group to develop a standard format for exchange of process parameter data used for parasitic and device extraction

Design for Manufacturability Coalition Members Cadence Design Systems Polyteda Software Global Foundries Corporation IBM Corporation STARC Intel Corporation Synopsys Magma Design Automation Tela Innovations, Inc. Mentor Graphics Texas Instruments Executive Team

Sumit DasGupta – Sr. Vice President of Engineering Sumit DasGupta joined Si2 in 2002 as Vice President of Technology. As Vice President of Technol- ogy, he is responsible for Si2 engineering and service projects, with a special emphasis on OpenAccess. DasGupta comes to Si2 from Motorola, where he served as director of SoC and IP design systems in the semiconductor products sector. While at Motorola, DasGupta served on the Si2 Board of Directors and the Design Technology Council. Prior to Motorola, he worked at IBM in several management and technical positions. DasGupta holds a Ph.D. in computer science from Syracuse University and a master's degree in electrical engineering from Marquette University. He has eight patents and 20 publications to his name.

Bob Carver - VP, Business Development Bob Carver serves as VP of Business Development for Si2. Mr Carver has more than 25 years experience in the Electronic Design Automation Industry. Mr Carver was an early member of SDA which later merged with ECAD to become Cadence Design Systems. Bob has experience in EDA product development, product marketing and design services. While at Cadence Bob developed the SKILL programming language and much of the early Database system that would later evolve into OpenAccess. In marketing Bob launched the Design Framework product line, became Cadence's liaison to MCC in Austin Texas, help found CFI, the precursor to Si2, and later help start Spectrum Services. Bob has been working with Si2 since 2003 and has been instrumental in the launch of all of Si2 coalitions. Mr. Carver received his B.S.E.E. from the University of Texas at Austin.

Jake Buurma – VP, West Coast Operations Jake Buurma currently serves as VP of West Coast Operations for Si2. Mr. Buurma has more than 33 years of industry experience equally split between the design of integrated circuits at major semicon- ductor companies such as National Semiconductor and Toshiba Semiconductor and developing EDA software at companies such as Cadence Design Systems, Silicon Navigator and Aprio. Jake has worked extensively with global development teams in automated physical design, EDA software de- velopment and improving Design for Manufacturability (DFM) at sub-100nm process nodes.Jake was a founding board member of the Virtual Socket Interface Alliance (VSIA) and he was the General Chairman of the Custom Integrated Circuit Conference (CICC). He has authored over 100 papers in technical conferences and engineering journals, he was a contributing author in the book Talking Chips, and the recipient of three patents in Analog and Digital Circuit Design. Mr. Buurma received his M.S.E.E. degree from Santa Clara University and graduated cum laude with a global MBA from Duke University

Nick English - Vice President of Development As an experienced senior manager, Nick English is known for managing both business and technical processes that affect electronic design. He has over 25 years of high-technology industry experience in both engineering and management roles. He has previously served as the chair and the key driver of the OpenKit Initiative within to create standards for the semiconductor industry’s process design kits. Over the last twenty years Nick has held senior management positions in semiconductor, EDA, and software companies. As an engineer he worked in the areas of statistical device modeling at the transistor level. He holds a BSEE and MSEE from the University of South Florida. MembershipMembership ProfileProfile

Si2 Membership Composition

Sources of Si2 Funding

End-User Funding EDA/Other Funding

While EDA vendors represent the majority of Si2's membership by count, the majority of project funding is provided by end-user companies. Si2 Bylaws stipulate that 7 of the 10 elected seats be filled by non-EDA companies to ensure supply chain balance. Note also that Coalitions are normally chaired by end-user companies, and they typically participate in multiple coalitions. MemberMember ListList

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to market, reduce costs, and meet the challenges of sub-micron design. Now in its 23rd year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member compa- nies. Si2 represents nearly 100 companies involved in all parts of the silicon supply chain throughout the world.

Abound Logic Gradient Design Automation Oracle Advanced Micro Devices GRID Simulation Technology PDF Solutions, GmbH Agilent Technologies Hewlett-Packard Perception Software. Altera Huada Empyrean Software Co. Pinebush Technologies Altos Design Automation IBM Corporation Polyteda Software Corporation AnaGlobe Technology IC Manage Pulsic Limited Anova Solutions IMEC R3 Logic ANSYS In2Fab Renesas Electronics Corporation Apache Design Solutions Samsung Electronics Co. ARM Infiniscale SEMI Artwork Conversion Software Intel Corporation Semiconductor Research Corp. Atoptech Invarian Semitronix Atrenta Jedat Shanghai JT-Hyron Software Ausdia Juspertor UG Silicon Frontline Technology AWR Corporation Keirex Technology Inc. SiliconBlue Technologies Corp. CAD Design Software Kenji Morohashi Silvaco Cadence Design Systems LSI Corporation SoftJin Technologies Calypto Design Systems Magma Design Automation SpringSoft Ciranova Marvell Semiconductor STARC Concept Engineering GmbH MatrixOne STMicroelectronics Coupling Wave Solutions Mentor Graphics SynCira Corporation Cray Mephisto Design Automation Synopsys D2S Micro Magic Takumi Technology Demos on Demand Multiprobe Tanner Research Dolphin Integration Mun EDA GmbH Teklatech A/S eASIC Corporation Nangate A/S Tela Innovations, Inc. edacentrum Nannor Technologies TeraRoute LLC EDXACT National Semiconductor Texas Instruments Entasys Design NP Komplete Technologies BV Tool Corp. Ericsson Numerical Innovations TSMC Extreme DA NXP Virage Logic Fastrack Design Inc. OCP-IP Zuken GLOBALFOUNDRIES ON Semiconductor

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Cover photos courtesy of Si2 members AMD, NXP and Texas Instruments