92X25mm AMD Ball Bearing CPU Cooler Fan W/ TX3 Connector

Total Page：16

File Type：pdf, Size：1020Kb

92x25mm AMD Ball Bearing CPU Cooler Fan w/ TX3 Connector Product ID: FANK8AM2 This AMD CPU Cooler Fan supports Athlon 64 X2 dual core (Socket AM2) and older AMD K8 CPUs, offering the perfect way to ensure optimum system performance. Featuring a 92mm ever-lubricate ball-bearing fan, the AMD CPU cooler also offers an aluminum heatsink that helps dissipate and remove the harmful heat that comes as a result of typical drive operation. A cost-effective solution that helps to increase CPU lifespan by optimizing the processor's operating environment, the AMD CPU cooler can be powered through a simple TX3 (3-pin) connection to the computer power supply. View AMD Compatibility Chart www.startech.com 1 800 265 1844 Certifications, Reports Applications and Compatibility • Compatible with AMD Socket 939 Max. 103W): Athlon 64 up to 3800+ Athlon 64 X2 up to 4200+ Athlon FX-53 • Compatible with AMD Socket 940 (Max. 103W): Athlon FX-51 and FX-53 • Compatible with AMD Socket AM2 (Max. 103W): Athlon 64 up to 3800+ Athlon 64 X2 up to 5600+ Sempron up to 3400+ • Compatible with AMD Socket 754: Sempron up to 3800+ Features • Compatible with AMD Socket 939, 940, and AM2 • 92mm Ever Lubricate bearing cooling fan • Aluminum heatsink www.startech.com 1 800 265 1844 Warranty 2 Years Hardware Fan Bearing Type Ever Lubricate Bearing Fan Dimensions (Number / 92 x 92 x 25mm Dimensions) Fans 1 - 92 mm Heatsink Type Aluminum Number of Conductors 3 Performance Fan RPM 2600 +/- 10% Noise Level <28 dBA Connector(s) Connector Type(s) 1 - Molex Fan (3 pin, TX3) Female Power Input Voltage 12 DC Physical Color Black Characteristics Materials Aluminum Product Height 2.2 in [55 mm] Product Length 4.1 in [105 mm] Product Weight 10.2 oz [290 g] Product Width 3.6 in [92 mm] Packaging Shipping (Package) Weight 0.8 lb [0.4 kg] Information What's in the Box Included in Package 1 - Heatsink and Fan 1 - Thermal Compound 1 - Instruction Manual Product appearance and specifications are subject to change without notice. www.startech.com 1 800 265 1844.

Copy Link

Recommended publications

2004 Gamers' Hardware Upgrade Guide
Ace’s Hardware 2004 Gamers’ Hardware Upgrade Guide 2004 Gamers’ Hardware Upgrade Guide By Johan De Gelas – January 2004 Introduction Last week, we showed you a preview of the Athlon 64 3400+. Today, we'll investigate this new CPU as an upgrade to an existing system. How much performance do you gain when upgrading? What about the other features aside from performance, such as Cool'n'Quiet and more thermal and mechanical safety? As always, we start with a base system to be upgraded. This time around, our base system is equipped with an Athlon XP 2100+, as previous polls among our readers show that the faster versions of the Athlon XP "Palomino" were very popular in the early days of 2003. Now in 2004, Palomino is getting a little long in the tooth, so it's interesting to know whether or not an upgrade may be worthwhile. Our old system also contains a GeForce Ti 4200 and 512 MB of DDR266 (PC2100) memory. We will upgrade the CPU (to the Athlon 4 3400+) and memory (to DDR400 CAS 2) and compare that upgrade with one that simply upgrades the video card. As mentioned previously, we've done this before in many of our Gamer's Upgrade Guides. However, the gaming industry is not sitting still, and we are moving from hybrid DirectX 7/8 games to DirectX 8/9 games, which - as you will see - behave quite differently. The games you'll see tested in detail today are Halo 1.03, Return to Castle Wolfenstein: Enemy Territory, and X²- The Threat.
