Quick Guide to DRAM for Industrial Applications 2019 by SQRAM What’s the difference between DRAM & Flash? DRAM (Dynamic Random Access Memory) and Flash are key components in PC systems, but they are different types of semiconductor products with different speeds/capacity/power-off data storage.
High Small Type DRAM Flash
Cache data transfer through Location close to CPU PCIe BUS
Speed/Cost IC Density low high SRAM Capacity Module 32~64GB 2~8TB
Capacity
DRAM by ns Speed by ms (faster than flash) non-volatile memory: Power-Off volatile memory: data can be stored if NAND Flash data will lost if powered off Status powered off
Low Large What are the features of DRAM?
High Data Processing Speed Volatile Memory Extremely fast with low latency by RAM is a type of volatile memory. nanoseconds(10-9) access time. Much faster than It retains its data while powered on, but the data will HDD or SSD data speeds. vanish once the power is off.
CPU DRAM HDD
Extremely Fast Transfer Higher Capacity, Better Performance DRAM is closely connected to the CPU with short DRAM of higher capacity can process more data to access time. The system performance will drop if increase system performance. The more data data is processed directly by storage without DRAM. processed by DRAM, the less HDD processing time.
What are the DDR specifications (DDR, DDR2, DDR3, DDR4)? The prefetch length of DDR SDRAM is 2 bits. On DDR2 the prefetch length is increased to 4 bits, and on DDR3 and on DDR DDR 4 it was raised to 8 bits and 16 bits respectively. Higher prefetch length allows higher data transfer rates and lower power consumption.
DDR2 Type DDR DDR2 DDR3/DDR3L DDR4 Prefetch 4 4,8 8 16 Length Voltage 2.5V/2.6V 1.8V 1.5V/1.35V 1.2V DDR3 Data Rate 533/667/80 1066/1333/ 2133/2400/ 266-400 (MT/s) 0 1600/1866 2666/3200 Density 128Mb- 512Mb- 1Gb-8Gb 4Gb-32Gb (by chip) 512Mb 2Gb DDR4 Organization x4,x8,x16 x4,x8,x16 x4,x8,x16 x4,x8,x16 (by chip) Capacity 512MB- 128MB-1GB 1GB-16GB 2GB-128GB (by module) 4GB What are the DIMM types and features?
Unbuffered DIMM Buffered DIMM SODIMM for NBs, laptops, box PCs Register DIMM: Higher bandwidth and UDIMM for desktops capacity than UDIMM, suitable for high- ECC DIMM (DIMM with Error end server markets Correcting Code function) for Load Reduced DIMM: Extreme capacity networking, military, telecom, servers above 32GB and low power consumption Unbuffered SODIMM (SODIMM) • Small Outline Dual In-Line Memory Module
SDRAM
PCB
Resistor
EEPROM ETT IC Major IC No Brand Samsung Inking Capacitor (module vendor brand) Specification PN No Specification Serial No. No Serial No. Non-ECC Unbuffered DIMM Non-ECC vs. ECC Unbuffered DIMM • PC DIMM as basic function with best cost Non-ECC Unbuffered DIMM ECC Unbuffered DIMM • Non error correction function, neither Register buffer function.
• CostCost-effective effective DIMM withoutsolution error ECC: Error Correcting Code Memory correction function, neither Register buffer function ECC memory has one extra unit DRAM IC on each BANK for Error Correction Non-ECC memory data path: 64 bits ECC memory data path: 72 bit (64 data bits Applications: PC DIMM with basic plus 8 ECC bits for data correction) function and cost effectiveness Applications: workstations, entry-level servers UDIMM vs. RDIMM (Buffered DIMM) • Unbuffered Dual In-Line • Registered Dual In-Line Memory Module Memory Module
SDRAM PCB
EEPROM Register
Resister
Capacitor Registered DIMM (Buffered DIMM) Registered DIMM improves signal integrity by having a register on the DIMM to buffer the address and command signals between each DRAM modules and the system's memory controller,. It also features an Error Correcting Code function. Registered memory often has a higher price because of the lower number of units sold and additional circuitry required. Register DIMMs achieve higher bandwidth and capacity than unbuffered DIMM. Application: High-end server market.
Load Reduced DIMM (LR-DIMM) LRDIMM adds a special memory buffer chip to the bus. Memory buffer chips in the processer packetize and transmit all data, command and control signals on the LRDIMM. In this way, the memory buffer handles all the reads and writes to the DRAM chips. LRDIMMs achieve capacity higher than 32GB and better power saving efficiency.
RDIMM LR-DIMM
CMD/ADDR
Memory /CLK Memory
Controller Controller
Buffer Register CMD/ Memory ADDR/ CLK DRAM IC Level & Production Flow
Major Manufacturers Fully tested DRAM and mark IC brand Vendor: Samsung, Micron, Hynix Wafer Package Test IC Application: High-end market, value conscious inking market
ETT : Effectively TesTed Module manufacturing brand Not ully tested DRAM, unmarked Wafer Package Test IC Application: Value memory market inking
UTT : UnTesTed Non-brand Not tested and unmarked Wafer Package IC inking
Downgraded Non-brand Unknown production flow, resources Wafer Package Untested and unmarked
Why Choose SQRAM for Industrial Applications?
Industrial and Robust Design • Original IC with rigorous testing • Wide temperature of -40~85 °C • Fixed BOM and 3-year longevity • Rugged DIMM against shock and extreme vibration • Optional industrial heatsink
Smart DRAM Management Software • Manage up to 8 slots of SQRAM memory modules • Operating temperature monitoring • Temperatures alert over 65°C Download Watch • SPD information and timing table SQRAM Manger Tutorial
Customization and Value-Added Service • Conformal coating/ underfill • Anti-sulfur protection • Industrial heatsink SQRAM 32GB DDR4 2666 Unbuffered Memory Solutions
Server-Grade Performance / Optional Heatsink Available / Monitoring Software
Unbuffered SODIMM ECC Unbuffered DIMM ECC SODIMM Rugged DIMM
SQR-SD4N/ SQR-SD4I SQR-UD4N/I(ECC) SQR-SD4N/I(ECC) SQR-YD4N/I 4G~32G 4G~32G 4G~32G 8G~32G 0~85℃/-40~85℃ 0~85℃/-40~85℃ 0~85℃/-40~85℃ 0~85℃/-40~85℃
Data Center Medical Transportation Defense SQRAM Product Selection https://www.advantech.com/products/memory- module/sub_memory_module E-Catalog https://advcloudfiles.advantech.com/ecatalog/2019/0 1250951.pdf Contact Your Local Sales Offices https://www.advantech.com/contact
KC. Liu. Advantech