HB0085: Coreabc V3.7 Handbook
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HB0085 Handbook CoreABC v3.7 Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not Microsemi Corporate Headquarters rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to One Enterprise, Aliso Viejo, independently determine suitability of any products and to test and verify the same. The information provided by Microsemi CA 92656 USA hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely Within the USA: +1 (800) 713-4113 with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP Outside the USA: +1 (949) 380-6100 rights, whether with regard to such information itself or anything described by such information. Information provided in this Fax: +1 (949) 215-4996 document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this Email: [email protected] document or to any products and services at any time without notice. www.microsemi.com About Microsemi © 2016 Microsemi Corporation. All Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and rights reserved. Microsemi and the radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; Microsemi logo are trademarks of timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing Microsemi Corporation. All other devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and trademarks and service marks are the scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design property of their respective owners. capabilities and services. Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www.microsemi.com. 50200085. 11.0 12/16 Contents 1 Revision History . 1 1.1 Revision 11.0 . 1 1.2 Revision 10.0 . 1 1.3 Revision 9.0 . 1 1.4 Revision 8.0 . 1 1.5 Revision 7.0 . 1 1.6 Revision 6.0 . 1 1.7 Revision 5.0 . 1 1.8 Revision 4.0 . 1 1.9 Revision 3.0 . 1 1.10 Revision 2.0 . 1 1.11 Revision 1.0 . 2 2 Introduction . 3 2.1 CoreABC Overview . 3 2.2 Supported Device Families . 4 2.3 Core Version . 4 2.4 Supported Interfaces . 4 2.5 Supported Tool Flows . 4 2.6 Utilization and Performance . 5 3 Functional Description . 9 4 Interface . 10 4.1 Overview of Interfaces . 10 4.2 Parameters . 10 4.3 EN_DATAM Parameter . 13 4.4 Ports . 14 5 CoreABC Programmer’s Model . 15 5.1 Address Spaces . 15 5.1.1 Internal Data RAM Address Space (optional) . 15 5.1.2 I/O Address Space . 15 5.1.3 APB Address Space . 15 5.2 Registers . 16 5.2.1 Accumulator . 16 5.2.2 Z Register (Optional) . 16 5.2.3 Flags Register—Inputs and Condition Codes . 16 5.3 Instruction Set . 16 5.3.1 Constant Expressions . 20 5.3.2 Conditional Code . 21 6 CoreABC Operation . 22 6.1 ACM Lookup Table for Use with CoreAI . 22 6.2 Stack . 22 6.3 Interrupt Operation . 22 7 CoreABC Configuration . 24 HB0085 Handbook Revision 11.0 iii 7.1 Configurable Options . 24 7.1.1 Data Bus Width . 24 7.1.2 Number of APB Slots . 25 7.1.3 APB Slot Size . 25 7.1.4 Maximum Number of Instructions . 25 7.1.5 Z Register Size . 25 7.1.6 Number of I/O Inputs . ..