Transistor Basics
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Chapter 7: AC Transistor Amplifiers
Chapter 7: Transistors, part 2 Chapter 7: AC Transistor Amplifiers The transistor amplifiers that we studied in the last chapter have some serious problems for use in AC signals. Their most serious shortcoming is that there is a “dead region” where small signals do not turn on the transistor. So, if your signal is smaller than 0.6 V, or if it is negative, the transistor does not conduct and the amplifier does not work. Design goals for an AC amplifier Before moving on to making a better AC amplifier, let’s define some useful terms. We define the output range to be the range of possible output voltages. We refer to the maximum and minimum output voltages as the rail voltages and the output swing is the difference between the rail voltages. The input range is the range of input voltages that produce outputs which are not at either rail voltage. Our goal in designing an AC amplifier is to get an input range and output range which is symmetric around zero and ensure that there is not a dead region. To do this we need make sure that the transistor is in conduction for all of our input range. How does this work? We do it by adding an offset voltage to the input to make sure the voltage presented to the transistor’s base with no input signal, the resting or quiescent voltage , is well above ground. In lab 6, the function generator provided the offset, in this chapter we will show how to design an amplifier which provides its own offset. -
“WW 2,873,387 United States Patent Rice Patented Feb
Feb. 10, 1959 M. c. KIDD 2,873,387 CONTROLLABLE.‘ TRANSISTOR CLIPPING CIRCUIT Filed Dec. 17, '1956 INVENTOR. v MARSHALL [.KIDD “WW 2,873,387 United States Patent rice Patented Feb. 10, 1959. 2 tap 34 on a second source of energizing potential, here illustrated as a battery 30, through a load resistor 32. 2,873,387 The battery 30 has a ground tap 31 at an intermediate point thereon, and the variable tap 34 allows the ener CONTROLLABLE TRANSISTOR CLIPPING gizing potential supplied to the collector electrode 14 to cmcurr be varied from a positive to a negative value. Output Marshall vC. Kidd, Haddon Heights, N. J., assignor to signals are derived between an output terminal 36, which Radio Corporation of America, a corporation of Dela is connected directly to the collector electrode 14 of the ware ‘ ‘ transistor 16, and a ground terminal 37. One type of 10 clipped or limited output signal that is available at the Application December 17, 1956, Serial No. 628,807 output terminals 36 is illustrated by the waveform 38, 5 ‘Claims. (Cl. 307-885) and the manner in which it is derived is hereinafter de scribed. , In order to describe the operation of the circuit, as This invention relates to signal translating circuits and 15 sume that the variable tap 34 on the battery 30 is set more particularly to transistor circuits for limiting or so that a small positive voltage, negative, however, with clipping a translated signal; - respect to base electrode voltage, appears on the collector In many types of electronic equipment, such as tele electrode 14, and that a sine wave is applied to the input vision, radar, computer and like equipment, it may be terminal 10, as illustrated by the waveform 18. -
Basic DC Motor Circuits
Basic DC Motor Circuits Living with the Lab Gerald Recktenwald Portland State University [email protected] DC Motor Learning Objectives • Explain the role of a snubber diode • Describe how PWM controls DC motor speed • Implement a transistor circuit and Arduino program for PWM control of the DC motor • Use a potentiometer as input to a program that controls fan speed LWTL: DC Motor 2 What is a snubber diode and why should I care? Simplest DC Motor Circuit Connect the motor to a DC power supply Switch open Switch closed +5V +5V I LWTL: DC Motor 4 Current continues after switch is opened Opening the switch does not immediately stop current in the motor windings. +5V – Inductive behavior of the I motor causes current to + continue to flow when the switch is opened suddenly. Charge builds up on what was the negative terminal of the motor. LWTL: DC Motor 5 Reverse current Charge build-up can cause damage +5V Reverse current surge – through the voltage supply I + Arc across the switch and discharge to ground LWTL: DC Motor 6 Motor Model Simple model of a DC motor: ❖ Windings have inductance and resistance ❖ Inductor stores electrical energy in the windings ❖ We need to provide a way to safely dissipate electrical energy when the switch is opened +5V +5V I LWTL: DC Motor 7 Flyback diode or snubber diode Adding a diode in parallel with the motor provides a path for dissipation of stored energy when the switch is opened +5V – The flyback diode allows charge to dissipate + without arcing across the switch, or without flowing back to ground through the +5V voltage supply. -
Tektronix Cookbook of Standard Audio Tests
