Selection Guide Thermal Interface Materials Table of Contents
Introduction...... 2 Thermal Properties and Testing 4 Interface Material Selection Guide 5 GAP PAD Thermally Conductive Materials...... 6 GAP PAD Comparison Data 7 Frequently Asked Questions 8 GAP PAD VO 9 GAP PAD VO Soft 10 GAP PAD VO Ultra Soft 11 GAP PAD HC 3.0 12 GAP PAD HC 5.0 13 GAP PAD 1000HD 14 GAP PAD 1000SF 15 GAP PAD HC1000 16 GAP PAD 1450 17 GAP PAD 1500 18 GAP PAD 1500R 19 GAP PAD 1500S30 20 GAP PAD A2000 21 GAP PAD 2000S40 22 GAP PAD 2200SF 23 GAP PAD A3000 24 GAP PAD 3500ULM 25 GAP PAD 5000S35 26 GAP PAD EMI 1.0 27 Gap Filler Liquid Dispensed Materials and Comparison Data. . . . 28 Frequently Asked Questions 29 Gap Filler 1000 (Two-Part) 30 Gap Filler 1000SR (Two-Part) 31 Gap Filler 1100SF (Two-Part) 32 Gap Filler 1400SL (Two-Part) 33 Gap Filler 1500 (Two-Part) 34 Gap Filler 1500LV (Two-Part) 35 Gap Filler 2000 (Two-Part) 36 Gap Filler 3500LV (Two-Part) 37 Gap Filler 3500S35 (Two-Part) 38 Gap Filler 4000 (Two-Part) 39 Thermal Interface Compounds Comparison and FAQs...... 40 TIC 1000A 41 TIC 4000 42 LIQUI-FORM 2000 43 LIQUI-FORM 3500 44 HI-FLOW Phase Change Interface Materials...... 45 HI-FLOW Comparison Data 46 Frequently Asked Questions 47 HI-FLOW 105 48 HI-FLOW 225F-AC 49 HI-FLOW 225UT 50 Thermal Interface Selection Guide |
HI FLOW P HI FLOW UT HI FLOW HI FLOW P Thermally Conductive Insulators Frequently Asked Questions Choosing SIL PAD Thermally Conductive Insulators SIL PAD Comparison Data Mechanical, Electrical and Thermal Properties SIL PAD Thermally Conductive Insulator Selection Table SIL PAD SIL PAD SIL PAD S SIL PAD SIL PAD ST SIL PAD SIL PAD A SIL PAD ST SIL PAD SIL PAD A SIL PAD K- SIL PAD K- SIL PAD K- Q PAD II Q PAD POLY PAD POLY PAD POLY PAD K- POLY PAD K- SIL PAD Tubes BONDPLY and LIQUIBOND Adhesives ...... BOND PLY and LIQUI BOND Comparison Data and FAQs BOND PLY BOND PLY BOND PLY P BOND PLY BOND PLY LMS-HD LIQUI BOND EA (Two-Part) LIQUI BOND SA (One-Part) LIQUI BOND SA (One-Part) LIQUI BOND SA (One-Part) LIQUI BOND SA (Two-Part) Ordering ...... SIL PAD Configurations HI FLOW Configurations Solutions for Surface Mount Applications ...... Where Thermal Solutions Come Together ...... Ordering Information ...... | Thermal Interface Selection Guide — INTRODUCTION
Henkel. Developing solutions for the electronics industry.
Proven thermal management solutions and problem-solving partnership.
We make it our business to know your business. We understand your problems. We also know that there will always be a better way to help you reach your goals and objectives. To that end, our company continually invests considerable time and money into research and development.
Henkel is in the business of solving problems. With our history and experience in the electronics industry, our experts can help find ways to improve your process, control and manage heat, and back it all with exceptional service.
Let us show you the value Henkel offers. Thermal Interface Selection Guide — INTRODUCTION |
GLOBAL SUPPORT with locations in North America, THERMAL Asia and Europe, and sales staff in INNOVATION MANAGEMENT LEADER 30 countries Henkel’s BERGQUIST thermal Our solutions to control and solutions were often developed for manage heat in electronic specific customer requests assemblies and printed circuit boards are used by many of the world’s largest OEMs in a wide range of industries
WHY Henkel? Henkel, the leading solution provider for adhesives, sealants and functional coatings worldwide, uses high-quality BERGQUIST thermal management products—like BERGQUIST TCLAD, BERGQUIST SIL PAD and BERGQUIST LIQUI-BOND—to offer technological solutions for electronics. Beyond that, we work closely with our customers to understand your problems and deliver technologically advanced solutions backed by exceptional service.
GLOBAL SUPPLY CHAIN R&D to maintain a reliable supply of Over 10 R&D Centers around the products to our customers world staffed by 3,000 design and application professionals
BROAD PRODUCT PORTFOLIO that includes LOCTITE, TECHNOMELT and BERGQUIST products | Thermal Interface Selection Guide — INTRODUCTION
Thermal Properties and Testing
Thermal Conductivity Thermal Resistance The time rate of heat flow through a unit area producing a unit The opposition to the flow of heat through a unit area of material temperature difference across a unit thickness. across an undefined thickness.
Thermal conductivity is an inherent or absolute property of Thermal resistance varies with thickness. the material. Test Methods – ASTM D Thermal Impedance A property of a particular assembly measured by the ratio of the temperature difference between two surfaces to the steady-state heat flow through them.
Factors affecting thermal impedance include: Area: Increasing the area of thermal contact decreases thermal impedance. in. diameter stack (ref. . in.) – - psi, hour per layer Thickness: Increasing the insulator thickness increases thermal impedance. Pressure: Increasing mounting pressure under ideal conditions decreases thermal impedance. Time: Thermal impedance decreases over time. Measurement: Thermal impedance is affected by the method of temperature measurement. Thermal Impedance Per BERGQUIST TO- Thermal Performance (°C Cold Plate Testing) i Thermal Interface Selection Guide — INTRODUCTION |
Interface Material Selection Guide
PRODUCT OVERVIEW INTERFACE APPLICATIONS MOUNTING METHODS TYPICAL CONVERTED OPTIONS
MARKET APPLICATIONS PRODUCTS FOR DEVICES POWER DISCRETE COMPUTERS, SUPPLIES, POWER THRUHOLE TELECOM COMPONENTS: POWER ACTIVE INDUCTORS, CAPACITORS, RESISTORS FOR MODULES ELECTRONIC WIPER AND MOTOR AUTOMOTIVE: ETC. ANTILOCK, CONTROLS, FOR MODULES ELECTRONIC SUPPLIES POWER AND TELECOM CPU, APPLICATIONS: COMPUTER I DRIVES HARD ASICS, GPU, INSULATOR ELECTRICAL PRESSURE LOW CLIP, PRESSURE HIGH SCREW/RIVETS, APPLICABLE NOT STOCK SHEET CONTINUOUS FORM, ROLL CONFIGURATIONS STANDARD SHAPES EXTERNAL CUSTOM FEATURES INTERNAL CUSTOM OFFERINGS PSA STANDARD Q PAD II T TTT TT AAAAAA Q PAD T TTT TT AAAAAA HI FLOW T AS AS T AAAAAA Grease Replacement Materials HI FLOW G T TT T AS AAAAAA HI FLOW F-AC T T T AAA AS HI FLOW UT T T AS AA AS HI FLOW UT TT T AS AA AS HI FLOW T TT AAAAAA Grease Replacement HI FLOW P T TT AAAAAA Materials - Insulated HI FLOW P T TT AAAAA Bonding - Thin Film BOND PLY P T TTT TAAAAA BOND PLY T TTT TAAAAA Bonding - Fiberglass BOND PLY T TTT TAAAAA Bonding - Unreinforced BOND PLY T TTT T AAAA Bonding - Laminates BOND PLY LMS-HD T T AS T TAAAAA SIL PAD T TT TTT AAAAAA SIL PAD T TT TT AAAAAA SIL PAD S T TT TTT AAAAAA SIL PAD T TT T T AAAAAA SIL PAD ST T TT TTT AAAAA SIL PAD - Fiberglass SIL PAD T TT TTT AAAAAA SIL PAD A T TT TTT AAAAAA SIL PAD ST T TT TTT AAAAA SIL PAD T TT T AS AAAAAA SIL PAD A T TT T AS T AAAAAA SIL PAD K- T TT TTT AAAAAA SIL PAD - Thin Film Polyimide SIL PAD K- T TT TTT AAAAAA SIL PAD K- T TT TTT AAAAAA GAP PAD VO TTTTTTT A A* AA AS A GAP PAD VO Soft TTTTTTT A A* A A AS A GAP PAD VO Ultra Soft TTTTTTT A A* AA AS A GAP PAD HC . TTTTTTT A A* AA AS A GAP PAD HC . TTTTTTT A A* AA AS A GAP PAD HD TTTTTTT A A* AA AS A GAP PAD SF TTTTTTT A AA AS GAP PAD HC TT TTT A A* AAA GAP PAD TT TTT A A* AAA GAP PAD GAP PAD TT TTT A A* AA AS GAP PAD R TTT TTT A A* AAA GAP PAD S TTTT AS TT A AAA GAP PAD A TT T AS TT A A* AAA GAP PAD S TT T AS TT A AAA GAP PAD SF TTTTTTT A AA AS GAP PAD A TTTT AS TT A A* AAA GAP PAD ULM TTTT AS TT A A* AAA GAP PAD S TTTT AS TT AAA Gap Filler TTT AS T NA Gap Filler SR TTT AS T NA Gap Filler SF TTTT AS T NA Gap Filler SL AS T AS NA Gap Filler TTT AS T NA Gap Filler Gap Filler LV TTT AS T NA Gap Filler TTT AS T NA Gap Filler LV TTT AS T NA Gap Filler S TTT AS T NA Gap Filler TTT AS T NA LIQUI BOND EA T T AS T NA LIQUI BOND SA T T AS T NA Liquid Adhesive LIQUI BOND SA T T AS T NA LIQUI BOND SA T T AS T NA LIQUI BOND SA T T AS T NA T ® Typical; AS ® Application-Specific (contact Henkel Sales); A ® Available; * ® Roll stock configurations are limited — contact your Henkel Sales Representative for more information. Note: For HI FLOW UT, F-AC and HI FLOW UT, the adhesive is not a pressure sensitive adhesive (PSA). | Thermal Interface Selection Guide — GAP PAD
GAP PAD Thermally Conductive Materials
Solution-Driven Thermal Management Products for Electronic Devices A Complete Range of Choices for Filling Air Gaps and Enhancing Thermal Conductivity The BERGQUIST brand is a world leader in thermal interface The extensive GAP PAD family provides an effective thermal materials. The GAP PAD family of products was developed interface between heat sinks and electronic devices where to meet the electronic industry’s growing need for interface uneven surface topography, air gaps and rough surface textures materials with greater conformability, higher thermal are present. Henkel application specialists work closely with performance and easier application. customers to specify the proper GAP PAD material for each unique thermal management requirement.
Features Benefits Options Applications Each of the many products GAP PAD thermal products Some GAP PAD products have GAP PAD products are well- within the GAP PAD family are designed to improve special features for particular suited to a wide variety of is unique in its construction, an assembly’s thermal applications, including: electronics, automotive, properties and performance. performance and reliability • Available with or medical, aerospace and Following is an overview of the while saving time and money. without adhesive military applications such as: important features offered by • Eliminate air gaps to reduce • Rubber-coated fiberglass • Between an IC and a heat the GAP PAD family. thermal resistance reinforcement sink or chassis. Typical packages include BGAs, QFP, • Low-modulus • High conformability reduces • Thicknesses from . in. SMT power components and polymer material interfacial resistance to . in. magnetics • Available with fiberglass/ • Low-stress vibration • Available in custom die- • Between a semiconductor rubber carriers or in a non- dampening cut parts, sheets and rolls and heat sink reinforced version • Shock absorbing (converted or unconverted) • CD-ROM/DVD cooling • Special fillers to achieve • Easy material handling • Custom thicknesses and specific thermal constructions • Heat pipe assemblies • Simplified application and conformability • Adhesive or natural inherent • Memory modules characteristics • Puncture, shear and tack tear resistance • DDR SDRAM • Highly conformable to • Silicone-free GAP PAD • Hard drive cooling uneven and rough surfaces • Improved performance for available in thicknesses of • Electrically isolating high-heat assemblies . in. - . in. • Power supply • Natural tack on one or both • Compatible with automated We produce thousands of • IGBT modules dispensing equipment sides with protective liner specials. Tooling charges vary • Signal amplifiers • Variety of thicknesses depending on tolerance and • Between other heat- and hardnesses complexity of the part. generating devices • Range of thermal and chassis conductivities • Available in sheets and die-cut parts Thermal Interface Selection Guide — GAP PAD |
GAP PAD Comparison Data
Conductivity, Hardness and General Overview
GAP PAD Thermal Interface Materials
High Performance
Ultra Low Modulus GAP PAD
(ULM) 3500ULM Lowest Modulus
High Compliance GAP PAD GAP PAD GAP PAD (HC) HC 1000 HC 3.0 HC 5.0
Soft Class GAP PAD GAP PAD (S-Class) 1500S30 5000S35
GAP PAD 2000S40
Extended Performance Lowest Modulus VO Series GAP PAD VO Ultra Soft
GAP PAD VO Soft
GAP PAD VO
Value Performance Lowest Modulus Value GAP PAD GAP PAD 1450
GAP PAD 1500
GAP PAD 1500R
1.0 2.0 3.0 4.0 5.0 6.0
Specialty GAP PAD Thermal Interface Materials
Silicone-Free GAP PAD GAP PAD 2202SF 3004SF
GAP PAD GAP PAD 1000SF 2200SF
High Durability GAP PAD (HD) 1000HD
Electromagnetic GAP PAD (EMI) EMI 1.0
1.0 2.0 3.0 4.0 5.0 6.0 | Thermal Interface Selection Guide — GAP PAD
Frequently Asked Questions
Q: What thermal conductivity test method was used to Q: How is extraction testing performed? achieve the values given on the data sheets? A: The test method used is the Soxhlet Extraction Method; A: A test fixture is utilized that meets the specifications outlined please refer to GAP PAD S-Class White Paper. in ASTM D. Q: What is the thickness tolerance of your pads? Q: Is GAP PAD offered with an adhesive? A: The thickness tolerance is ¶· on materials ¸ mil and ¶ A: Currently, GAP PAD VO, GAP PAD VO Soft, and GAP PAD VO mil on materials ¹ mil. Ultra Soft are offered with or without an adhesive on the Q: What are the upper processing temperature limits for GAP SIL PAD / carrier-side of the material. The remaining PAD and for how long can GAP PAD be exposed to them? surface has natural inherent tack. All other GAP PAD A: GAP PAD in general can be exposed to temporary processing Materials have inherent tack. temperatures of °C for five minutes and °C for Q: Is the adhesive repositionable? one minute. A: Depending on the surface being applied to, if care is taken, Q: Is GAP PAD electrically isolating? the pad may be repositioned. Special care should be taken A: Yes, all GAP PAD materials are electrically isolating. However, when removing the pad from aluminum or anodized surfaces keep in mind that GAP PAD is designed to fill to avoid tearing or delamination. gaps and it is not recommended for applications where Q: What is meant by “natural tack”? high mounting pressure is exerted on the GAP PAD. A: The characteristic of the rubber itself has a natural inherent Q: How much force will the pad place on my device? tack, with the addition of an adhesive. As with adhesive- A: Refer to the Pressure vs. Deflection charts in BERGQUIST backed products, the surfaces with natural tack may help in Application Note º at our website’s Technical Library. the assembly process to temporarily hold the pad in place In addition, there are other helpful resources online at while the application is being assembled. Unlike adhesive- www.henkel-adhesives.com/thermal. backed products, inherent tack does not have a thermal penalty since the rubber itself has the tack. Tack strength Q: Why are “wet out,” “compliance” or “conformability” varies from one GAP PAD product to the next. characteristics of GAP PAD important? A: The better a GAP PAD lays smooth “wets out” or conforms to Q: Can GAP PAD with natural tack be repositioned? a rough or stepped surface, giving less interfacial resistance A: Depending on the material that the pad is applied to, in caused by air voids and air gaps. GAP PAD Materials are most cases they are repositionable. Care should be taken conformable or compliant as they adhere very well to the when removing the pad from aluminum or anodized surface. The GAP PAD Materials can act similarly to a “suction surfaces to avoid tearing or delaminating the pad. The cup” on the surface. This leads to a lower overall thermal side with the natural tack is always easier to reposition resistance of the pad between the two interfaces. than an adhesive side. Q: Is anything given off by the material (e.g., extractables, Q: Is GAP PAD reworkable? outgassing)? A: Depending on the application and the pad being used, A: ) Silicone GAP PAD and Gap Fillers, like all soft silicone GAP PAD has been reworked in the past. Some of our materials, can extract low molecular weight silicone (refer customers are currently using the same pad for reassembling to White Paper on GAP PAD S-Class). Also note that GAP their applications after burn-in processes and after fieldwork PAD and Gap Filler have some of the lowest extraction repairs. However, this is left up to the design engineer’s values for silicone-based gap filling products on the judgment as to whether or not the GAP PAD market and if your application requires minimal silicone, will withstand reuse. see our line of silicone-free material. The White Paper on Q: Will heat make the material softer? GAP PAD S-Class and information about our silicone-free A: From -°C to °C, there is no significant variance in materials are available on our website. hardness for silicone GAP PAD Materials and Gap Fillers. ) Primarily for aerospace applications, outgassing data is Q: What is the shelf life of GAP PAD? tested per ASTM E. A: Shelf life for most GAP PAD Materials is one () year after the Q: Why does the Technical Data Sheet (on the website) date of manufacture. For GAP PAD with adhesive, the shelf describe the Shore hardness rating as a bulk rubber life is six () months from the date of manufacture. After hardness? these dates, inherent tack and adhesive properties should be A: A reinforcement carrier is generally used in BERGQUIST recharacterized. The GAP PAD material’s long-term stability is GAP PAD Materials for ease of handling. When testing not the limiter on the shelf life; it is related to the adhesion or hardness, the reinforcement carrier can alter the test results “age up” of the GAP PAD to the liner. Or in the case of a and incorrectly depict thinner materials as being harder. To GAP PAD with adhesive, the shelf life is determined by how eliminate this error, a mil rubber puck is molded with no the adhesive ages up to the removable liner. reinforcement carrier. The puck is then tested for hardness. The Shore hardness is recorded after a -second delay. Thermal Interface Selection Guide — GAP PAD | ¥
GAP PAD VO
Conformable, Thermally Conductive Material for Filling Air Gaps
Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Enhanced puncture, shear and tear resistance Color Gold/Pink Gold/Pink Visual Reinforcement Carrier SIL PAD SIL PAD — • Conformable gap filling material Thickness (in.) / (mm) . to . . to . ASTM D • Electrically isolating Inherent Surface Tack (-sided) — Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN GAP PAD VO is a cost-effective, thermally conductive interface material. The Deflection ( strain) Thermal Impedance (°C-in./W) . in.() . . . material is a filled, thermally conductive ) Thirty-second delay value Shore hardness scale. polymer supplied on a rubber-coated ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual fiberglass carrier allowing for easy application performance is directly related to the surface roughness, flatness and pressure applied. material handling. The conformable nature of GAP PAD VO allows the pad to Typical Applications Include: fill in air gaps between PC boards and heat sinks or a metal chassis. • Telecommunications Note: Resultant thickness is defined as the • Computer and peripherals final gap thickness of the application. • Power conversion
Thickness vs. Thermal Resistance • Between heat-generating semiconductors and a heat sink GAP PAD VO • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader mils) • Between heat-generating magnetic components and a heat sink Configurations Available: Resultant Thickness ( • Sheet form and die-cut parts Thermal Resistance (C-in./W) Building a Part Number Standard Options GPVO–– .AC–– NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D ® Standard sheet size " x " or ® custom configuration AC ® Adhesive on SIL PAD side, natural tack on one side ® No pressure sensitive adhesive, natural tack on one side Standard thicknesses available: .", .", .", .", .", .", .", .", ." GPVO ® GAP PAD VO Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. ¦ | Thermal Interface Selection Guide — GAP PAD
GAP PAD VO Soft
Highly Conformable, Thermally Conductive Material for Filling Air Gaps
Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO SOFT • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Conformable, low hardness Color Mauve/Pink Mauve/Pink Visual • Enhanced puncture, shear and Reinforcement Carrier SIL PAD SIL PAD — tear resistance Thickness (in.) / (mm) . to . . to . ASTM D • Electrically isolating Inherent Surface Tack (-sided) — Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN GAP PAD VO Soft is recommended for applications that require a minimum Deflection ( strain) Thermal Impedance (°C-in./W) . in.() . . . amount of pressure on components. ) Thirty-second delay value Shore hardness scale. GAP PAD VO Soft is a highly conformable, ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual low-modulus, filled-silicone polymer on application performance is directly related to the surface roughness, flatness and pressure applied. a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a Typical Applications Include: leaded device. • Telecommunications Note: Resultant thickness is defined as the final • Computer and peripherals gap thickness of the application. • Power conversion
Thickness vs. Thermal Resistance • Between heat-generating semiconductors or magnetic components and a heat sink GAP PAD VO Soft • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader mils) Configurations Available: • Sheet form and die-cut parts
Resultant Thickness ( Building a Part Number Standard Options Thermal Resistance (C-in. /W) GPVOS–– . AC –– ACME Rev. a || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D ® Standard sheet size " x ", or ® custom configuration AC ® Adhesive on SIL-PAD side, natural tack on one side ® No pressure sensitive adhesive, natural tack on one side Standard thicknesses available: .", .", .", .", .", .", .", ." GPVOS ® GAP PAD VO Soft Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — GAP PAD |
GAP PAD VO Ultra Soft
Ultra Conformable, Thermally Conductive Material for Filling Air Gaps
Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Highly conformable, low hardness Color Mauve/Pink Mauve/Pink Visual • “Gel-like” modulus Reinforcement Carrier SIL PAD SIL PAD — • Decreased strain Thickness (in.) / (mm) . to . . to . ASTM D • Puncture-, shear- and tear-resistant Inherent Surface Tack (-sided) — Density (Bulk Rubber) (g/cc) . . ASTM D • Electrically isolating Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V- V- UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN Deflection ( strain) GAP PAD VO Ultra Soft is recommended Thermal Impedance (°C-in./W) . in.() . . . for applications that require a minimum ) Thirty-second delay value Shore hardness scale. ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . amount of pressure on components. ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing Typical Applications Include: characteristics. GAP PAD VO Ultra Soft is • Telecommunications an electrically isolating material, which • Computer and peripherals allows its use in applications requiring • Power conversion isolation between heat sinks and high- voltage, bare-leaded devices. • Between heat-generating semiconductors or magnetic components and a heat sink • Area where heat needs to be transferred to a frame, chassis, or other type of Note: Resultant thickness is defined as the final heat spreader gap thickness of the application.
