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Blackfin Dual Core Embedded Processor ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 FEATURES MEMORY Dual-core symmetric high-performance Blackfin processor, Each core contains 148K bytes of L1 SRAM memory (proces- up to 500 MHz per core sor core-accessible) with multi-parity bit protection Each core contains two 16-bit MACs, two 40-bit ALUs, and a Up to 256K bytes of L2 SRAM memory with ECC protection 40-bit barrel shifter Dynamic memory controller provides 16-bit interface to a RISC-like register and instruction model for ease of single bank of DDR2 or LPDDR DRAM devices programming and compiler-friendly support Static memory controller with asynchronous memory inter- Advanced debug, trace, and performance monitoring face that supports 8-bit and 16-bit memories Pipelined Vision Processor provides hardware to process sig- 4 Memory-to-memory DMA streams, 2 of which feature CRC nal and image algorithms used for pre- and co-processing protection of video frames in ADAS or other video processing Flexible booting options from flash, SD EMMC, and SPI mem- applications ories and from SPI, link port and UART hosts Accepts a range of supply voltages for I/O operation. See Memory management unit provides memory protection Operating Conditions on Page 52 Off-chip voltage regulator interface 349-ball BGA package (19 mm × 19 mm), RoHS compliant SYSTEM CONTROL BLOCKS PERIPHERALS EMULATOR PLL & POWER FAULT EVENT DUAL TEST & CONTROL MANAGEMENT MANAGEMENT CONTROL WATCHDOG 2× TWI 8× TIMER 1× COUNTER L2 MEMORY 2× PWM CORE 0 CORE 1 32K BYTE ROM B B 3× SPORT 256K BYTE 148K BYTE 148K BYTE 1× ACM PARITY BIT PROTECTED PARITY BIT PROTECTED ECC- L1 SRAM L1 SRAM PROTECTED INSTRUCTION/DATA INSTRUCTION/DATA SRAM 2× UART 112 GP I/O EMMC/RSI DMA SYSTEM 1× CAN 2× EMAC EXTERNAL WITH BUS 2× IEEE 1588 INTERFACES 2× SPI PIPELINED DYNAMIC STATIC CRC VISION PROCESSOR 4× LINK PORT MEMORY MEMORY CONTROLLER CONTROLLER VIDEO SUBSYSTEM HARDWARE 3× PPI FUNCTIONS PIXEL COMPOSITOR LPDDR 16 FLASH 16 USB 2.0 HS OTG DDR2 SRAM Figure 1. Processor Block Diagram Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc. Rev. A Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A. or otherwise under any patent or patent rights of Analog Devices. Trademarks and Tel: 781.329.4700 ©2014 Analog Devices, Inc. All rights reserved. registered trademarks are the property of their respective owners. Technical Support www.analog.com ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 TABLE OF CONTENTS Features . 1 Operating Conditions . 52 Memory . 1 Electrical Characteristics . 55 General Description . 3 Processor — Absolute Maximum Ratings . 59 Blackfin Processor Core . 3 ESD Sensitivity . 59 Instruction Set Description . 4 Processor — Package Information . 59 Processor Infrastructure . 5 Timing Specifications . 60 Memory Architecture . 6 Output Drive Currents . 102 Video Subsystem . 9 Test Conditions . 103 Processor Safety Features . 10 Environmental Conditions . 105 Additional Processor Peripherals . 11 ADSP-BF60x 349-Ball CSP_BGA Ball Assignments . 106 Power and Clock Management . 14 349-Ball CSP_BGA Ball Assignment (Numerical by Ball System Debug . 17 Number) . 106 Development Tools . 17 349-Ball CSP_BGA Ball Assignment (Alphabetical by Pin Name) . 108 Additional Information . 18 349-Ball CSP_BGA Ball Configuration . 110 Related Signal Chains . 18 Outline Dimensions . 111 ADSP-BF60x Detailed Signal Descriptions . 19 Surface-Mount Design . 111 349-Ball CSP_BGA Signal Descriptions . 23 Automotive Products . 112 GP I/O Multiplexing for 349-Ball CSP_BGA . 33 Ordering Guide . 112 ADSP-BF60x Designer Quick Reference . 37 Specifications . 52 REVISION HISTORY 2/14—Rev. 0 to Rev. A Corrected the signal names in the following figures: DDR2 SDRAM Clock and Control Cycle Timing . 69 Added the system clock output specification and additional peripheral external clocks in Clock Related Operating Condi- DDR2 SDRAM Controller Input AC Timing . 70 tions on Page 53. These changes affect the following peripheral Mobile DDR SDRAM Clock and Control Cycle Timing . 72 timing sections. Added Figure 29 and updated Table 42 in Enhanced Parallel Enhanced Parallel Peripheral Interface Timing . 74 Peripheral Interface Timing . 74 Link Ports . 78 Corrected the tHSPIDM, tSDSCIM, tSPICLK, tHDSM, and tSPITDM specifications in Serial Peripheral Interface (SPI) Port—Master Serial Ports—External Clock . 80 Timing . 86 Serial Peripheral Interface (SPI) Port—Master Timing . 86 Corrected the tHDSPID specification in Serial Peripheral Interface Serial Peripheral Interface (SPI) Port—Slave Timing . 88 (SPI) Port—Slave Timing . 88 ADC Controller Module (ACM) Timing . 96 Corrected tSRDYSCKM1 in Serial Peripheral Interface (SPI) Port— SPI_RDY Timing . 