Silicon and Silicide Nanowires
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Reliability Evaluation of Finfet-Based Srams in the Presence of Resistive Defects
UNIVERSIDADE FEDERAL DO RIO GRANDE DO SUL INSTITUTO DE INFORMÁTICA PROGRAMA DE PÓS-GRADUAÇÃO EM MICROELETRÔNICA THIAGO SANTOS COPETTI Reliability Evaluation of FinFET-based SRAMs in the Presence of Resistive Defects Thesis presented in partial fulfillment of the requirements for the degree of PhD in Microelectronics Advisor: Prof. Dr. Tiago Roberto Balen Coadvisor: Profa. Dra. Letícia Maria Bolzani Poehls Porto Alegre February 2021 CIP — CATALOGING-IN-PUBLICATION Copetti, Thiago Santos Reliability Evaluation of FinFET-based SRAMs in the Pres- ence of Resistive Defects / Thiago Santos Copetti. – Porto Alegre: PGMICRO da UFRGS, 2021. 121 f.: il. Thesis (Ph.D.) – Universidade Federal do Rio Grande do Sul. Programa de Pós-Graduação em Microeletrônica, Porto Alegre, BR–RS, 2021. Advisor: Tiago Roberto Balen; Coadvisor: Letícia Maria Bolzani Poehls. 1. FinFET. 2. SRAM. 3. Resistive Defects. 4. SPICE. 5. TCAD. 6. Reliability. 7. Single Event Transient Modeling. I. Balen, Tiago Roberto. II. Poehls, Letícia Maria Bolzani. III. Tí- tulo. UNIVERSIDADE FEDERAL DO RIO GRANDE DO SUL Reitor: Prof. Carlos André Bulhões Vice-Reitora: Profa. Patricia Helena Lucas Pranke Pró-Reitor de Pós-Graduação: Prof. Júlio Otávio Jardim Barcellos Diretora do Instituto de Informática: Profa. Carla Maria Dal Sasso Freitas Coordenador do PGMICRO: Prof. Tiago Roberto Balen Bibliotecária-chefe do Instituto de Informática: Beatriz Regina Bastos Haro THIAGO SANTOS COPETTI Reliability Evaluation of FinFET-based SRAMs in the Presence of Resistive Defects Orientador: Dr. Tiago Roberto Balen Coorientador: Dra. Letícia Maria Bolzani Poehls Porto Alegre February 2021 DEDICATION I dedicate this work to my wife, my parents, and my siblings. “Nobody told me it was impossible, so I did” —JEAN COCTEAU ACKNOWLEDGMENT Firstly, I would like to thank my advisors and friends, Prof. -
Introducing 10-Nm Finfet Technology in Microwind Etienne Sicard
Introducing 10-nm FinFET technology in Microwind Etienne Sicard To cite this version: Etienne Sicard. Introducing 10-nm FinFET technology in Microwind. 2017. hal-01551695 HAL Id: hal-01551695 https://hal.archives-ouvertes.fr/hal-01551695 Submitted on 30 Jun 2017 HAL is a multi-disciplinary open access L’archive ouverte pluridisciplinaire HAL, est archive for the deposit and dissemination of sci- destinée au dépôt et à la diffusion de documents entific research documents, whether they are pub- scientifiques de niveau recherche, publiés ou non, lished or not. The documents may come from émanant des établissements d’enseignement et de teaching and research institutions in France or recherche français ou étrangers, des laboratoires abroad, or from public or private research centers. publics ou privés. APPLICATION NOTE 10 nm technology Introducing 10-nm FinFET technology in Microwind Etienne SICARD Professor INSA-Dgei, 135 Av de Rangueil 31077 Toulouse – France www.microwind.org email: [email protected] This paper describes the implementation of a high performance FinFET-based 10-nm CMOS Technology in Microwind. New concepts related to the design of FinFET and design for manufacturing are also described. The performances of a ring oscillator layout and a 6-transistor RAM memory layout are also analyzed. 1. Technology Roadmap Several companies and research centers have released details on the 14-nm CMOS technology, as a major step for improved integration and performances, with the target of 7-nm process by 2020. We recall in -
The Impact of China's Policies on Global Semiconductor
Moore’s Law Under Attack: The Impact of China’s Policies on Global Semiconductor Innovation STEPHEN EZELL | FEBRUARY 2021 China’s mercantilist strategy to grab market share in the global semiconductor industry is fueling the rise of inferior innovators at the expense of superior firms in the United States and other market-led economies. That siphons away resources that would otherwise be invested in the virtuous cycle of cutting-edge R&D that has driven semiconductor innovation for decades. KEY TAKEAWAYS ▪ No industry has an innovation dynamic quite like the semiconductor industry, where “Moore’s Law” has held for decades: The number of transistors on a microchip doubles about every two years, producing twice the processing power at half the cost. ▪ The pattern persists because the semiconductor industry vies with biopharmaceuticals to be the world’s most R&D-intensive industry—a virtuous cycle that depends on one generation of innovation to finance investment in the next. ▪ To continue heavy investment in R&D and CapEx, semiconductor firms need access to large global markets where they can compete on fair terms to amortize and recoup their costs. When they face excess, non-market-based competition, innovation suffers. ▪ China’s state-directed strategy to vault into a leadership position in the semiconductor industry distorts the global market with massive subsidization, IP theft, state-financed foreign firm acquisitions, and other mercantilist practices. ▪ Inferior innovators thus have a leg up—and the global semiconductor innovation curve is bending downward. In fact, ITIF estimates there would be 5,100 more U.S. patents in the industry annually if not for China’s innovation mercantilist policies. -