Thickness vs. Thermal Resistance Configurations Available: GAP PAD VO Ultra Soft • Sheet form and die-cut parts Building a Part Number Standard Options GPVOUS–– . AC –– NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and Resultant Thickness (mils) revision level. Section E Section C Section B Section A Section D ® Standard sheet size " x ", or Thermal Resistance (C-in./W) ® custom configuration AC ® Adhesive on SIL-PAD side, natural tack on one side ® No pressure sensitive adhesive, natural tack on one side Standard thicknesses available: .", .", .", .", .", .", .", .", ." GPVOUS ® GAP PAD VO Ultra Soft Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — GAP PAD
GAP PAD HC .
High-Compliance, Thermally Conductive, Low Modulus Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC . • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • High-compliance, low compression stress Color Blue Blue Visual Reinforcement Carrier Fiberglass Fiberglass — • Fiberglass-reinforced for shear and tear Thickness (in.) / (mm) . to . . to . ASTM D resistance Inherent Surface Tack — Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.)() ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K)() . . ASTM D GAP PAD HC . is a soft and compliant THERMAL PERFORMANCE VS. STRAIN gap filling material with a thermal Deflection ( strain) conductivity of . W/m-K. The material Thermal Impedance (°C-in./W) . in.() . . . offers exceptional thermal performance at ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. after minutes of compression at · strain on a mm thickness material. low pressures due to a unique . W/m-K ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. filler package and low-modulus resin ) Minimum value at mil. ) Thirty-second delay value on Shore hardness scale. formulation. The enhanced material is ideal for applications requiring low stress on components and boards during Typical Applications Include: assembly. GAP PAD HC . maintains • Telecommunications a conformable nature that allows for • ASICs and DSPs quick recovery and excellent wet-out • Consumer electronics characteristics, even to surfaces with high • Thermal modules to heat sinks roughness and/or topography. GAP PAD HC . is offered with natural Configurations Available: inherent tack on both sides of the • Sheet form and die-cut parts material, eliminating the need for thermally impeding adhesive layers. The Building a Part Number Standard Options top side has minimal tack for ease of GPHC.–– . –– NA || example NA ® Selected standard option. If not selecting a standard handling. GAP PAD HC . is supplied option, insert company name, drawing number, and with protective liners on both sides. revision level. Section E Section C Section B Section A Section D ® Standard sheet size " x ", or Thickness vs. Thermal Resistance ® custom configuration GAP PAD HC . ® Natural tack, both sides (With fiberglass) Standard thicknesses available: .", .", .", .", .", ." GPHC. ® GAP PAD HC . Material with fiberglass Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php.
Resultant Thickness (mils) . . . . . . . . Thermal Resistance (C-in./W) Thermal Interface Selection Guide — GAP PAD |
GAP PAD HC .
Highly Conformable, Thermally Conductive, Low Modulus Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC . • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • High-compliance, low compression stress Color Violet Violet Visual • Fiberglass reinforced for shear and Reinforcement Carrier Fiberglass Fiberglass — tear resistance ., ., . ., ., ., Thickness (in.) / (mm)* ASTM D ., ., . ., ., . Inherent Surface Tack — Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() . ASTM D Typical Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.)() ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL GAP PAD HC . is a soft and compliant gap THERMAL filling material with a thermal conductivity Thermal Conductivity (W/m-K)() . . ASTM D of . W/m-K. The material offers exceptional THERMAL PERFORMANCE VS. STRAIN thermal performance at low pressures due Deflection ( strain) to a unique filler package and low-modulus Thermal Impedance (°C-in./W) . in.() . . . resin formulation. The enhanced material is * Custom thicknesses available. Please contact your Henkel Sales Representative for more information. () Young’s Modulus, calculated using . in/min. step rate of strain with a sample size of . inch after minutes of compression at · strain on a mm ideal for applications requiring low stress on thickness material. () The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. components and boards during assembly. Actual application performance is directly related to the surface roughness, flatness and pressure applied. () Minimum value at mil. GAP PAD HC . maintains a conformable () Thirty second delay value on Shore hardness scale. nature that allows for excellent interfacing and wet-out characteristics, even to surfaces Typical Applications Include: with high roughness and/or topography. • Telecommunications GAP PAD HC . is offered with natural • ASICs and DSPs inherent tack on both sides of the material, • Consumer electronics eliminating the need for thermally-impeding • Thermal modules to heat sinks adhesive layers. The top side has minimal tack for ease of handling. GAP PAD HC . Configurations Available: is supplied with protective liners on • Sheet form and die-cut parts both sides. Building a Part Number Standard Options
GPHC5.0–– 0.020 02–– 0816 NA NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and Thickness vs. Thermal Resistance revision level. Gap Pad HC 5.0 Section E Section B Section A Section C 140 Section D 0816 = Standard sheet size 8" x 16", or 120 00 = custom configuration 100 02 = Natural tack, both sides (With Fiberglass) 80 Standard thicknesses available: 0.020", 0.040", 0.060", 60 0.080", 0.100", 0.125" 40 GPHC5.0 = Gap Pad HC 5.0 Material with fiberglass
Resultant Thickness (mils) Resultant 20 0 Note:Note: To To buildbuild a a part part numbernumber,, visit go toour www.bergquistcompany.com/Part_Number_Builder.php. website at www.henkel-adhesives.com/thermal. 0.2 0.4 0.6 0.8 1.0 1.2 For any other custom thickness requirements, please contact your Henkel Representative. Thermal Resistance (C-in2/W) | Thermal Interface Selection Guide — GAP PAD
GAP PAD HD
Highly Durable, Conformable, Thermally Conductive, Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD HD • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Designed for high durability applications Color Grey/Black Grey/Black Visual Reinforcement Carrier Polyimide Polyimide — • Robust polyimide carrier provides Thickness (in.) / (mm) . to . . to . ASTM D excellent voltage breakdown, puncture Inherent Surface Tack (- or -sided) — and tear resistance Density (g/cc) . . ASTM D • Highly conformable Heat Capacity (J/g-K) . . ASTM E • Ease of handling and rework Hardness, Bulk Rubber (Shore )() ASTM D in applications Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL GAP PAD HD Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN Deflection ( strain) Thermal Impedance (°C-in./W) . in.() . . .
) Thirty-second delay value Shore hardness scale. ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . GAP PAD HD was designed to ) The ASTM D test fixture was used. The recorded values includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. withstand applications requiring high durability. Typical Applications Include: The coated polyimide carrier on one • High durability applications side of the material allows easy rework, excellent handling characteristics and • Automotive energy storage: ultra capacitors, batteries, power transmissions, power inverters puncture resistance. • Industrial automotive applications such as trucks, buses and trains The conformable and elastic nature • Computer and peripherals of GAP PAD HD allows excellent • Telecommunications interfacing and wet-out characteristics, even to surfaces with a high degree of • Between any heat-generating device and a heat sink roughness or uneven topography. Configurations Available: The asymmetric construction of • Sheet form GAP PAD HD provides minimal • Die-cut parts tack on the polyimide side, with high inherent tack on the upcoated side. Building a Part Number Standard Options GAP PAD HD can be assembled GPHD–– . –– NA || example with manual or automated processes. NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Thickness vs. Thermal Resistance Section E Section C Section B Section A GAP PAD HD Section D ® Standard sheet size " x ", or ® custom configuration
® Natural tack on one side
Standard thicknesses available: .", .", .", .", .", ." GPHD ® GAP PAD HD Material Resultant Thickness (mils) Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. . . . . . Thermal Resistance (C-in./W) Thermal Interface Selection Guide — GAP PAD |
GAP PAD SF
Thermally Conductive, Silicone-Free Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD SF • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • No silicone outgassing Color Green Green Visual • No silicone extraction Reinforcement Carrier Fiberglass Fiberglass — • Reduced tack on one side to aid in Thickness (in.) / (mm) . to . . to . ASTM D application assembly Inherent Surface Tack (- or -sided) — • Electrically isolating Density (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness, Bulk Rubber (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V- V- UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D
) Thirty-second delay value Shore hardness scale. ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . For more information on GAP PAD modulus, refer to BERGQUIST Application Note º at our website’s Technical Library. GAP PAD SF is a thermally conductive, electrically insulating, silicone-free polymer specially designed Typical Applications Include: for silicone-sensitive applications. The • Digital disk drives / CD-ROM material is ideal for applications with high • Automotive modules standoff and flatness tolerances. • Fiber optics modules GAP PAD SF is reinforced for easy material handling and added durability Configurations Available: during assembly. The material is available • Sheet form with a protective liner on both sides of • Die-cut parts the material. The top side has reduced tack for ease of handling. Building a Part Number Standard Options Note: Resultant thickness is defined as the final GPSF–– . –– NA || example gap thickness of the application. NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.
Thickness vs. Thermal Resistance Section E Section C Section B Section A GAP PAD SF Section D : ® Standard sheet size " x ", or ® custom configuration ® Natural tack, both sides Standard thicknesses available: .", .", .", .", .", .", .", ." GPSF ® GAP PAD SF Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Resultant Thickness (mils) Thermal Resistance (C-in./W) | Thermal Interface Selection Guide — GAP PAD
GAP PAD HC
“Gel-Like” Modulus Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD HC • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Highly conformable, low hardness Color Grey Grey Visual • “Gel-like” modulus Reinforcement Carrier Fiberglass Fiberglass — • Fiberglass-reinforced for puncture, Thickness (in.) / (mm) . to . . to . ASTM D shear and tear resistance Inherent Surface Tack (-sided) — Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN GAP PAD HC is an extremely conformable, low-modulus polymer that Deflection ( strain) Thermal Impedance (°C-in./W) . in.() . . . acts as a thermal interface and electrical ) Thirty-second delay value Shore hardness scale. insulator between electronic components ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual and heat sinks. The “gel-like” modulus application performance is directly related to the surface roughness, flatness and pressure applied. allows this material to fill air gaps to enhance the thermal performance of electronic systems. GAP PAD HC is Typical Applications Include: offered with removable protective liners • Computer and peripherals on both sides of the material. • Telecommunications • Heat interfaces to frames, chassis, or other heat spreading devices Note: Resultant thickness is defined as the final gap thickness of the application. • Memory modules / chip scale packages • CD-ROM / DVD cooling Thickness vs. Thermal Resistance GAP PAD HC • Areas where irregular surfaces need to make a thermal interface to a heat sink • DDR SDRAM memory modules • FB-DIMM modules Configurations Available: Resultant Thickness (mils) • Sheet form, die-cut parts, and roll form (converted or unconverted) . . .. .. . Thermal Resistance (C-in. /W) Building a Part Number Standard Options HC–– . –– NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D ® Standard sheet size " x ", or ® custom configuration
® Natural tack, both sides
Standard thicknesses available: .", .", ."
HC ® High Compliance Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — GAP PAD |
GAP PAD
Highly Conformable, Thermally Conductive, Reworkable Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD • Thermal conductivity: . W/m-K (bulk rubber) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • PEN film reinforcement allows easy Color Light Pink Light Pink Visual rework and resistance to puncture and Reinforcement Carrier PEN film PEN film — tear resistance Thickness (in.) / (mm) . to . . to . ASTM D Inherent Surface Tack (-sided) — • Highly conformable/low hardness Density (Bulk Rubber) (g/cc) . . ASTM D • Low strain on fragile components Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V- V- UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D
GAP PAD is a highly compliant ) Thirty-second delay value Shore hardness scale. GAP PAD material that is ideal for fragile ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . component leads. The material includes a PEN film, which facilitates rework Typical Applications: and improves puncture resistance and • Lighting and LED applications handling characteristics. The tacky side of • Low strain is required for fragile component leads GAP PAD maintains a conformable, yet elastic nature that provides excellent • Computer and peripherals interfacing and wet-out characteristics, • Telecommunications even to surfaces with high roughness or • Between any heat-generating semiconductor and a heat sink uneven topography. Configurations Available: GAP PAD has inherent tack on one • Sheet form and die-cut parts side of the material, eliminating the need for thermally impeding adhesive layers. Building a Part Number Standard Options It is highly recommended that the PEN GP . NA || example NA ® Selected standard option. If not selecting a standard film be left intact. However, film removal option, insert company name, drawing number, and will not have a significant impact on revision level. Section E Section C Section B Section A Section D ® Standard sheet size " x ", or thermal performance. ® custom configuration Please contact your local Henkel Sales ® Natural tack, one side
Representative for sample inquiries and Standard thickness available: .", .", ." additional product information. .", .", ." GP ® GAP PAD Material Thickness vs. Thermal Resistance GAP PAD Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php.
Thermal Resistance (C-in. /W) | Thermal Interface Selection Guide — GAP PAD
GAP PAD
Thermally Conductive, Unreinforced Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Unreinforced construction for additional compliancy Color Black Black Visual Reinforcement Carrier — — — • Conformable, low hardness Thickness (in.) / (mm) . to . . to . ASTM D • Electrically isolating Inherent Surface Tack (-sided) — Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN GAP PAD has an ideal filler Deflection ( strain) blend that gives it a low-modulus Thermal Impedance (°C-in./W) . in.() . . . characteristic which maintains optimal ) Thirty-second delay value Shore hardness scale. thermal performance yet still allows ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual for easy handling. The natural tack application performance is directly related to the surface roughness, flatness and pressure applied. on both sides of the material allows for good compliance to adjacent Typical Applications Include: surfaces of components, minimizing interfacial resistance. • Telecommunications • Computer and peripherals Note: Resultant thickness is defined as the final gap thickness of the application. • Power conversion • Memory modules / chip scale packages Thickness vs. Thermal Resistance GAP PAD • Areas where heat needs to be transferred to a frame chassis or other type of heat spreader Configurations Available: • Sheet form and die-cut parts
Resultant Thickness (mils) Building a Part Number Standard Options Thermal Resistance (C-in./W) GP–– . –– NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D ® Standard sheet size " x ", or ® custom configuration
® Natural tack, both sides
Standard thicknesses available: .", .", .", .", .", .", .", ." GP ® GAP PAD Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — GAP PAD | ¥
GAP PAD R
Thermally Conductive, Reinforced Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD R • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Fiberglass-reinforced for puncture, shear and tear resistance Color Black Black Visual Reinforcement Carrier Fiberglass Fiberglass — • Easy release construction Thickness (in.) / (mm) . to . . to . ASTM D • Electrically isolating Inherent Surface Tack (-sided) — Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN GAP PAD R has the same highly conformable, low-modulus polymer as Deflection ( strain) Thermal Impedance (°C-in./W) . in.() . . . the standard GAP PAD . The ) Thirty-second delay value Shore hardness scale. fiberglass reinforcement allows for easy ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual material handling and enhances puncture, application performance is directly related to the surface roughness, flatness and pressure applied. shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating surfaces Typical Applications Include: of components, further reducing • Telecommunications thermal resistance. • Computer and peripherals • Power conversion Note: Resultant thickness is defined as the final gap thickness of the application. • Memory modules / chip scale packages Thickness vs. Thermal Resistance • Areas where heat needs to be transferred to a frame chassis or other type GAP PAD R of heat spreader Configurations Available: • Sheet form, die-cut parts, and roll form (converted or unconverted) Resultant Thickness (mils) Building a Part Number Standard Options . . .. .. . GPR–– . –– ACME Rev. A || example Thermal Resistance (C-in. /W) NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D ® Standard sheet size " x ", or ® custom configuration
® Natural tack, both sides
Standard thicknesses available: .", .", ."
GPR ® GAP PAD R Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. ¦ | Thermal Interface Selection Guide — GAP PAD
GAP PAD S
Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD S • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Highly conformable/low hardness Color Light Pink Light Pink Visual • Decreased strain on fragile components Reinforcement Carrier Fiberglass Fiberglass ASTM D • Fiberglass-reinforced for puncture, Thickness (in.) / (mm) . to . . to . ASTM D shear and tear resistance Inherent Surface Tack (-sided) — • Quick rebound to original shape Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN Deflection ( strain) GAP PAD S is a highly compliant Thermal Impedance (°C-in./W) . in.() . . . GAP PAD material that is ideal for ) Thirty-second delay value Shore hardness scale. fragile component leads. The material ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual is fiberglass-reinforced for improved application performance is directly related to the surface roughness, flatness and pressure applied. puncture resistance and handling characteristics. GAP PAD S Typical Applications: maintains a conformable, yet elastic • Any heat-generating component and a heat sink nature that provides excellent interfacing and wet-out characteristics, • Computers and peripherals even to surfaces with high roughness • Telecommunications or uneven topography. • Between any heat-generating semiconductor and a heat sink GAP PAD S features an inherent • Shielding devices tack on both sides of the material, eliminating the need for thermally Configurations Available: impeding adhesive layers. • Sheet form and die-cut parts
Note: Resultant thickness is defined as the final Building a Part Number Standard Options gap thickness of the application. GPS . || example Thickness vs. Thermal Resistance NA ® Selected standard option. If not selecting a standard GAP PAD S option, insert company name, drawing number, and revision level.
Section E Section C Section B Section A Section D ® Standard sheet size " x ", or ® custom configuration ® Natural tack, both sides
Resultant Thickness (mils) Standard thicknesses available: .", .", ." . . . . . . . . . .", .", .", .", .", ." Thermal Resistance (C-in./W) GPS ® GAP PAD S Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — GAP PAD |
GAP PAD A
High Performance, Thermally Conductive Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD A • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Fiberglass-reinforced for puncture, shear and tear resistance Color Grey Grey Visual Reinforcement Carrier Fiberglass Fiberglass — • Electrically isolating Thickness (in.) / (mm) . to . . to . ASTM D Inherent Surface Tack (-sided) — Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL GAP PAD A acts as a thermal Thermal Conductivity (W/m-K) . . ASTM D interface and electrical insulator between THERMAL PERFORMANCE VS. STRAIN electronic components and heat sinks. Deflection ( strain) () In the thickness range of to mil, Thermal Impedance (°C-in. /W) . in. . . . ) Thirty-second delay value Shore hardness scale. GAP PAD A is supplied with natural ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual tack on both sides, allowing for excellent application performance is directly related to the surface roughness, flatness and pressure applied. compliance to the adjacent surfaces of components. The mil material thickness is supplied with lower tack on Typical Applications Include: one side, allowing for burn-in processes • Computer and peripherals; between CPU and heat spreader and easy rework. • Telecommunications • Heat pipe assemblies Note: Resultant thickness is defined as the final gap thickness of the application. • Memory modules Thickness vs. Thermal Resistance • CDROM / DVD cooling GAP PAD A • Areas where heat needs to be transferred to a frame chassis or other type of heat spreader • DDR SDRAM memory modules Configurations Available: Resultant Thickness (mils) . . .. .. . • Sheet form, die-cut parts and roll form (converted or unconverted) Thermal Resistance (C-in./W) Building a Part Number Standard Options GPA–– . –– NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D ® Standard sheet size " x ", or ® custom configuration
® Natural tack, both sides
Standard thicknesses available: .", .", ." ." GPA ® GAP PAD A Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — GAP PAD
GAP PAD S
Highly Conformable, Thermally Conductive, Reinforced “S-Class” Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD S • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Low “S-Class” thermal resistance at very low pressures Color Grey Grey Visual Reinforcement Carrier Fiberglass Fiberglass — • Highly conformable, low hardness Thickness (in.) / (mm) . to . . to . ASTM D • Designed for low-stress applications Inherent Surface Tack (-sided) — • Fiberglass-reinforced for puncture, Density (Bulk Rubber) (g/cc) . . ASTM D shear and tear resistance Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN Deflection ( strain) GAP PAD S is recommended for Thermal Impedance (°C-in./W) . in.() . . . low-stress applications that require a mid- ) Thirty-second delay value Shore hardness scale. ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . to high-thermally conductive interface ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual material. The highly conformable nature application performance is directly related to the surface roughness, flatness and pressure applied. of the material allows the pad to fill in air voids and air gaps between PC boards and Typical Applications Include: heat sinks or metal chassis with stepped • Power electronics DC/DC; /, /, full bricks, etc. topography, rough surfaces and high • Mass storage devices stack-up tolerances. • Graphics card/processor/ASIC GAP PAD S is offered with • Wireline/wireless communications hardware inherent natural tack on both sides • Automotive engine/transmission controls of the material allowing for stick-in- place characteristics during application Configurations Available: assembly. The material is supplied • Sheet form and die-cut parts with protective liners on both sides. The top side has reduced tack for ease Building a Part Number Standard Options of handling. GPS–– . –– NA || example NA ® Selected standard option. If not selecting a standard Note: Resultant thickness is defined as the final option, insert company name, drawing number, and gap thickness of the application. revision level. Section E Section C Section B Section A Section D Thickness vs. Thermal Resistance ® Standard sheet size " x ", or GAP PAD S ® custom configuration ® Natural tack, both sides Standard thicknesses available: .", .", .", .", .", ." GPS ® GAP PAD S Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Resultant Thickness (mils) . . . . . . Thermal Resistance (°C-in./W) Thermal Interface Selection Guide — GAP PAD |
GAP PAD SF
Thermally Conductive, Silicone-Free Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD SF • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Silicone-free formulation Color Green Green Visual • Medium compliance with easy handling Reinforcement Carrier Fiberglass Fiberglass — • Electrically isolating Thickness (in.) / (mm) . to . . to . ASTM D Inherent Surface Tack (- or -sided) — Density (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness, Bulk Rubber (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D GAP PAD SF is a thermally ) Thirty-second delay value Shore hardness scale. conductive, electrically isolating, ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . For more information on GAP PAD modulus, refer to BERGQUIST Application Note º at our website’s Technical Library. silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications Typical Applications: with uneven topologies and high • Digital disk drives stack-up tolerances. GAP PAD SF is • Proximity near electrical contacts (e.g., DC brush motors, connectors, relays) reinforced for easy material handling and • Fiber optics modules added durability during assembly. The material is available with a protective Configurations Available: liner on both sides. GAP PAD SF is • Sheet form supplied with reduced tack on one side, • Die-cut parts allowing for burn-in processes and easy rework. • Standard sheet size is in. x in.