[Show full text]
Titan X Amd 1.2 V4 Ig 20210319
English TITAN X_AMD 1.2 Installation Guide V4 Parts List A CPU Water Block A A-1 BPTA-CPUMS-V2-SKA ..........1 pc A-1 A-2 A-2 Backplane assembly ..............1 set B Fittings B-1 BPTA-DOTFH1622 ...............4 pcs B-2 TA-F61 ...................................2 pcs B-3 BPTA-F95 ..............................2 pcs B-4 BP-RIGOS5 ...........................2 pcs B-5 TA-F60 ..................................2 pcs B-6 TA-F40 ..................................2 pcs C Accessory C-1 Hard tube ..............................2 pcs C-2 Fitting + soft tube ....................1 pc C-3 CPU set SCM3FL20 SPRING B SCM3F6 1mm Spacer Back Pad Paste Pad Metal Backplane M3x32mm Screw B-1 B-2 B-3 B-4 B-5 B-6 C C-1 Hard Tube ※ The allowable variance in tube length is ± 2mm C-2 Fitting + soft tube Bitspower reserves the right to change the product design and interpretations. These are subject to change without notice. Product colors and accessories are based on the actual product. — 1 — I. AMD Motherboard system 54 AMD SOCKET 939 / 754 / 940 IN 48 AMD SOCKET AM4 AMD SOCKET AM3 / AM3+ AMD SOCKET AM2 / AM2+ AMD SOCKET FM1 / FM2+ Bitspower Fan and DRGB RF Remote Controller Hub (Not included) are now available at microcenter.com DRGB PIN on Motherboard or other equipment. 96 90 BPTA-RFCHUB The CPU water block has a DRGB cable, which AMD SOCKET AM4 AMD SOCKET AM3 AM3+ / AMD SOCKET AM2 AM2+ / AMD SOCKET FM1 / FM2+ can be connected to the DRGB extension cable of the radiator fans. Fan and DRGB RF Remote Motherboard Controller Hub (Not included) OUT DRGB LED Do not over-tighten the thumb screws Installation (SCM3FL20).
[Show full text]
SOCKETS (Zocalos)
Instituto ITES Armado, Reparación y Mantención PC. Prof: Vladimir Zúñiga C. SOCKETS (zocalos) LGA 775 Especificaciones Tipo LGA Factores de forma Flip-chip land grid array del chip Contactos 775 Protocolo del FSB Quad-Pumped Frecuencia del 533 MT/s, 800 MT/s, 1066 FSB MT/s, 1333 MT/s, 1600 MT/s Dimesiones del 1.47 × 1.47 inches[1] procesador Procesadores Intel Pentium 4 (2.66 - 3.80 GHz) Intel Celeron D (2.53 - 3.60 GHz ) Intel Pentium 4 Extreme Edition (3.20 - 3.73 GHz) Intel Pentium D (2.66 - 3.60 GHz) Pentium Dual-Core (1.40 - 2.80 GHz) Intel Core 2 Duo (1.60 - 3.33 GHz) Intel Core 2 Extreme (2.66 - 3.20 GHz) Intel Core 2 Quad (2.33 - 3.00 GHz) Intel Xeon (1.86-3.40 GHz) Intel 'Core' Celeron (1.60 - 2.40 GHz) El zócalo LGA 775, también conocido como Socket T o Socket 775, es uno de los zócalos utilizados por Intel para dar soporte a los microprocesadores Pentium 4. Entre otros aspectos, se diferencia de los anteriores 370 (para Pentium III) y del Socket 423 y 478 (para los primeros Pentium 4) en que carece de pines. Las velocidades de bus disponibles para esta arquitectura van desde 533Mhz hasta 1600MHz. Este tipo de zócalo es el "estándar" para casi todos los procesadores de consumo de Intel para equipos sobremesa y algunos portátiles. Desde los "Celeron D" hasta los "Core 2 Duo", pasando por los "Pentium D", su principal atractivo es que los procesadores para LGA 775 carecen de pines; es decir que la placa base es la que contiene los contactos para comunicarse con el procesador.