( Copyright © 1975, Tektronix, Inc. AI! rig hts re served P ri nt ed· in U .S.A. ForeIg n and U .S.A. Products of Tektronix , Inc. are covered by Fore ign and U .S.A . Patents and /o r Patents Pending. Inform ation in thi s publi ca tion supersedes all previously published material. Specification and price c hange pr ivileges reserve d . TEKTRON I X, SCOPE-MOBILE, TELEOU IPMENT, and @ are registered trademarks of Tekt ro nix, Inc., P. O. Box 500, Beaverlon, Oregon 97077, Phone : (Area Code 503) 644-0161, TWX : 910-467-8708, Cabl e : TEKTRON IX. Overseas Di stributors in over 40 Counlries. 1 STANDARD AUDIO TESTS BY CLIFFORD SCHROCK ACKNOWLEDGEMENTS The author would like to thank Linley Gumm and Gordon Long for their excellent technical assistance in the prepara tion of this paper. In addition, I would like to thank Joyce Lekas for her editorial assistance and Jeanne Galick for the illustrations and layout. CONTENTS PRELIMINARY INFORMATION Test Setups ________________ page 2 Input- Output Load Matching ________ page 3 TESTS Power Output _______________ page 4 Frequency Response ____________ page 5 Harmonic Distortion _____________ page 7 Intermodulation Distortion __________ page 9 Distortion vs Output _____________ page 11 Power Bandwidth page 11 Damping Factor page 12 Signal to Noise Ratio page 12 Square Wave Response page 15 Crosstalk page 16 Sensitivity page 16 Transient Intermodulation Distortion page 17 SERVICING HINTS___________ page19 PRELIMINARY INFORMATION Maintaining a modern High-Fidelity-Stereo system to day requires much more than a "trained ear." The high specifications of receivers and amplifiers can only be maintained by performing some of the standard measure ments such as : 1. -
Topaz Sr10 / Sr20 Stereo Receivers Top-Tips
TOPAZ SR10 / SR20 STEREO RECEIVERS TOP-TIPS Incredible performance, connectivity and value for money… The most powerful amplifiers in the Topaz range are designed to on the back allow you to connect traditional sources such as be the heart of your separates hi-fi system. The SR10 offers a CD players and even Blu-ray players. Thanks to a high quality room-filling 85 watts per channel and is backed by a dedicated Wolfson DAC, the SR20 goes one step further and provides three subwoofer output as well as two sets of speaker outputs - so you additional digital audio inputs, allowing the connection of digital can listen in two rooms at once or bi-wire your main speakers for sources such as streamers, TVs or set top boxes. a true audiophile performance. The SR20 steps things up a notch The SR10 and SR20’s playback capabilities also include a built- by offering the same flexible connectivity, but with an even more in FM/AM tuner, giving you access to all of your favourite radio powerful 100 watts per channel, driving virtually any loudspeaker stations with ease. We only use pure audiophile components, including discreet However you listen to your music, the SR10 and SR20 have it amplifiers, full metal chassis’ and high-performance toroidal covered. They boast a built-in phono stage so you can instantly transformers. The Topaz SR10 and SR20 are a winning connect a turntable, and a direct front panel input for iPods, combination of power, connectivity and purity, putting far more smart phones or MP3 players. -
The Transistor, Fundamental Component of Integrated Circuits
D The transistor, fundamental component of integrated circuits he first transistor was made in (SiO2), which serves as an insulator. The transistor, a name derived from Tgermanium by John Bardeen and In 1958, Jack Kilby invented the inte- transfer and resistor, is a fundamen- Walter H. Brattain, in December 1947. grated circuit by manufacturing 5 com- tal component of microelectronic inte- The year after, along with William B. ponents on the same substrate. The grated circuits, and is set to remain Shockley at Bell Laboratories, they 1970s saw the advent of the first micro- so with the necessary changes at the developed the bipolar transistor and processor, produced by Intel and incor- nanoelectronics scale: also well-sui- the associated theory. During the porating 2,250 transistors, and the first ted to amplification, among other func- 1950s, transistors were made with sili- memory. The complexity of integrated tions, it performs one essential basic con (Si), which to this day remains the circuits has grown exponentially (dou- function which is to open or close a most widely-used semiconductor due bling every 2 to 3 years according to current as required, like a switching to the exceptional quality of the inter- “Moore's law”) as transistors continue device (Figure). Its basic working prin- face created by silicon and silicon oxide to become increasingly miniaturized. ciple therefore applies directly to pro- cessing binary code (0, the current is blocked, 1 it goes through) in logic cir- control gate cuits (inverters, gates, adders, and memory cells). The transistor, which is based on the switch source drain transport of electrons in a solid and not in a vacuum, as in the electron gate tubes of the old triodes, comprises three electrodes (anode, cathode and gate), two of which serve as an elec- transistor source drain tron reservoir: the source, which acts as the emitter filament of an electron gate insulator tube, the drain, which acts as the col- source lector plate, with the gate as “control- gate drain ler”. -
Fundamentals of MOSFET and IGBT Gate Driver Circuits
