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Logic Families/Objectives Logic Families/Objectives – Digital Logic Voltage and Current Parameters • Fan-out, Noise Margin, Propagation Delay – TTL Logic Family – Supply current spikes and ground bounce – TTL Logic Family Evolution –ECL – CMOS Logic Families and Evolution – Logic Family Overview 29/09/2005 EE6471 (KR) 121 Logic Families/Level of Integration – SSI <12 gates/chip Level of integration ever increasing, because of – MSI 12..99 gates/chip •cost •speed – LSI ..1000 gates/chip •size •power – VLSI …10k gates/chip •reliability – ULSI …100k gates/chip Limits of integration: – GSI …1Meg gates/chip •packaging •power dissipation •inductive and capacitive components Note: Ratio gate count/transistor count •flexibility is roughly 1/10 •critical quantity 29/09/2005 EE6471 (KR) 122 Logic Families/Level of Integration – Remember: Gordon Moore, 1975. Predictions: • Mosfet device dimensions scale down by a factor of 2 every 3 years • #transistors/chip double every 1-2 years. Source: G. Sery, Intel 29/09/2005 EE6471 (KR) 123 Logic Families/Static VI Parameters Vcc Vcc Vcc Ioh Iih Iol Iil Voh Vih Vol Vil Parameter Comment Voh(min) High-Level Output Voltage. The minimum voltage level at a logic circuit output in the logical 1 state under defined load conditions. Vol(max) Low-Level Output Voltage. The maximum voltage level at a logic circuit output in the logical 0 state under defined load conditions. 29/09/2005 EE6471 (KR) 124 Logic Families/Static VI Parameters Vcc Vcc Vcc Ioh Iih Iol Iil Voh Vih Vol Vil Parameter Comment Vih(min) High-Level Input Voltage. The minimum voltage level required for a logical 1 at an input. Any voltage below this level may not be recognized as a logical 1 by the logic circuit. Vil(max) Low-Level Input Voltage. The maximum voltage level required for a logical 0 at an input. Any voltage above this level may not be recognized as a logical 0 by the logic circuit. 29/09/2005 EE6471 (KR) 125 Logic Families/Static VI Parameters Vcc Vcc Vcc Ioh Iih Iol Iil Voh Vih Vol Vil Parameter Comment Ioh High-Level Output Current. Current flowing into an output in the logical 1 state under specified load conditions. Iol Low-Level Output Current. Current flowing into an output in the logical 0 state under specified load conditions. 29/09/2005 EE6471 (KR) 126 Logic Families/Static VI Parameters Vcc Vcc Vcc Ioh Iih Iol Iil Voh Vih Vol Vil Parameter Comment Iih High-Level Input Current. Current flowing into an input when a specified high-level voltage is applied to that input. Iil Low-Level Input Current. Current flowing into an input when a specified low-level voltage is applied to that input. 29/09/2005 EE6471 (KR) 127 Logic Families/Fan-Out – Fan-out: The maximum number of logic inputs that an output can drive reliably. Beware: Modern mixed-technology digital systems often employ logic from different logic families. In this case Fan-out is meaningless, unless the operating condition is specified exactly. Unless otherwise specified, fan-out is always assumed to refer to load devices of the same family as the driving output. 29/09/2005 EE6471 (KR) 128 Logic Families/Noise (Voltage) Margin Vcc Vcc High state noise margin : Vnh = Voh(min)−Vih(min) Output Input Low state noise margin : Vnl = Vil(max) −Vol(max) Logic 1 Logic 1 Noise margin : Voh(min) = Vnh Vn min(Vnh,Vnl) Vih(min) Abnormal Indetermined Operation Range Noise margin required for reliable operation Vil(max) of digital systems in the presence of noise, Vnl Vol(max) crosscoupling, and ground-bounce. Logic 0 Logic 0 Sometimes quoted: Percentage noise margin… bears little practical value. 29/09/2005 EE6471 (KR) 129 Logic Families/Propagation Delay vi 50% Input t vo vi vo 50% Output t tphl tplh Parameter Comment tphl Input-to-output propagation delay time for output going from high to low. tplh Input-to-output propagation delay time for output going from low to high. (Vague) comparison between logic families: Gate Speed Power Product : ⋅ (e.g. for 74HC00: 25ns*100µW=2.5pJ) tpavg Pdissavg 29/09/2005 EE6471 (KR) 130 Logic Families/TTL Logic Inputs A Output B Standard TTL Logic: •Bipolar Transistor-Transistor Logic •Introduced in 1964 (Texas Instruments) A B Y •Tremendous influence on the characteristics 0 0 1 Vcc of all logic devices today 0 1 1 5V 1 0 1 •Standard TTL shaped digital technology 1 1 0 R1 R2 R4 •Standard TTL Logic (e.g. 7400) practically 4k 1.6k 130 obsolete (i.e. replaced by more advanced Q3 logic families, e.g. 74ALS00) •A large variety of logic functions available Inputs Q1 D1 •Single- or multi-emitter input transistor Q1 A Q2 Output (up to eight emitters) B •Totem-pole output arrangement (Q3, Q4) Q4 R3 1k 29/09/2005 EE6471 (KR) 131 Logic Families/TTL Logic/Static Analysis Vcc Vcc Low State Analysis: 5V 5V •Inputs high (connected to Vcc) •Q1: Inverse-active mode R1 R2 R4 4k 1.6k 130 •Input currents very low (base current of Q2) •Q2 conducting (saturated) •Q4 conducting Q3 •Q3 and D1 off (approx 0.8V at B of Q3) OFF •Power dissipation in R1, Q1, R2, Q2, R3, Q4 OFF Q1 D1 •On-state resistance of Q4 is roughly 1..25Ω Q2 •Non-ideal pull-down: Vcesat (Q4) ON •Load will supply output low state current Q4 R3 ON 1k Q4 is referred to as current-sinking transistor or pull- down transistor Inputs interpreted as “high” when unconnected (floating). DON’T LEAVE INPUTS UNCONNECTED ! Floating inputs are susceptible to noise… 29/09/2005 EE6471 (KR) 132 Logic Families/TTL Logic/Static Analysis Vcc 5V High State Analysis: •One or both inputs low (connected to GND) R1 R2 R4 •Substantial input current (emitter current Q1) 4k 1.6k 130 controlled by R1 •Q1 on (saturated) Q3 •Q2 off ON •Q4 off ON Q1 D1 •Q3 and D1 on •Q3 acts as an “active pull-up” Q2 OFF •Non-ideal pull-up: Vbe (Q3) and Vfw (D1) Q4 •Output high current through R4, Q3, D1 R3 OFF •Power dissipation in R1, Q1, R2, R4, Q3, D1 1k •Vcc will supply output high state current Q3 is referred to as current-sourcing transistor or pull-up transistor 29/09/2005 EE6471 (KR) 133 Logic Families/TTL Logic/Cascading TTL Vcc Vcc Vcc 5V 5V 5V R1 R2 R4 R1 R2 R4 R1 R2 R4 4k 1.6k 130 4k 1.6k 130 4k 1.6k 130 Q3 Iih Q3 Q3 Iil Q1 D1 Q1 D1 Q1 D1 Q2 Q2 Q2 high low Q4 Q4 Q4 R3 R3 R3 1k 1k 1k 29/09/2005 EE6471 (KR) 134 Logic Families/Supply Current Spikes Vcc 5V Output Low-to-High Transient: •Initially: Q3 off, Q4 on (saturated) R1 R2 R4 4k 1.6k 130 •Q4 turned off, Q3 turned on •Change of state of Q4 takes longer than Q3 Q3 •During a short interval both Q3 and Q4 are conducting (cross-conduction, “shot-through”). Q1 i_transient D1 •Supply sees a relatively large current surge. Q2 •Additional current surge due to load Q4 capacitance (e.g. input capacitance of following R3 gate) 1k Cload Whenever a totem-pole TTL output goes from LOW vo to HIGH, a current spike is drawn from the supply. t Essential: POWER SUPPLY DECOUPLING! icc iccl icch Current spikes can cause noise problems (inductive cross- t coupling). Identify loops and minimise loop areas! 29/09/2005 EE6471 (KR) 135 Logic Families/Ground Bounce Vcc 5V Output High-to-Low Transient: R1 R2 R4 •Initially: Q3 on, Q4 off 4k 1.6k 130 •Negligible Q3/Q4 cross-conduction •Fast discharge of load capacitance through Q4 Q3 •Discharge current spike through IC ground pin. Q1 D1 i_transient Q2 Q4 vi R3 1k Cload Current spikes can cause noise problems (inductive cross- coupling). Identify loops and minimise loop areas! 29/09/2005 EE6471 (KR) 136 Logic Families/Ground Bounce Vcc 5V Discharge current path R1 R2 R4 •positive electrode of load capacitance 4k 1.6k 130 •Q4 Q3 •bond wire •IC pin Q1 D1 •tracks on PCB Q2 •ground plane on PCB Q4 •negative electrode of load capacitance R3 1k Cload •sections of the discharge current path are vi_eff i_transient shared with the input voltage loop internal IC GND vi L_shared Transient currents through shared inductance (bond wire, (package, tracks) vl_s tracking) is the cause for “ground bounce”. Ground Bounce = Voltage Difference between internal and external ground external IC GND L_unshared di vl _ s = L _ shared ⋅ L _ shared vi _ eff = vi − vl _ s dt 29/09/2005 EE6471 (KR) 137 Logic Families/Ground Bounce Digital logic gates are differential amplifiers! They look at input voltages with respect to their internal ground. Transient voltages across inductances between internal and external ground distort the input voltage and results in undesired feedback (positive or negative). Typically ground bounce does not significantly impair the transmitted signal, but it interferes in a major way with signal reception. What can be done to reduce ground bounce: •Minimise di/dt by proper choice of gate family •Minimise shared inductance (star point GND connection) •Use ICs with separate driver and logic ground pins •Identify current loops and minimise loop areas 29/09/2005 EE6471 (KR) 138 Logic Families/Ground Bounce 10 8.46 Vcc 5 v1 j v2 R V v2 j 0 V v1eff i2 j v1 i2 10⋅ m ⋅A 5 vls Ls − C 8.46 10 0102030405060708090100 0 tj() 99.994 ns⋅ 10 8.46 Example Parameter: 5 v1effj •Vcc=5V V •Tr=10ns vls j 0 •Tpd=15ns V ils j •Ls=40nH 10⋅ m ⋅A •C=100pF dils 5 •R=10Ω vls = Ls ⋅ − dt 10 10 0102030405060708090100 0 tj() 99.994 29/09/2005 EE6471 (KR)ns⋅ 139 Logic Families/TTL/Logic Evolution BJT (Bipolar Junction Transistor) storage time reduction by using a BC Schottky diode.
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