Extending the Road Beyond CMOS
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Denys I. Bondar
Updated on July 15, 2020 Denys I. Bondar Assistant Professor, Department of Physics and Engineering Physics, Tulane University, 2001 Percival Stern Hall, New Orleans, Louisiana, USA 70118 office: 4031 Percival Stern Hall e-mail: [email protected] phone: +1 (504) 862 8701 web: Google Scholar, Research Gate, ORCiD Education Ph. D. in Physics 01/2007{12/2010 Department of Physics and Astronomy, • University of Waterloo, Waterloo, Ontario, Canada Ph. D. thesis [arXiv:1012.5334]: supervisor: Misha Yu. Ivanov; co-supervisor: Wing-Ki Liu M. Sc. and B. Sc. in Physics with Honors 09/2001{06/2006 • Uzhgorod National University, Uzhgorod, Ukraine B. Sc. in Computer Science 09/2001{06/2006 • Transcarpathian State University, Uzhgorod, Ukraine Awards, Grants, and Scholarships Young Faculty Award DARPA 2019{2021 Army Research Office (ARO) grant W911NF-19-1-0377 2019{2021 Defense University Research Instrumentation Program (DURIP) 2018 Humboldt Research Fellowship for Experienced Researchers 2017-2020 Air Force Young Investigator Research Program 2016-2019 Los Alamos Director's Fellowship (declined) 2013 President's Graduate Scholarship (University of Waterloo) 2010 Ontario Graduate Scholarship 2010 International Doctoral Student Awards (University of Waterloo) 2007-2010 Award of Recognition at the All-Ukrainian Contest of Students' Scientific Works 2006 Current Research Interests • Quantum technology • Optics including quantum, ultrafast, nonlinear, and incoherent • Optical communication and sensing • Nonequilibrium quantum statistical mechanics 1 • Many-body -
Advanced MOSFET Structures and Processes for Sub-7 Nm CMOS Technologies
Advanced MOSFET Structures and Processes for Sub-7 nm CMOS Technologies By Peng Zheng A dissertation submitted in partial satisfaction of the requirements for the degree of Doctor of Philosophy in Engineering - Electrical Engineering and Computer Sciences in the Graduate Division of the University of California, Berkeley Committee in charge: Professor Tsu-Jae King Liu, Chair Professor Laura Waller Professor Costas J. Spanos Professor Junqiao Wu Spring 2016 © Copyright 2016 Peng Zheng All rights reserved Abstract Advanced MOSFET Structures and Processes for Sub-7 nm CMOS Technologies by Peng Zheng Doctor of Philosophy in Engineering - Electrical Engineering and Computer Sciences University of California, Berkeley Professor Tsu-Jae King Liu, Chair The remarkable proliferation of information and communication technology (ICT) – which has had dramatic economic and social impact in our society – has been enabled by the steady advancement of integrated circuit (IC) technology following Moore’s Law, which states that the number of components (transistors) on an IC “chip” doubles every two years. Increasing the number of transistors on a chip provides for lower manufacturing cost per component and improved system performance. The virtuous cycle of IC technology advancement (higher transistor density lower cost / better performance semiconductor market growth technology advancement higher transistor density etc.) has been sustained for 50 years. Semiconductor industry experts predict that the pace of increasing transistor density will slow down dramatically in the sub-20 nm (minimum half-pitch) regime. Innovations in transistor design and fabrication processes are needed to address this issue. The FinFET structure has been widely adopted at the 14/16 nm generation of CMOS technology. -
Nanosystems, Edge Computing, and the Next Generation Computing Systems
sensors Review Nanosystems, Edge Computing, and the Next Generation Computing Systems Ali Passian * and Neena Imam Computing & Computational Sciences Directorate, Oak Ridge National Laboratory, Oak Ridge, TN 37830, USA; [email protected] * Correspondence: [email protected] Received: 30 July 2019; Accepted: 16 September 2019; Published: 19 September 2019 Abstract: It is widely recognized that nanoscience and nanotechnology and their subfields, such as nanophotonics, nanoelectronics, and nanomechanics, have had a tremendous impact on recent advances in sensing, imaging, and communication, with notable developments, including novel transistors and processor architectures. For example, in addition to being supremely fast, optical and photonic components and devices are capable of operating across multiple orders of magnitude length, power, and spectral scales, encompassing the range from macroscopic device sizes and kW energies to atomic domains and single-photon energies. The extreme versatility of the associated electromagnetic phenomena and applications, both classical and quantum, are therefore highly appealing to the rapidly evolving computing and communication realms, where innovations in both hardware and software are necessary to meet the growing speed and memory requirements. Development of all-optical components, photonic chips, interconnects, and processors will bring the speed of light, photon coherence properties, field confinement and enhancement, information-carrying capacity, and the broad spectrum of light into the high-performance computing, the internet of things, and industries related to cloud, fog, and recently edge computing. Conversely, owing to their extraordinary properties, 0D, 1D, and 2D materials are being explored as a physical basis for the next generation of logic components and processors. Carbon nanotubes, for example, have been recently used to create a new processor beyond proof of principle. -