92 Additional revisions include the following. Revised all parameters in Timer Cycle Timing . 94 Corrected S0SEL and S1SEL in Figure 8 Clock Relationships and Divider Values . 54 Corrected the timing diagram in ADC Controller Module (ACM) Timing . 96 Revised the dynamic and static current tables CCLK Dynamic Current per core (mA, with ASF = 1) . 57 Removed TWI signals in footnote 3 in JTAG Test And Emula- Static Current—IDD_DEEPSLEEP (mA) . 58 tion Port Timing . 101 Corrected the tWARE parameter in Asynchronous Page Mode Added models to Automotive Products . 112 Read . 64 Corrected the timing diagram in Bus Request/Bus Grant . 69 Rev. A | Page 2 of 112 | February 2014 ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 GENERAL DESCRIPTION The ADSP-BF60x processors are members of the Blackfin Table 1. Processor Comparison (Continued) family of products, incorporating the Analog Devices/Intel Micro Signal Architecture (MSA). Blackfin processors combine a dual-MAC state-of-the-art signal processing engine, the advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) Processor Feature ADSP-BF606 ADSP-BF607 ADSP-BF608 ADSP-BF609 multimedia capabilities into a single instruction-set architecture. L1 Instruction SRAM 64K The processors offer performance up to 500 MHz, as well as low L1 Instruction SRAM/Cache 16K static power consumption. Produced with a low-power and low- L1 Data SRAM 32K voltage design methodology, they provide world-class power L1 Data SRAM/Cache 32K management and performance. L1 Scratchpad 4K By integrating a rich set of industry-leading system peripherals L2 Data SRAM 128K 256K and memory (shown in Table 1), Blackfin processors are the L2 Boot ROM 32K platform of choice for next-generation applications that require per core) Memory(bytes, RISC-like programmability, multimedia support, and leading- Maximum Speed Grade (MHz)2 400 500 edge signal processing in one integrated package. These applica- Maximum SYSCLK (MHz) tions span a wide array of markets, from automotive systems to 250 embedded industrial, instrumentation and power/motor con- Package Options 349-Ball CSP_BGA trol applications. 1 VGA is 640 × 480 pixels per frame. HD is 1280 × 960 pixels per frame. 2 Table 1. Processor Comparison Maximum speed grade is not available with every possible SYSCLK selection. BLACKFIN PROCESSOR CORE As shown in Figure 1, the processor integrates two Blackfin pro- cessor cores. Each core, shown in Figure 2, contains two 16-bit multipliers, two 40-bit accumulators, two 40-bit ALUs, four Processor Feature ADSP-BF606 ADSP-BF607 ADSP-BF608 ADSP-BF609 Up/Down/Rotary Counters 1 video ALUs, and a 40-bit shifter. The computation units process 8-, 16-, or 32-bit data from the register file. Timer/Counters with PWM 8 The compute register file contains eight 32-bit registers. When 3-Phase PWM Units (4-pair) 2 performing compute operations on 16-bit operand data, the SPORTs 3 register file operates as 16 independent 16-bit registers. All SPIs 2 operands for compute operations come from the multiported USB OTG 1 register file and instruction constant fields. Parallel Peripheral Interface 3 Each MAC can perform a 16-bit by 16-bit multiply in each Removable Storage Interface 1 cycle, accumulating the results into the 40-bit accumulators. CAN 1 Signed and unsigned formats, rounding, and saturation are supported. TWI 2 UART 2 The ALUs perform a traditional set of arithmetic and logical operations on 16-bit or 32-bit data. In addition, many special ADC Control Module (ACM) 1 instructions are included to accelerate various signal processing Link Ports 4 tasks. These include bit operations such as field extract and pop- Ethernet MAC (IEEE 1588) 2 ulation count, modulo 232 multiply, divide primitives, saturation Pixel Compositor (PIXC) No 1 1 and rounding, and sign/exponent detection. The set of video Pipelined Vision Processor instructions include byte alignment and packing operations, (PVP) Video Resolution1 No VGA HD 16-bit and 8-bit adds with clipping, 8-bit average operations, and 8-bit subtract/absolute value/accumulate (SAA) operations. Maximum PVP Line Buffer Size N/A 640 1280 Also provided are the compare/select and vector search GPIOs 112 instructions. For certain instructions, two 16-bit ALU operations can be per- formed simultaneously on register pairs (a 16-bit high half and 16-bit low half of a compute register). If the second ALU is used, quad 16-bit operations are possible. Rev. A | Page 3 of 112 | February 2014 ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609 ADDRESS ARITHMETIC UNIT SP I3 L3 B3 M3 FP I2 L2 B2 M2 P5 I1 L1 B1 M1 DAG1 P4 I0 L0 B0 M0 P3 DAG0 P2 DA1 32 P1 DA0 32 P0 32 32 RAB PREG TO MEMORY TO SD 32 LD1 32 32 ASTAT LD0 32 32 SEQUENCER R7.H R7.L R6.H.

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