Note: Resultant thickness is defined as the final Building a Part Number Standard Options gap thickness of the application. GPSF – . –– – N || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A GAP PAD SF Section D ® Standard sheet size " x ", or ® custom configuration
® Natural tack, both sides
Standard thicknesses available: .", .", .", .", .", .", .", ." GPSF ® GAP PAD SF Material . . . . . Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Resistance (°C-in./W) | Thermal Interface Selection Guide — GAP PAD
GAP PAD A
Thermally Conductive, Reinforced Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD A • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Fiberglass-reinforced for puncture, shear and tear resistance Color Gold Gold Visual Reinforcement Carrier Fiberglass Fiberglass — • Reduced tack on one side to aid in Thickness (in.) / (mm) . to . . to . ASTM D application assembly Inherent Surface Tack (-sided) — • Electrically isolating Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN GAP PAD A is a thermally Deflection ( strain) () conductive, filled-polymer laminate, Thermal Impedance (°C-in. /W) . in. . . . ) Thirty-second delay value Shore hardness scale. supplied on a reinforcing mesh for added ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. . ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual electrical isolation, easy material handling application performance is directly related to the surface roughness, flatness and pressure applied. and enhanced puncture, shear and tear resistance. GAP PAD A has a reinforcement layer on the dark gold side Typical Applications Include: of the material that assists in burn-in and • Computer and peripherals • Telecommunications rework processes while the light gold • Heat pipe assemblies • Memory modules and soft side of the material allows for • CDROM / DVD cooling • Between CPU and heat spreader added compliance. • Area where heat needs to be transferred to a frame, chassis or other type of Note: Resultant thickness is defined as the final gap thickness of the application. heat spreader Thickness vs. Thermal Resistance GAP PAD A Configurations Available: • Sheet form, die-cut parts and roll form (converted or unconverted)
Building a Part Number Standard Options GPA–– . –– NA || example NA ® Selected standard option. If not selecting a standard
Resultant Thickness (mils) option, insert company name, drawing number, and revision level. . . . . .. ... Section E Section C Section B Section A Section D Thermal Resistance (C-in./W) ® Standard sheet size " x ", or ® custom configuration
® Natural tack, one side
Standard thicknesses available: .", .", .", .", .", .", ." GPA ® GAP PAD A Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — GAP PAD |
GAP PAD ULM
Highly Conformable, Thermally Conductive, Ultra-Low Modulus Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD ULM • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Fiberglass-reinforced for shear and tear resistance Color Grey Grey Visual Fiberglass or Fiberglass or Reinforcement Carrier — • Non-fiberglass option for applications no fiberglass no fiberglass that require an additional reduction Thickness (in.) / (mm) . to . . to . ASTM D in stress Inherent Surface Tack — Density (Bulk Rubber) (g/cc) . . ASTM D Heat Capacity (J/g-K) . . ASTM E Young’s Modulus (psi) / (kPa)()() . — Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz)() . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL GAP PAD ULM (ultra-low modulus) Thermal Conductivity (W/m-K) . . ASTM D is an extremely soft gap filling material THERMAL PERFORMANCE VS. STRAIN with a thermal conductivity of . W/m-K. Deflection ( strain) The material offers exceptional thermal Thermal Impedance (°C-in./W) . in.() . . . performance at low pressures due to ) Young’s Modulus, calculated using . in./min. step rate of strain with a sample size of . in. after minutes of compression at · strain on a mm thickness material. a unique . W/m-K filler package and ) Thirty-second delay value Shore hardness scale is for mil. ) Minimum value at mil. ultra-low modulus resin formulation. ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual The enhanced material is well-suited for application performance is directly related to the surface roughness, flatness and pressure applied. high performance applications requiring extremely low assembly stress. GAP PAD Typical Applications Include: ULM maintains a conformable nature • Consumer electronics that allows for excellent interfacing and • Telecommunications wet-out characteristics, even to surfaces with high roughness and/or topography. • ASICs and DSPs • PC applications GAP PAD ULM is offered with and without fiberglass and has higher natural Configurations Available: inherent tack on one side of the material, • Sheet form and die-cut parts eliminating the need for thermally impeding adhesive layers. The top side Building a Part Number Standard Options has minimal tack for ease of handling. GPULM–– . –– NA || example NA ® Selected standard option. If not selecting a standard GAP PAD ULM is supplied with option, insert company name, drawing number, and protective liners on both sides. revision level. Section E Section C Section B Section A Section D ® Standard sheet size " x ", or Thickness vs. Thermal Resistance ® custom configuration GAP PAD ULM ® Natural tack, both sides (without fiberglass) ® Natural tack, both sides (with fiberglass) ® Non-tack, one side (without fiberglass), ." x ." ® Non-tack, one side (with fiberglass), ." x ." mils) Standard thicknesses available: ."(fiberglass only), .", .", .", .", ." GPULM ® GAP PAD ULM Material without fiberglass GPULM-G ® GAP PAD ULM Material with fiberglass (GPULM and GPULM-G are also offered in a NT,
Resultant Thickness ( non-tack, version) Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. . . . . . . . . Thermal Resistance (°C-in./W) | Thermal Interface Selection Guide — GAP PAD
GAP PAD S
High Thermal Conductivity Plus “S-Class” Softness and Conformability Features and Benefits TYPICAL PROPERTIES OF GAP PAD S • High-thermal conductivity: . W/m-K • Highly conformable, “S-Class” softness PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Naturally-inherent tack reduces Color Light Green Light Green Visual interfacial thermal resistance Reinforcement Carrier Fiberglass Fiberglass — Thickness (in.) / (mm) . to . . to . ASTM D • Conforms to demanding contours and maintains structural integrity with little Inherent Surface Tack (-sided) — or no stress applied to fragile Density (Bulk Rubber) (g/cc) . . ASTM D component leads Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D
• Fiberglass reinforced for puncture, () shear and tear resistance Young’s Modulus (psi) / (kPa) . ASTM D Continuous Use Temp. (°F) / (°C) - to - to — • Excellent thermal performance at low pressures ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. STRAIN Deflection ( strain) Thermal Impedance (°C-in./W) . in.() . . .
() Thirty second delay value Shore hardness scale. () Young’s Modulus, calculated using . in/min. step rate of strain with a sample size of . inch . () The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. GAP PAD 5000S35 is a fi berglass-reinforced Actual application performance is directly related to the surface roughness, flatness and pressure applied. fi ller and polymer featuring a high thermal conductivity. The material yields extremely Typical Applications Include: soft characteristics while maintaining • Voltage Regulator Modules (VRMs) and POLs elasticity and conformability. The fi berglass • CD ROM/DVD ROM • Memory packages/modules reinforcement provides easy handling and • PC Board to chassis • Thermally-enhanced BGAs converting, added electrical isolation and • ASICs and DSPs tear resistance. The inherent natural tack on both sides assists in application and Configurations Available: allows the product to eff ectively fi ll air gaps, • Die-cut parts are available in any shape or size, separated or in sheet form enhancing the overall thermal performance. The top side has reduced tack for ease Building a Part Number Standard Options of handling. GAP PAD 5000S35 is ideal for high-performance applications at low GPS . NA || example mounting pressures. NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Note: Resultant thickness is defined as the final Section E Section C Section B Section A gap thickness of the application. Section D ® Standard sheet size " x ", or ® custom configuration Thickness vs. Thermal Resistance ÀÃ ® Natural tack, one side GAP PAD 5000S35 ÀÁ ® Non-tack, one side (fiberglass side), ." x ." 140 ÀÂ ® Non-tack, one side (upcoat side), ." x ." 120 Standard thicknesses available: .", .", ." 100 .", .", ." GPS ® GAP PAD S Material 80 GPS NT ® GAP PAD S Non-tack Material 60 Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. 40
Resultant Thickness (mils) Resultant 20 0 0.2 0.4 0.6 0.8 1.0 1.2 Thermal Resistance (C-in2/W) Thermal Interface Selection Guide — GAP PAD |
GAP PAD EMI .
Thermally Conductive, Conformable EMI Absorbing Material
Features and Benefits TYPICAL PROPERTIES OF GAP PAD EMI .¡ • Thermal conductivity: Å. W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Electromagnetic Interference (EMI) absorbing Color Black Black Visual Reinforcement Carrier Fiberglass Fiberglass — • Highly conformable, low hardness Thickness (in.) / (mm) . to . . to . ASTM D • Fiberglass reinforced for puncture, Inherent Surface Tack (-sided) — shear and tear resistance Density (Bulk Rubber) (g/cc) . . ASTM D • Electrically isolating Heat Capacity (J/g-K) . . ASTM E Hardness (Bulk Rubber) (Shore )() ASTM D Young’s Modulus (psi) / (kPa)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) ¸, ¸, ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K)() . . ASTM D GAP PAD EMI . is a highly conformable, THERMAL PERFORMANCE VS. STRAIN combination gap fi lling material off ering Deflection ( strain) both thermal conductivity performance and Thermal Impedance (°C-in./W) . in. . . . Electromagnetic Energy absorption (cavity EMI PERFORMANCE ASTM D ¦ TEST METHOD resonances and/or cross-talk causing Absorption () dB/inch dB/cm Electromagnetic Interference) at frequencies @ . Ghz - -. of GHz and higher. @ Ghz - -.
The material off ers EMI suppression and () Thirty second delay value Shore hardness scale. () Young’s Modulus, calculated using . in/min. step rate of strain with a sample size of . inch. Relaxation stress @ mil. . W/m-K thermal conductivity performance () The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. with low assembly stress. The soft nature () Based on waveguide testing with mil thickness testing of the material enhances wet-out at the interface resulting in better thermal Thickness vs. Thermal Resistance Absorption and Reflection (60 mil) Gap Pad EMI 1.0 Gap Pad EMI 1.0 performance than harder materials with a 140 0 120 -2 similar performance rating. 100 -4 GAP PAD EMI . has an inherent, natural 80 -6
60 dB -8 tack on one side of the material eliminating 40 -10 Resultant Thickness (mils) Resultant 20 -12 the need for thermally-impeding adhesive 0 -14 0 1.00 2.00 3.00 4.00 5.00 6.00 -16 layers and allowing improved handling Thermal Resistance (C-in2/W) 01 32 45678 Frequency (GHz) during placement and assembly. The other side is tack-free, again enhancing handling Building a Part Number Standard Options and rework, if required. GAP PAD EMI . is supplied with a protective liner on the GPEMI1.0–– 0.020 01–– 0816 NA NA = Selected standard option. If not selecting a standard material’s tacky side. option, insert company name, drawing number, and revision level. Section E Section B Section A Section C Typical Applications Include: Section D 0816 = Standard sheet size 8" x 16", or 00 = custom configuration • Consumer electronics • ASICs and DSPs 01 = Natural tack, one side (With Fiberglass) • Telecommunications • PC applications Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125" Configurations Available: GPEMI1.0 = Gap Pad EMI 1.0 Material with fiberglass • Sheet form and die-cut parts Note:Note: To To build build a apart part number, number, go visitto www.bergquistcompany.com/Part_Number_Builder.php. our website at www.bergquistcompany.com. | Thermal Interface Selection Guide — GAP FILLER
Gap Filler Liquid Dispensed Materials
Introduction Effective thermal management is key to ensuring consistent performance and long-term reliability of many electronic devices. With the wide variety of applications requiring thermal management, the need for alternative thermal material solutions and innovative material placement methods continues to grow. Henkel’s family of dispensable liquid polymer materials with unique characteristics is especially designed for ultimate thermal management design and component assembly flexibility. Two-Part Gap Fillers BERGQUIST two-part, cure-in-place materials are dispensed as a liquid onto the target surface. As the components are assembled, the material will wet-out to the adjacent surfaces, filling even the smallest gaps and air voids. Once cured, the material remains a flexible and soft elastomer, designed to assist in relieving Gap Filler solutions provide easy dispensing and efficient heat transfer coefficient of thermal expansion (CTE) mismatch stresses during in electronic applications. thermal cycling. Gap Filler is ideally suited for applications where pads cannot perform adequately, can be used to replace grease or potting compounds, and is currently used in power supply, telecom, digital, and automotive applications. Single Solution for Multiple Applications Unlike pre-cured gap filling materials, the liquid approach offers Liquid Gap Filler infinite thickness options and eliminates the need for specific pad thicknesses or die-cut shapes for individual applications. Key Performance Benefits Efficient Material Usage Ultra Low Modulus: Minimal Stress During Assembly Manual or semiautomatic dispensing tools can be used to apply Because Gap Filler is dispensed and wet-out in its liquid state, material directly to the target surface, resulting in effective use the material will create virtually zero stress on components of material with minimal waste. Further maximization of material during the assembly process. Gap Filler can be used to interface usage can be achieved with implementation of automated even the most fragile and delicate devices. dispensing equipment, which allows for precise material Excellent Conformability to Intricate Geometries placement and reduces the application time of the material. Liquid Gap Filler materials are able to conform to intricate Customizable Flow Characteristics topographies, including multi-level surfaces. Due to its increased Although Gap Fillers are designed to flow easily under minimal mobility prior to cure, Gap Filler can fill small air voids, crevices, pressure, they are thixotropic in nature which helps the material and holes, reducing overall thermal resistance to the heat remain in place after dispensing and prior to cure. BERGQUIST generating device. Gap Filler offerings include a range of rheological characteristics and can be tailored to meet customer-specific flow requirements Liquid Dispensable Gap Filler Thermal Conductivity from self-leveling to highly thixotropic materials that maintain 4.0 their form as dispensed. 3.5
3.0
2.5
2.0
1.5
1.0
0.5
0 GAP FILLER GAP FILLER GAP FILLER GAP FILLER GAP FILLER GAP FILLER GAP FILLER GAP FILLER SR SF LV S Thermal Interface Selection Guide — GAP FILLER | ¥
Frequently Asked Questions
Q: How is viscosity measured? Q: What container sizes are available for Gap Fillers? A: Due to the thixotropic characteristics of most Gap Fillers, A: Two-part materials are available in several standard dual special consideration should be given to the test method(s) cartridge sizes including cc ( cc each of parts A and used to determine viscosity of these materials. Because B) and cc ( cc each of parts A and B). Gap Fillers the material viscosity is dependent on shear rate, different are also available in kits of cc (two stand-alone measurement equipment testing under varying shear rates cc containers, one of each part) and -gallon (two -gallon will produce varied viscosity readings. When comparing pails, one of each part) sizes for higher volume production. apparent viscosities of multiple materials, it is important Other special and custom container sizes are available to ensure that the data was generated using the same test upon request. method and test conditions (therefore the same shear rate). Q: How do I mix the two-part Gap Fillers? Test methods and conditions for BERGQUIST products are A: Disposable plastic static mixing nozzles are used to mix parts noted in the individual Technical Data Sheets. A and B together at the desired ratio. Static mixers can be Q: How are pot life and cure time defined? attached to the ends of cartridges or mounted on automated A: Two-part Gap Filler systems begin curing once the two dispensing equipment. They are reliable, accurate and components are mixed together. Henkel defines the pot inexpensive to replace after extended down times. Unless life (working life) of a two-part system as the time for the otherwise indicated, mixing nozzles with a minimum of viscosity to double after parts A and B are mixed. Henkel mixing elements are recommended to achieve proper mixing. defines the cure time of a two-part material as the time to Q: What is the tolerance on the mix ratio? reach percent cure after mixing. Two-part Gap Fillers A: Two-part materials should be mixed to the stated mix will cure at room temperature (°C), or cure time can be ratio by volume within a Æ/-· tolerance to ensure accelerated with exposure to elevated temperatures. proper material characteristics. If light-colored streaks Q: Can I use my Gap Filler after the shelf life has expired? or marbling are present in the material, there has been A: Henkel does not advocate using Gap Filler beyond inadequate mixing. Henkel recommends purging newly the recommended shelf life and is unable to recertify tapped containers through the static mixer until a material that has expired. In order to ensure timely use uniform color is achieved. In order to ensure consistent of product, Henkel recommends a first-in-first-out (FIFO) material characteristics and performance, BERGQUIST inventory system. two-part systems are to be used with matching part A and B lot numbers. Q: How should I store my Gap Filler? A: Unless otherwise indicated on Technical Data Sheets, Q: What options are available for dispensing material two-part Gap Fillers should be stored in the original onto my application? sealed container in a climate-controlled environment A: Henkel can provide manual or pneumatic applicator guns for at or below °C and · relative humidity. If stored at product supplied in dual cartridge form. Gap Filler supplied in reduced temperatures, materials should be placed at room high volume container kits can be dispensed via automated temperature and allowed to stabilize prior to use. Unless dispensing equipment for high-speed in-line manufacturing. otherwise noted, all cartridges and tubes should be stored in Henkel and our other experienced automated dispensing Henkel-defined packaging with the nozzle end down. equipment partners can further assist our customers in creating an optimized dispensing process. For information Q: Do temperature excursions above °C affect the regarding dispensing equipment, contact your local Henkel shelf life? representative. For some materials, screen or stencil A: Short periods of time above the recommended storage application may be an option and should be evaluated on a temperature, such as during shipping, have not been shown case by case basis. to affect the material characteristics. Q: Should I be concerned about Gap Filler compatibility Q: Does Gap Filler have adhesive characteristics? with other materials in my application? A: Although Gap Fillers are not designed as structural adhesives, A: Although not common, it is possible to encounter materials when cured, they have a low level of natural tack, which will that can affect the cure of two-part Gap Fillers. A list of allow the material to adhere mildly to adjacent components. general categories of compounds that may inhibit the rate This aids in keeping the material in the interface throughout of cure or poison the curing catalyst in Gap Filler products repeated temperature cycling and eliminates pump-out from is available to help assist with material compatibility the interface. evaluation. Please contact your local Henkel representative Q: Is Gap Filler reworkable? for more details. A: In many cases, Gap Filler can be reworked. The ease of rework is highly dependent on the topography of the application as well as the coverage area. ¦ | Thermal Interface Selection Guide — GAP FILLER
Gap Filler (Two-Part)
Thermally Conductive, Liquid Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP FILLER • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Ultra-conforming, designed for fragile and low-stress applications Color / Part A Grey Grey Visual Color / Part B White White Visual • Ambient and accelerated Viscosity as Mixed (cPs)() , , ASTM D cure schedules Density (g/cc) . . ASTM D • · solids – no cure by-products Mix Ratio : : — • Excellent low and high temperature Shelf Life @ °C (months) — mechanical and chemical stability PROPERTY AS CURED Color Grey Grey Visual Hardness (Shore )() ASTM D Heat Capacity (J/g-K) . . ASTM E Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL AS CURED Dielectric Strength (V/mil) ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL AS CURED Thermal Conductivity (W/m-K) . . ASTM D CURE SCHEDULE Gap Filler is a thermally conductive, Pot Life @ °C (mins.)() — liquid gap filling material. It is supplied Cure @ °C (mins.)() - - — as a two-component, room or elevated Cure @ °C (mins.)() — temperature curing system. The material ) Brookfield RV, Heli-Path, Spindle TF @ rpm, °C. ) Thirty-second delay value Shore hardness scale. is formulated to provide a balance of ) Time for viscosity to double. cured material properties highlighted by ) Cure schedule (rheometer - time to read · cure) a low modulus and good compression set (memory). The result is a soft, thermally Typical Applications Include: conductive, form-in-place elastomer ideal • Automotive electronics for coupling “hot” electronic components • Computer and peripherals mounted on PC boards with an adjacent metal case or heat sink. Before cure, • Between any heat-generating semiconductor and a heat sink Gap Filler flows under pressure like • Telecommunications a grease. After cure, it does not pump • Thermally conductive vibration dampening from the interface as a result of thermal cycling. Unlike thermal grease, the cured Configurations Available: product is dry to the touch. Unlike cured • Supplied in cartridge and kit form gap filling materials, the liquid approach offers infinite thickness with little or no Building a Part Number Standard Options GF–– –– cc NA || example stress during displacement and eliminates NA ® Selected standard option. If not selecting a standard the need for specific pad thickness and option, insert company name, drawing number, and revision level. Section E Section C Section B Section A die-cut shapes for individual applications. Section D Cartridges: cc ® .cc, cc ® .cc Gap Filler is intended for use in Kits: cc ® .cc, or G ® gallon thermal interface applications when a Pot Life: ® minutes strong structural bond is not required. ® No spacer beads ® ." spacer beads
GF ® GAP FILLER Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — GAP FILLER |
Gap Filler SR (Two-Part)
Thermally Conductive, Liquid Gap Filler Material
Features and Benefits TYPICAL PROPERTIES OF GAP FILLER SR • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Excellent slump resistance (stays in place) Color / Part A Violet Violet Visual Color / Part B White White Visual • Ultra-conforming, with excellent wet- Viscosity, High Shear (Pa·s)() ASTM D out for low stress interface applications Density (g/cc) . . ASTM D • · solids – no cure by-products Mix Ratio : : — • Excellent low and high temperature Shelf Life @ °C (months) — mechanical and chemical stability PROPERTY AS CURED Color Violet Violet Visual Hardness (Shore )() ASTM D Heat Capacity (J/g-K) . . ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL AS CURED Dielectric Strength (V/mil) ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL AS CURED Thermal Conductivity (W/m-K) . . ASTM D CURE SCHEDULE Gap Filler SR is a two-part, thermally Pot Life @ °C (mins.)() — conductive, liquid gap filling material that Cure @ °C (hrs.)() — features exceptional slump resistance. Cure @ °C (mins.)() — ) Capillary Viscosity, Initial, , sec-. Part A and B measured separately. The mixed system will cure at room ) Thirty-second delay value Shore hardness scale. temperature and can be accelerated with ) ARES Parallel Plate Rheometer - Working life as liquid, time for modulus to double. ) ARES Parallel Plate Rheometer - Estimated time to read · cure. the addition of heat. Unlike cured thermal pad materials, a Typical Applications: liquid approach offers infinite thickness • Automotive electronics variations with little or no stress to sensitive components during assembly. • Computer and peripherals As cured, Gap Filler SR provides • Between any heat-generating semiconductor and a heat sink a soft, thermally conductive, form-in- • Telecommunications place elastomer that is ideal for fragile assemblies or for filling unique and Configurations Available: intricate air voids and gaps. • Supplied in cartridge or kit form Gap Filler SR exhibits low level Building a Part Number Standard Options natural tack characteristics and is GFSR–– –– cc NA || example intended for use in applications where a NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and strong structural bond is not required. revision level. Section E Section C Section B Section A Section D Cartridges: cc ® .cc, cc ® .cc Kits: cc ® .cc, or G ® gallon
Pot Life: ® minutes
® No spacer beads ® ." spacer beads
GFSR ® GAP FILLER SR Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — GAP FILLER
Gap Filler SF (Two-Part)
