Table of Contents

Total Page:16

File Type:pdf, Size:1020Kb

Table of Contents PROFILES 1996 A Worldwide Survey of IC Manufacturers and Suppliers Table of Contents Alphabetical Listing of Companies....................................................................................................ix North American Company Profiles 8x8, Inc. ..................................................................................................................................1-1 ACC Microelectronics Corporation............................................................................................1-3 Actel Corporation.....................................................................................................................1-4 Allegro MicroSystems, Inc........................................................................................................1-7 Alliance Semiconductor Corporation ........................................................................................1-10 Altera Corporation....................................................................................................................1-14 AMCC (Applied Micro Circuits Corporation)...............................................................................1-18 AMD (Advanced Micro Devices, Inc.) .......................................................................................1-21 AMI (American Microsystems Inc.)...........................................................................................1-28 Anadigics, Inc..........................................................................................................................1-31 Analog Devices, Inc.................................................................................................................1-33 ARK Logic, Inc. (see ICS) Array Microsystems, Inc...........................................................................................................1-38 AT&T Microelectronics (see Lucent Technologies) Atmel Corporation....................................................................................................................1-40 Austin Semiconductor, Inc.......................................................................................................1-44 Avantek, Inc. (see Hewlett-Packard) Benchmarq Microelectronics, Inc. ............................................................................................1-46 Bit Incorporated.......................................................................................................................1-48 Brooktree Corporation..............................................................................................................1-49 Burr-Brown Corporation............................................................................................................1-53 C-Cube Microsystems..............................................................................................................1-57 California Micro Devices Corporation (CMD) .............................................................................1-59 Calogic Corporation .................................................................................................................1-62 Catalyst Semiconductor, Inc. ...................................................................................................1-64 Cherry Semiconductor Corporation ..........................................................................................1-66 Chip Express Corporation ........................................................................................................1-68 Chips and Technologies, Inc....................................................................................................1-70 Cirrus Logic, Inc.......................................................................................................................1-72 Comlinear Corporation (see National Semiconductor) Crosspoint Solutions, Inc. ........................................................................................................1-77 Crystal Semiconductor Corporation (see Cirrus Logic) Cypress Semiconductor Corporation........................................................................................1-79 Cyrix Corporation .....................................................................................................................1-83 INTEGRATED CIRCUIT ENGINEERING CORPORATION iii Table of Contents Dallas Semiconductor Corporation...........................................................................................1-86 Delco Electronics Corporation (see Hughes Electronics) Digital Semiconductor..............................................................................................................1-89 Dionics Inc...............................................................................................................................1-92 Dominion Semiconductor (see IBM or Toshiba) DSP Group..............................................................................................................................1-93 ECI Semiconductor (see Semtech) EDI (Electronic Designs Inc.)....................................................................................................1-96 EG&G Reticon.........................................................................................................................1-98 Elantec, Inc. ............................................................................................................................1-99 Enhanced Memory Systems, Inc. (see Ramtron) ESS Technology......................................................................................................................1-101 Exar Corporation......................................................................................................................1-103 Exel Microelectronics, Inc.........................................................................................................1-106 Genesis Microchip Inc..............................................................................................................1-108 Gennum Corporation...............................................................................................................1-110 GM Hughes Electronics Corporation (see Hughes Electronics) GTE Microelectronics...............................................................................................................1-112 Harris Semiconductor...............................................................................................................1-114 Honeywell, Incorporated ..........................................................................................................1-119 HP (Hewlett-Packard Company)...............................................................................................1-122 Hughes Aircraft Company (see Hughes Electronics) Hughes Electronics Corporation...............................................................................................1-126 IBM Microelectronics................................................................................................................1-129 IC Works, Inc...........................................................................................................................1-136 ICS (Integrated Circuit Systems, Inc.).......................................................................................1-139 ICT Inc.....................................................................................................................................1-142 IDT (Integrated Device Technology Inc.) ..................................................................................1-144 IMI (International Microcircuits Inc.)..........................................................................................1-148 IMP, Inc...................................................................................................................................1-149 Instant Circuit Holdings Inc. (see Single Chip Systems) Integrated Information Technology, Inc. (IIT), (see 8x8, Inc.) Integrated Silicon Solution Inc. (ISSI).......................................................................................1-152 Intel Corporation......................................................................................................................1-155 Interdesign Custom Arrays Corporation....................................................................................1-161 International Rectifier Corporation............................................................................................1-162 ISD (Information Storage Devices, Inc.) ...................................................................................1-164 IXYS Corporation.....................................................................................................................1-166 KMOS Semiconductor (see Orbit Semiconductor) Lansdale Semiconductor, Inc. .................................................................................................1-168 Lattice Semiconductor Corporation..........................................................................................1-170 Level One Communications, Inc..............................................................................................1-173 Linear Integrated Systems, Inc................................................................................................1-175 Linear Technology Corporation................................................................................................1-176 Linfinity
Recommended publications
  • Reference Architecture: Tiered Hybrid Storage Solution Using Datacore
    REFERENCE ARCHITECTURE WHITE PAPER JANUARY 2020 Tiered Hybrid Storage Solution REFERENCE ARCHITECTURE Tier 1: Ultrastar® NVMe™ series SSDs MV MV Tier 2: Ultrastar Data60 Storage Platform MV SW: DataCore SANsymphony™ Virtual Disks MV MV MV Tier 1 MV MV MV Ultrastar NVMe SSDs Tier 2 Ultrastar Data60 This is an ideal solution for medium-to-large-sized enterprise The Ultrastar Data60 can be equipped with Ultrastar SAS HDDs, workloads with high capacity demand. The solution provides excellent providing a data repository of up to 1.4PB in a 4U storage rack. availability and medium performance at a very low TCO. The 2 tiers of Minimum configuration is 24 HDDs, providing an upgrade roadmap storage allow data to be moved in real time to an appropriate storage of up to 60 drives. If an additional performance tier is required, it is layer that always provides the right performance at the right time for possible to install up to 24 SAS/SATA SSDs. any data set. The DataCore SANSymphony software requires both DataCore To create а high-performance multi-tiered storage solution, it takes SANsymphony EN-Node licenses (free to request and download) and two mirrored server nodes with SATA (OS boot) and NVMe SSDs (data at maximum 904 Datacore TB Capacity license. The actual amount storage) and 2 JBODs with SAS HDDs. This reference architecture uses of TB Capacity licenses is dependent on the total managed storage Ultrastar NVMe series SSDs, connected to 2x Ultrastar Data60 storage capacity in the configuration. platform. The Datacore SANsymphony software runs on a server with Intel® Xeon® Gold 5120 Processors.
    [Show full text]
  • Ethics Agreement in Order to Avoid Any Financial Conflict
    Date: 7 .-e-•15 Iett..% 1--4 17 MEMORANDUM FOR THE RECORD SUBJECT: Ethics Agreement In order to avoid any financial conflict of interest in violation of 18 U.S.C. § 208(a) or the appearance of a financial conflict of interest as defined in the Standards of Ethical Conduct for Employees of the Executive Branch, 5 C.F.R. § 2635.502, and to adhere to the Ethics Pledge instituted by Executive Order 13770 issued on January 28, 2017, and entitled "Ethics Commitments by Executive Branch Appointees" (the Ethics Pledge), I am issuing the following statement. I understand that as an appointee I must sign the Ethics Pledge and that I will be bound by the requirements and restrictions therein even if not specifically mentioned in this or any other ethics agreement. Before beginning my covered Federal position, I resigned from my non-Federal positions with the Association of State and Territorial Health Officials (ASTHO) and the State of Georgia on July 6, 2017. Pursuant to the Ethics Pledge, I will not, for a period of two years from the date of my appointment to my covered Federal position, participate in an official capacity in any particular matter involving specific parties that is directly and substantially related to ASTHO, unless an exception applies or I am granted a waiver. I understand that this provision in the Ethics Pledge does not apply to state government entities, including the State of Georgia. Even when the two-year restriction of the Ethics Pledge does not apply, under 5 C.F.R. § 2635.502, I will not, for a period of one year from the date of my resignation from ASTHO and the State of Georgia, participate in any particular matter involving specific parties in which ASTHO or the State of Georgia is a party or represents a party, unless I am first authorized to participate, pursuant to 5 C.F.R.
