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Intel® Core™ I5 Processor with Mobile Intel® QM57 Express Chipset

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Intel® Core™ I5 Processor with Mobile Intel® QM57 Express Chipset Intel® Core™ i5 Processor With Mobile Intel® QM57 Express Chipset Development Kit User Guide December 2009 Revision 001 Document Number: 322996 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. The Intel® CoreTM 2 Duo processor and Mobile Intel® GME965 Express Chipset may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-548-4725 or by visiting Intel's website at http://www.intel.com. BunnyPeople, Celeron, Celeron Inside, Centrino, Centrino logo, Core Inside, Dialogic, FlashFile, i960, InstantIP, Intel, Intel logo, Intel386, Intel486, Intel740, IntelDX2, IntelDX4, IntelSX2, Intel Core, Intel Inside, Intel Inside logo, Intel. Leap ahead., Intel. Leap ahead. logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel Viiv, Intel vPro, Intel XScale, IPLink, Itanium, Itanium Inside, MCS, MMX, Oplus, OverDrive, PDCharm, Pentium, Pentium Inside, skoool, Sound Mark, The Journey Inside, VTune, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2009, Intel Corporation. All Rights Reserved. 2 322996 / Development Kit User Guide Contents 1 About This Manual ............................................................................................. 7 1.1 Content Overview ................................................................................... 7 1.2 Text Convention ..................................................................................... 7 1.3 Terminology ........................................................................................... 8 1.4 Reference Documents ............................................................................. 14 1.5 Development Kit Technical Support .......................................................... 15 1.5.1 Online Support ......................................................................... 15 1.5.2 Additional Technical Support ...................................................... 15 2 Getting Started ................................................................................................ 16 2.1 Development Kit .................................................................................... 16 2.2 Additional Required Hardware Not Included In This Kit ............................... 17 2.3 Additional Required Software Not Included In This Kit ................................ 17 2.4 Workspace Preparation ........................................................................... 17 2.5 System Setup2.5 ................................................................................... 18 2.6 System Power-up ................................................................................... 19 2.7 System Power-down ............................................................................... 19 2.8 System BIOS ......................................................................................... 19 2.8.1 Configuring the BIOS ................................................................ 20 2.8.2 Programming BIOS Using a Bootable USB Device ......................... 20 2.9 Instructions to Flash BIOS on SPI ............................................................ 21 3 Development Board Features ............................................................................. 23 3.1 Block Diagram ....................................................................................... 23 3.2 Mechanical Form Factor .......................................................................... 23 3.3 Development Board Key Features ............................................................ 24 3.4 Driver Key Features ............................................................................... 26 3.5 BIOS Key Features ................................................................................. 26 3.6 System Thermal Management ................................................................. 26 3.7 System Features and Operation ............................................................... 27 3.7.1 Processor ................................................................................ 27 3.7.2 Chipset Support ....................................................................... 30 3.7.3 Displays .................................................................................. 38 3.7.4 Debugging Interfaces ................................................................ 39 3.7.5 Power Management .................................................................. 40 3.7.6 Power Measurement Support ..................................................... 40 4 Development Board Physical Hardware Reference ................................................. 46 4.1 Primary Features ................................................................................... 46 4.2 Connectors............................................................................................ 49 4.3 Configuration Settings ............................................................................ 50 322996 / Development Kit User Guide 3 4.4 Power On and Reset Push Buttons ............................................................ 52 4.5 LEDs .................................................................................................... 53 4.6 Other Headers ....................................................................................... 54 4.6.1 H8 Programming Header ........................................................... 54 4.7 Default Jumper Configuration .................................................................. 55 5 Rework Instructions .......................................................................................... 56 5.1 Simultaneous M1 and M3 VREF ................................................................ 56 5.1.1 DDR3 Channel 0 Reworks .......................................................... 56 5.1.2 DDR3 Channel 1 Reworks .......................................................... 56 5.1.3 SM_DRAM_PWROK ................................................................... 58 5.1.4 PCH_JATG_RST# Jumper J6B1 ................................................... 58 5.2 eDP ...................................................................................................... 59 5.2.1 eDP Rework ............................................................................. 59 5.2.2 eDP Panel and Cables Supported ................................................ 60 5.2.3 Enabling eDP Support on Intel® 5 Series Chipset Port D ................ 61 6 Add-in Cards .................................................................................................... 63 6.1 PCI Expansion Card ................................................................................ 63 6.2 Port 80-83 Add-in Card ........................................................................... 64 7 Heatsink Installation Instructions ........................................................................ 66 Figures Figure 1. System Block Diagram ......................................................................... 23 Figure 2. VID Override Circuit ............................................................................ 28 Figure 3. Block Diagram of On-bard LAN Implementation ...................................... 32 Figure 4. Jumpers for CLK_BSEL Signals .............................................................
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