Thermally Conductive, Silicone-Free, Liquid Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP FILLER SF • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • No silicone outgassing or extraction Color / Part A Yellow Yellow Visual • Ultra-conforming, designed for fragile Color / Part B Red Red Visual and low-stress applications Viscosity as Mixed (cPs)() , , ASTM D • Ambient and accelerated Density (g/cc) . . ASTM D cure schedules Mix Ratio : : — • · solids – no cure by-products Shelf Life @ °C (months) — PROPERTY AS CURED Gap Filler SF is the thermal solution for Color Orange Orange Visual silicone-sensitive applications. The material is Hardness (Shore )() ASTM D supplied as a two-part component, curing at Heat Capacity (J/g-K) . . ASTM E room or elevated temperatures. The material Continuous Use Temp. (°F) / (°C) - to - to — exhibits low modulus properties, then cures ELECTRICAL AS CURED to a soft, flexible elastomer, helping reduce Dielectric Strength (V/mil) ASTM D thermal cycling stresses during operation and Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D virtually eliminating stress during assembly of Flame Rating V-O V-O UL low-stress applications. THERMAL AS CURED The two components are colored to assist as a Thermal Conductivity (W/m-K) . . ASTM D mix indicator (: by volume). The mixed system CURE SCHEDULE will cure at ambient temperature. Unlike cured Pot Life @ °C() mins. ( hrs.) mins. ( hrs.) — thermal pad materials, the liquid approach Cure @ °C (hrs.)() — offers infinite thickness variations with little or Cure @ °C (mins.)() — no stress during assembly displacement. Gap ) Brookfield RV, Heli-Path, Spindle TF @ rpm, °C. ) Thirty-second delay value Shore hardness scale. Filler SF, although exhibiting some natural ) Time for viscosity to double. ) Cure schedule (rheometer - time to read · cure). tack characteristics, is not intended for use in thermal interface applications requiring a mechanical structural bond. Typical Applications Include: • Silicone-sensitive optic components Application • Silicone-sensitive electronics Gap Filler SF can be mixed and dispensed using dual-tube cartridge packs with static mixers • Filling various gaps between heat-generating devices to heat sinks and housings and manual or pneumatic gun or high volume • Mechanical switching relay mixing and dispensing equipment (application of • Hard disk assemblies heat may be used to reduce viscosity). • Dielectric for bare-leaded devices TEMPERATURE DEPENDENCE OF VISCOSITY Configurations Available: The viscosity of the Gap Filler SF material is temperature dependent. The table below provides • Supplied in cartridge or kit form the multiplication factor to obtain viscosity at various temperatures. To obtain the viscosity at a given temperature, look up the multiplication factor at that Building a Part Number Standard Options temperature and multiply the corresponding viscosity GFSF–– ––cc NA || example at °C. NA ® Selected standard option. If not selecting a standard Temperature Multiplication Factor option, insert company name, drawing number, and °C Part A Part B revision level. Section E Section C Section B Section A . . Section D Cartridges: cc ® .cc . . Kits: cc ® .cc, or G ® gallon . . . . Pot Life: ® minutes . . ® No spacer beads Example - Viscosity of Part A @ °: ® ." spacer beads Viscosity of Part A @ °C is , cPs. GFSF ® GAP FILLER SF Material The multiplication factor for Part A @ °C is .. Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Therefore: (,) x (.) ® , cPs. Thermal Interface Selection Guide — GAP FILLER |
Gap Filler SL (Two-Part)
Thermally Conductive, Self-Leveling, Liquid Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP FILLER SL • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Self-leveling Color / Part A Yellow Yellow Visual Color / Part B White White Visual • Very soft Viscosity as Mixed (cPs)() , , ASTM D • Vibration dampening Density (g/cc) . . ASTM D Mix Ratio : : — Shelf Life @ °C (months)() — PROPERTY AS CURED Color Yellow Yellow Visual Hardness (Shore )() ASTM D Heat Capacity (J/g-K) . . ASTM D
Siloxane Content, ∑D- D (ppm) — Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL AS CURED Dielectric Strength (V/mil) ASTM D Dielectric Constant ( Hz) . . ASTM D Gap Filler ÅÉÀÀSL is a two-part, thermally Volume Resistivity (Ohm-meter) ASTM D conductive, silicone based, liquid gap Flame Rating V-O V-O UL filling material. This material has an THERMAL AS CURED extremely low viscosity to enable self- Thermal Conductivity (W/m-K) . . ASTM D leveling and filling of voids resulting in CURE SCHEDULE excellent thermal transfer. Working Time @ °C (min) () — Cure @ °C (hrs.)() — Unlike cured thermal pad materials, a Cure @ °C (mins.)() — liquid approach offers infinite thickness () Brookfield Rheometer, Part A and Part B mixed : ratio. variations with little or no stress to the () See application note for storage and handling recommendations. () Thirty second delay value, Shore scale. sensitive components during assembly. () Parallel Plate Rheometer, see reactivity application note. As cured, Gap Filler SL provides a soft, thermally conductive, form-in- Typical Applications Include: place elastomer that is ideal for fragile • Automotive electronics • Lighting assemblies and filling unique and • Telecommunications • Power Supplies intricate gaps. • Encapsulating semiconductors and magnetic components with heatsink Gap Filler SL exhibits low level • Silicone sensitive applications natural tack characteristics and is intended for use in applications where a Configurations Available: strong structural bond is not required. • Available for order in cc kits and gallon pail formats Dispensing Building a Part Number Standard Options Due to its low viscosity nature, Gap GF1400SL–– 00 120–– 1200cc NA NA = Selected standard option. If not selecting a standard Filler SL will settle upon storage. option, insert company name, drawing number, and Each container must be thoroughly revision level. Section E Section B Section A Section C Section D mixed before combining Part A and Part Kits: 1200cc = 1200.0cc, or 7G = 7 gallon B via static mixer and dispensing into Working Time: 120 = 120 minutes application. 00 = No spacer beads
GF1400SL = Gap Filler 1400SL Material Note: To To build build a a part part number, number , govisit to ourwww.bergquistcompany.com/Part_Number_Builder.php. website at www.bergquistcompany.com. | Thermal Interface Selection Guide — GAP FILLER
Gap Filler (Two-Part)
Thermally Conductive Liquid Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP FILLER • Thermal conductivity: . W/mK PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Optimized shear thinning characteristics for ease of dispensing Color / Part A Yellow Yellow Visual Color / Part B White White Visual • Excellent slump resistance Viscosity, High Shear (Pa·s)() ASTM D (stays in place) Density (g/cc) . . ASTM D • Ultra-conforming with excellent wet- Mix Ratio : : — out for low stress interface applications Shelf Life @ °C (months) — • · solids – no cure by-products PROPERTY AS CURED
• Excellent low and high temperature Color Yellow Visual mechanical and chemical stability Yellow Hardness (Shore )() ASTM D Heat Capacity (J/g-K) . . ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL AS CURED Dielectric Strength (V/mil) ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL AS CURED Thermal Conductivity (W/m-K) . . ASTM D CURE SCHEDULE SCHEDULE SCHEDULE Pot Life @ °C() mins. mins. ( hrs.) — Gap Filler is a two-part, high Cure @ °C() hrs. days — performance, thermally conductive, Cure @ °C() mins. mins. — liquid gap filling material, which ) Capillary viscosity, initial, sec-. Part A and B measured separately. ) Thirty-second delay value Shore hardness scale. features exceptional slump resistance ) Parallel Plate Rheometer - Working life as liquid. ) Parallel Plate Rheometer - Estimated time to read · cure. and high shear thinning characteristics for optimized consistency and control Typical Applications Include: during dispensing. The mixed system • Automotive electronics will cure at room temperature and can be accelerated with the addition of heat. • Computer and peripherals Unlike cured thermal pad materials, a • Between any heat generating semiconductor and a heat sink liquid approach offers infinite thickness • Telecommunications variations with little or no stress to the sensitive components during assembly. Configurations Available: Gap Filler exhibits low level natural • Supplied in cartridge or kit form tack characteristics and is intended • With or without glass beads for use in applications where a strong structural bond is not required. As cured, Building a Part Number Standard Options Gap Filler provides a soft, thermally GF–– –– G NA || example NA ® Selected standard option. If not selecting a standard conductive, form-in-place elastomer that option, insert company name, drawing number, and is ideal for fragile assemblies and filling revision level. Section E Section C Section B Section A unique and intricate air voids and gaps. Section D Cartridges: cc ® .cc, cc ® .cc Kits: cc ® .cc, G ® gallon
Pot Life: ® min, ® min
® No spacer beads, ® ." spacer beads, ® ." spacer beads
GF ® GAP FILLER (Two-Part) Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — GAP FILLER |
Gap Filler LV (Two-Part)
Thermally Conductive, Liquid Gap Filler Material
Features and Benefits TYPICAL PROPERTIES OF GAP FILLER LV • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Low volatility for silicone-sensitive applications Color / Part A Yellow Yellow Visual Color / Part B White White Visual • Ultra-conforming, with excellent Viscosity, High Shear (Pa·s)() ASTM D wet-out Density (g/cc) . . ASTM D • · solids — no cure by-products Mix Ratio : : — • Excellent low and high temperature Shelf Life @ °C (months) — chemical and mechanical stability PROPERTY AS CURED Color Yellow Yellow Visual Hardness (Shore )() ASTM D Heat Capacity (J/g-K) . . ASTM D Siloxane Content, SD-D (ppm) Ê Ê — Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL AS CURED Dielectric Strength (V/mil) ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL AS CURED Thermal Conductivity (W/m-K) . . ASTM D Gap Filler LV is a two-part, CURE SCHEDULE high performance, thermally conductive, Working Time @ °C() mins. ( hrs.) mins. ( hrs.) — liquid gap filling material. This material Cure @ °C (hrs.)() — () offers the high temperature resistance Cure @ °C (mins.) — ) Capillary Viscosity, /sec, Part A and B measured separately. and low modulus of a silicone material ) Thirty-second delay value Shore hardness scale. with significantly lower levels of silicone ) Parallel plate rheometer, see reactivity application note. outgassing for use in silicone-sensitive applications. Typical Applications: The mixed material will cure at room • Lighting temperature and can be accelerated • Automotive electronics with the addition of heat. As cured, • Silicone sensitive applications Gap Filler LV provides a soft, thermally conductive, form-in-place Configurations Available: elastomer that is ideal for fragile • Supplied in cartridge or kit form assemblies or for filling unique and intricate air voids and gaps. Building a Part Number Standard Options GFLV–– –– cc NA || example Liquid dispensed thermal materials NA ® Selected standard option. If not selecting a standard offer infinite thickness variations and option, insert company name, drawing number, and revision level.
impart little to no stress on sensitive Section E Section C Section B Section A Section D Cartridges: cc ® .cc, cc ® .cc components during assembly. Gap Filler Kits: cc ® .cc, or G ® gallon
LV exhibits low level natural tack Pot Life: ® minutes characteristics and is intended for use ® No spacer beads ® ." spacer beads in applications where a strong structural ® ." spacer beads bond is not required. GFLV ® GAP FILLER LV Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — GAP FILLER
Gap Filler (Two-Part)
Thermally Conductive, Liquid Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP FILLER • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Ultra-conforming, designed for fragile and low-stress applications Color / Part A Pink Pink Visual Color / Part B White White — • Ambient and accelerated Viscosity as Mixed (cPs)() , , ASTM D cure schedules Density (g/cc) . . ASTM D • · solids – no cure by-products Mix Ratio : : — • Excellent low and high temperature Shelf Life @ °C (months) — mechanical and chemical stability PROPERTY AS CURED Color Pink Pink Visual Hardness (Shore )() ASTM D Heat Capacity (J/g-K) . . ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL AS CURED Dielectric Strength (V/mil) ASTM D Dielectric Constant (, Hz) ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL AS CURED Thermal Conductivity (W/m-K) . . ASTM D CURE SCHEDULE SCHEDULE SCHEDULE SCHEDULE Gap Filler is a high performance, Pot Life @ °C() mins. mins. mins. ( hr) thermally conductive, liquid gap-filling Cure @ °C() - hrs. - hrs. days material supplied as a two-component, Cure @ °C() mins. mins. hr ) Brookfield RV, Heli-Path, Spindle TF @ rpm, °C. room or elevated temperature curing ) Thirty-second delay value Shore hardness scale. system. The material provides a balance ) Time for viscosity to double. ) Cure schedule (rheometer - time to read · cure). of cured material properties and good compression set (memory). The result is a soft, form-in-place elastomer ideal for Typical Applications Include: coupling “hot” electronic components • Automotive electronics mounted on PC boards with an adjacent • Computer and peripherals metal case or heat sink. Before cure, it • Between any heat-generating semiconductor and a heat sink flows under pressure like grease. After • Telecommunications cure, it won’t pump from the interface as a result of thermal cycling and is dry to • Thermally conductive vibration dampening the touch. Configurations Available: Unlike cured gap filling materials, • Supplied in cartridge or kit form the liquid approach offers infinite thickness with little or no stress Building a Part Number Standard Options during displacement and assembly. It GF–– –– G NA || example also eliminates the need for specific NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and pad thickness and die-cut shapes for revision level. Section E Section C Section B Section A individual applications. Section D Cartridges: cc ® .cc, cc ® .cc Kits: cc ® .cc, or G ® gallon Gap Filler is intended for use in Pot Life: ® minutes, ® minutes ® minutes thermal interface applications when a ® No spacer beads strong structural bond is not required. ® ." spacer beads GF ® GAP FILLER Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — GAP FILLER |
Gap Filler LV (Two-Part)
Thermally Conductive, Liquid Gap Filler Material
Features and Benefits TYPICAL PROPERTIES OF GAP FILLER LV • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Low volatility for outgassing sensitive applications Color / Part A Blue Blue Visual Color / Part B White White Visual • Ultra-conforming with excellent wet-out Viscosity, High Shear (Pa·s)() ASTM D for low stress interfaces on applications Density (g/cc) . . ASTM D • · solids - no cure by-products Mix Ratio : : — Shelf Life @ °C (months) — PROPERTY AS CURED Color Lite Blue Lite Blue Visual Hardness (Shore )() ASTM D Heat Capacity (J/g-K) . . ASTM D
Siloxane Content, ∑D- D (ppm) — Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL AS CURED Dielectric Strength (V/mil) ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL Gap Filler ÁÂÀÀLV is a two-part, high THERMAL AS CURED thermal conductivity, liquid gap filling Thermal Conductivity (W/m-K) . . ASTM D material. This material offers the CURE SCHEDULE mechanical property benefits of a silicone Working Time @ °C() mins. ( hrs.) mins. ( hrs.) — material with the additional feature of Cure @ °C (hrs.)() — low outgassing. Cure @ °C (mins.)() —
() Capillary Viscosity, ,/sec., Part A and B measured separately. The mixed material will cure at room () Thirty-second delay value Shore hardness scale. () Parallel plate rheometer, see reactivity application note. temperature or can be accelerated with the addition of heat. Typical Applications: The liquid approach offers infinite Lighting thickness variations with little to no stress • to sensitive components during assembly. • Automotive in-cabin electronics As cured, Gap Filler LV provides a • Medical electronics soft, form-in-place elastomer that is ideal • Industrial controls for fragile assemblies or for filling • Optics intricate air voids. Configurations Available: • Supplied in cartridge or kit form Building a Part Number Standard Options GF3500LV0––0 240–– 50cc NA NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section B Section A Section C Section D Cartridges: 50cc = 50.0cc, 400cc = 400.0cc Kits: 1200cc = 1200.0cc, or 10G = 10 gallon
Working Time: 240 = 240 minutes 00 = No spacer beads 07 = 0.007" spacer beads 10 = 0.010" spacer beads GF3500LV = Gap Filler 3500LV Material Note:Note: To To build build a a part part number number,, visit go toour www.bergquistcompany.com/Part_Number_Builder.php. website at www.bergquistcompany.com. | Thermal Interface Selection Guide — GAP FILLER
Gap Filler S (Two-Part)
Thermally Conductive Liquid Gap Filling Material
Features and Benefits TYPICAL PROPERTIES OF GAP FILLER S • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Thixotropic nature makes it easy to dispense Color / Part A White White Visual Color / Part B Blue Blue Visual • Two-part formulation for easy storage Viscosity as Mixed (cPs)() , , ASTM D • Ultra-conforming – designed for fragile Density (g/cc) . . ASTM D and low stress applications Mix Ratio : : — • Ambient or accelerated cure schedules Shelf Life @ °C (months) — PROPERTY AS CURED Color Blue Blue Visual Hardness (Shore )() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL AS CURED Dielectric Strength (V/mil) ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL AS CURED Thermal Conductivity (W/m-K) . . ASTM D CURE SCHEDULE Gap Filler S is a two-component, Pot Life @ °C (mins.)() — liquid gap-filling material, cured at either Cure @ °C (hrs.)() — () room or elevated temperature, featuring Cure @ °C (mins.) — ) Brookfield RV, Heli-Path, Spindle TF @ rpm, °C. ultra-high thermal performance and ) Thirty-second delay value Shore hardness scale. ) Time for viscosity to double. outstanding softness. Prior to curing, ) Cure schedule (rheometer - time to read · cure). the material maintains good thixotropic characteristics as well as low viscosity. The result is a gel-like liquid material Typical Applications Include: designed to fill air gaps and voids yet flow • Automotive electronics when acted upon by an external force • Discrete components to housing (e.g., dispensing or assembly process). • PCBA to housing The material is an excellent solution for • Fiber optic telecommunications equipment interfacing fragile components with high topography and/or stack-up tolerances Configurations Available: to a universal heat sink or housing. • Supplied in cartridge or kit form Once cured, it remains a low modulus elastomer designed to assist in relieving Building a Part Number Standard Options CTE stresses during thermal cycling yet GF S cc NA || example maintain enough modulus to prevent NA Selected standard option. If not selecting a standard option, insert company name, drawing number, and pump-out from the interface. revision level. Section E Section C Section B Section A Gap Filler S will lightly adhere Section D Cartridges: cc .cc, cc .cc to surfaces, thus improving surface Kits: cc .cc, or G gallon area contact. Gap Filler S is not Pot Life: minutes No spacer beads designed to be a structural adhesive. ." spacer beads
GP S GAP PAD S Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — GAP FILLER | ¥
Gap Filler (Two-Part)
Thermally Conductive, Liquid Gap Filler Material
Features and Benefits TYPICAL PROPERTIES OF GAP FILLER • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Extended working time for manufacturing flexibility Color / Part A Blue Blue Visual Color / Part B White White Visual • Ultra-conforming with excellent Viscosity, High Shear (Pa·s)() ASTM D wet-out Density (g/cc) . . ASTM D • · solids – no cure by-products Mix Ratio : : — • Excellent low and high temperature Shelf Life @ °C (months) — chemical and mechanical stability PROPERTY AS CURED Color Blue Blue Visual Hardness (Shore )() ASTM D Heat Capacity (J/g-K) . . ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL AS CURED Dielectric Strength (V/mil) ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL AS CURED Thermal Conductivity (W/m-K) . . ASTM D CURE SCHEDULE Gap Filler is a two-part, high Working Time @ °C() mins. ( hrs.) mins. ( hrs.) — performance, thermally conductive, liquid Cure @ °C (hrs.)() — gap-filling material. The mixed material Cure @ °C (mins.)() — ) Capillary Viscosity, ,/sec., Part A and B measured separately. will cure at room temperature and can be ) Thirty-second delay value Shore hardness scale. accelerated with the addition of heat. ) Parallel plate rheometer, see reactivity application note. Gap Filler offers an extended working time to allow greater flexibility Typical Applications: in the customer’s assembly process. • Automotive electronics Liquid dispensed thermal materials offer • Computer and peripherals infinite thickness variations and impart • Between any heat-generating semiconductor and a heat sink little to no stress on sensitive components • Telecommunications during assembly. Gap Filler exhibits low level natural tack characteristics and Configurations Available: is intended for use in applications where • Supplied in cartridge or kit form a strong structural bond is not required. As cured, Gap Filler provides a Building a Part Number Standard Options soft, thermally conductive, form-in- GF–– ––cc NA || example NA ® Selected standard option. If not selecting a standard place elastomer that is ideal for fragile option, insert company name, drawing number, and assemblies or for filling unique and revision level. Section E Section C Section B Section A Section D Cartridges: cc ® .cc, cc ® .cc intricate air voids and gaps. Kits: cc ® .cc, or G ® gallon
Pot Life: ® minutes ® No spacer beads ® ." spacer beads ® ." spacer beads GF ® GAP FILLER Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. ¦ | Thermal Interface Selection Guide — TIC
Thermal Interface Compounds (One-Part)
Thermally Conductive Grease Compounds The BERGQUIST line of thermally conductive thermal interface impedance. TIC products are designed for use between a compounds (TIC) will flow under assembly pressure to wet-out high-end computer processor and a heat sink or other high the thermal interface surfaces and produce very low thermal watt density applications.
Features Benefits Options Applications The TIC portfolio has TIC products are ideal for high TIC products can be obtained TICs have a variety of diverse thermal and watt density applications. with application-specific applications such as: electrical characteristics. Primary benefits include: options such as: • CPU Key criteria when selecting • Low interfacial resistance • Containers • GPU TIC products include: • Low thermal impedance • IGBT • Viscosity • Resist dripping • High power density • Volume resistivity • Ideally suited to screen applications • Thermal conductivity printing applications • Thermal performance • No post “cure” conditioning required • Filler size Comparison Data and FAQs
Q: What is the best fastening method for a TIC interface? A: A constant-pressure fastener is preferred when using TIC for high performance applications. The constant pressure from a clip or spring washer will ensure adequate pressure is being applied with varying bond line thickness. Q: How should the TIC be applied? A: Screenprinting the TIC is a fast, low-cost method that delivers a consistent and accurate amount of material on each application. Alternate methods include stenciling, pin transfer and needle dispensing. Q: Will the grease stay in the interface? A: All the TIC materials were specifically designed to resist pump-out of the interface, even after many hours of thermal and power cycling. Thermal Interface Selection Guide — TIC |
TIC A
High Performance, Value Compound for High-End Computer Processors
Features and Benefits TYPICAL PROPERTIES OF TIC A • High thermal performance: .°C/W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Good screenability Color Grey Grey Visual Density (g/cc) . . ASTM D • Room temperature storage Continuous Use Temp. (°F) / (°C) — • No post “cure” required ELECTRICAL • Exceptional value Electrical Resistivity (Ohmmeter)() N/A N/A ASTM D THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W)() . . . . .
) The compound contains an electrically conductive filler surrounded by electrically nonconductive resin. ) TO- performance data is provided as a reference to compare material thermal performance.
Assembly – No Post-Screen Cure TIC A has good screenability. No solvent is used to reduce the viscosity, so no post “cure” conditioning is required.
TIC A is a high performance, Application Cleanliness thermally conductive compound . Pre-clean heat sink and component interface with isopropyl alcohol prior intended for use as a thermal interface to assembly or repair. Ensure heat sink is dry before applying TIC A. material between a high-end computer processor and a heat sink. Other high Application Methods watt density applications will also . Dispense and/or screenprint TIC A compound onto the processor or heat sink benefit from the extremely low thermal surface like thermal grease (see a Henkel Representative for application information). impedance of TIC A. . Assemble the processor and heat sink with spring clips or TIC A compound wets-out the constant-pressure fasteners. thermal interface surfaces and flows to produce the lowest thermal impedance. Typical Applications Include: The compound requires pressure of the • High performance CPUs assembly to cause flow. The TIC A • High performance GPUs compound will resist dripping. Building a Part Number Standard Options For microprocessor applications, TICA cc NA || example traditional screw fastening or spring NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and clamping methods will provide revision level. Section E Section C Section B Section A adequate force to optimize the thermal Section D Containers: cc ® .cc, cc ® .cc, cc ® .cc performance of TIC A. Cartridge: cc ® .cc ® No options An optimized application would utilize ® No options the minimum volume of TIC A material necessary to ensure complete TICA ® Thermal Interface Compound A wet-out of both mechanical interfaces. Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — TIC
TIC
High Performance Thermal Interface Compound for Copper-Based Heat Sinks
Features and Benefits TYPICAL PROPERTIES OF TIC • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Exceptional thermal performance: .°C/W (@ psi) Color Grey Grey Visual Density (g/cc) . . ASTM D Continuous Use Temp. (°F) / (°C) — ELECTRICAL Electrical Resistivity (Ohmmeter)() N/A N/A ASTM D THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W)() . . . . .
) The compound contains an electrically conductive filler surrounded by electrically nonconductive resin. ) TO- performance data is provided as a reference to compare material thermal performance.