MOS Caps II; Mosfets I
6.012 - Microelectronic Devices and Circuits Lecture 10 - MOS Caps II; MOSFETs I - Outline G cS vGS + SiO2 – • Review - MOS Capacitor (= vGB) The "Delta-Depletion Approximation" n+ (n-MOS example) p-Si Flat-band voltage: VFB ≡ vGB such that φ(0) = φp-Si: VFB = φp-Si – φm Threshold voltage: VT ≡ vGB such B 1/2 * that φ(0) = – φp-Si: VT = VFB – 2φp-Si + [2εSi qNA|2φp-Si| ] /Cox * * Inversion layer sheet charge density: qN = – Cox [vGC – VT] • Charge stores - qG(vGB) from below VFB to above VT Gate Charge: qG(vGB) from below VFB to above VT Gate Capacitance: Cgb(VGB) Sub-threshold charge: qN(vGB) below VT • 3-Terminal MOS Capacitors - Bias between B and C Impact is on VT(vBC): |2φp-Si| → (|2φp-Si| - vBC) • MOS Field Effect Transistors - Basics of model Gradual Channel Model: electrostatics problem normal to channel drift problem in the plane of the channel Clif Fonstad, 10/15/09 Lecture 10 - Slide 1 G CS vGS + SiO2 – (= vGB) The n-MOS capacitor n+ Right: Basic device p-Si with vBC = 0 B Below: One-dimensional structure for depletion approximation analysis* vGB + – SiO 2 p-Si G B x -tox 0 * Note: We can't forget the n+ region is there; we Clif Fonstad, 10/15/09 will need electrons, and they will come from there. Lecture 10 - Slide 2 MOS Capacitors: Where do the electrons in the inversion layer come from? Diffusion from the p-type substrate? If we relied on diffusion of minority carrier electrons from the p-type substrate it would take a long time to build up the inversion layer charge. -
Advances in Photonic Devices Based on Optical Phase-Change Materials
molecules Review Advances in Photonic Devices Based on Optical Phase-Change Materials Xiaoxiao Wang 1, Huixin Qi 1, Xiaoyong Hu 1,2,3,*, Zixuan Yu 1, Shaoqi Ding 1, Zhuochen Du 1 and Qihuang Gong 1,2,3 1 Collaborative Innovation Center of Quantum Matter & Frontiers Science Center for Nano-Optoelectronics, State Key Laboratory for Mesoscopic Physics & Department of Physics, Beijing Academy of Quantum Information Sciences, Peking University, Beijing 100871, China; [email protected] (X.W.); [email protected] (H.Q.); [email protected] (Z.Y.); [email protected] (S.D.); [email protected] (Z.D.); [email protected] (Q.G.) 2 Peking University Yangtze Delta Institute of Optoelectronics, Nantong 226010, China 3 Collaborative Innovation Center of Extreme Optics, Shanxi University, Taiyuan 030006, China * Correspondence: [email protected] Abstract: Phase-change materials (PCMs) are important photonic materials that have the advantages of a rapid and reversible phase change, a great difference in the optical properties between the crystalline and amorphous states, scalability, and nonvolatility. With the constant development in the PCM platform and integration of multiple material platforms, more and more reconfigurable photonic devices and their dynamic regulation have been theoretically proposed and experimentally demonstrated, showing the great potential of PCMs in integrated photonic chips. Here, we review the recent developments in PCMs and discuss their potential for photonic devices. A universal overview of the mechanism of the phase transition and models of PCMs is presented. PCMs have injected new life into on-chip photonic integrated circuits, which generally contain an optical switch, Citation: Wang, X.; Qi, H.; Hu, X.; an optical logical gate, and an optical modulator. -
Photovoltaic Couplers for MOSFET Drive for Relays
Photocoupler Application Notes Basic Electrical Characteristics and Application Circuit Design of Photovoltaic Couplers for MOSFET Drive for Relays Outline: Photovoltaic-output photocouplers(photovoltaic couplers), which incorporate a photodiode array as an output device, are commonly used in combination with a discrete MOSFET(s) to form a semiconductor relay. This application note discusses the electrical characteristics and application circuits of photovoltaic-output photocouplers. ©2019 1 Rev. 1.0 2019-04-25 Toshiba Electronic Devices & Storage Corporation Photocoupler Application Notes Table of Contents 1. What is a photovoltaic-output photocoupler? ............................................................ 3 1.1 Structure of a photovoltaic-output photocoupler .................................................... 3 1.2 Principle of operation of a photovoltaic-output photocoupler .................................... 3 1.3 Basic usage of photovoltaic-output photocouplers .................................................. 4 1.4 Advantages of PV+MOSFET combinations ............................................................. 5 1.5 Types of photovoltaic-output photocouplers .......................................................... 7 2. Major electrical characteristics and behavior of photovoltaic-output photocouplers ........ 8 2.1 VOC-IF characteristics .......................................................................................... 9 2.2 VOC-Ta characteristic ........................................................................................ -