Lecture 25: Enhancement Type MOSFET Operation, P-Channel, and CMOS
Whites, EE 320 Lecture 25 Page 1 of 11 Lecture 25: Enhancement Type MOSFET Operation, P-channel, and CMOS. We will now move on to the second major type of transistor called the field effect transistor (FET). In particular, we will examine in detail the metal oxide semiconductor FET (MOSFET). This is an extremely popular type of transistor. MOSFETs have similar uses as BJTs. They can be used as signal amplifiers and electronic switches, for example. MOSFETS can be manufactured using a relatively simple process and made very small with respect to BJTs. There are two major types of MOSFETS, called enhancement type and depletion type. Each of these types can be manufactured with a so-called n channel or p channel: © 2017 Keith W. Whites Whites, EE 320 Lecture 25 Page 2 of 11 Enhancement Type, N Channel MOSFET The enhancement type MOSFET is the most widely used FET. It finds extensive use in VLSI circuits, for example. (In general, MOSFETs are not used too often in discrete component design.) The physical structure of this type of MOSFET (enhancement type NMOS) is shown in Fig. 5.1: (Fig. 5.1a) Four Terminals: “n+” means heavily doped Often the body and source are connected. (Fig. 5.1b) Whites, EE 320 Lecture 25 Page 3 of 11 Typical dimensional values are L = 0.1 to 3 m, W = 0.2 to 100 m, and tox = 2 to 50 nm. The minimum L and W dimensions are dictated by the resolution of the lithography process used to create the device. Around the 2007 time frame, Intel developed a 45-nm process, as described in the attached article from IEEE Spectrum. -
International Roadmap for Devices and Systems
INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS 2020 EDITION BEYOND CMOS THE IRDS IS DEVISED AND INTENDED FOR TECHNOLOGY ASSESSMENT ONLY AND IS WITHOUT REGARD TO ANY COMMERCIAL CONSIDERATIONS PERTAINING TO INDIVIDUAL PRODUCTS OR EQUIPMENT. ii © 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. THE INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS: 2020 COPYRIGHT © 2020 IEEE. ALL RIGHTS RESERVED. iii Table of Contents Acknowledgments .............................................................................................................................. vi 1. Introduction .................................................................................................................................. 1 1.1. Scope of Beyond-CMOS Focus Team .............................................................................................. 1 1.2. Difficult Challenges ............................................................................................................................ 2 1.3. Nano-information Processing Taxonomy........................................................................................... 4 2. Emerging Memory Devices .......................................................................................................... -
Conga-TCA7 User's Guide
COM Express™ conga-TCA7 COM Express Type 6 Compact module based on the Intel® Atom™, Pentium™ and Celeron® Elkhart Lake SoC User's Guide Revision 0.1 (Preliminary) Revision History Revision Date (yyyy-mm-dd) Author Changes 0.1 2021-07-31 AEM • Preliminary release Copyright © 2021 congatec GmbH TA70m01 2/67 Preface This user’s guide provides information about the components, features, connectors, system resources and BIOS features available on the conga-TCA7. It is one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should be used include the following: COM Express™ Design Guide COM Express™ Specification The links to these documents can be found on the congatec GmbH website at www.congatec.com. Software Licences Notice Regarding Open Source Software The congatec products contain Open Source software that has been released by programmers under specific licensing requirements such as the “General Public License“ (GPL) Version 2 or 3, the “Lesser General Public License“ (LGPL), the “ApacheLicense“ or similar licenses. You can find the specific details athttps://www.congatec.com/en/licenses/ . Search for the revision of the BIOS/UEFI or Board Controller Software (as shown in the POST screen or BIOS setup) to get the complete product related license information. To the extent that any accompanying material such as instruction manuals, handbooks etc. contain copyright notices, conditions of use or licensing requirements that contradict any applicable Open Source license, these conditions are inapplicable. The use and distribution of any Open Source software contained in the product is exclusively governed by the respective Open Source license. -
Doctoral Thesis by Zhen Zhang
