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Heat spreader
Integrated Vapor Chamber Heat Spreader for Power Module Applications
Heat Pipes & Vapor Chambers Design Guidelines
Optimal Micro Heat Pipe Configuration on High Performance Heat Spreaders
Thermal Interface Materials Table of Contents
Power Electronic Fabrication Choices Vital to Performance and Yield
Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules
Power Electronics High Performance Air-Cooled Heat Sinks Integratinggraphite Based Materials
Heat Pipe Embedded Alsic Plates for High Conductivity – Low Cte Heat Spreaders
Hybrid Heat Sink Manufacturing by Cold Spray Process
Diamond-Based Multimaterials for Thermal Management Applications
BGA Socket with Heatsink for High Power Devices
Refractory Metals for Thermal Management |2|
Heat Spreader Heat Sink Heat Spreader Heat Sink Heat Spreader Heat Sink Heat Spreader Heat Sink
Industry Developments: Heat Spreader Options and Materials
———– Tips & FAQ for Diamond Heat Spreaders
Multi-Artery, Heat-Pipe Spreader
Boyd Heat Sink Fabrications Guide a Quick & Easy Guide to Choosing a Heat Sink
Congatec Cooling Solutions for Computer-On-Modules
Top View
Review of Power Electronics Packaging and the Use of Copper Tungsten As Heat Sink
Novel Power Electronics Three-Dimensional Heat Exchanger
Optimization of Heat Spreader a Thesis Presented to the Faculty of the Russ College of Engineering and Technology of Ohio Univer
Advanced Thermal Management Technologies for High Power Automotive Equipment
A Heat Sink with an Integrated Heat Pipe
Molybdenum-Copper-Composites for the Advanced Thermal Management
Heat Spreading with Copper, Silicon, and Heat Pipes
A Multi-Layered Approach for Application of CVD Diamond Heat Spreaders for Cooling of High Power Density (HPD) Asics