Application Report SLUA618A–March 2017–Revised October 2018 Fundamentals of MOSFET and IGBT Gate Driver Circuits Laszlo Balogh ABSTRACT The main purpose of this application report is to demonstrate a systematic approach to design high performance gate drive circuits for high speed switching applications. It is an informative collection of topics offering a “one-stop-shopping” to solve the most common design challenges. Therefore, it should be of interest to power electronics engineers at all levels of experience. The most popular circuit solutions and their performance are analyzed, including the effect of parasitic components, transient and extreme operating conditions. The discussion builds from simple to more complex problems starting with an overview of MOSFET technology and switching operation. Design procedure for ground referenced and high side gate drive circuits, AC coupled and transformer isolated solutions are described in great details. A special section deals with the gate drive requirements of the MOSFETs in synchronous rectifier applications. For more information, see the Overview for MOSFET and IGBT Gate Drivers product page. Several, step-by-step numerical design examples complement the application report. This document is also available in Chinese: MOSFET 和 IGBT 栅极驱动器电路的基本原理 Contents 1 Introduction ................................................................................................................... 2 2 MOSFET Technology ...................................................................................................... -
Power MOSFET Basics by Vrej Barkhordarian, International Rectifier, El Segundo, Ca
Power MOSFET Basics By Vrej Barkhordarian, International Rectifier, El Segundo, Ca. Breakdown Voltage......................................... 5 On-resistance.................................................. 6 Transconductance............................................ 6 Threshold Voltage........................................... 7 Diode Forward Voltage.................................. 7 Power Dissipation........................................... 7 Dynamic Characteristics................................ 8 Gate Charge.................................................... 10 dV/dt Capability............................................... 11 www.irf.com Power MOSFET Basics Vrej Barkhordarian, International Rectifier, El Segundo, Ca. Discrete power MOSFETs Source Field Gate Gate Drain employ semiconductor Contact Oxide Oxide Metallization Contact processing techniques that are similar to those of today's VLSI circuits, although the device geometry, voltage and current n* Drain levels are significantly different n* Source t from the design used in VLSI ox devices. The metal oxide semiconductor field effect p-Substrate transistor (MOSFET) is based on the original field-effect Channel l transistor introduced in the 70s. Figure 1 shows the device schematic, transfer (a) characteristics and device symbol for a MOSFET. The ID invention of the power MOSFET was partly driven by the limitations of bipolar power junction transistors (BJTs) which, until recently, was the device of choice in power electronics applications. 0 0 V V Although it is not possible to T GS define absolutely the operating (b) boundaries of a power device, we will loosely refer to the I power device as any device D that can switch at least 1A. D The bipolar power transistor is a current controlled device. A SB (Channel or Substrate) large base drive current as G high as one-fifth of the collector current is required to S keep the device in the ON (c) state. Figure 1. Power MOSFET (a) Schematic, (b) Transfer Characteristics, (c) Also, higher reverse base drive Device Symbol. -
Amplifier Clipping
Amplifier clipping Amplifier clipping – What is it? How is it caused and how can we prevent itit???? What does it do? We shall deal with each of these topics one at a time. What is it: Almost everyone assumes that amplifier clipping is the sole domain of power amplifiers? This is not true. A preamplifier is just as prone to clipping as power amplifiers. If the level of signal is high enough to cause the preamplifier to clip, the power amplifier being a faithful servant will just amplify the clipped signal it receives. For the purposes of this discussion we will assume that our amplifier/preamplifier models use a bi-polar power supply (as almost all audio electronics does today) and therefore the signal swings from a level of zero to either the positive or negative supply rails (“rail” is a commonly used term which we use to describe a power supply output). We shall also assume that the electronic building blocks are in the form of operational amplifiers WITH negative feedback. Op-amps as they are called, are TWO input ONE output building blocks. Input is to either positive or negative ports and feedback is taken from the output and returned to the (-) input. I shall show the op-amps as in the diagram below even though it is not the standard schematic symbol for an op-amp. Note: A power amplifier (that is one which can drive a loudspeaker) is nothing less than just a high current preamplifier. Preamplifiers can and do run off very high rail (there we go again with the term “rail”) voltages – they just do not have the capability to source lots of current. -
Chapter 4: the MOS Transistor