Integration of silicide nanowires as Schottky barrier source/drain in FinFETs Doctoral Thesis by Zhen Zhang Stockholm, Sweden 2008 Laboratory of Solid State Devices (EKT), School of Information and Communication Technology (ICT), Royal Institute of Technology (KTH) Integration of silicide nanowires as Schottky barrier source/drain in FinFETs A dissertation submitted to Kungliga Tekniska Högskolan (KTH), Stockholm, Sweden, in partial fulfillment of the requirements for the degree of Teknologie Doktor (Doctor of Philosophy) TRITA-ICT/MAP AVH 2008:02 ISSN 1653-7610 ISRN KTH/ICT-MAP/AVH-2008:02-SE © 2008 Zhen Zhang This thesis is available in electronic version at: http://media.lib.kth.se Printed by Universitetsservice US-AB, Stockholm, 2008. ii Zhang, Zhen: Integration of silicide nanowires as Schottky barrier source/drain in FinFETs, Laboratory of Solid State Devices (EKT), School of Information and Communication Technology(ICT), KTH (Royal Institute of Technology), Stockholm 2008. TRITA-ICT/MAP AVH 2008:02, ISSN 1653-7610, ISRN KTH/ICT-MAP/AVH- 2008:02-SE Abstract The steady and aggressive downscaling of the physical dimensions of the conventional metal-oxide-semiconductor field-effect-transistor (MOSFET) has been the main driving force for the IC industry and information technology over the past decades. As the device dimensions approach the fundamental limits, novel double/tri- gate device architecture such as FinFET is needed to guarantee the ultimate downscaling. Furthermore, Schottky barrier source/drain technology presents a promising solution to reducing the parasitic source/drain resistance in the FinFET. The ultimate goal of this thesis is to integrate Schottky barrier source/drain in FinFETs, with an emphasis on process development and integration towards competitive devices. -
1 the Future of CMOS: More Moore Or a New Disruptive Technology?
1 1 The Future of CMOS: More Moore or a New Disruptive Technology? Nazek El-Atab and Muhammad M. Hussain King Abdullah University of Science and Technology, Integrated Nanotechnology Lab, Thuwal, 4700, Saudi Arabia For more than four decades, Moore’s law has been driving the semiconductor industry where the number of transistors per chip roughly doubles every 18–24 months at a constant cost. Transistors have been relentlessly evolving from the first Ge transistor invented at Bell Labs in 1947 to planar Si metal-oxide semiconductor field-effect transistor (MOSFET), then to strained SiGe source/drain (S/D) in the 90- and 65-nm technology nodes and high-κ/metal gate stack introduced at the 45- and 32-nm nodes, then to the current 3D transistors (Fin field-effect transistors (FinFETs)) introduced at the 22-nm node in 2011 (Figure 1.1). In extremely scaled transistors, the parasitic and contact resistances greatly deteriorate the drive current and degrade the circuit speed. Thus, miniaturization of devices so far has been possible due to changes in dielectric, S/D, and contacts materials/processes, and innovations in lithography processes, in addition to changes in the device architecture [1, 2]. The gate length of current transistors has been scaled down to 14 nm and below, with over 109 transistors in state-of-the-art microprocessors. Yet, the clock speed is limited to 3–4 GHz due to thermal constraints, and further scaling down the device dimensions is becoming extremely difficult due to lithography challenges. In addition, further scaling down the complementary metal-oxide semiconductor (CMOS) technology is leading to larger interconnect delay and higher power den- sity [3]. -
Building Resilient Supply Chains, Revitalizing American Manufacturing, and Fostering Broad-Based
BUILDING RESILIENT SUPPLY CHAINS, REVITALIZING AMERICAN MANUFACTURING, AND FOSTERING BROAD-BASED GROWTH 100-Day Reviews under Executive Order 14017 June 2021 A Report by The White House Including Reviews by Department of Commerce Department of Energy Department of Defense Department of Health and Human Services BUILDING RESILIENT SUPPLY CHAINS, REVITALIZING AMERICAN MANUFACTURING, AND FOSTERING BROAD-BASED GROWTH June 2021 2 TABLE OF CONTENTS INTRODUCTORY NOTE .................................................................................................................................................................. 4 EXECUTIVE SUMMARY FOR E.O. 14017 100-DAY REVIEWS ........................................................................................... 6 RECOMMENDATIONS .................................................................................................................................................................... 12 REVIEW OF SEMICONDUCTOR MANUFACTURING AND ADVANCED PACKAGING - DEPARTMENT OF COMMERCE .................................................................................................................................................................................. 21 EXECUTIVE SUMMARY ............................................................................................................................................................. 22 INTRODUCTION ......................................................................................................................................................................... -
Current Status of the Integrated Circuit Industry in China