TIC is a thermally conductive grease Application Methods . Pre-clean heat sink and component interface with isopropyl alcohol prior to compound designed for use as a thermal assembly or repair. Ensure heat sink is dry before applying TIC . interface material between a computer processor and a copper-based heat sink. . Dispense TIC compound onto the processor or heat sink surface like Other high watt density applications will thermal grease. benefit from the extremely low thermal . Assemble the processor and heat sink with clip or constant-pressure fasteners. impedance of TIC . TIC compound wets-out the thermal Typical Applications Include: interface surfaces and flows to produce • High performance computer processors (traditional screw fastening or clamping low thermal impedance. The compound methods will provide adequate force to optimize the thermal performance of requires pressure of the assembly to cause TIC ) flow. TIC compound will not drip. • High watt density applications where the lowest thermal resistance interface is required For a typical . in. x . in. application at . in. thick, Henkel estimates Building a Part Number Standard Options approximately . ml (cc) of TIC . TIC cc NA || example NA Selected standard option. If not selecting a standard Although Henkel estimates a . option, insert company name, drawing number, and revision level. Section E Section C Section B
ml (cc) volumetric requirement for a Section A Section D . in. x . in. component interface, Containers: cc . cc, cc . cc, cc . cc dispensed at a thickness of . in., No options
Henkel also recognizes that an optimized No options application would use the minimum volume of TIC material necessary TIC Thermal Interface Compound to ensure complete wet-out of both Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. mechanical interfaces. Thermal Interface Selection Guide — TIC |
LIQUI FORM
Thermally Conductive, One-Part, Liquid Formable Material
Features and Benefits TYPICAL PROPERTIES OF LIQUI-FORM • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Applies very low force on components during assembly Color Grey Grey Visual Low Shear Viscosity (Pa·s) @ . sec-() , , ASTM D • Low volumetric expansion High Shear Viscosity (Pa·s) @ sec-() ASTM D Volumetric Expansion • Excellent chemical and mechanical ASTM E modified stability even at higher temperatures ( to °C), ppm/K • No curing required Outgassing, · Total Mass Loss . . ASTM E Density (g/cc) . . ASTM D • Stable viscosity in storage and in Continuous Use Temp. (°F) / (°C) - to - to — the application Shelf Life at °C (Months) — ELECTRICAL Dielectric Strength (V/mil)/(V/mm) , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (PSI) Thermal Impedance (°C-in./W)() . . .
) Parallel Plate Rheometer, See Product Management Liqui-Form Application Note on our website under Liquid Thermal Interface Materials. ) Capillary Rheometer, See Product Management for Viscosity and Dispensing Application Note. ) The ASTM D test fixture was used. The recorded values include the interfacial thermal resistance. The values are provided for reference only. Actual LIQUI-FORM is a high thermal application performance is directly related to the surface roughness, flatness and pressure applied. conductivity liquid formable material designed for demanding applications Typical Applications Include: requiring a balance between dispensability, low component stresses • Bare die to heat spreader lid during assembly and ease of rework. • Filling various gaps between heat-generating devices to heat sinks and housings • Devices requiring low assembly pressure LIQUI-FORM is a highly conformable, shear-thinning material • BGA, PGA, PPGA which requires no curing, mixing or Configurations Available: refrigeration. Its unique formulation assures excellent thermal performance, • Supplied in cc or cc cartridges or gallon pails low applied stress and reliable long-term Building a Part Number Standard Options performance. LIQUI-FORM is LF–– –– G NA || example thixotropic and has a natural tack, NA ® Selected standard option. If not selecting a standard ensuring it forms around the component option, insert company name, drawing number, and revision level. Section E Section C Section B Section A and stays in place in the application. Section D Cartridges: cc ® .cc, cc ® .cc Pails: G ® gallon
: No options
® No spacer beads ® ." spacer beads
LF ® LIQUI-FORM Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — TIC
LIQUI FORM
Thermally Conductive, One-Part, Liquid Formable Gel Material
Features and Benefits TYPICAL PROPERTIES OF LIQUI-FORM • Thermal Conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Dispensable pre-cured gel • Color Gray Gray Visual • Stable viscosity in storage and in Dispense Rate (Grams/min)() Henkel Test the application Volumetric Expansion ( to °C), ppm/K ASTM E modified • Excellent chemical stability and Outgassing, · Total Mass Loss . . ASTM E mechanical stability Density (g/cc) . . ASTM D Continuous Use Temp (°F) / (°C) - to - to — Shelf Life at °C (Months) — ELECTRICAL Dielectric Strength (V/mil)/(V/mm) , ASTM D Dielectric Constant ( Hz) . . ASTM D Volume Resistivity (Ohm-meter) ASTM D Flame Rating V-O V-O U.L. THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (PSI) LIQUI-FORM is a high conductivity Thermal Impedance(°C-in/W)() . . . gel thermal interface material designed for () cc syringe, psi ( kPa), ." orifice no attachment. demanding applications that require a () The ASTM D test fixture was utilized. The recorded values include the interfacial thermal resistance. The values are provided for reference only. Actual balance between dispensability and low application performance is directly related to the surface roughness, flatness and pressure applied. component stress during assembly and also in the application. Typical Applications Include: LIQUI-FORM is a one-part, highly • Handheld devices conformable gel with thixotropic properties. • Bare die to heat spreader lid The material is precured and requires no Filling various gaps between heat-generating devices to heat sinks and housings curing, mixing or refrigeration. It’s unique • formulation assures excellent thermal • Devices requiring low assembly pressure performance, low applied stress and • High value assemblies with rework reliable long-term performance. • BGA, PGA, PPGA LIQUI-FORM is thixotropic with a Configurations Available: natural tack ensuring it will stay in place within the application. • Supplied in 30cc, 150cc, 300cc, 600cc cartridges or 4.3 gallon pails Building a Part Number Standard Options LF3500– 00 –– 00 4.3G – NA NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section B Section A Section C Section D Cartridges: 30cc = 30.0cc, 150cc = 150.0cc, 300cc = 300.0cc Pails: 4.3G = 4.3 gallon
00: No options
00 = No spacer beads
LF3500 = LIQUI-FORM 3500 Material Note: To build a part number, visit our website at www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — HI-FLOW |
HI FLOW Phase Change Interface Materials
Solutions-Driven Thermal Management Products for Electronic Devices Use phase change materials for excellent thermal performance without the mess of grease. HI-FLOW phase change materials are an excellent replacement The HI-FLOW family of phase change thermal interface materials for grease as a thermal interface between a CPU or power device covers a wide range of applications. Henkel’s BERGQUIST brand and a heat sink. The materials change from a solid at specific offers leading thermal management solutions and we work phase change temperatures and flow to assure a total wet-out of closely with customers to ensure that the proper HI FLOW the interface without overflow. The result is a thermal interface material is specified. comparable to grease, without the mess, contamination and hassle.
Features Benefits Options Applications HI FLOW handles like Using HI FLOW materials The broad HI FLOW family HI FLOW materials are suited BERGQUIST SIL PAD materials instead of grease can offers a variety of choices for consumer and industrial at room temperature, but flows save time and money to meet the customer’s electronics, automotive, like grease at its designed without sacrificing thermal performance, handling and medical, aerospace and phase change temperature. performance. Here are some process needs. Some of the telecommunications The following is an overview of other benefits: choices include: applications such as: the important features shared • No mess – thixotropic • Some HI-FLOW materials are • UPS and SMPS AC/DC, DC/ by the HI FLOW family: characteristics of the available with or DC or linear power supplies materials keep it from without adhesive • Comparable thermal • Between a CPU and flowing out of the interface performance to grease in • Aluminum carrier for heat sink most applications • Easier handling – applications not requiring • Power conversion devices tackified or tack-free at electrical isolation • Thermally conductive phase room temperature • Fractional and integral change compound • Film or fiberglass carrier for motor control • No protective liner required electrical isolation • Aluminum, film or fiberglass • Leaded, surface mount and carriers and non-reinforced • High thermal performance • Dry, non-reinforced material power module assemblies versions helps ensure CPU reliability • Tackified or tack-free at • Low volatility • Do not attract contaminants room temperature • Easy to handle and apply • Easier material handling and • Tabbed parts, die-cut parts, in the manufacturing shipping sheets or bulk rolls environment • Simplified application • Adhesive specifically for • Tackified or tack-free at process cold application without room temperature preheating heat sink We produce thousands of specials. Tooling charges vary depending on the complexity of the part. | Thermal Interface Selection Guide — HI-FLOW
HI FLOW Comparison Data
TO- Thermal Performance Isolating HI-FLOW Series p to P Grease Replacement Materials . HI-FLOW HI-FLOW P. . HI-FLOW P. HI-FLOW P.
W) HI-FLOW P. . HI-FLOW P. HI-FLOW P. . . . . . . . Thermal Performance (°C/ Thermal Performance . Interface Pressure (psi)
Non-Isolating HI-FLOW Series Grease Replacement Materials . HI-FLOW
W) .
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.
. Thermal Performance (°C/ Thermal Performance . Interface Pressure (psi)
Non-Isolating HI-FLOW to Grease Replacement Materials . HI-FLOW FT . HI-FLOW F-AC
W) HI-FLOW UT . HI-FLOW UT .
.
.
.
. Thermal Performance (°C/ Thermal Performance .
.
Interface Pressure (psi) Thermal Interface Selection Guide — HI-FLOW |
Frequently Asked Questions
Q: How is the ASTM D ¦ test modified to characterize bare aluminum, mild soap and water wash cleaning processes phase change thermal performance? are typically used to eliminate machine oils and debris. A: ASTM classifies a phase change as a Type , viscous liquid Q: Is HIFLOW material reworkable? that exhibits unlimited deformation when a stress is applied. A: If the material has not gone through phase change, the Henkel uses test equipment that is designed to meet ASTM material will readily release from the device surface. For D specifications for Type , which requires a shim or this situation, the HI FLOW material will not likely have mechanical stop to precisely control the thickness. The to be replaced. phase change material is conditioned at °C over the stated phase change temperature. Understanding that time is If the material has gone through the phase change, it will also a key variable for material flow, the over-temperature adhere very well to both surfaces. In this case, Henkel condition is limited to minutes and then allowed to cool, suggests warming the heat sink to soften the HI FLOW prior to initiating the actual test at the given pressure. The compound for easier removal from the processor. Replace -minute time has been demonstrated to be an acceptable with a new piece of HI FLOW material. time period for the thermal mass inherent in the test setup. Q: What is meant by “easy to handle” in manufacturing? Note: Actual application testing may require more or less A: Insulated HI FLOW products are manufactured with inner time to condition, depending upon the heat transfer and film support. This film stiffens the material, allowing parts to associated thermal mass. The performance values are be more readily die-cut as well as making the material easier recorded and published at , , , and psi to to handle in manual or automated assembly. give the designer a broad-based understanding of HI FLOW material’s performance. Q: What is meant by “tack-free” and why is this important? A: Many HI FLOW materials have no surface tack at room Q: What is the minimum pressure required to optimize the temperature. The softer materials will pick up dirt more thermal performance of the HIFLOW material? readily. Softer resins are more difficult to clean if any dirt A: Upon achieving phase change temperature (e.g., pre- is on the surface. If you try to rub the dirt away, the dirt is conditioning), Henkel has demonstrated that psi easily pushed into the soft phase change materials. HI FLOW provides adequate pressure to achieve exceptional thermal coatings are typically hard at room temperature rendering performance. Henkel continues to research lower pressure them easier to clean off without embedding dirt. wet-out characteristics in an effort to minimize interfacial losses associated with ultra-thin material interfaces. Q: What does “more scratch resistance” mean on HIFLOW ? Q: Will the HIFLOW replace a mechanical fastener? A: HI FLOW does not require a protective film during A: Mechanical fasteners are required. Henkel recommends the shipment. HI FLOW has a higher phase change temperature use of spring clips to maintain consistent pressure over time. and remains hard to a higher temperature. The HI FLOW Q: Can I use screw-mount devices with HIFLOW material? material is harder and is not as easy to scratch or dent in A: HI FLOW works best with a clip or spring washer-mounted shipping and handling. assembly. The continuous force applied by these devices Q: Why is HIFLOW phase change temperature °C? allows the HI FLOW material to flow and reduce the cross A: The °C phase change temperature was selected for two sectional gap. Henkel suggests that design engineers evaluate reasons. First, it was a low enough temperature for the phase whether a screw-mount assembly will have acceptable change to occur in applications. Second, it would not phase performance. See TO- Technical Note. change in transport. Studies show that shipping containers Q: Is the adhesive in HIFLOW F-AC repositionable? can reach °C in domestic and international shipments. The A: The adhesive in the current construction does adhere more higher phase change temperature eliminates the possibility to the heat sink aluminum than to the HI FLOW material. of a product being ruined in shipment. We offer a standard There is the potential that the adhesive will be removed by line of HI FLOW and series products with °C phase the heat sink surface when it is removed to reposition on change for those customers wanting the lower phase change the heat sink. Time and/or pressure will increase the bond to temperature. the aluminum, increasing the potential for the adhesive to Q: In which applications should I avoid using HIFLOW? adhere to the heat sink. A: Avoid using HI FLOW in applications in which the device will Q: Is there any surface preparation required before applying not reach operation at or above phase change temperature. the adhesive-backed HIFLOW to the heat sink? Also avoid applications in which the operating temperature A: Standard electronics industry cleaning procedures apply. exceeds the maximum recommended operating temperature Remove dirt or other debris. Best results are attained when the of the compound. HI FLOW material is applied to a heat sink at a temperature of ° Æ/- °C. If the heat sink has been surface treated (e.g., anodized or chromated), it is typically ready for assembly. For | Thermal Interface Selection Guide — HI-FLOW
HI FLOW
Phase Change Coated Aluminum
Features and Benefits TYPICAL PROPERTIES OF HI-FLOW • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Used where electrical isolation Color Dark Grey Dark Grey Visual is not required Reinforcement Carrier Aluminum Aluminum — Thickness (in.) / (mm) . . ASTM D • Low volatility – less than · Continuous Use Temp. (°F) / (°C) — • Easy to handle in the Phase Change Temp. (°F) / (°C) ASTM D manufacturing environment ELECTRICAL • Flows but doesn’t run like grease Dielectric Constant (, (Hz) . . ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K)() . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . .
) This is the measured thermal conductivity of the HI FLOW coating. It represents one conducting layer in a three-layer laminate. The HI FLOW coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D. Please contact Henkel if additional specifications are required. ) The ASTM D test fixture was used and the test sample was conditioned at °C prior to test. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
HI FLOW is a phase change material Typical Applications Include: coated on both sides of an aluminum • Power semiconductors substrate. It is designed specifically to • Microprocessors mounted on a heat sink replace grease as a thermal interface, eliminating the mess, contamination and • Power conversion modules difficult handling associated with grease. • Spring or clip-mount applications where thermal grease is used HI-FLOW is tack-free and scratch- resistant at room temperature, and does Configurations Available: not require a protective liner in shipment • Sheet form, die-cut parts and roll form when attached to a heat sink. • With or without pressure sensitive adhesive At °C (phase change temperature), Building a Part Number Standard Options HI-FLOW changes from a solid HF–– . AC ––/ NA || example and flows, thereby assuring total wet- NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and out of the interface. The thixotropic revision level. Section E Section C Section B Section A characteristics of HI FLOW reduce the Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or pump-out from the interface. ® custom configuration
AC ® Adhesive, one side HI FLOW has thermal performance ® No adhesive equal to grease with .°C-in. /W Standard thicknesses available: ." contact thermal resistance. HF ® HI-FLOW Phase Change Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php.
Heat Sink HI-FLOW Power Device Thermal Interface Selection Guide — HI-FLOW | ¥
HI FLOW F-AC
Reinforced, Phase Change Thermal Interface Material
Features and Benefits TYPICAL PROPERTIES OF HI-FLOW F-AC • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Can be manually or automatically Color Black Black Visual applied to the surfaces of Reinforcement Carrier Aluminum Aluminum — room-temperature heat sinks Thickness (in.) / (mm) . . ASTM D Carrier Thickness (in.) / (mm) . . ASTM D • Foil-reinforced, adhesive-coated Continuous Use Temp. (°F) / (°C) — • Soft, thermally conductive °C Phase Change Temp. (°F) / (°C) ASTM D phase change compound ELECTRICAL Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K)() . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . .
) This is the measured thermal conductivity of the HI FLOW coating. It represents one conducting layer in a three-layer laminate. The HI FLOW coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D. Please contact Henkel Product Management if additional specifications are required. ) The ASTM D test fixture was used and the test sample was conditioned at °C prior to test. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
HI FLOW F-AC is a high performance, thermal interface material for use between a computer processor and a heat Heat Sink sink. HI FLOW F-AC consists of a soft, AC (Tackified HI-FLOW) Aluminum Foil thermally conductive °C phase change HI-FLOW F-AC compound coated to the top surface of an Microprocessor aluminum carrier with a soft, thermally conductive adhesive compound coated to Typical Applications Include: the bottom surface to improve adhesion • Computer and peripherals to the heat sink. • Power conversion Above the °C phase change • High performance computer processors temperature, HI FLOW F-AC wets-out the thermal interface surfaces and flows • Power semiconductors to produce low thermal impedance. • Power modules HI FLOW F-AC requires pressure from the assembly to cause material flow. Configurations Available: The HI FLOW coatings resist dripping in • Roll form, kiss-cut parts, and sheet form vertical orientation. The material includes a base carrier liner Building a Part Number Standard Options with differential release properties to HFFAC ––. AC ––/ NA || example NA ® Selected standard option. If not selecting a standard facilitate simplicity in roll form packaging option, insert company name, drawing number, and and application assembly. Please revision level. Section E Section C Section B Section A contact Henkel Product Management Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or for applications that are less than . ® custom configuration inch squared. AC ® Adhesive, one side
Standard thicknesses available: ."
HFFAC ® HI-FLOW F-AC Phase Change Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. ¦ | Thermal Interface Selection Guide — HI-FLOW
HI FLOW UT
Unreinforced, Pressure Sensitive Phase Change Thermal Interface Material
Features and Benefits TYPICAL PROPERTIES OF HI-FLOW UT • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • °C phase change composite with Color Black Black Visual inherent tack characteristics Reinforcement Carrier None None — Thickness (in.) / (mm) . . ASTM D • High-visibility protective tabs Continuous Use Temp. (°F) / (°C) — • Pressure sensitive phase change Phase Change Temp. (°F) / (°C) ASTM D thermal interface material ELECTRICAL Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K)() . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . .
) This is the measured thermal conductivity of the HI FLOW coating. It represents one conducting layer in a three-layer laminate. The HI FLOW coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D. Please contact Henkel Product Management if additional specifications are required. ) The ASTM D test fixture was used and the test sample was conditioned at °C prior to test. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
HI FLOW UT is designed as a pressure sensitive thermal interface Typical Applications Include: material for use between a high • Computer and peripherals performance processor and a heat sink. • High performance computer processors HI FLOW UT is a thermally conductive °C phase change composite with • Graphic cards inherent tack. The material is supplied on • Power modules a polyester carrier liner and is available with high-visibility protective tabs. Configurations Available: Above its phase change temperature, • Roll form with tabs, kiss-cut parts – no holes HI FLOW UT wets-out the thermal HI FLOW UT is limited to a square or rectangular part design. Dimensional tolerance interface surfaces and flows to produce is Æ/- . in. (. mm). the lowest thermal impedance. The material requires pressure of the assembly to cause flow. Building a Part Number Standard Options HFUT . / NA Application Methods: NA Selected standard option. If not selecting a standard Hand-apply HI FLOW UT to a option, insert company name, drawing number, and revision level. Section E Section C Section B
room-temperature heat sink. The Section A Section D _ _ _ Standard HI-FLOW UT configuration, HI FLOW UT pad exhibits inherent / " x -foot rolls, or custom tack and can be hand-applied similar to configuration an adhesive pad. The tab liner can remain Pressure sensitive adhesive, one side on the heat sink and pad throughout Standard thicknesses available: ." shipping and handling until it is ready for final assembly. HFUT HI-FLOW UT Phase Change Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Clear/Colored HF UT Protective Tab Roll Form, Kiss-Cut Parts "Quick-Snap" High Visibility Tab for Removal
Adhesive Strip Clear Polyester Carrier Liner Thermal Interface Selection Guide — HI-FLOW |
HI FLOW P
Electrically Insulating, Thermally Conductive Phase Change Material
Features and Benefits TYPICAL PROPERTIES OF HI-FLOW P • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Field-proven polyimide film: excellent Color Green Green Visual dielectric performance; excellent cut- Reinforcement Carrier Polyimide Polyimide — through resistance Thickness (in.) / (mm) . - . . - . ASTM D Film Thickness (in.) / (mm) . - . . - . ASTM D • Outstanding thermal performance in an insulated pad Elongation (·) ASTM DA Tensile Strength (psi) / (mPa) , ASTM DA Continuous Use Temp. (°F) / (°C) — Phase Change Temp. (°F) / (°C) ASTM D ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K)() . . ASTM D HI FLOW P consists of a thermally THERMAL PERFORMANCE VS. PRESSURE conductive °C phase change Pressure (psi) compound coated on a thermally TO- Thermal Performance (°C/W) . in. . . . . . conductive polyimide film. The polyimide TO- Thermal Performance (°C/W) . in. . . . . . reinforcement makes the material easy TO- Thermal Performance (°C/W) . in. . . . . . to handle and the °C phase change Thermal Impedance (°C-in./W) . in.() . . . . . temperature minimizes shipping and Thermal Impedance (°C-in./W) . in.() . . . . . handling problems. Thermal Impedance (°C-in./W) . in.() . . . . .
) This is the measured thermal conductivity of the HI FLOW coating. It represents one conducting layer in a three-layer laminate. The HI FLOW coatings are HI FLOW P achieves outstanding phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, values in voltage breakdown and thermal thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D. Please contact Henkel Product Management if additional specifications are required. performance. The product is supplied ) The ASTM D test fixture was used and the test sample was conditioned at °C prior to test. The recorded value includes interfacial thermal resistance. on an easy release liner for exceptional These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. handling in high volume manual assemblies. HI FLOW P is designed Typical Applications Include: for use as a thermal interface material between electronic power devices • Spring / clip-mounted requiring electrical isolation • Discrete power semiconductors and modules to the heat sink. Henkel suggests the use of spring clips Configurations Available: to assure constant pressure with the • Roll form, die-cut parts and sheet form, dry both sides interface and power source. Please refer to thermal performance data to Building a Part Number Standard Options determine nominal spring pressure for HFP–– . –– ACME Rev a || example your application. NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D . ® ." x " sheets, ./ ® ." x -foot rolls, or ® custom configuration Heat Sink HI-FLOW P ® No adhesive Polyimide HI-FLOW P Standard polyimide thicknesses available: .", .", Power Device ." We produce thousands of specials. Tooling HFP ® HI-FLOW P Phase Change Material charges vary depending on tolerances and Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. complexity of the part. | Thermal Interface Selection Guide — HI-FLOW
HI FLOW UT
Tacky, High Performance, Phase Change TIM
Features and Benefits TYPICAL PROPERTIES OF HI-FLOW §UT • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • High thermal conductivity: . W/mk Color Blue Blue Visual Reinforcement Carrier None None — • Phase change softening temp. °C Thickness (in.) / (mm) ., . ., . ASTM D • Naturally tacky Continuous Use Temp. (°F) / (°C) — • Tabulated for ease of assembly Phase Change Softening Temp. (°F) / (°C) ASTM D ELECTRICAL Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K)() . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . .
) This is the measured thermal conductivity of the HI FLOW coating. It represents one conducting layer in a three-layer laminate. The HI FLOW coatings are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D. Please contact Henkel Product Management if additional specifications are required. ) The ASTM D test fixture was used and the test sample was conditioned at °C prior to test. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
HI FLOW UT is a naturally tacky, thermally conductive phase change Typical Applications Include: material which is supplied in an easy • Processor lid to heat sink to use tabulated pad form. In the • Processor die to lid or heat sink application the material undergoes a • FBDIMM to heat spreader phase change softening, starting near °C. The phase change softening feature Configurations Available: improves handling characteristics prior • Tabulated in roll form, kiss-cut parts – no holes to a facilitated assembly. At application • HI FLOW UT is limited to a square or rectangular part design. Dimensional temperatures and pressures, HI FLOW tolerance is Æ/- . in. (. mm) UT wets out the thermal interfaces producing a very low thermal impedance. Building a Part Number Standard Options The thermal performance of HF UT . ACME Rev a || example NA Selected standard option. If not selecting a standard HI FLOW UT is comparable to the option, insert company name, drawing number, and revision level. Section E
best thermal greases. HI FLOW UT Section C Section B Section A Section D _ _ _ Standard HI-FLOW UT configuration, is provided at a consistent thickness / " x -foot rolls, or custom to ensure reliable performance. configuration HI FLOW UT can be applied in Natural Tack high volumes to the target surface via Standard thicknesses available: . ", . ", . " low pressure from a roller or manual HF UT HI-FLOW UT Phase Change Material application. Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — HI-FLOW |
HI FLOW
Reinforced Phase Change Thermal Interface Material
Features and Benefits TYPICAL PROPERTIES OF HI-FLOW § • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Electrically isolating Color Green Green Visual Reinforcement Carrier PEN Film PEN Film — • °C phase change compound coated Thickness (in.) / (mm) . . ASTM D on PEN film Elongation (· ° to Warp and Fill) ASTM DA • Tack-free and scratch-resistant Tensile Strength (psi) / (mPa) , ASTM DA Continuous Use Temp. (°F) / (°C) — Phase Change Temp. (°F) / (°C) ASTM D ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K)() . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . HI FLOW is a film-reinforced phase Thermal Impedance (°C-in./W)() . . . . . ) This is the measured thermal conductivity of the HI FLOW coating. It represents one conducting layer in a three-layer laminate. The HI FLOW coatings are change material. The product consists phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D. Please contact Henkel of a thermally conductive °C phase Product Management if additional specifications are required. change compound coated on PEN film. ) The ASTM D test fixture was used and the test sample was conditioned at °C prior to test. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. HI FLOW is designed to be used as a thermal interface material between electronic power devices that require Typical Applications Include: electrical isolation and a heat sink. The • Spring / clip-mounted reinforcement makes HI FLOW easy • Power semiconductors to handle, and the °C phase change • Power modules temperature of the coating material eliminates shipping and handling Configurations Available: problems. The PEN film has a continuous • Sheet form, die-cut parts and roll form use temperature of °C. • With or without pressure sensitive adhesive HI FLOW is tack-free and scratch- resistant at production temperature and Building a Part Number Standard Options does not require a protective liner in most HF–– .AC –– NA || example NA ® Selected standard option. If not selecting a standard shipping situations. The material has the option, insert company name, drawing number, and revision level. thermal performance of - mil mica and Section E Section C Section B Section A Section D ® " x " sheets, / ® " x -foot rolls, or grease assemblies. ® custom configuration
AC ® Adhesive, one side ® No adhesive
Standard thicknesses available: ."
HF ® HI-FLOW Phase Change Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — HI-FLOW
HI FLOW P
Electrically Insulating, High Performance, Thermally Conductive Phase Change Material
Features and Benefits TYPICAL PROPERTIES OF HI-FLOW §P • Thermal Impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • °C high temperature reliability Color Gold Gold Visual Reinforcement Carrier Polyimide Polyimide — • Natural tack on one side for ease of Thickness (in.) / (mm) . - . . - . ASTM D assembly Film Thickness (in.) / (mm) . - . . - . ASTM D • Exceptional thermal peformance in Inherent Surface Tack (- or -sided) — an insulated pad Elongation (·) ASTM DA Tensile Strength (psi) , , ASTM DA Continuous Use Temp. (°F / °C) - to - to — Phase Change Softening Temp. (°F / °C) ASTM D ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K)() . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) HI FLOW P is a thermally conductive TO- Thermal Performance (°C/W) . in. . . . . . phase change material, reinforced with TO- Thermal Performance (°C/W) . in. . . . . . a polyimide film that is naturally tacky TO- Thermal Performance (°C/W) . in. . . . . . () on one side. The polyimide film provides Thermal Impedance (°C-in. /W) . in. . . . . . Thermal Impedance (°C-in./W)() . in. . . . . . a high dielectric strength and high cut Thermal Impedance (°C-in./W)() . in. . . . . . through resistance. HI FLOW P offers ) This is the measured thermal conductivity of the HI FLOW wax coating. It represents one conducting layer in a three-layer laminate. The HI FLOW coatings high temperature reliability ideal for are phase change compounds. These layers will respond to heat and pressure induced stresses. The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied. This characteristic is not accounted for in ASTM D. Please contact automotive applications. Henkel Product Management if additional specifications are required. ) The ASTM D test fixture was used and the test sample was conditioned at °C for minutes prior to test. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and HI FLOW P is designed for use pressure applied. between a high-power electrical device requiring electrical isolation from the heat Typical Applications sink and is ideal for automated dispensing • Spring / clip-mounted devices systems. • Discrete power semiconductors and modules Henkel recommends the use of spring clips to assure constant pressure with Configurations Available the component interface and the • Roll form, die-cut parts, sheet form heat sink. Please refer to the TO- • Available with ., . or . mil polyimide reinforcement carrier thermal performance data to determine the nominal spring pressure for Building a Part Number Standard Options your application. HF P . ACME Rev a || example NA Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D " x " sheets, / / " x " rolls, or custom configuration
Natural tack
Standard Polymide Thicknesses available: .", .", ."
HF P HI-FLOW P Phase Change Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — SIL PAD |
SIL PAD Thermally Conductive Insulators
Solutions-Driven Thermal Management Products for Electronic Devices Comprehensive choices for a cleaner and more efficient thermal interface SIL PAD elastomeric thermal interface material was introduced SIL PAD thermally conductive insulators, in their many forms, more than years ago. Today, a complete family of SIL PAD continue to be a clean and efficient alternative to mica, ceramics materials is available to meet the needs of a rapidly changing or grease for a wide range of electronic applications. BERGQUIST electronics industry. brand application specialists work closely with customers to specify the proper SIL PAD material for each unique thermal management requirement.
Features Benefits Options Applications The SIL PAD family Choosing SIL PAD thermal Some SIL PAD products have The large family of encompasses dozens of products saves time and special features for particular SIL PAD thermally conductive products, each with its money while maximizing an applications. Options include: insulators is extremely own unique construction, assembly’s performance and • Available with or versatile. In today’s properties and performance. reliability. Specifically: without adhesive marketplace, SIL PAD materials Here are some of the • Excellent thermal • Some configurations are used in virtually every important features offered by performance are well-suited for component of the electronics automated dispensing the SIL PAD family: • Eliminates the mess industry, including: and/or placement • Proven silicone of grease • Interface between a power • Aluminum foil or embedded rubber binders • More durable than mica transistor, CPU or other graphite construction for • Fiberglass, dielectric film heat-generating component • Less costly than ceramic applications not requiring and a heat sink or rail or polyester film carriers electrical insulation • Resistant to electrical • To isolate electrical • Special fillers to achieve shorting • Copper shield layer specific performance components and power characteristics • Easier and cleaner to apply • Polyester binder material sources from heat sink and/ for silicone-sensitive or mounting bracket • Flexible and conformable • Under time and pressure, thermal resistance will applications • As an interface for • Reinforcements to resist decrease • Polyimide film carrier discrete semiconductors cut-through requiring low-pressure • Better performance for for increased voltage spring-clamp mounting • Variety of thicknesses today’s high-heat breakdown • Wide range of thermal compacted assemblies • Materials with reduced • Consumer electronics conductivities and • A specific interfacial moisture sensitivity • Automotive systems dielectric strengths performance that • Available in rolls, sheets, • Telecommunications matches the need tubes and custom • Aerospace • Efficient “total applied cost” die-cut parts • Custom thicknesses • Military and constructions • Medical devices We produce thousands of • Industrial controls specials. Tooling charges vary depending on the complexity of the part. | Thermal Interface Selection Guide — SIL PAD
Frequently Asked Questions
Q: What is the primary difference between SIL PAD A ¦¦¦ Q: When should I choose SIL PAD ¥¦ versus SIL PAD ¥¦¦S and SIL PAD ¦¦¦ products? for my application? A: SIL PAD A uses a different filler package than A: SIL PAD is specifically formulated to provide SIL PAD . This change results in a more compliant exceptional cut-through and crush resistance in combination SIL PAD A material that inherently lowers interfacial with excellent heat transfer and dielectric properties. resistance losses. This reduction in interfacial resistance SIL PAD has a proven history of reliability in high- results in improved overall thermal performance when pressure applications where surface imperfections such as measured at lower pressures in standard ASTM D and burrs and dents are inherently common. These applications TO- testing. often include heavily machined metal surfaces manufactured from extrusions or castings. SIL PAD S carries a high level Q: When should I choose SIL PAD A ¦¦¦ versus of crush resistance and is more likely to be used in burr-free SIL PAD ¦¦¦ for my application? or controlled-surface finish applications. A: The answer is based on the assumption that the primary design intent is to increase thermal performance. If your Q: Is there an adhesive available for SIL PAD ¦¦ST and application uses lower clamping pressures (e.g., to psi), SIL PAD ¦¦ST? you will find the SIL PAD A to provide excellent thermal A: SIL PAD ST and SIL PAD ST have an inherent tack performance. In contrast, if you are designing for higher on both sides of the material. This inherent tack is used clamping pressures (e.g., psi or greater), it is likely that instead of an adhesive. The tack provides sufficient adhesive you will require the thermal performance characteristics of for dispensing from the carrier liner and placement on the the SIL PAD . component. SIL PAD ST and SIL PAD ST can be repositioned after the initial placement. Q: Are there differences in electrical characteristics between SIL PAD A ¦¦¦ and SIL PAD ¦¦¦? Q: Why are the thermal performance curves of SIL PAD A: Yes. Henkel evaluates and publishes voltage breakdown, ¦¦ST and SIL PAD ¦¦ST so flat when compared to dielectric constant and volume resistivity data per ASTM other SIL PAD materials? standards for these materials. Due to differences between A: SIL PAD ST and SIL PAD ST wet-out the application ASTM lab testing and actual application performance, for best surfaces at a very low pressures. Optimal thermal results, these characteristics should be evaluated within the performance is achieved at pressures as low as psi. actual customer system. Q: How do I know which SIL PAD is right for my Q: Can I get SIL PAD A ¦¦¦ in roll form? specific application? A: Yes. With the environmentally responsible process A: Each application has specific characteristics (e.g., surface improvements added with the introduction of SIL PAD finish, flatness tolerances, high pressure requirements, A products, the materials are now available in roll form. potential burrs, etc.) that determine which SIL PAD will The original SIL PAD material cannot be produced in optimize thermal performance. Select a minimum of two continuous roll form. pads that best fit the application, then conduct testing to determine which material performs the best. Q: When should I choose SIL PAD ¦¦ versus SIL PAD ¥¦¦S for my application? Q: What is IS¦¥¦¦ : ¦¦? A: SIL PAD is specifically formulated to provide excellent A: The ISO certification is the adoption of a quality management thermal performance for discrete semiconductor applications system that is a strategic decision of the organization. This that use low clamping pressures (e.g., spring clips at to International Standard specifies requirements for a quality psi.). In contrast, if you are designing for higher clamping management system where an organization: a) needs to pressure applications using discrete semi-conductors (e.g., demonstrate its ability to consistently provide product that to psi.), it is likely that you will prefer the combination meets customer and applicable regulatory requirements, of high thermal performance and cut-through resistance and b) aims to enhance customer satisfaction through the inherent in SIL PAD S material. effective application of the system, including processes for continual improvement of the system and the assurance of conformity to customer and regulatory requirements. Thermal Interface Selection Guide — SIL PAD |
Choosing SIL PAD Thermally Conductive Insulators
Mica and Grease Mica insulators have been in use for over years and are still commonly used as an insulator. Mica is inexpensive and has excellent dielectric strength, but it is brittle and is easily cracked or broken. Because mica used by itself has high thermal impedance, thermal grease is commonly applied to it. The grease flows easily and excludes air from the interface to reduce the interfacial thermal resistance. If the mica is also thin (- mils [- µm]), a low thermal impedance can be achieved. However, thermal grease introduces a number of problems to the assembly process. It is time-consuming to apply, messy and difficult to clean. Once thermal grease has been applied to an electronic assembly, solder processes must be avoided to prevent contamination of the solder. Cleaning baths must also be avoided to prevent wash-out of the interface grease, causing a dry joint and contamination of the bath. Assembly, soldering and cleaning processes must be performed in one process while the greased insulators are installed off-line in a secondary process. If the grease is silicone-based, migration of silicone molecules Carriers occurs over time, drying out the grease and contaminating the assembly. The carrier provides physical reinforcement and contributes to dielectric strength. High dielectric and physical strength are Polyimide Films obtained by using a heavy, tight mesh, but thermal resistance will suffer. A light, open mesh reduces thermal resistance, Polyimide films can also be used as insulators and are often dielectric strength and cut-through resistance. The carrier combined with wax or grease to achieve a low thermal materials used in SIL PAD materials include fiberglass and impedance. These polyimide films are especially tough and have dielectric film. high dielectric strength. SIL PAD K-, K- and K- incorporate polyimide film as the carrier material. Fillers SIL PAD Materials The thermal conductivity of SIL PAD products is improved by filling them with ingredients of high thermal conductivity. SIL PAD thermally conductive insulators are designed to The fillers change the characteristics of the silicone rubber to be clean, grease-free and flexible. The combination of a enhance thermal and/or physical characteristics. tough carrier material such as fiberglass and silicone rubber which is confirmable provides the engineer with a more versatile For instance, some fillers make the silicone rubber hard and material than mica or ceramics and grease. SIL PAD products tough while still retaining the ability to flow under pressure. A minimize the thermal resistance from the case of a power harder silicone helps the material resist cut-through. In other semiconductor to the heat sink. SIL PAD materials electrically applications, a filler is used to make the silicone rubber softer isolate the semiconductor from the heat sink and have suffiicient and more conformable to rough surfaces. While the range in dielectric strength to withstand high voltage. They are also strong thermal resistance of greased mica is quite large, the average is enough to resist puncture by the facing metal surface. comparable to elastomeric insulators filled with a blend of the appropriate ingredients. Binders Most SIL PAD products use silicone rubber as the binder. Silicone rubber has a low dielectric constant, high dielectric strength, good chemical resistance and high thermal stability. Silicone rubber also exhibits cold flow, which excludes air from the interface as it conforms to the mating surfaces. This flow eliminates the need for thermal grease. A rough-surface-textured insulator needs to flow more to exclude air than a smooth one. The smoother pads also need less pressure to wet-out the surfaces and obtain optimum thermal contact. | Thermal Interface Selection Guide — SIL PAD
SIL PAD Comparison Data
TO- Thermal Performance Q-PAD Materials Non-Electrically Isolating SIL PAD High Value Materials . . SIL PAD , mil Q-PAD SIL PAD , mil Q-PAD II . . SIL PAD SIL PAD S . SIL PAD . SIL PAD ST
. W) W) . .
. . . . . Thermal Performance (C/ Thermal Performance
Thermal Performance (C/ Thermal Performance . .
. . .
. . Interface Pressure (psi) Interface Pressure (psi)
SIL PAD High Performance Materials SIL PAD Polyimide-Based Materials . . SIL PAD A, mil SIL PAD K- SIL PAD , mil . SIL PAD K- . SIL PAD , mil SIL PAD K- SIL PAD A, mil . . SIL PAD ST, mil . W) W) . . . . . .
. . . . Thermal Performance (C/ Thermal Performance Thermal Performance (C/ Thermal Performance . . . . . . . Interface Pressure (psi) Interface Pressure (psi) Thermal Interface Selection Guide — SIL PAD | ¥
Mechanical and Electrical Properties
Mechanical Properties pressure sensitive adhesive on each side may give the lowest thermal resistance since the adhesive wets-out the interface Woven fiberglass and films are used in SIL PAD products easier than the dry rubber. This decreases the interfacial to provide mechanical reinforcement. The most important thermal resistance. mechanical property in SIL PAD applications is resistance to cut-through to avoid electrical shorting from the device to Devices with larger surface areas need more pressure to get the heat sink. the insulator to conform to the interface than smaller devices. In most screw-mount applications, the torque required to tighten the fastener is sufficient to generate the pressure needed for optimum thermal resistance. There are exceptions where the specified torque on the fastener does not yield the optimum thermal resistance for the insulator being used and either a different insulator or a different mounting scheme should be used. Interfacial thermal resistance decreases as time under pressure increases. In applications where high clamping forces cannot be used, time can be substituted for pressure to achieve lower thermal resistance. The only way to know precisely what the thermal resistance of an insulator will be in an application is to measure it in that application. Electrical Properties If your application does not require electrical insulation, Cut-Through Resistance – The TO- cut-through helps customers better understand typical application performance. Q-Pad II or Q-Pad are ideal grease replacement materials. These materials do not provide electrical isolation but have excellent Mounting Techniques and Mounting Pressure thermal properties. HI FLOW phase change materials should also Typical mounting techniques include: be considered for these applications. (Refer to pages - of • A spring clip, which exerts a centralized clamping force on the this guide.) body of the transistor. The greater the mounting force of the spring, the lower the thermal resistance of the insulator. The most important electrical property in a typical assembly where a SIL PAD insulator is used is dielectric strength. In many • A screw in the mounting tab. With a screw-mounted TO-, the force on the transistor is determined by the torque applied cases, the dielectric strength of a SIL PAD product will be the to the fastener. determining factor in the design of the apparatus in which it is to be used. In extremely low-pressure applications, an insulator with
SIL PAD TYPICAL ELECTRICAL PROPERTIES BREAKDOWN VOLTAGE DIELECTRIC STRENGTH DIELECTRIC CONSTANT VOLUME RESISTIVITY MATERIAL KV VOLTS/MIL KV/MM ,¦¦¦ HZ OHMMETER SIL PAD - . . . SIL PAD - . . . SIL PAD S . . SIL PAD - . . . SIL PAD A . . SIL PAD . . SIL PAD K- . , . SIL PAD K- . , . SIL PAD K- . , . ASTM D* ASTM D* Test Method ASTM D ASTM D * Method A, Type Electrodes * Method A, Type Electrodes ¦ | Thermal Interface Selection Guide — SIL PAD
Thermal Properties
SIL PAD Thermal Performance Overview (TO- Test @ psi)
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W) .
. . . . . . . . . . . . . . . .
. Thermal Performance (°C/ Thermal Performance
. SP SP SPS SPA SPST SP SPST SP SP SPK- SPK- SPK- QP II QP (.) (.) (.) (.) BERGQUIST Material
Here are some general guidelines regarding electrical properties rise in junction temperature can reduce the mean-time-to-failure to consider when selecting a SIL PAD material: of a device by a factor of two. Also, above °C, the • Q-Pad II and Q-Pad are used when electrical isolation is semiconductor’s total power handling capability will be reduced not required. by a derating factor inherent to the device. • Dielectric breakdown voltage is the total voltage that a The thermal properties of SIL PAD products are thermal dielectric material can withstand. When insulating electrical components from each other and ground, it is desirable to use impedance, thermal conductivity and thermal resistance. The an insulator with a high breakdown voltage. thermal resistance and conductivity of SIL PAD products are • Breakdown voltage decreases as the area of the electrodes inherent to the material and do not change. Thermal resistance increases. This area effect is more pronounced as the thickness and thermal conductivity are measured per ASTM D and do of the insulator decreases. not include the interfacial thermal resistance effects. Thermal • Breakdown voltage decreases as temperature increases. impedance applies to the thermal transfer in an application and • Breakdown voltage decreases as humidity increases. includes the effects of interfacial thermal resistance. As the material is applied in different ways, the thermal impedance • Breakdown voltage decreases in the presence of partial discharge. values will vary from application to application. • Breakdown voltage decreases as the size of the voltage source • The original SIL PAD material, SIL PAD , continues to (kVA rating) increases. be the BERGQUIST brand’s most popular material for many applications. • Breakdown voltage can be decreased by excessive mechanical stress on the insulator. • SIL PAD A is chosen when greater thermal performance is required. SIL PAD A is ideal for high performance, Dielectric strength, dielectric constant and volume resistivity high reliability applications. should all be taken into consideration when selecting a Beyond these standard materials, many things can contribute to SIL PAD material. If your application requires specific electrical the selection of the correct material for a particular application. performance, please contact a Henkel Sales Representative for Questions regarding the amount of torque and clamping pressure more detailed testing information. are often asked when selecting a SIL PAD material. Here are Thermal Properties some guidelines: • Interfacial thermal resistance decreases as clamping The thermal properties of a SIL PAD material and your pressure increases. requirements for thermal performance probably have more to do • The clamping pressure required to minimize interfacial thermal with your selection of a SIL PAD product than any other factor. resistance can vary with each type of insulator. Discrete semiconductors, under normal operating conditions, • SIL PAD products with smooth surface finishes (SIL PAD A, dissipate waste power which raises the junction temperature of SIL PAD A, SIL PAD K-, SIL PAD K- and SIL PAD K-) are less sensitive to clamping pressure than SIL PAD materials the device. Unless sufficient heat is conducted out of the device, with rough surface finishes (SIL PAD ) or smooth and tacky its electrical performance and parameters are changed. A °C finishes (SIL PAD ST). Thermal Interface Selection Guide — SIL PAD |
SIL PAD Thermally Conductive Insulator Selection Table
SIL PAD SIL PAD SIL PAD SIL PAD SIL PAD SIL PAD SIL PAD SIL PAD TEST ¦¦ .¦¦ IN. ¦¦ .¦¦¥ IN. ¦¦ ¥¦¦S ¥¦ ¦¦ST ¦¦ A ¦¦ METHOD COLOR GREY GREY GOLD PINK MAUVE YELLOW BLACK GREEN VISUAL . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . Thickness (in./mm) ASTM D (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) Thermal Performance TO- Test . . . . . . . . ASTM D @ psi °C/W Thermal Impedance . . . . . . . . ASTM D (°C-in./W) Thermal Conductivity . . . . . . . . ASTM D (W/m-K nominal) Voltage Breakdown , , , , , , , , ASTM D (Vac.) Continuous Use - to - to - to - to - to - to - to - to — Temperature (°C) Silicone/ Silicone/ Silicone/ Silicone/ Silicone/ Silicone/ Silicone/ Silicone/ Construction — Fiberglass Fiberglass Fiberglass Fiberglass Fiberglass Fiberglass Fiberglass Fiberglass
SIL PAD Applications
Here, SIL PAD S enhances SIL PAD is available in over The circuit board above shows This application uses SIL PAD to the thermal transfer from this standard configurations punched parts interfacing screw- isolate the mounting brackets FR- circuit board with thermal for common JEDEC mounted transistors to a finned from the assembly frame. vias to the metal base plate. package outlines. heat sink.