    [Show full text]
  • Reviving the Development of Openchrome
    Reviving the Development of OpenChrome Kevin Brace OpenChrome Project Maintainer / Developer XDC2017 September 21st, 2017 Outline ● About Me ● My Personal Story Behind OpenChrome ● Background on VIA Chrome Hardware ● The History of OpenChrome Project ● Past Releases ● Observations about Standby Resume ● Developmental Philosophy ● Developmental Challenges ● Strategies for Further Development ● Future Plans 09/21/2017 XDC2017 2 About Me ● EE (Electrical Engineering) background (B.S.E.E.) who specialized in digital design / computer architecture in college (pretty much the only undergraduate student “still” doing this stuff where I attended college) ● Graduated recently ● First time conference presenter ● Very experienced with Xilinx FPGA (Spartan-II through 7 Series FPGA) ● Fluent in Verilog / VHDL design and verification ● Interest / design experience with external communication interfaces (PCI / PCIe) and external memory interfaces (SDRAM / DDR3 SDRAM) ● Developed a simple DMA engine for PCI I/F validation w/Windows WDM (Windows Driver Model) kernel device driver ● Almost all the knowledge I have is self taught (university engineering classes were not very useful) 09/21/2017 XDC2017 3 Motivations Behind My Work ● General difficulty in obtaining meaningful employment in the digital hardware design field (too many students in the field, difficulty obtaining internship, etc.) ● Collects and repairs abandoned computer hardware (It’s like rescuing puppies!) ● Owns 100+ desktop computers and 20+ laptop computers (mostly abandoned old stuff I
    [Show full text]
  • List of Marginable OTC Stocks
    List of Marginable OTC Stocks @ENTERTAINMENT, INC. ABACAN RESOURCE CORPORATION ACE CASH EXPRESS, INC. $.01 par common No par common $.01 par common 1ST BANCORP (Indiana) ABACUS DIRECT CORPORATION ACE*COMM CORPORATION $1.00 par common $.001 par common $.01 par common 1ST BERGEN BANCORP ABAXIS, INC. ACETO CORPORATION No par common No par common $.01 par common 1ST SOURCE CORPORATION ABC BANCORP (Georgia) ACMAT CORPORATION $1.00 par common $1.00 par common Class A, no par common Fixed rate cumulative trust preferred securities of 1st Source Capital ABC DISPENSING TECHNOLOGIES, INC. ACORN PRODUCTS, INC. Floating rate cumulative trust preferred $.01 par common $.001 par common securities of 1st Source ABC RAIL PRODUCTS CORPORATION ACRES GAMING INCORPORATED 3-D GEOPHYSICAL, INC. $.01 par common $.01 par common $.01 par common ABER RESOURCES LTD. ACRODYNE COMMUNICATIONS, INC. 3-D SYSTEMS CORPORATION No par common $.01 par common $.001 par common ABIGAIL ADAMS NATIONAL BANCORP, INC. †ACSYS, INC. 3COM CORPORATION $.01 par common No par common No par common ABINGTON BANCORP, INC. (Massachusetts) ACT MANUFACTURING, INC. 3D LABS INC. LIMITED $.10 par common $.01 par common $.01 par common ABIOMED, INC. ACT NETWORKS, INC. 3DFX INTERACTIVE, INC. $.01 par common $.01 par common No par common ABLE TELCOM HOLDING CORPORATION ACT TELECONFERENCING, INC. 3DO COMPANY, THE $.001 par common No par common $.01 par common ABR INFORMATION SERVICES INC. ACTEL CORPORATION 3DX TECHNOLOGIES, INC. $.01 par common $.001 par common $.01 par common ABRAMS INDUSTRIES, INC. ACTION PERFORMANCE COMPANIES, INC. 4 KIDS ENTERTAINMENT, INC. $1.00 par common $.01 par common $.01 par common 4FRONT TECHNOLOGIES, INC.