Fundamentals of MOSFET and IGBT Gate Driver Circuits
Application Report SLUA618A–March 2017–Revised October 2018 Fundamentals of MOSFET and IGBT Gate Driver Circuits Laszlo Balogh ABSTRACT The main purpose of this application report is to demonstrate a systematic approach to design high performance gate drive circuits for high speed switching applications. It is an informative collection of topics offering a “one-stop-shopping” to solve the most common design challenges. Therefore, it should be of interest to power electronics engineers at all levels of experience. The most popular circuit solutions and their performance are analyzed, including the effect of parasitic components, transient and extreme operating conditions. The discussion builds from simple to more complex problems starting with an overview of MOSFET technology and switching operation. Design procedure for ground referenced and high side gate drive circuits, AC coupled and transformer isolated solutions are described in great details. A special section deals with the gate drive requirements of the MOSFETs in synchronous rectifier applications. For more information, see the Overview for MOSFET and IGBT Gate Drivers product page. Several, step-by-step numerical design examples complement the application report. This document is also available in Chinese: MOSFET 和 IGBT 栅极驱动器电路的基本原理 Contents 1 Introduction ................................................................................................................... 2 2 MOSFET Technology ...................................................................................................... -
Power MOSFET Basics by Vrej Barkhordarian, International Rectifier, El Segundo, Ca
Power MOSFET Basics By Vrej Barkhordarian, International Rectifier, El Segundo, Ca. Breakdown Voltage......................................... 5 On-resistance.................................................. 6 Transconductance............................................ 6 Threshold Voltage........................................... 7 Diode Forward Voltage.................................. 7 Power Dissipation........................................... 7 Dynamic Characteristics................................ 8 Gate Charge.................................................... 10 dV/dt Capability............................................... 11 www.irf.com Power MOSFET Basics Vrej Barkhordarian, International Rectifier, El Segundo, Ca. Discrete power MOSFETs Source Field Gate Gate Drain employ semiconductor Contact Oxide Oxide Metallization Contact processing techniques that are similar to those of today's VLSI circuits, although the device geometry, voltage and current n* Drain levels are significantly different n* Source t from the design used in VLSI ox devices. The metal oxide semiconductor field effect p-Substrate transistor (MOSFET) is based on the original field-effect Channel l transistor introduced in the 70s. Figure 1 shows the device schematic, transfer (a) characteristics and device symbol for a MOSFET. The ID invention of the power MOSFET was partly driven by the limitations of bipolar power junction transistors (BJTs) which, until recently, was the device of choice in power electronics applications. 0 0 V V Although it is not possible to T GS define absolutely the operating (b) boundaries of a power device, we will loosely refer to the I power device as any device D that can switch at least 1A. D The bipolar power transistor is a current controlled device. A SB (Channel or Substrate) large base drive current as G high as one-fifth of the collector current is required to S keep the device in the ON (c) state. Figure 1. Power MOSFET (a) Schematic, (b) Transfer Characteristics, (c) Also, higher reverse base drive Device Symbol. -
Optical Memristive Switches
J Electroceram DOI 10.1007/s10832-017-0072-3 Optical memristive switches Ueli Koch1 & Claudia Hoessbacher1 & Alexandros Emboras1 & Juerg Leuthold1 Received: 18 September 2016 /Accepted: 6 February 2017 # The Author(s) 2017. This article is published with open access at Springerlink.com Abstract Optical memristive switches are particularly inter- signals. Normally, the operation speed is moderate and in esting for the use as latching optical switches, as a novel op- the MHz range. The application range includes usage as a tical memory or as a digital optical switch. The optical new kind of memory which can be electrically written and memristive effect has recently enabled a miniaturization of optically read, or usage as a latching switch that only needs optical devices far beyond of what seemed feasible. The to be triggered once and that can keep the state with little or no smallest optical – or plasmonic – switch has now atomic scale energy consumption. In addition, they represent a new logical andinfactisswitchedbymovingsingleatoms.Inthisreview, element that complements the toolbox of optical computing. we summarize the development of optical memristive The optical memristive effect has been discovered only switches on their path from the micro- to the atomic scale. recently [1]. It is of particular interest because of strong Three memristive effects that are important to the optical field electro-optical interaction with distinct transmission states are discussed in more detail. Among them are the phase tran- and because of low power consumption and scalability [8]. sition effect, the valency change effect and the electrochemical Such devices rely in part on exploiting the electrical metallization. -