[Show full text]
HDAMA Rev.G User's Guide
HDAMA rev.G HDAMA User’s Guide Release Date:Jul.2005 3.02 Version: Appendix BIOS Hardware Overview Setup Install Arima ServerBoard Manual COPYRIGHTS AND DISCLAIMERS ..........................................C-I ATTENTION: READ FIRST! ...................................... C-II Overview GENERAL SAFETY PRECAUTIONS .......................................C-2 ESD PRECAUTIONS ........................................................C-2 OPERATING PRECAUTIONS ................................................C-2 ABOUT THIS USER'S MANUAL ...........................................C-3 GETTING HELP ...............................................................C-3 SERVERBOARD SPECIFICATIONS ........................................C-5 SERVERBOARD LAYOUT ...................................................C-6 SERVERBOARD MAP .......................................................C-7 I/O PORT ARRAY ............................................................C-7 Hardware Installation MAP OF JUMPERS ...........................................................C-9 JUMPER SETTINGS ........................................................C-10 INSTALLING MEMORY .....................................................C-11 RECOMMENDED MEMORY CONFIGURATIONS .......................C-13 INSTALLING THE PROCESSOR AND HEATSINK ......................C-14 MAP OF SERVERBOARD CABLE CONNECTORS ...................C-16 ATX POWER CONNECTORS ............................................C-17 FLOPPY DISK DRIVE CONNECTOR ...................................C-18 PRIMARY IDE CONNECTORS ............................................C-18
[Show full text]
MX690E2 Radeon X1250 for Gaming Applications
Industrial Motherboards AMD® RS690E Mini ITX with Integrated MX690E2 Radeon X1250 for Gaming Applications Audio 2 USB KB + Mouse Features 2 USB + LAN DVI + VGA COM1, COM2 • AMD® Socket AM2/AM2+ Supports Athlon 64, Athlon 64 x2, Sempron with 2000 MHz Hyper Transport • AMD® RS690E/SB600 Chipset Amplifi er ATX • Up to 4 GB DDR2 533/667/800 MHz SO-DIMM Sys- LVDS tem Memory PCIe x16 • ATI® Radeon Xpress1250 Graphic Engine RS690E • Dual Display: DVI-D, LVDS, VGA • 1 Gigabit LAN, HD Audio, Amplifi er Socket AM2 • 1 PCI, 1 Mini PCIe, Compact Flash SB600 • 2 SATA, 4 COM, 6 USB, 8-bit GPIO 2 SATA • TPM 1.2 Supported DIO • ATX Power COM3 COM4 • Mini ITX (6.7” x 6.7”) Mini PCIe CF (back) IDE 2 USB Front Panel 2 SO-DIMMs up to 4 GB Specifi cation ATX Power DDR2 SDRAM System Audio CPU Supports AMD® Socket AM2 support Athlon 64, Athlon 64 X AC’97 Codec Realtek® ALC888/ALC886 Audio Codec 2, Sempron with FSB 2000MHz Hyper Transport support with Audio Amplifer TPA3005D2 Stereo 5Watt per channel 200/400/600/800/1000 MHz Chipsets AMD® RS690E + SB600 Ethernet System Memory Two 200-pin SO-DIMM supports up to 4 GB DDR2 SDRAM LAN 1 Realtek® RTL8111B (1000Base-T Fast Ethernet) 400/533/667/800 MHz BIOS SPI Award 8 Mb BIOS Mechanical and Environment Expansion Interface 1 x PCI 1 x CF Power Requirement 42W (Max). ( 3.3V, 3.08A , 5V 0.817A, 5VSB 0.387A, 12V 2.18A) 1 x Mini PCIe Operating Temperature 0~60°C TPM TPM1.2 (Infi neon® TPM chip 9635 TT 1.2 on board) Operating Humidity 5%~90% relative humidity, non-condensing Watchdog Timer Reset: 1 sec.~255 min.