    [Show full text]
  • RECEIVED May 16,2005
    Zoran Corporation 1390 Kifer Road Sunnyvale CA 94086 408 523 65DO Fax 408 523 6501 w.zoran.com RECEIVED May 16,2005 Mr. Alan Stillwell MAY 1 7 2005 Senior Associate Chief Office of Engineering and Technology Federal Communications Commission 445 12th street sw Washington, DC 20554 Re: Requirements for Digital Television Receiving Capability, ET Docket 05-24 Dear Mr. Stillwell, Pursuant to your telephonic request, Zoran Corporation (Zoran) hereby supplies certain information with respect to Digital Television converter boxes that would be capable of converting over the air ATSC signals to NTSC signals for display on legacy NTSC sets through the standard coaxial input of those sets. As you know, Zoran does not manufacturer set top boxes; rather it created the SupraHDTM640 Reference Board, which includes a DTV receiver on a chip. (See the enclosed brochure.) It also has a complete ATSC DTV Reference Design that could be easily used by original equipment manufacturers to build large quantities of low cost converter boxes. Zoran has a great deal of experience in producing full-function low-cost integrated circuits for various consumer electronics devices. Last year it produced silicon chips to enable some 42 million DVD players. That chip is a large part of the reason why a progressive scan DVD player can be purchased for $39.88. (See, e.g., Kenwood model DF-3080s at htt~://www.~ann~.com/shoo/servlet/item/f81099939% c=PriceGrabber) Accordingly, Zoran can provide the following predictions about DTV converter box costs at wholesale and retail. These estimates below, however, are highly dependent on a demand for large quantities of DTV converter boxes, in excess of 100,000 per month, towards a goal of deploying boxes at least in all households dependent on analog broadcasts by the end of 2006.
    [Show full text]
  • Portfolio Holdings Listing Select Semiconductors Portfolio As of June
    Portfolio Holdings Listing Select Semiconductors Portfolio DUMMY as of August 31, 2021 The portfolio holdings listing (listing) provides information on a fund’s investments as of the date indicated. Top 10 holdings information (top 10 holdings) is also provided for certain equity and high income funds. The listing and top 10 holdings are not part of a fund’s annual/semiannual report or Form N-Q and have not been audited. The information provided in this listing and top 10 holdings may differ from a fund’s holdings disclosed in its annual/semiannual report and Form N-Q as follows, where applicable: With certain exceptions, the listing and top 10 holdings provide information on the direct holdings of a fund as well as a fund’s pro rata share of any securities and other investments held indirectly through investment in underlying non- money market Fidelity Central Funds. A fund’s pro rata share of the underlying holdings of any investment in high income and floating rate central funds is provided at a fund’s fiscal quarter end. For certain funds, direct holdings in high income or convertible securities are presented at a fund’s fiscal quarter end and are presented collectively for other periods. For the annual/semiannual report, a fund’s investments include trades executed through the end of the last business day of the period. This listing and the top 10 holdings include trades executed through the end of the prior business day. The listing includes any investment in derivative instruments, and excludes the value of any cash collateral held for securities on loan and a fund’s net other assets.
    [Show full text]
  • Intel Corporation
    US RESEARCH | PUBLISHED BY RAYMOND JAMES & ASSOCIATES INTEL CORPORATION (INTC-NASDAQ) JULY 26, 2021 | 8:27 PM EDT Semiconductors COMPANY BRIEF Chris Caso | (212) 856-4893 | [email protected] Melissa Fairbanks | (727) 567-1081 | [email protected] Underperform 4 New Names, Same Problems Suitability M/ACC Intel hosted its "Intel Accelerated" manufacturing roadmap update Monday evening, detailing their process roadmap through 2025. The presentation laid a path through which Intel hopes to MARKET DATA Current Price (Jul-26-21) $54.31 have achieved parity with TSMC (and by extension, AMD) by 2024, and a goal of process leadership Market Cap (mln) $221,802 by 2025. This is no different from the goals laid out by Intel’s new CEO when he came on board Current Net Debt (mln) $10,552 a quarter ago, but the company did provide more details about how they intend to achieve that Enterprise Value (mln) $232,354 Shares Outstanding (mln) 4,084.0 goal. Attaining leadership by 2025 requires Intel to introduce a full process node improvement 30-Day Avg. Daily Value (mln) $1,362.7 each year for the next 4 years – an aggressive assumption given the production missteps from Dividend $1.39 the past several years. What Intel didn’t disclose were the costs of this roadmap, which we Dividend Yield 2.6% 52-Week Range $43.61 - $68.49 expect them to discuss during the November analyst day. And while there is great uncertainty BVPS $14.76 about Intel’s ability to achieve these targets, what’s less uncertain is a requirement for higher Long-Term Debt (mln) $24,632 capital intensity.