Optical Computing: a 60-Year Adventure Pierre Ambs
Optical Computing: A 60-Year Adventure Pierre Ambs To cite this version: Pierre Ambs. Optical Computing: A 60-Year Adventure. Advances in Optical Technologies, 2010, 2010, pp.1-15. 10.1155/2010/372652. hal-00828108 HAL Id: hal-00828108 https://hal.archives-ouvertes.fr/hal-00828108 Submitted on 30 May 2013 HAL is a multi-disciplinary open access L’archive ouverte pluridisciplinaire HAL, est archive for the deposit and dissemination of sci- destinée au dépôt et à la diffusion de documents entific research documents, whether they are pub- scientifiques de niveau recherche, publiés ou non, lished or not. The documents may come from émanant des établissements d’enseignement et de teaching and research institutions in France or recherche français ou étrangers, des laboratoires abroad, or from public or private research centers. publics ou privés. Hindawi Publishing Corporation Advances in Optical Technologies Volume 2010, Article ID 372652, 15 pages doi:10.1155/2010/372652 Research Article Optical Computing: A 60-Year Adventure Pierre Ambs Laboratoire Mod´elisation Intelligence Processus Syst`emes, Ecole Nationale Sup´erieure d’Ing´enieurs Sud Alsace, Universit´e de Haute Alsace, 12 rue des Fr`eres Lumi`ere, 68093 Mulhouse Cedex, France Correspondence should be addressed to Pierre Ambs, [email protected] Received 15 December 2009; Accepted 19 February 2010 Academic Editor: Peter V. Polyanskii Copyright © 2010 Pierre Ambs. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Optical computing is a very interesting 60-year old field of research. -
Basics of CMOS Logic Ics Application Note
Basics of CMOS Logic ICs Application Note Basics of CMOS Logic ICs Outline: This document describes applications, functions, operations, and structure of CMOS logic ICs. Each functions (inverter, buffer, flip-flop, etc.) are explained using system diagrams, truth tables, timing charts, internal circuits, image diagrams, etc. ©2020- 2021 1 2021-01-31 Toshiba Electronic Devices & Storage Corporation Basics of CMOS Logic ICs Application Note Table of Contents Outline: ................................................................................................................................................. 1 Table of Contents ................................................................................................................................. 2 1. Standard logic IC ............................................................................................................................. 3 1.1. Devices that use standard logic ICs ................................................................................................. 3 1.2. Where are standard logic ICs used? ................................................................................................ 3 1.3. What is a standard logic IC? .............................................................................................................. 4 1.4. Classification of standard logic ICs ................................................................................................... 5 1.5. List of basic circuits of CMOS logic ICs (combinational logic circuits) -
Basic Design of MOSFET, Four-Phase, Digital Integrated Circuits
Scholars' Mine Masters Theses Student Theses and Dissertations 1969 Basic design of MOSFET, four-phase, digital integrated circuits Earl Morris Worstell Follow this and additional works at: https://scholarsmine.mst.edu/masters_theses Part of the Electrical and Computer Engineering Commons Department: Recommended Citation Worstell, Earl Morris, "Basic design of MOSFET, four-phase, digital integrated circuits" (1969). Masters Theses. 5304. https://scholarsmine.mst.edu/masters_theses/5304 This thesis is brought to you by Scholars' Mine, a service of the Missouri S&T Library and Learning Resources. This work is protected by U. S. Copyright Law. Unauthorized use including reproduction for redistribution requires the permission of the copyright holder. For more information, please contact [email protected]. BASIC DESIGN OF MOSFET, FOUR-PHASE, DIGITAL INTEGRATED CIRCUITS By t_fL/ () Earl Morris Worstell , Jr./ J q¥- 2., A Thesis submitted to the faculty of THE UNIVERSITY OF MISSOURI - ROLLA in partial fulfillment of the requirements for the Degree of MASTER OF SCIENCE IN ELECTRICAL ENGINEERING Ro 11 a , M i sous ri 1969 Approved By i BASIC DESIGN OF MOSFET, FOUR-PHASE, DIGITAL INTEGRATED CIRCUITS by Earl M. Worstell, Jr. Abstract MOSFET is defined as metal oxide semiconductor field-effect transis tor. The integrated circuit design relates strictly to logic and switch ing circuits rather than linear circuits. The design of MOS circuits is primarily one of charge and discharge of stray capacitance through MOSFETS used as switches and active loads. To better take advantage of the possibilities of MOS technology, four phase (4¢) circuitry is developed. It offers higher speeds and lower power while permitting higher circuit density than does static or two phase (2cj>) logic.