[Show full text]
User's Manual User's Manual
User’s Manual (English Edition) Intel Pentium 4 Socket 478 CPU AMD Athlon/ Duron/Athlon XP Socket 462 CPU AMD Athlon 64 Socket 754 CPU ZM-WB2 Gold * Please read before installation http://www.zalman.co.kr http://www.zalmanusa.com 1. Features 1) Gold plated pure copper base maximizes cooling performance and prevents CPU blocks from galvanic corrosion 2) Intel Pentium 4 (Socket 478), AMD Athlon/Duron/Athlon XP (Socket 462),Athlon 64 (Socket 754) compatible design for broad compatibility. 3) Three types of compression fitting are offered for use with water tubes (8X10mm,8X11mm,10X13mm) * Zalman Tech. Co., Ltd. is not responsible for any damage resulting from CPU OVERCLOCKING. 2. Specifications Part No Part name Q’ ty Weight (g) Use 1 CPU block 1 447.0 CPU mountimg 2 Hand screw 2 8.0 Clip mountimg 3 Thermal grease 1 1.8 Apply to cpu core 4 Clip 1 9.6 CPU block mountimg 5 User’s manual 1 6 Clip supports 2 8.2 Socket 478 7 Clip supports A 2 5.0 Socket 462 8 Clip supports B 2 5.0 Socket 462 9 Bolts 4 0.8 Clip supports, A, B-type 10 Paper washer 1 set 7, 8 mountimg 11 Nipple 2 6.2 Socket 754 mountimg 12 Back plate 60.0 Socket 754 mountimg Fitting to 13 Fitting 3 set 8 x 10mm, 8 x 11mm, 10 x 13mm tubes NOTE 1) The maximum weight for the cooler is specified as 450g/450g/300g for socket 478/754/462 respectively. Special care should be taken when moving a computer equipped with a cooler which exceeds the relevant weight limit.
[Show full text]
AMD Socket AM2 with AMD M690T Chipset Reference Schematic D D
5 4 3 2 1 AMD Socket AM2 with AMD M690T Chipset Reference Schematic D D NOTES: Page Index Page Index ------- -------------------------------------------- ------- -------------------------------------------- 1) This schematic supports the AMD Socket AM2 CPU devices. 1 Cover Page 17 SB600 PCIe, PCI, LPC, Straps, & CPU Control 2) These are "Reference Schematics" and as such they have 2 Revision History 18 SB600 ACPI, GPIO, USB, and Audio Interfaces not been verified by an actual board build. 3 Block Diagram 19 SB SATA, IDE, SPI, and HW Management Interfaces 3) This reference schematic supports AMD M960T revision 4 Clock Structure 20 SB600 Power A12 or later. If A12 or later revision is not used, please 5 Power Configuration (1) 21 CRT Connector see your customer support representative for the 6 Power Configuration (2) 22 Broadcom Ethernet Controller necessary application notes for workarounds. 7 Reset & Voltage Sequence 23 Realtek Audio Codec C 4) This reference schematic supports SB600 revision 8 Socket AM2 HT Interface 24 LPC BIOS C A21 or later. If A21 or later revision is not used, please 9 Socket AM2 DDRII Memory Interface 25 USB Power and Connectors see your customer support representative for the 10 Socket AM2 Control & Debug 26 Power Main System, SB600 PCIe, & Other necessary application notes for workarounds. 11 Socket AM2 Power & Ground 27 Standby Power & Powergood 5) Unless otherwise specified, resistors have 5% tolerance. 12 SODIMM DDR2 28 Power for CPU Core 13 M690T HT, PCI, PCIe(R), PCIe Graphics Port 29 Power for DDR2 Memory and Interface 6) Unless otherwise specified, capacitors have 20% tolerance. 14 M690T PLL and Video Interface 30 Power M690T Core, PCIe Interface 15 M690T Power and Side Port Memory Interface 31 Unused Interfaces 16 Clock Generator IMPORTANT NOTICE: B 1.