    [Show full text]
  • LPC47N267 Product Brief
    LPC47N267 100-Pin LPC Super I/O with X-Bus Interface Product Features • Enhanced Digital Data Separator - 2 Mbps, 1 Mbps, 500 Kbps, 300 Kbps, 250 • 3.3 Volt Operation (5V tolerant) Kbps Data Rates • Programmable Wakeup Event Interface - Programmable Precompensation Modes (IO_PME# Pin) • Serial Ports • SMI Support (IO_SMI# Pin) - Two Full Function Serial Ports • GPIOs (29) - High Speed NS16C550 Compatible UARTs • Four IRQ Input Pins with Send/Receive 16-Byte FIFOs • X-Bus Interface - Supports 230k and 460k Baud - Supports up to 4 external components - Programmable Baud Rate Generator - Supports I/O cycles (No Memory Support) - Modem Control Circuitry - 8-Bit Data Transfer • Infrared Communications Controller - 16-Bit Address Qualification - IrDA v1.2 (4Mbps), HPSIR, ASKIR, Con- - Write Protection for each component sumer IR Support • XNOR Chain -2 IR Ports • PC99 and ACPI 1.0b Compliant - 96 Base I/O Address, 15 IRQ Options and 3 • 100-pin STQFP Package DMA Options • Intelligent Auto Power Management • Multi-Mode Parallel Port with ChiProtect • 2.88MB Super I/O Floppy Disk Controller - Standard Mode IBM PC/XT, PC/AT, and PS/2 - Licensed CMOS 765B Floppy Disk Controller Compatible Bidirectional Parallel Port - Software and Register Compatible with - Enhanced Parallel Port (EPP) Compatible - Microchip's Proprietary 82077AA Compatible EPP 1.7 and EPP 1.9 (IEEE 1284 Compliant) Core - IEEE 1284 Compliant Enhanced Capabilities - Supports One Floppy Drive Directly Port (ECP) - Configurable Open Drain/Push-Pull Output - ChiProtect Circuitry for
    [Show full text]
  • Fund Holdings As of 6/30/2021 Massmutual Balanced Fund Invesco Prior to 5/1/2021, the Fund Name Was Massmutual Premier Balanced Fund
    Fund Holdings As of 6/30/2021 MassMutual Balanced Fund Invesco Prior to 5/1/2021, the Fund name was MassMutual Premier Balanced Fund. Fund Shares or Par Position Market Security Name Ticker CUSIP Weighting % Amount Value Apple Inc AAPL 037833100 3.91 48,433 6,633,384 Microsoft Corp MSFT 594918104 3.45 21,552 5,838,437 USTREAS T-Bill Auction Ave 3 Mon 1.69 2,862,977 JPMorgan Chase & Co JPM 46625H100 1.56 16,948 2,636,092 Verizon Communications Inc VZ 92343V104 1.45 43,768 2,452,321 The Home Depot Inc HD 437076102 1.42 7,556 2,409,533 Intel Corp INTC 458140100 1.29 38,961 2,187,271 Procter & Gamble Co PG 742718109 1.04 13,105 1,768,258 Cisco Systems Inc CSCO 17275R102 1.03 32,830 1,739,990 UnitedHealth Group Inc UNH 91324P102 1.00 4,215 1,687,855 Comcast Corp Class A CMCSA 20030N101 0.94 28,021 1,597,757 AT&T Inc T 00206R102 0.91 53,587 1,542,234 Oracle Corp ORCL 68389X105 0.83 18,031 1,403,533 Deere & Co DE 244199105 0.76 3,635 1,282,101 Accenture PLC Class A ACN G1151C101 0.74 4,237 1,249,025 Johnson Controls International PLC JCI G51502105 0.74 18,185 1,248,037 Visa Inc Class A V 92826C839 0.71 5,152 1,204,641 Texas Instruments Inc TXN 882508104 0.70 6,128 1,178,414 Costco Wholesale Corp COST 22160K105 0.67 2,850 1,127,660 Bank of America Corp BAC 060505104 0.64 26,192 1,079,896 Broadcom Inc AVGO 11135F101 0.63 2,223 1,060,015 Abbott Laboratories ABT 002824100 0.57 8,348 967,784 Target Corp TGT 87612E106 0.56 3,949 954,631 Honeywell International Inc HON 438516106 0.56 4,324 948,469 Goldman Sachs Group Inc GS 38141G104 0.53 2,374 901,004
    [Show full text]
  • HB0085: Coreabc V3.7 Handbook
    HB0085 Handbook CoreABC v3.7 Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not Microsemi Corporate Headquarters rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to One Enterprise, Aliso Viejo, independently determine suitability of any products and to test and verify the same. The information provided by Microsemi CA 92656 USA hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely Within the USA: +1 (800) 713-4113 with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP Outside the USA: +1 (949) 380-6100 rights, whether with regard to such information itself or anything described by such information. Information provided in this Fax: +1 (949) 215-4996 document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this Email: [email protected] document or to any products and services at any time without notice.