Chapter 4: the MOS transistor 1. Introduction First products in Complementary Metal Oxide Silicon (CMOS) technology appeared in the market in seventies. At the beginning, CMOS devices were reserved for logic, as they offer the highest density (in gates/mm2), and the lowest static power consumption. Most high‐frequency circuitry was carried out in bipolar technology. As a result, a lot of analog functions were realized in bipolar technology. The technology development, which is driven by digital circuits (in particular by flash memories), lead to smaller and faster CMOS devices. At the beginning of the seventies, 1µm transistors length was considered short. Currently, CMOS technology with 22nm channel length is available. In the last twenty years a lot of analog circuits started to be developed in CMOS technology. In fact, the technology scaling enabled CMOS devices at higher frequencies of working, also for the analog counterpart. Today, CMOS and bipolar technologies are in competition over a wide frequency region up to 100GHz. The challenge indeed, to choice the technology that fulfills best the system and circuit requirements at a reasonable cost. Bipolar is more expensive than standard CMOS technology. Moreover, most systems and circuits are mixed signal, i.e. they include digital and analog parts. In the past, separated integrated circuits were dedicated to the analog (bipolar) and digital (CMOS) circuits. As analog circuits were also available in CMOS technology, this technology started to offer the opportunity to integrate cheap, high density and low power digital circuits, as well as analog circuits, in the same chip. This brings enormous advantages in terms of reduced costs and smaller form factors of electronic devices. -
Aliasing Reduction in Clipped Signals
This is an electronic reprint of the original article. This reprint may differ from the original in pagination and typographic detail. Author(s): Fabián Esqueda, Stefan Bilbao and Vesa Välimäki Title: Aliasing reduction in clipped signals Year: 2016 Version: Author accepted / Post print version Please cite the original version: Fabián Esqueda, Stefan Bilbao and Vesa Välimäki. Aliasing reduction in clipped signals. IEEE Transactions on Signal Processing, Vol. 64, No. 20, pp. 5255-5267, October 2016. DOI: 10.1109/TSP.2016.2585091 Rights: © 2016 IEEE. Reprinted with permission. In reference to IEEE copyrighted material which is used with permission in this thesis, the IEEE does not endorse any of Aalto University's products or services. Internal or personal use of this material is permitted. If interested in reprinting/republishing IEEE copyrighted material for advertising or promotional purposes or for creating new collective works for resale or redistribution, please go to http://www.ieee.org/publications_standards/publications/rights/rights_link.html to learn how to obtain a License from RightsLink. This publication is included in the electronic version of the article dissertation: Esqueda, Fabián. Aliasing Reduction in Nonlinear Audio Signal Processing. Aalto University publication series DOCTORAL DISSERTATIONS, 74/2018. All material supplied via Aaltodoc is protected by copyright and other intellectual property rights, and duplication or sale of all or part of any of the repository collections is not permitted, except that material may be duplicated by you for your research use or educational purposes in electronic or print form. You must obtain permission for any other use. Electronic or print copies may not be offered, whether for sale or otherwise to anyone who is not an authorised user. -
CMOS Basics MOS: Metal Oxide Semiconductor Transistors Are Built on a Silicon
Principles of VLSI Design CMOS Basics CMPE 413 MOS: Metal Oxide Semiconductor Transistors are built on a Silicon (semiconductor) substrate. Pure silicon has no free carriers and conducts poorly. Dopants are added to increase conductivity: extra electrons (n-type) or extra holes (p-type) MOS structure created by superimposing several layers of conducting, insulating and tran- sistor-forming materials. Metal gate has been replaced by polysilicon or poly in modern technologies. There are two types of MOS transistors: nMOS : Negatively doped silicon, rich in electrons. pMOS : Positively doped silicon, rich in holes. CMOS: Both type of transistors are used to construct any gate. 1 Principles of VLSI Design CMOS Basics CMPE 413 nMOS and pMOS Four terminal devices: Source, Gate, Drain, body (substrate, bulk). SourceGate Drain Polysilicon Thin W Oxide SiO2 Source Gate Drain L nMOS n+ n+ n+ p bulk Si p substrate n+ SourceGate Drain Polysilicon SiO2 pMOS p+ p+ n bulk Si 2 Principles of VLSI Design CMOS Basics CMPE 413 CMOS Inverter Cross-Section Cadence Layer's for AMI 0.6mm technology m1-m2 contact (via) p-diffusion contact (cc) p-substrate contact (cc) (source) metal2 metal1 n-diffusion contact (cc) n-substrate contact (cc) (source) (Out) glass(insulator) VDD GND layer #3 layer #2 layer #1 p+ n+ n+ p+ p+ n+ (pactive) (drains) n-well (nwell) (nactive) p substrate (black background) n-transistor polysilicon gate (poly ) p-transistor 3 Principles of VLSI Design CMOS Basics CMPE 413 CMOS Cadence Layout Cadence Layout for the inverter on previous slide 4 Principles of VLSI Design CMOS Basics CMPE 413 MOS Transistor Switches We can treat MOS transistors as simple on-off switches with a source (S), gate (G) (con- trols the state of the switch) and drain (D).