A common SIL PAD application These SIL PAD applications show Choose a SIL PAD that optimizes SIL PAD is used extensively includes TO- transistors clip mounting of transistors on thermal performance for your in industrial applications having mounted in a row on a heat rail. the left and screw mounting mounting method — screw, clip, excellent cut-through and to an aluminum bracket on spring, bar, etc. abrasion resistance. the right. | Thermal Interface Selection Guide — SIL PAD
SIL PAD Thermally Conductive Insulator Selection Table
SIL PAD SIL PAD SIL PAD SIL PAD SIL PAD SIL PAD POLYPAD POLYPAD POLYPAD TEST ¦¦ST ¦¦¦ A ¦¦¦ K K K ¦ ¦¦¦ K K ¦ METHOD COLOR BLUE WHITE WHITE GREY BLUEGREEN BEIGE YELLOW TAN YELLOW VISUAL . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . Thickness (in./mm) ASTM D (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) Thermal Performance TO- Test . . . . . . . . . ASTM D @ psi °C/W Thermal Impedance . . . . . . . . . ASTM D (°C-in./W) Thermal Conductivity . . . . . . . . . ASTM D (W/m-K nominal) Voltage Breakdown , , , , , , , , , ASTM D (Vac.) Continuous Use - to - to - to - to - to - to - to - to - to — Temperature (°C) Silicone/ Silicone/ Silicone/ Polyester/ Polyester/ Construction Silicone/Film Silicone/Film Silicone/Film Polyester/Film — Fiberglass Fiberglass Fiberglass Fiberglass Film
SIL PAD Comparison Made Simple
Comparing thermally conductive interface materials has never been easier. Simply go to the “Thermal Materials” section of our website www.henkel-adhesives.com/thermal and select “Compare Material Properties.” Then select up to three separate products and this handy comparison tool will automatically chart thermal resistance values and display a material properties table of the selected materials. The materials comparison tool can be used for most BERGQUIST thermal materials, including SIL PAD, HI-FLOW, GAP PAD, Q PAD, BOND-PLY and LIQUI-BOND. Thermal Interface Selection Guide — SIL PAD |
SIL PAD
The Original SIL PAD Material
SIL PAD SIL PAD SIL PAD SIL PAD SIL PAD SIL PAD POLYPAD POLYPAD POLYPAD TEST Features and Benefits TYPICAL PROPERTIES OF SIL PAD ¦¦ST ¦¦¦ A ¦¦¦ K K K ¦ ¦¦¦ K K ¦ METHOD • Thermal impedance: .°C-in./W COLOR BLUE WHITE WHITE GREY BLUEGREEN BEIGE YELLOW TAN YELLOW VISUAL (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . . ¶ . Color Grey Grey Visual Thickness (in./mm) ASTM D • Original SIL PAD material (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) (. ¶ .) Reinforcement Carrier Fiberglass Fiberglass — Thermal Performance • Excellent mechanical and Thickness (in.) / (mm) ., . ., . ASTM D TO- Test . . . . . . . . . ASTM D physical characteristics Hardness (Shore A) ASTM D @ psi °C/W • Flame retardant Breaking Strength (lbs./in.) / (kN/m) ASTM D Thermal Impedance . . . . . . . . . ASTM D Elongation (· at º to Warp and Fill) ASTM D (°C-in./W) Tensile Strength (psi) / (mPa) , ASTM D Thermal Conductivity . . . . . . . . . ASTM D (W/m-K nominal) Continuous Use Temp. (°F) / (°C) - to - to — Voltage Breakdown ELECTRICAL , , , , , , , , , ASTM D (Vac.) Dielectric Breakdown Voltage (Vac.) ,, , ,, , ASTM D Continuous Use - to - to - to - to - to - to - to - to - to — Dielectric Constant (, Hz) . . ASTM D Temperature (°C) Volume Resistivity (Ohmmeter) ASTM D Silicone/ Silicone/ Silicone/ Polyester/ Polyester/ Construction Silicone/Film Silicone/Film Silicone/Film Polyester/Film — Flame Rating V-O V-O UL Fiberglass Fiberglass Fiberglass Fiberglass Film THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) SIL PAD is a composite of silicone TO- Thermal Performance (°C/W) . in. . . . . . rubber and fiberglass. The material TO- Thermal Performance (°C/W) . in. . . . . . () is flame retardant and is specially Thermal Impedance (°C-in. /W) . in. . . . . . Thermal Impedance (°C-in./W) . in.() . . . . . formulated for use as a thermally ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual conductive insulator. The primary use application performance is directly related to the surface roughness, flatness and pressure applied. for SIL PAD is to electrically isolate power sources from heat sinks. Typical Applications Include: SIL PAD has excellent mechanical • Power supplies and physical characteristics. Surfaces • Power semiconductors are pliable and allow complete surface • Automotive electronics contact with excellent heat dissipation. • Motor controls SIL PAD actually improves its thermal resistance with age. The reinforcing Configurations Available: fiberglass provides excellent cut-through • Sheet form, die-cut parts and roll form; with or without pressure sensitive adhesive resistance. In addition, SIL PAD is nontoxic and resists damage from Building a Part Number Standard Options cleaning agents. SP–– . AC ––/ NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or ® custom configuration AC ® Adhesive, one side; or ® no adhesive Standard thicknesses available: .", ."
SP ® SIL-PAD Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — SIL PAD
SIL PAD
High Performance Insulator for Low-Pressure Applications
Features and Benefits TYPICAL PROPERTIES OF SIL PAD • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • High value material Color Gold Gold Visual Reinforcement Carrier Fiberglass Fiberglass — • Smooth and highly compliant surface Thickness (in.) / (mm) . . ASTM D • Electrically isolating Hardness (Shore A) ASTM D Elongation (· at º to Warp and Fill) ASTM D Tensile Strength (psi) / (mPa) , ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) The SIL PAD family of thermally TO- Thermal Performance (°C/W) . . . . . () conductive insulation materials is Thermal Impedance (°C-in. /W) . . . . . ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual designed for applications requiring high application performance is directly related to the surface roughness, flatness and pressure applied. thermal performance and electrical isolation. These applications also typically Typical Applications Include: have low mounting pressures for • Power supplies component clamping. • Automotive electronics SIL PAD material combines a • Motor controls smooth and highly compliant surface • Power semiconductors characteristic with high thermal conductivity. These features optimize Configurations Available: the thermal resistance properties at • Sheet form, die-cut parts and roll form low pressure. • With or without pressure sensitive adhesive Applications requiring low component clamping forces include discrete Building a Part Number Standard Options semiconductors (TO-, TO- and SP–– .AC–– NA || example TO-) mounted with spring clips. NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and Spring clips assist with quick assembly revision level. Section E Section C Section B Section A but apply a limited amount of force to Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or the semiconductor. The smooth surface ® custom configuration texture of SIL PAD minimizes AC ® Adhesive, one side ® No adhesive interfacial thermal resistance and Standard thicknesses available: ." maximizes thermal performance. SP ® SIL-PAD Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — SIL PAD |
SIL PAD S
High Performance Insulator for Low-Pressure Applications
Features and Benefits TYPICAL PROPERTIES OF SIL PAD S • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Electrically isolating Color Pink Pink Visual Reinforcement Carrier Fiberglass Fiberglass — • Low mounting pressures Thickness (in.) / (mm) . . ASTM D • Smooth and highly compliant surface Hardness (Shore A) ASTM D • General-purpose thermal interface Elongation (· at º to Warp and Fill) ASTM D material solution Tensile Strength (psi) / (mPa) , ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . .
) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual The true workhorse of the SIL PAD application performance is directly related to the surface roughness, flatness and pressure applied. product family, SIL PAD S thermally conductive insulation material is designed Typical Applications Include: for a wide variety of applications requiring high thermal performance and • Power supplies electrical isolation. These applications • Automotive electronics also typically have low mounting • Motor controls pressures for component clamping. • Power semiconductors SIL PAD S material combines a Configurations Available: smooth and highly compliant surface characteristic with high thermal • Sheet form, die-cut parts and roll form conductivity. These features optimize • With or without pressure sensitive adhesive the thermal resistance properties at low pressures. Building a Part Number Standard Options SPS–– . AC –– ACME Rev B || example Applications requiring low component NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and clamping forces include discrete revision level. Section E Section C Section B Section A semiconductors (TO-, TO- and Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or TO-) mounted with spring clips. ® custom configuration Spring clips assist with quick assembly AC ® Adhesive, one side ® No adhesive and apply a limited amount of force to Standard thicknesses available: ." the semiconductor. The smooth surface SPS ® SIL-PAD S Material texture of SIL PAD S minimizes Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. interfacial thermal resistance and maximizes thermal performance. | Thermal Interface Selection Guide — SIL PAD
SIL PAD
High Cut-Through Resistant, Electrically Insulating, Thermally Conductive Material Affordable, Electrically Insulating, Thermally Conductive, Soft Tack Elastomeric Material
Features and Benefits TYPICAL PROPERTIES OF SIL PAD • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Excellent cut-through resistance Color Mauve Mauve Visual Reinforcement Carrier Fiberglass Fiberglass — • Use in screw-mounted applications Thickness (in.) / (mm) . . ASTM D with cut-through problems Hardness (Shore A) ASTM D Breaking Strength (lbs./in.) / (kN/m) ASTM D Elongation (· at º to Warp and Fill) ASTM D Cut-Through (lbs.) / (kg) ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE In addition to excellent heat transfer Pressure (psi) and dielectric properties, SIL PAD TO- Thermal Performance (°C/W) . . . . . is specially formulated for high Thermal Impedance (°C-in./W)() . . . . . resistance to crushing and cut-through ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. typically found in high-pressure applications where surface imperfections such as burrs and dents Typical Applications Include: are inherently common (e.g., heavily- • Silicone-sensitive assemblies machined metal surfaces manufactured • Telecommunications from extrusions or castings). • Automotive electronics With a field-proven history of reliability, SIL PAD is Henkel’s best material Configurations Available: for cut-through resistance in screw- • Sheet form, die-cut parts and roll form mounted and other applications with • With or without pressure sensitive adhesive cut-through problems. Building a Part Number Standard Options SP–– . AC –– ACME Rev B || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or ® custom configuration AC ® Adhesive, one side ® No adhesive Standard thicknesses available: ."
SP ® SIL-PAD Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — SIL PAD |
SIL PAD ST
Affordable, Electrically Insulating, Thermally Conductive, Soft Tack Elastomeric Material
Features and Benefits TYPICAL PROPERTIES OF SIL PAD ST • Inherent tack on both sides for exceptional thermal performance and PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD easy placement Color Yellow Yellow Visual • Repositionable for higher Reinforcement Carrier Fiberglass Fiberglass — utilization, ease of use and Thickness (in.) / (mm) . . ASTM D assembly error reduction Inherent Surface Tack (- or -sided) — () • Lined on both sides for ease of Hardness (Shore ) ASTM D handling prior to placement in Breaking Strength (lb./in.) / (kN/m) . . ASTM D high volume assemblies Elongation (· at º to Warp and Fill) ASTM D Tensile Strength (psi) / (mPa) . ASTM D • Exhibits exceptional thermal performance even at a low Continuous Use Temp. (°F) / (°C) - to - to — mounting pressure ELECTRICAL • Fiberglass-reinforced Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D • Value alternative to SIL PAD ST Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (ºC/W) . . . . . Thermal Impedance (ºC-in./W) () . . . . .
) Thirty-second delay value Shore hardness scale. ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include: SIL PAD ST (Soft Tack) is a fiberglass- • Automotive ECMs reinforced thermal interface material • Power supplies featuring inherent tack on both sides. • Motor controls The material exhibits excellent thermal • Between an electronic power device and its heat sink performance at low mounting pressures. The material is supplied on two liners Configurations Available: for exceptionally easy handling prior • Sheet form, die-cut parts and roll form to auto-placement in high volume • Top and bottom liners assemblies. The material is ideal for placement between an electronic power Building a Part Number Standard Options device and its heat sink. SPST . NA || example NA Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D " x " sheets, / " x -foot rolls or custom configuration
Natural tack, both sides
Standard thicknesses available: . "
SPST SIL-PAD ST Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — SIL PAD
SIL PAD
Exceptional Performance, Thermally Conductive Elastomeric Material
Features and Benefits TYPICAL PROPERTIES OF SIL PAD • Thermal Impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Exceptional thermal performance at Color Black Black Visual lower application pressures Reinforcement Carrier Fiberglass Fiberglass — Thickness (in.) / (mm) . to . . to . ASTM D • Smooth and non-tacky on both sides Hardness Bulk Rubber (Shore ) ASTM D for easy repositioning, ease of use and assembly error reduction Elongation (· at º to warp and fill) ASTM D Tensile Strength (psi) / (mPa) ASTM D • Exceptional breakdown voltage and Continuous Use Temp. (°F) / (°C) - to - to — surface “wet-out” values ELECTRICAL • Designed for applications where Dielectric Breakdown Voltage (Vac.) , , ASTM D electrical isolation is critical Dielectric Constant (, Hz) . . ASTM D • Excellent cut-through resistance, Volume Resistivity (Ohmmeter) ASTM D designed for screw and clip Flame Rating V-O V-O UL mounted applications THERMAL Thermal Conductivity (W/m-K)() . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (ºC/W) . . . . . Thermal Impedance (ºC-in./W)() . . . . .
) This is the measured thermal conductivity of the SIL PAD Compound. ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
Typical Applications Include: • Automotive electronics control modules • Power supplies • Motor controls • Audio amplifiers SIL PAD is a silicone-based, • Discrete devices • Telecommunications fiberglass-reinforced thermal interface material featuring a smooth, highly Configurations Available: compliant surface. The material features • Sheet form, slit-to-width roll form • , and mil thicknesses a non-tacky surface for efficient repositioning and ease of use, as well • Die-cut parts • Adhesive coating as an optional adhesive coating. We produce thousands of specials and customs. Tooling charges vary depending on SIL PAD exhibits exceptional thermal tolerances and complexity of the part. performance at low and high application pressures. The material is ideal for Building a Part Number Standard Options placement between electronic power SP . AC NA || example NA Selected standard option. If not selecting a standard devices and a heat sink for screw and clip option, insert company name, drawing number, and mounted applications. revision level. Section E Section C Section B Section A Section D ___ Standard configuration dash number, " x " sheets, / -foot x in. or custom configuration AC Adhesive, one side No adhesive Standard thicknesses available: .", . ", . "
SP SIL-PAD Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — SIL PAD | ¥
SIL PAD A
Electrically Insulating, Thermally Conductive Elastomeric Material
Features and Benefits TYPICAL PROPERTIES OF SIL PAD A • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Elastomeric compound coated on Color Green Green Visual both sides Reinforcement Carrier Fiberglass Fiberglass — Thickness (in.) / (mm) . . ASTM D Hardness (Shore A) ASTM D Breaking Strength (lbs./in.) / (kN/m) ASTM D Elongation (· at ° to Warp and Fill) ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE SIL PAD A is a silicone-based, Pressure (psi) thermally conductive and electrically TO- Thermal Performance (°C/W) . . . . . insulating material. It consists of a Thermal Impedance (°C-in./W)() . . . . . cured silicone elastomeric compound ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual coated on both sides of a fiberglass application performance is directly related to the surface roughness, flatness and pressure applied. reinforcement layer. Typical Applications Include: SIL PAD A performs well under clamping pressure up to psi and is • Power supplies an excellent choice for high performance • Automotive electronics applications requiring electrical isolation • Motor controls and cut-through resistance. • Power semiconductors Configurations Available: • Sheet form, die-cut parts, and roll form • With or without pressure sensitive adhesive Building a Part Number Standard Options SPA–– . AC ––/ NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x ' rolls, or ® custom configuration AC ® Adhesive, one side ® No adhesive Standard thicknesses available: ."
SPA ® SIL-PAD A Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. ¦ | Thermal Interface Selection Guide — SIL PAD
SIL PAD ST
Electrically Insulating, Thermally Conductive, Soft Tack Elastomeric Material
Features and Benefits TYPICAL PROPERTIES OF SIL PAD ST • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Naturally tacky on both sides Color Blue Blue Visual Reinforcement Carrier Fiberglass Fiberglass — • Pad is repositionable Thickness (in.) / (mm) . . ASTM D • Excellent thermal performance Hardness (Shore ) ASTM D • Auto-placement and dispensable Breaking Strength (lbs./in.) / (kN/m) . . ASTM D Elongation (· at º to Warp and Fill) ASTM D Tensile Strength (psi) / (mPa) . ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . SIL PAD ST (Soft Tack) is a fiberglass- Thermal Impedance (°C-in./W)() . . . . .
reinforced thermal interface material ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual that is naturally tacky on both sides. application performance is directly related to the surface roughness, flatness and pressure applied. SIL PAD ST exhibits exceptional thermal performance. Typical Applications Include: SIL PAD ST is supplied in sheet or • Power supplies roll form for outstanding auto-dispensing • Power semiconductors and auto-placement in high volume • Aerospace assemblies. SIL PAD ST is intended • Motor controls for placement between an electronic power device and its heat sink. Configurations Available: • Sheet form, die-cut parts and slit-to-width roll form Building a Part Number Standard Options SPST–– . –– NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or ® custom configuration
® Natural tack, both sides
Standard thicknesses available: ."
SPST ® SIL-PAD ST Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — SIL PAD |
SIL PAD
Higher Performance, High Reliability Insulator
Features and Benefits TYPICAL PROPERTIES OF SIL PAD • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Optimal heat transfer Color White White Visual Reinforcement Carrier Fiberglass Fiberglass — • High thermal conductivity: . W/m-K Thickness (in.) / (mm) . to . . to . ASTM D Hardness (Shore A) ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) .’’ . . . . . SIL PAD is a high performance, Thermal Impedance (°C-in./W) .’’() . . . . . thermally conductive insulator designed ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. for demanding aerospace and commercial applications. Typical Applications Include: SIL PAD is a silicone elastomer • Power supplies formulated to maximize the thermal and dielectric performance of the filler/ • Motor controls binder matrix. The result is a grease-free, • Power semiconductors conformable material capable of meeting • Aerospace or exceeding the thermal and electrical • Avionics requirements of high-reliability electronic packaging applications. Configurations Available: • Sheet form, die-cut parts • With or without pressure sensitive adhesive Building a Part Number Standard Options SP–– . AC –– NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, or ® custom configuration
AC ® Adhesive, one side ® No adhesive Standard thicknesses available: .", .", ."
SP ® SIL-PAD Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — SIL PAD
SIL PAD A
Higher Performance, High Reliability Insulator
Features and Benefits TYPICAL PROPERTIES OF SIL PAD A • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Optimal heat transfer Color White White Visual Reinforcement Carrier Fiberglass Fiberglass — • High thermal conductivity: . W/m-K Thickness (in.) / (mm) . to . . to . ASTM D Hardness (Shore A) ASTM D Heat Capacity (J/g-K) . . ASTM E Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) SIL PAD A is a conformable TO- Thermal Performance (°C/W) . in. . . . . . elastomer with very high thermal Thermal Impedance (°C-in./W) . in.() . . . . . conductivity that acts as a thermal ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. interface between electrical components and heat sinks. SIL PAD A is for applications where optimal heat transfer Typical Applications Include: is a requirement. • Motor drive controls This thermally conductive silicone • Avionics elastomer is formulated to maximize the • High-voltage power supplies thermal and dielectric performance of • Power transistor / heat sink interface the filler/binder matrix. The result is a grease-free, conformable material capable Configurations Available: of meeting or exceeding the thermal and • Sheet form, die-cut parts and roll form electrical requirements of high reliability • With or without pressure sensitive adhesive electronic packaging applications. Building a Part Number Standard Options SPA–– . –– NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or ® custom configuration AC ® Adhesive, one side ® No adhesive Standard thicknesses available: .", ."
SPA ® SIL-PAD A Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — SIL PAD |
SIL PAD K-
The Polyimide-Based Insulator
Features and Benefits TYPICAL PROPERTIES OF SIL PAD K- • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Withstands high voltages Color Grey Grey Visual Reinforcement Carrier Polyimide Polyimide — • High dielectric strength Thickness (in.) / (mm) . . ASTM D • Very durable Hardness (Shore A) ASTM D Breaking Strength (lbs./in.) / (kN/m) ASTM D Elongation (·) ASTM D Tensile Strength (psi) / (mPa) , ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating VTM-O VTM-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE SIL PAD K- uses a specially developed Pressure (psi) film which has high thermal conductivity, TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . . high dielectric strength and is very ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual durable. SIL PAD K- combines the application performance is directly related to the surface roughness, flatness and pressure applied. thermal transfer properties of well-known SIL PAD rubber with the physical Typical Applications Include: properties of a film. • Power supplies SIL PAD K- is a durable insulator that • Motor controls withstands high voltages and requires • Power semiconductors no thermal grease to transfer heat. SIL PAD K- is available in customized Configurations Available: shapes and sizes. • Sheet form, die-cut parts and roll form • With or without pressure sensitive adhesive Building a Part Number Standard Options SPK–– . –– . NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, . ® ." x " sheets, ./ ® ." x -foot rolls, or ® custom configuration AC ® Adhesive, one side ® No adhesive Standard thicknesses available: ."
SPK ® SIL-PAD K Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — SIL PAD
SIL PAD K-
The Medium Performance Polyimide-Based Insulator
Features and Benefits TYPICAL PROPERTIES OF SIL PAD K-§ • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Physically strong dielectric barrier Color Blue-green Blue-green Visual against cut-through Reinforcement Carrier Polyimide Polyimide — Thickness (in.) / (mm) . . ASTM D • Medium performance film Hardness (Shore A) ASTM D Breaking Strength (lbs./in.) / (kN/m) ASTM D Elongation (·) ASTM D Tensile Strength (psi) / (mPa) , ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating VTM-O VTM-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE SIL PAD K- is a medium performance, Pressure (psi) film-based thermally conductive insulator. TO- Thermal Performance (°C/W) . . . . . The film is coated with a silicone Thermal Impedance (°C-in./W)() . . . . . elastomer to deliver high performance ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. and provide a continuous, physically strong dielectric barrier against “cut- through” and resultant assembly failures. Typical Applications Include: • Power supplies • Motor controls • Power semiconductors Configurations Available: • Sheet form, die-cut parts and roll form • With or without pressure sensitive adhesive Building a Part Number Standard Options SPK–– . AC ––. NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, . ® ." x " sheets, ./ ® ." x -foot rolls, or ® custom configuration AC ® Adhesive, one side ® No adhesive Standard thicknesses available: ."