[Show full text]
Thermal and Electrical Specification of AMD Semprontm Processors
Thermal and Electrical Specification of AMD SempronTM Processors Thermal and Electrical Specification of AMD SempronTM Processors 27 September 2004 Page 1/5 Thermal and Electrical Specification of AMD SempronTM Processors ©2004 Advanced Micro Devices Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products and are for information purposes only. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. No license, whether express, implied, arising by estoppels or otherwise, to any intellectual property rights are granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN OR FOR THE PERFORMANCE OR OPERATION OF ANY PERSON’S SYSTEM, INCLUDING, WITHOUT LIMITATION, ANY LOST PROFITS, BUSINESS INTERRUPTION, DAMAGE TO OR DESTRUCTION OF PROPERTY, OR LOSS OF PROGRAMS OR OTHER DATA, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
[Show full text]
Cray XT and Cray XE Y Y System Overview
Crayyy XT and Cray XE System Overview Customer Documentation and Training Overview Topics • System Overview – Cabinets, Chassis, and Blades – Compute and Service Nodes – Components of a Node Opteron Processor SeaStar ASIC • Portals API Design Gemini ASIC • System Networks • Interconnection Topologies 10/18/2010 Cray Private 2 Cray XT System 10/18/2010 Cray Private 3 System Overview Y Z GigE X 10 GigE GigE SMW Fibre Channels RAID Subsystem Compute node Login node Network node Boot /Syslog/Database nodes 10/18/2010 Cray Private I/O and Metadata nodes 4 Cabinet – The cabinet contains three chassis, a blower for cooling, a power distribution unit (PDU), a control system (CRMS), and the compute and service blades (modules) – All components of the system are air cooled A blower in the bottom of the cabinet cools the blades within the cabinet • Other rack-mounted devices within the cabinet have their own internal fans for cooling – The PDU is located behind the blower in the back of the cabinet 10/18/2010 Cray Private 5 Liquid Cooled Cabinets Heat exchanger Heat exchanger (XT5-HE LC only) (LC cabinets only) 48Vdc flexible Cage 2 buses Cage 2 Cage 1 Cage 1 Cage VRMs Cage 0 Cage 0 backplane assembly Cage ID controller Interconnect 01234567 Heat exchanger network cable Cage inlet (LC cabinets only) connection air temp sensor Airflow Heat exchanger (slot 3 rail) conditioner 48Vdc shelf 3 (XT5-HE LC only) 48Vdc shelf 2 L1 controller 48Vdc shelf 1 Blower speed controller (VFD) Blooewer PDU line filter XDP temperature XDP interface & humidity sensor
[Show full text]
Memorandum in Opposition to Hewlett-Packard Company's Motion to Quash Intel's Subpoena Duces Tecum
ORIGINAL UNITED STATES OF AMERICA BEFORE THE FEDERAL TRADE COMMISSION ) In the Matter of ) ) DOCKET NO. 9341 INTEL. CORPORATION, ) a corporation ) PUBLIC ) .' ) MEMORANDUM IN OPPOSITION TO HEWLETT -PACKARD COMPANY'S MOTION TO QUASH INTEL'S SUBPOENA DUCES TECUM Intel Corporation ("Intel") submits this memorandum in opposition to Hewlett-Packard Company's ("HP") motion to quash Intel's subpoena duces tecum issued on March 11,2010 ("Subpoena"). HP's motion should be denied, and it should be ordered to comply with Intel's Subpoena, as narrowed by Intel's April 19,2010 letter. Intel's Subpoena seeks documents necessary to defend against Complaint Counsel's broad allegations and claimed relief. The Complaint alleges that Intel engaged in unfair business practices that maintained its monopoly over central processing units ("CPUs") and threatened to give it a monopoly over graphics processing units ("GPUs"). See CompI. iiii 2-28. Complaint Counsel's Interrogatory Answers state that it views HP, the world's largest manufacturer of personal computers, as a centerpiece of its case. See, e.g., Complaint Counsel's Resp. and Obj. to Respondent's First Set ofInterrogatories Nos. 7-8 (attached as Exhibit A). Complaint Counsel intends to call eight HP witnesses at trial on topics crossing virtually all of HP' s business lines, including its purchases ofCPUs for its commercial desktop, commercial notebook, and server businesses. See Complaint Counsel's May 5, 2010 Revised Preliminary Witness List (attached as Exhibit B). Complaint Counsel may also call HP witnesses on other topics, including its PUBLIC FTC Docket No. 9341 Memorandum in Opposition to Hewlett-Packard Company's Motion to Quash Intel's Subpoena Duces Tecum USIDOCS 7544743\'1 assessment and purchases of GPUs and chipsets and evaluation of compilers, benchmarks, interface standards, and standard-setting bodies.