    [Show full text]
  • North American Company Profiles 8X8
    North American Company Profiles 8x8 8X8 8x8, Inc. 2445 Mission College Boulevard Santa Clara, California 95054 Telephone: (408) 727-1885 Fax: (408) 980-0432 Web Site: www.8x8.com Email: [email protected] Fabless IC Supplier Regional Headquarters/Representative Locations Europe: 8x8, Inc. • Bucks, England U.K. Telephone: (44) (1628) 402800 • Fax: (44) (1628) 402829 Financial History ($M), Fiscal Year Ends March 31 1992 1993 1994 1995 1996 1997 1998 Sales 36 31 34 20 29 19 50 Net Income 5 (1) (0.3) (6) (3) (14) 4 R&D Expenditures 7 7 7 8 8 11 12 Capital Expenditures — — — — 1 1 1 Employees 114 100 105 110 81 100 100 Ownership: Publicly held. NASDAQ: EGHT. Company Overview and Strategy 8x8, Inc. is a worldwide leader in the development, manufacture and deployment of an advanced Visual Information Architecture (VIA) encompassing A/V compression/decompression silicon, software, subsystems, and consumer appliances for video telephony, videoconferencing, and video multimedia applications. 8x8, Inc. was founded in 1987. The “8x8” refers to the company’s core technology, which is based upon Discrete Cosine Transform (DCT) image compression and decompression. In DCT, 8-pixel by 8-pixel blocks of image data form the fundamental processing unit. 2-1 8x8 North American Company Profiles Management Paul Voois Chairman and Chief Executive Officer Keith Barraclough President and Chief Operating Officer Bryan Martin Vice President, Engineering and Chief Technical Officer Sandra Abbott Vice President, Finance and Chief Financial Officer Chris McNiffe Vice President, Marketing and Sales Chris Peters Vice President, Sales Michael Noonen Vice President, Business Development Samuel Wang Vice President, Process Technology David Harper Vice President, European Operations Brett Byers Vice President, General Counsel and Investor Relations Products and Processes 8x8 has developed a Video Information Architecture (VIA) incorporating programmable integrated circuits (ICs) and compression/decompression algorithms (codecs) for audio/video communications.
    [Show full text]
  • LATTICE SEMICONDUCTOR CORPORATION (Exact Name of Registrant As Specified in Its Charter)
    3333 33 UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 10-K (Mark One) ANNUAL REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 FOR THE FISCAL YEAR ENDED JANUARY 3, 2009 or TRANSITION REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 FOR THE TRANSITION PERIOD FROM TO Commission file number: 000-18032 LATTICE SEMICONDUCTOR CORPORATION (Exact name of registrant as specified in its charter) Delaware 93-0835214 (State of Incorporation) (I.R.S. Employer Identification Number) 5555 NE Moore Court Hillsboro, Oregon 97124-6421 (Address of principal executive offices) (Zip Code) Registrant’s telephone number, including area code: (503) 268-8000 Securities registered pursuant to Section 12(b) of the Act: (Title of Class) (Name of each exchange on which registered) Common Stock, $.01 par value NASDAQ Global Market Securities registered pursuant to Section 12(g) of the Act: None Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act. Yes No Indicate by check mark if the registrant is not required to file reports pursuant to Section 13 or Section 15(d) of the Act. Yes No Indicate by check mark whether the registrant (1) has filed all reports required to be filed by Section 13 or 15(d) of the Securities Exchange Act of 1934 during the preceding 12 months (or for such shorter period that the registrant was required to file such reports), and (2) has been subject to such filing requirements for the past 90 days.
    [Show full text]