J. Microelectron. Manuf. 2, 19020205 (2019) doi: 10.33079/jomm.19020205 Editorial Introduction: China's IC industry has been flourishing in recent years, huge market demand together with government investments are the major driving forces for this development. The status and development momentum of the Chinese IC industry also attracted wide interest and attention of international counterparts. A group of domestic IC experts are invited by the JoMM to write a series of articles about China's IC industry, including the history, current status, development, and related government policies. Information in these articles is all from public data from recent years. The purpose of these articles is to enhance mutual understanding between the Chinese domestic IC industry and international IC ecosystem. The following article is the third one of this series, the status quo of China's IC industry. The IC industry chain is very long including design, manufacturing, special equipment, materials, packaging and testing. The article series are arranged in accordance with this scope. Current Status of the Integrated Circuit Industry in China ― IC Manufacturing Industry 1. Introduction other hand, many IC design enterprises from abroad have poured into the Chinese market, among which The integrated circuit is a product featured with there are plenty of well-known design companies with fast revolution and high technologies. Speaking of the strong capital and technical strength, which further current international market structure, IC companies intensified the competition in Chinese market. are struggling with intellectual property dominance, As the foundation and core of the information the key IC industrial product global organizations industry, the integrated circuit is the basic, leading and presents the characteristics of multinational monopoly. -
Reliability Challenges for High Performance Electronics in the Internet of Things Era
Reliability Challenges for High Performance Electronics in the Internet of Things Era Prof. Cecilia Metra DEI - ARCES – Univ. of Bologna [email protected] ISFCT2018, Waseda University, July 24th, 2018 Cecilia Metra Outline Todays’ electronics, and technological development till now. Reliability Challenges for today’s electronics: Vulnerability to transient faults (TFs) soft errors (SEs) Likelihood of Aging Phenomena (NBTI) Design Approaches for Reliable electronics. ISFCT2018, Waseda University, July 24th, 2018 Cecilia Metra Outline Todays’ electronics, and technological development till now. Reliability Challenges for today’s electronics: Vulnerability to transient faults (TFs) soft errors (SEs) Likelihood of Aging Phenomena (NBTI) Design Approaches for Reliable electronics. ISFCT2018, Waseda University, July 24th, 2018 Cecilia Metra Today’s Electronics Continuous miniaturization of microelectronic technology massive diffusion/presence of electronic devices, possibly connected to each other through the Internet (IoT). ISFCT2018, Waseda University, July 24th, 2018 Cecilia Metra IoT, Big Data and Reliability Huge amount of electronic devices connected through the Internet (IoT) huge amount of data to be stored (Data Center/Cloud/Fog), processed and distributed again. R. Mariani, “Making the Autonomous Dream Work“, Intel Fellow, Unviersity of Bologna presentation, May 2018 Life’s decisions driven by such data (autonomous drive, factory, transport, home, etc). But can we rely on these data? Is the electronic storing/processing them reliable? ISFCT2018, Waseda University, July 24th, 2018 Cecilia Metra Today’s Electronic Technology M. Bohr, “Continuing Moore‘s Law“, Technology and Manufacturing Day, 19 September 2017 ISFCT2018, Waseda University, July 24th, 2018 Cecilia Metra Today’s Electronic Technology (cont’d) How much small are 14nm? M. -
Mark Bohr on Intel's Technology Leadership
technology Leadership MARK BOHR INTEL SENIOR FELLOW, TECHNOLOGY AND MANUFACTURING GROUP DIRECTOR, PROCESS ARCHITECTURE AND INTEGRATION SEPTEMBER 19, 2017 TECHNOLOGY AND MANUFACTURING DAY Legal Disclaimer DISCLOSURES China Tech and Manufacturing Day 2017 occurs during Intel’s “Quiet Period,” before Intel announces its 2017 third quarter financial and operating results. Therefore, presenters will not be addressing third quarter information during this year’s program. Statements in this presentation that refer to forecasts, future plans and expectations are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “goals,” “plans,” “believes,” “seeks,” “estimates,” “continues,” “may,” “will,” “would,” “should,” “could,” and variations of such words and similar expressions are intended to identify such forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Such statements are based on management’s expectations as of September 19-20, 2017, and involve many risks and uncertainties that could cause actual results to differ materially from those expressed or implied in these forward-looking statements. Important factors that could cause actual results to differ materially from the company’s expectations are set forth in Intel’s earnings release dated July 27, 2017, which is included as an exhibit to Intel’s Form 8-K furnished to the SEC on such date. Additional information regarding these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the company’s most recent reports on Forms 10-K, 10-Q and 8-K reports may be obtained by visiting our Investor Relations website at www.intc.com or the SEC’s website at www.sec.gov.