[Show full text]
AMD Multi-Core Processors Providing Multiple Benefits for the Future
hard hat area | white paper AMD Multi-Core Processors Providing Multiple Benefits For The Future y now you probably have heard of variations this year. In 2007 the chipmakers (page 50). This month, we’ll focus on what dual- and multi-core processors. expect to introduce several multi-core AMD has planned for 2006 and beyond. B Both AMD and Intel released chips, beginning with quad-core offerings. dual-core chips in 2005, and both have We discussed Intel’s multi-core proces- Dual-Core Chips plans to release dozens more dual-core chip sors in the January 2006 issue of CPU In April 2005, AMD released its first dual-core chip aimed at the server and workstation market, the Opteron proces- Direct Connect Architecture vs. sor. There are several Opteron dual-core Legacy Systems 90nm processors ranging in clock speeds from 1.6GHz to 2.4GHz. Direct Connect Architecture lives up to its name by providing a for the past few years in its single-core chips. direct connection between the processor, the memory But now AMD has extended the use of Direct Connect Architecture to controller, and the I/O area to improve overall system connect the cores on a dual- or multi-core chip die and to connect each performance. AMD has used Direct Connect Architecture core to its memory controller. ▲ With multi-core architecture, each core on the chip has its own memory con- When using a dual-processor x86 legacy architecture, troller, which significantly improves memory performance. Using Direct Connect however, two processors then have to share the same Architecture to make a connection with the memory controller eliminates most memory control hub, which creates bottlenecks in data bottlenecks and makes multitasking easier.
[Show full text]
Reverse Engineering X86 Processor Microcode
Reverse Engineering x86 Processor Microcode Philipp Koppe, Benjamin Kollenda, Marc Fyrbiak, Christian Kison, Robert Gawlik, Christof Paar, and Thorsten Holz, Ruhr-University Bochum https://www.usenix.org/conference/usenixsecurity17/technical-sessions/presentation/koppe This paper is included in the Proceedings of the 26th USENIX Security Symposium August 16–18, 2017 • Vancouver, BC, Canada ISBN 978-1-931971-40-9 Open access to the Proceedings of the 26th USENIX Security Symposium is sponsored by USENIX Reverse Engineering x86 Processor Microcode Philipp Koppe, Benjamin Kollenda, Marc Fyrbiak, Christian Kison, Robert Gawlik, Christof Paar, and Thorsten Holz Ruhr-Universitat¨ Bochum Abstract hardware modifications [48]. Dedicated hardware units to counter bugs are imperfect [36, 49] and involve non- Microcode is an abstraction layer on top of the phys- negligible hardware costs [8]. The infamous Pentium fdiv ical components of a CPU and present in most general- bug [62] illustrated a clear economic need for field up- purpose CPUs today. In addition to facilitate complex and dates after deployment in order to turn off defective parts vast instruction sets, it also provides an update mechanism and patch erroneous behavior. Note that the implementa- that allows CPUs to be patched in-place without requiring tion of a modern processor involves millions of lines of any special hardware. While it is well-known that CPUs HDL code [55] and verification of functional correctness are regularly updated with this mechanism, very little is for such processors is still an unsolved problem [4, 29]. known about its inner workings given that microcode and the update mechanism are proprietary and have not been Since the 1970s, x86 processor manufacturers have throughly analyzed yet.
[Show full text]