NXP Semiconductors NXP List of Hazardous Substances in Products

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NXP Semiconductors NXP List of Hazardous Substances in Products NXP Semiconductors NX3-00119 NXP List of Hazardous Substances Sustainability 01-October-2012 in Products and Packaging Sustainability Page 1 of 7 Supersedes: NX3-00119 01-October-2010 Table of contents 1 Objectives ............................................................................................................................. 2 2 Scope ................................................................................................................................... 2 3 Responsibilities, Records & Risks......................................................................................... 2 3.1 Roles and Responsibilities .................................................................................................... 2 3.2 Records ................................................................................................................................ 2 3.3 Risks .................................................................................................................................... 3 4 References ........................................................................................................................... 3 5 Definitions/Abbreviations ...................................................................................................... 3 5.1 Definitions ............................................................................................................................. 3 5.2 Abbreviations ........................................................................................................................ 4 6 Flowchart(s) .......................................................................................................................... 4 7 Procedure ............................................................................................................................. 5 7.1 Table A: Prohibited Substances ............................................................................................ 5 7.2 Table B: Restricted Substances ............................................................................................ 6 7.3 Table C: Declarable Substances .......................................................................................... 7 8 Approval List ......................................................................................................................... 7 9 Revision History .................................................................................................................... 7 10 Annexes ............................................................................................................................... 7 Owner: Harrold van Rooij COMPANY PUBLIC Author: Harrold van Rooij © NXP Semiconductors N.V. Uncontrolled copy if printed NXP Semiconductors NX3-00119 NXP List of Hazardous Substances Sustainability 01-October-2012 in Products and Packaging Sustainability Page 2 of 7 1 Objectives NXP Semiconductor products and its packaging should not contain “Hazardous Substances” at levels above our established threshold which can be liberated under normal operating and/or handling conditions during its useful period and at its end of life treatment. NXP Semiconductors should ensure that it does not put anything on the market that contains any hazardous substances above allowed levels as specified by law or other regulations. This procedure will be enforced by NXP as of January 1st, 2013. Till this date records based upon previous requirements1 are still accepted by NXP. 2 Scope Applicable to all materials, parts, (semi-)finished goods, subassemblies and packaging materials delivered and used for NXP Semiconductor products (IC’s, Discretes and Modules) which are either intended to be put on the market or intended to be used by the business for evaluation purposes. 3 Responsibilities, Records & Risks 3.1 Roles and Responsibilities Role RASCI* Activities Suppliers and R/A Are responsible to check compliance to this procedure and Subcontractors provide adequate information regarding their products Purchasing and R Are responsible to verify compliance to this procedure Subcontracting managers Business Unit/Line R Are responsible to adequately register the documents and managers information derived from these documents into EnoviaNXP Sustainability Officer S/C/I Can be consulted for expertise, any supportive activities regarding compliance requirements and needs to be informed in case of any non-compliance issues *R=responsible A=accountable S=supportive C=consulted I=informed 3.2 Records Compliance to this procedure should be checked through and by means of the NXP Material Declaration Form (MDF), conform NX5-00071. In addition, compliance should be checked and verified through and by means of test reports as evidence with respect to the NXP Test Requirements for Hazardous Substances in Products and Packaging, NX3-00572 for the: • EU Directive 2011/65/EU (RoHS), its amendment and recasts; • EU Directive 94/62/EC (PPW) and its amendments; • NXP Halogen/Antimony-Free Definition (see table B2 for reference). Documents submitted by suppliers should be registered in EnoviaNXP on material and/or (sub-) component level for traceability purposes. 1 previous version is available for NXP via: http://nww.nxp.com/excellence/sustainability/html/Suppliers.html Owner: Harrold van Rooij COMPANY PUBLIC Author: Harrold van Rooij © NXP Semiconductors N.V. Uncontrolled copy if printed NXP Semiconductors NX3-00119 NXP List of Hazardous Substances Sustainability 01-October-2012 in Products and Packaging Sustainability Page 3 of 7 3.3 Risks There are no SOx risks associated with the operation of this procedure. Risks are basically on non-compliance of NXP Semiconductor products. The direct financial risks towards our customers are covered by our standard T&C of Sales. However, business-wise it can have a quite sever impact to our image if the procedure isn’t followed and can eventually result in losing business. In case of non-compliance to legislation the consequences can be even more severe, from blocking shipments to fines, closure of operational facilities and/or jail of those responsible. 4 References • National and International legislation • (Key-)customer requirements • NX3-00105 RHF-2006 Classification codes for Semiconductor Products • NX3-00124 NXP Material Declaration Procedure • NX3-00572 NXP Test Requirements for Hazardous Substances in Products and Packaging • NX5-00071 NXP Material Declaration Form 5 Definitions/Abbreviations 5.1 Definitions Prohibited Substances: The intentional use of substances is prohibited. That is, NXP does not allow its intentional use under the conditions as set by our objectives and scope. NXP accepts impurities of substances in naturally occurring amounts and/or amounts generated via synthesis which cannot be avoided and where removal is not feasible. Restricted Substances The intentional use of substances is restricted. That is, NXP allows its intentional use only for specific applications under the conditions as set by our objectives and scope. NXP accepts impurities of substances in naturally occurring amounts and/or amounts generated via synthesis which cannot be avoided and where removal is not feasible. Declarable Substances The declaration of intentional and/or unintentional use of substances is mandatory on homogeneous material levels exceeding 100ppm (0.01%), or above the listed Threshold Limit Value (TLV), whichever is lower. Homogeneous Material A material of uniform composition throughout or a material, consisting of a combination of materials that cannot be disjointed or separated into different materials by mechanical actions such as unscrewing, cutting, crushing, grinding and abrasive processes. Not Detectable NXP considers amounts of substances below the natural occurrence levels and/or below the detection limit of currently accepted quantitative analytical methods as “not detectable (n.d.)”, “not present”, “not contained” or “0 ppm”. Owner: Harrold van Rooij COMPANY PUBLIC Author: Harrold van Rooij © NXP Semiconductors N.V. Uncontrolled copy if printed NXP Semiconductors NX3-00119 NXP List of Hazardous Substances Sustainability 01-October-2012 in Products and Packaging Sustainability Page 4 of 7 5.2 Abbreviations MDF - Material Declaration Form ppm - Parts per million by weight of a substance; equivalent to 1 mg/kg or 0.001% RoHS - Restriction on Hazardous Substances RHF - RoHS+Halogen/Antimony-Free PPW - Packaging and Packaging Waste n.d. - Not detectable T&C - Terms & Conditions TLV - Threshold Limit Value 6 Flowchart(s) N/A Owner: Harrold van Rooij COMPANY PUBLIC Author: Harrold van Rooij © NXP Semiconductors N.V. Uncontrolled copy if printed NXP Semiconductors NX3-00119 NXP List of Hazardous Substances Sustainability 01-October-2012 in Products and Packaging Sustainability Page 5 of 7 7 Procedure 7.1 Table A: Prohibited Substances2 Substance Group Prohibited applications for TLV 2 products and packaging ppm (mg/kg) 0.09 Aldehydes All applications a) 0.05 in HWPW Asbestos (all types) All applications 10 Azo compounds (azocolourants and azodyes) All applications 30 BenzoTriazole, specified substance - cas no. 3846-71-7 All applications 50 b) Cadmium and its compounds (Cd) All applications 5 Chlorinated HydroCarbons (CHC's) - Aliphatic, chain < C10 All applications 900 Chlorinated Paraffins (CP's), chain ? C10 All applications 100 DiMethylFumarate (DMF), specified substance - cas no. 624-49-7 All applications 0.1 Endangered species of flora and fauna, specified group All applications
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