SPK ® SIL-PAD K Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — SIL PAD |
SIL PAD K-
The High Performance Polyimide-Based Insulator
Features and Benefits TYPICAL PROPERTIES OF SIL PAD K- • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Tough dielectric barrier against Color Beige Beige Visual cut-through Reinforcement Carrier Polyimide Polyimide — Thickness (in.) / (mm) . . ASTM D • High performance film Hardness (Shore A) ASTM D • Designed to replace ceramic insulators Breaking Strength (lbs./in.) / (kN/m) ASTM D Elongation (·) ASTM D Tensile Strength (psi) / (mPa) , ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating VTM-O VTM-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) SIL PAD K- is a high performance TO- Thermal Performance (°C/W) . . . . . insulator. It combines special film with Thermal Impedance (°C-in./W)() . . . . . ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual a filled silicone rubber. The result is a application performance is directly related to the surface roughness, flatness and pressure applied. product with good cut-through properties and excellent thermal performance. Typical Applications Include: SIL PAD K- is designed to replace • Power supplies ceramic insulators such as Beryllium • Motor controls Oxide, Boron Nitride and Alumina. • Power semiconductors Ceramic insulators are expensive and they break easily. SIL PAD K- reduces Configurations Available: breakage and costs less than ceramics. • Sheet form, die-cut parts and roll form • With or without pressure sensitive adhesive Building a Part Number Standard Options SPK–– . AC ––. NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, . ® ." x " sheets, ./ ® ." x -foot rolls, or ® custom configuration AC ® Adhesive, one side ® No adhesive Standard thicknesses available: ."
SPK ® SIL-PAD K Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — Q-PAD
Q PAD II
Foil-Format Grease Replacement for Maximum Heat Transfer
Features and Benefits TYPICAL PROPERTIES OF QPAD II • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Maximum heat transfer Color Black Black Visual Reinforcement Carrier Aluminum Aluminum — • Aluminum foil-coated both sides Thickness (in.) / (mm) . . ASTM D • Designed to replace thermal grease Hardness (Shore A) ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) Non-Insulating Non-Insulating ASTM D Dielectric Constant (, Hz) N/A N/A ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . .
) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual Q-Pad II is a composite of aluminum application performance is directly related to the surface roughness, flatness and pressure applied. foil-coated on both sides with thermally/ electrically conductive SIL PAD rubber. The material is designed for those Typical Applications Include: applications in which maximum heat • Between a transistor and a heat sink transfer is needed and electrical isolation • Between two large surfaces such as an L-bracket and the chassis of an assembly is not required. Q PAD II is the ideal • Between a heat sink and a chassis thermal interface material to replace • Under electrically isolated power modules or devices such as resistors, messy thermal grease compounds. transformers and solid state relays Q PAD II eliminates problems associated Configurations Available: with grease such as contamination of • Sheet form, die-cut parts and roll form reflow solder or cleaning operations. Unlike grease, Q PAD II can be used • With or without pressure sensitive adhesive prior to these operations. Q PAD II also eliminates dust collection which Building a Part Number Standard Options QII . AC NA can cause possible surface shorting || example NA Selected standard option. If not selecting a standard or heat buildup. option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ Standard configuration dash number, " x " sheets, / " x -foot rolls, or custom configuration AC Adhesive, one side No adhesive Standard thicknesses available: . "
QII Q-PAD II Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — Q-PAD |
Q PAD
Glass-Reinforced Grease Replacement Thermal Interface
Features and Benefits TYPICAL PROPERTIES OF QPAD • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Does away with processing constraints Color Black Black Visual typically associated with grease Reinforcement Carrier Fiberglass Fiberglass — Thickness (in.) / (mm) . . ASTM D • Conforms to surface textures Hardness (Shore A) ASTM D • Easy handling Continuous Use Temp. (°F) / (°C) - to - to — • May be installed prior to soldering and ELECTRICAL cleaning with confidence Dielectric Breakdown Voltage (Vac.) Non-Insulating Non-Insulating ASTM D Dielectric Constant (, Hz) N/A N/A ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . .
) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
BERGQUIST Q PAD is a grease-only Typical Applications Include: replacement that does away with • Between a transistor and a heat sink contamination of electronic assemblies • Between two large surfaces such as an L-bracket and the chassis of an assembly and reflow solder baths. Q PAD may be • Between a heat sink and a chassis installed prior to soldering and cleaning • Under electrically isolated power modules or devices such as resistors, transformers with confidence. When clamped between and solid state relays two surfaces, the elastomer conforms to surface textures, thereby creating Configurations Available: an air-free interface between heat- • Sheet form, die-cut parts and roll form generating components and heat sinks. • With or without pressure sensitive adhesive Fiberglass reinforcement enables Q PAD to withstand processing Building a Part Number Standard Options stresses without losing physical Q–– .AC–– / NA || example NA ® Selected standard option. If not selecting a standard integrity. It also provides ease of option, insert company name, drawing number, and handling during application. revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or ® custom configuration AC ® Adhesive, one side ® No adhesive Standard thicknesses available: ."
Q ® Q-PAD Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — POLY-PAD
POLY PAD
Polyester-Based, Thermally Conductive Insulation Material
Features and Benefits TYPICAL PROPERTIES OF POLY-PAD • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Polyester-based Color Tan Tan Visual Reinforcement Carrier Fiberglass Fiberglass — • For applications requiring conformal Thickness (in.) / (mm) . . ASTM D coatings Hardness (Shore A) ASTM D • Designed for silicone-sensitive standard Breaking Strength (lbs./in.)/(kN/m) ASTM D applications Elongation(· at ° to Warp and Fill) ASTM D Tensile Strength (psi) / (mPa) , ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D THERMAL Thermal Conductivity (W/m-K) . . ASTM D Flame Rating V-O V-O UL THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . POLY PAD is a fiberglass-reinforced Thermal Impedance (°C-in./W)() . . . . . insulator coated with a filled polyester ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. resin. POLY PAD is economical and designed for most standard applications. Typical Applications Include: Polyester-based, thermally conductive • Power supplies BERGQUIST insulators provide a complete • Automotive electronics family of materials for silicone-sensitive applications. POLY-PADs are ideally suited • Motor controls for applications requiring conformal • Power semiconductors coatings or applications where silicone contamination is a concern (telecomm Configurations Available: and certain aerospace applications). • Sheet form, die-cut parts and roll form POLY-PADs are constructed with • With or without pressure sensitive adhesive ceramic-filled polyester resins coating • We produce thousands of specials. Tooling charges vary depending on tolerances either side of a fiberglass carrier and the complexity of the part. or a film carrier. The POLY PAD family offers a complete range of Building a Part Number Standard Options performance characteristics to match PP–– . –– NA || example NA ® Selected standard option. If not selecting a standard individual applications. option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or ® custom configuration AC ® Adhesive, one side ® No adhesive Standard thicknesses available: ."
PP ® POLY-PAD Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — POLY-PAD | ¥
POLY PAD
Polyester-Based, Thermally Conductive Insulation Material
Features and Benefits TYPICAL PROPERTIES OF POLY-PAD • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Polyester-based Color Yellow Yellow Visual Reinforcement Carrier Fiberglass Fiberglass — • For applications requiring non-silicone Thickness (in.) / (mm) . . ASTM D conformal coatings Hardness (Shore A) ASTM D • Designed for silicone-sensitive Breaking Strength (lbs./in.) / (kN/m) ASTM D applications requiring high Elongation (·) ASTM D performance Tensile Strength (psi) / (mPa) , ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . .
) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual POLY PAD is a fiberglass- application performance is directly related to the surface roughness, flatness and pressure applied. reinforced insulator coated with a filled polyester resin. The material offers Typical Applications Include: exceptional thermal resistance for high • Power supplies performance applications. • Automotive electronics BERGQUIST polyester-based, thermally • Motor controls conductive insulators provide a complete • Power semiconductors family of materials for silicone-sensitive applications. POLY-PADs are ideally Configurations Available: suited for applications requiring • Sheet form, die-cut parts and roll form conformal coatings or applications • With or without pressure sensitive adhesive where silicone contamination is a concern (telecom and certain Building a Part Number Standard Options aerospace applications). POLY PADs PP–– . –– NA || example are constructed with ceramic-filled NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and polyester resins coating either side of revision level. Section E Section C Section B Section A a fiberglass carrier or a film carrier. The Section D _ _ _ ® Standard configuration dash number, ® " x " sheets, / ® " x -foot rolls, or POLY PAD family offers a complete range ® custom configuration of performance characteristics to match AC ® Adhesive, one side ® No adhesive individual applications. Standard thicknesses available: ."
PP ® POLY-PAD Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. ¦ | Thermal Interface Selection Guide — POLY-PAD
POLY PAD K-
Polyester-Based, Thermally Conductive Insulation Material
Features and Benefits TYPICAL PROPERTIES OF POLY-PAD K- • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Polyester-based Color Tan Tan Visual Reinforcement Carrier Polyimide Polyimide — • For applications requiring non-silicone Thickness (in.) / (mm) . . ASTM D conformal coatings Hardness (Shore A) ASTM D • Designed for silicone-sensitive Breaking Strength (lbs./in.) / (kN/m) ASTM D applications Elongation (·) ASTM D • Excellent dielectric and Tensile Strength (psi) / (mPa) , ASTM D physical strength Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . .
) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. POLY PAD K- is a composite of film coated with a polyester resin. The material is an economical insulator Typical Applications Include: and the film carrier provides excellent • Power supplies dielectric and physical strength. • Motor controls BERGQUIST polyester-based, thermally • Power semiconductors conductive insulators provide a complete family of materials for silicone-sensitive Configurations Available: applications. POLY-PADs are ideally • Sheet form, die-cut parts and roll form suited for applications requiring • With or without pressure sensitive adhesive conformal coatings or applications where silicone contamination is a Building a Part Number Standard Options concern (telecom and certain PPK–– . –– . NA || example NA ® Selected standard option. If not selecting a standard aerospace applications). POLY-PADs are option, insert company name, drawing number, and constructed with ceramic-filled revision level. Section E Section C Section B Section A Section D _ _ _ ® Standard configuration dash number, polyester resins coating either side of a . ® ." x " sheets, ./ ® ." x -foot rolls, fiberglass carrier or a film carrier. The or ® custom configuration AC ® Adhesive, one side POLY PAD family offers a complete range ® No adhesive of performance characteristics to match Standard thicknesses available: ." individual applications. PPK ® POLY-PAD K- Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — POLY-PAD |
POLY PAD K-
Polyester-Based, Thermally Conductive Insulation Material
Features and Benefits TYPICAL PROPERTIES OF POLY-PAD K- • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Polyester-based Color Yellow Yellow Visual Reinforcement Carrier Polyimide Polyimide — • For applications requiring non-silicone Thickness (in.) / (mm) . . ASTM D conformal coatings Hardness (Shore A) ASTM D • Designed for silicone-sensitive Breaking Strength (lbs./in.) / (kN/m) ASTM D applications Elongation (·) ASTM D • Excellent dielectric strength and Tensile Strength (psi) / (mPa) , ASTM D thermal performance Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D THERMAL PERFORMANCE VS. PRESSURE Pressure (psi) TO- Thermal Performance (°C/W) . . . . . Thermal Impedance (°C-in./W)() . . . . .
) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. POLY PAD K- is a composite of film coated with a polyester resin. The material offers exceptional thermal Typical Applications Include: performance for your most critical • Power supplies applications with a thermal resistance of • Motor controls .°C-in. /W as well as excellent dielectric • Power semiconductors strength. BERGQUIST polyester-based, thermally Configurations Available: conductive insulators provide a complete • Sheet form, die-cut parts and roll form family of materials for silicone-sensitive • With or without pressure sensitive adhesive applications. POLY-PADs are ideally suited for applications requiring Building a Part Number Standard Options conformal coatings or applications PPK–– . AC ––. NA || example NA Selected standard option. If not selecting a standard where silicone contamination is a option, insert company name, drawing number, and concern (telecom and certain aerospace revision level. Section E Section C Section B Section A Section D _ _ _ Standard configuration dash number, applications). POLY-PADs are constructed . ." x " sheets, ./ ." x -foot rolls, with ceramic-filled polyester resins or custom configuration AC Adhesive, one side coating either side of a fiberglass No adhesive carrier or a film carrier. The POLY Standard thicknesses available: ." PAD family offers a complete range of PPK POLY-PAD K- Material performance characteristics to match Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. individual applications. | Thermal Interface Selection Guide — SIL PAD Tubes
SIL PAD Tubes
Silicone-Based, Thermally Conductive Tubes
Features and Benefits TYPICAL PROPERTIES OF SIL PAD TUBE • Thermal conductivity: SPT – . W/m-K SPT – . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • For clip-mounted plastic Color Grey/Green Grey/Green Visual power packages Thickness / Wall (in.) / (mm) . . ASTM D Hardness (Shore A) ASTM D Breaking Strength (lbs./in.) / (kN/m) ASTM D Continuous Use Temp. (°F) / (°C) - to - to — ELECTRICAL Dielectric Breakdown Voltage (Vac.) , , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL Thermal Conductivity (W/m-K) . . ASTM D Thermal Impedance (°C-in./W)() . . ASTM D TYPICAL PROPERTIES OF SIL PAD TUBE
SPT and SPT (SIL PAD Tubes) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD provide thermally conductive insulation Color Brown Brown Visual for clip-mounted plastic power packages. Thickness / Wall (in.) / (mm) . . ASTM D SIL PAD Tubes are made of silicone rubber Hardness (Shore A) ASTM D with high thermal conductivity. Breaking Strength (lbs./in.) / (kN/m) ASTM D Continuous Use Temp. (°F) / (°C) - to - to — SIL PAD Tube is best suited for ELECTRICAL higher thermal performance. Dielectric Breakdown Voltage (Vac.) , , ASTM D SIL PAD Tube is ideal for applications Dielectric Constant (, Hz) . . ASTM D requiring average thermal conductivity Volume Resistivity (Ohmmeter) ASTM D and economy. Flame Rating V-O V-O UL SIL PAD Tube and SIL PAD Tube THERMAL are designed to meet VDE, UL and TUV Thermal Conductivity (W/m-K) . . ASTM D Thermal Impedance (°C-in./W)() . . ASTM D agency requirements. ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Typical Applications Include: Standard Dimensions A ® Wall Thickness: . mm (. in.) Æ . mm/ -. mm (Æ. in. / -. in.) • Clip-mounted power semiconductors B ® Inner Diameter: mm (. in.) or . mm (. in.) ¶ . mm (¶ . in.) • TO-, TO-, TO- and TO-P C ® Length: mm (. in.) or mm (. in.) Æ. mm / -. mm Configurations Available: (Æ . in. / - . in.) • TO-, TO-, TO- and TO-P Special lengths are available. For more information, contact a Henkel Sales Representative. B Ordering Procedure: Sample: SPT ___ - ___ - ___ “A” – “B” – “C” C A Thermal Interface Selection Guide — BOND-PLY |
BOND PLY and LIQUI BOND Adhesives
BONDPLY Adhesive Tapes LIQUIBOND Liquid Adhesives Available in a pressure sensitive adhesive or laminating format, BERGQUIST LIQUI BOND liquid adhesives are high performance, the BOND PLY family of materials is thermally conductive thermally conductive, liquid adhesive materials. These form- and electrically isolating. BOND PLY facilitates the decoupling in-place elastomers are ideal for coupling “hot” electronic of bonded materials with mismatched thermal coefficients components mounted on PC boards with an of expansion. adjacent metal case or heat sink.
Typical BONDPLY Applications Typical LIQUIBOND Applications
Features Features • High performance, thermally conductive, pressure • Excellent low and high temperature mechanical and sensitive adhesive chemical stability • Material immediately bonds to the target surface Benefits • Bond strength increases over time when repeatedly exposed to high continuous-use temperatures Before cure, LIQUI BOND flows under pressure like a grease. After cure, it bonds the components, eliminating the need for Benefits mechanical fasteners. Additional benefits include: • Provides an excellent dielectric barrier • Low modulus provides stress-absorbing flexibility • Excellent wet-out to most types of component surfaces • Supplied as a one-part material with an elevated temperature including plastic curing system • BOND PLY is unreinforced to increase conformance and • Offers infinite thickness with little or no stress wet-out on low surface energy materials during displacement • Eliminates need for screws, clip mounts or fasteners • Eliminates need for specific pad thickness and die-cut shapes for individual applications Options • Supplied in sheet, die-cut, roll and tabulated forms Options • Available in thickness range of to mil The growing LIQUI BOND family offers a variety of choices to • Custom coated thickness meet the customer’s performance, handling and process needs. Applications Applications • Attach a heat sink to a graphics processing unit LIQUI BOND products are intended for use in thermal interface • Attach a heat spreader to a motor control PCB applications where a structural bond is a requirement. This • Attach a heat sink to a power converter PCB material is formulated for high cohesive and adhesive strength • Attach a heat sink to a drive processor and cures to a low modulus. Typical applications include: • Automotive electronics • Telecommunications • Computer and peripherals • Between any heat-generating semiconductor and a heat sink | Thermal Interface Selection Guide — BOND-PLY
Frequently Asked Questions
Q: What is the primary difference between the variables associated with increasing surface contact or wet- BONDPLY ¦B and BONDPLY ¦¦ products? out. Increasing the application time and/or pressure will A: BOND PLY B uses a dielectric film, replacing the significantly increase surface contact. Natural wet-out will fiberglass inherent in our BOND PLY series products. The continue to occur with BOND PLY materials. This inherent addition of the film allows for high dielectric performance action often increases bond strength by more than two times without additional product thickness. within the first hours. Q: How should I size my interface dimensions Q: Will BONDPLY adhere to plastic packages? for BONDPLY? A: Adhesive performance on plastic packages is primarily A: BOND PLY product testing has been completed on various a function of surface contact or wet-out. If surface interface materials. These tests have demonstrated that contaminants such as plastic mold release oils are present, improper surface wet-out is the single largest variable this will prevent contact and/or bonding to the surface. Make associated with maximizing bond strength and heat transfer. sure all surfaces are clean and dry prior to applying BOND We have found that reducing the size of the interface pad PLY materials. to roughly · of the total interface area actually improves Q: How are one-part LIQUIBOND adhesives cured? the overall bonding performance while offering significant A: One-part LIQUI BOND requires heat to cure and bond in the improvements in total package cooling. Henkel offers three application. Altering the bond line temperature and time standard thicknesses for BOND PLY , allowing each can control the cure schedule. Component fixturing may be application to be optimized in three dimensions. required to maintain placement through cure. Q: What application pressure is required to optimize bond strength with BONDPLY? A: The answer to this varies from application to application, depending upon surface roughness and flatness. In general, pressure, temperature and time are the primary
BONDPLY Comparison Data BOND-PLY Thermal Performance LIQUI-BOND Cure Schedule .
. LIQUI-BOND SA LIQUI-BOND SA
W) . LIQUI-BOND SA LIQUI-BOND SA
. .
Cure Time (Minutes) Cure . Thermal Performance (°C/ Thermal Performance . BOND-PLY BOND-PLY (.”) BOND-PLY (. ”) BOND-PLY P BOND-PLY (. ”) . Interface Pressure (psi) Interface Temperature (°C) Thermal Interface Selection Guide — BOND-PLY |
BOND PLY
Thermally Conductive, Fiberglass-Reinforced Pressure Sensitive Adhesive Tape
Features and Benefits TYPICAL PROPERTIES OF BOND-PLY • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • High bond strength to a variety Color White White Visual of surfaces Reinforcement Carrier Fiberglass Fiberglass — Thickness (in.) / (mm) ., ., . ., ., . ASTM D • Double-sided, pressure sensitive Temp. Resistance, sec. (°F) / (°C) — adhesive tape Elongation (· ° to Warp & Fill) ASTM D • High performance, thermally Tensile Strength (psi) / (mPa) ASTM D conductive acrylic adhesive CTE (ppm) ASTM D • Can be used instead of heat-cure Glass Transition (°F) / (°C) - - ASTM D adhesive, screw mounting or Continuous Use Temp. (°F) / (°C) - to - to — clip mounting ADHESION Lap Shear @ RT (psi) / (mPa) . ASTM D Lap Shear after hrs. @ °C . ASTM D Lap Shear after mins. @ °C . ASTM D Static Dead Weight Shear (°F) / (°C) PSTCº ELECTRICAL VALUE TEST METHOD Dielectric Breakdown Voltage - . in. (Vac.) , ASTM D Dielectric Breakdown Voltage - . in. (Vac.) , ASTM D Dielectric Breakdown Voltage - . in. (Vac.) , ASTM D Flame Rating V-O UL THERMAL Thermal Conductivity (W/m-K) . ASTM D THERMAL PERFORMANCE VS. PRESSURE Typical Applications Include: Initial Assembly Pressure (psi for seconds) TO- Thermal Performance (°C/W) . in. . . . . . • Mount heat sink onto BGA graphic processor or drive processor TO- Thermal Performance (°C/W) . in. . . . . . TO- Thermal Performance (°C/W) . in. . . . . . • Mount heat spreader onto power Thermal Impedance (°C-in./W) . in.() . . . . . converter PCB or onto motor control PCB Thermal Impedance (°C-in./W) . in.() . . . . . Thermal Impedance (°C-in./W) . in.() . . . . .
Configurations Available: ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual • Sheet form, roll form and die-cut parts application performance is directly related to the surface roughness, flatness and pressure applied. Shelf Life: The double-sided, pressure sensitive adhesive used in BOND PLY Building a Part Number Standard Options products requires the use of dual liners to BP–– . –– NA || example NA ® Selected standard option. If not selecting a standard protect the surfaces from contaminants. option, insert company name, drawing number, and Henkel recommends a -month shelf revision level. Section E Section C Section B Section A Section D life at a maximum continuous storage ® " x " sheets, ® " x -foot rolls temperature of °C or -month shelf or ® custom configuration life at a maximum continuous storage ® No adhesive temperature of °C, for maintenance of Standard thicknesses available: .", .", ." controlled adhesion to the liner. The shelf BP ® BOND-PLY Material life of the BOND PLY material, without Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. consideration of liner adhesion (which is often not critical for manual assembly processing), is recommended at months from date of manufacture at a maximum continuous storage temperature of °C. | Thermal Interface Selection Guide — BOND-PLY
BOND PLY
Thermally Conductive, Unreinforced, Pressure Sensitive Adhesive Tape
Features and Benefits TYPICAL PROPERTIES OF BOND-PLY • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Easy application Color White White Visual Thickness (in.) / (mm) . to . . to . ASTM D • Eliminates need for external hardware Glass Transition (°F) / (°C) - - ASTM E (screws, clips, etc.) Continuous Use Temp. (°F) / (°C) - to - to — • Available with easy release tabs ADHESION Lap Shear @ RT (psi) / (mPa) . ASTM D Lap Shear after hrs. @ °C . ASTM D Lap Shear after mins. @ °C . ASTM D ELECTRICAL VALUE TEST METHOD Dielectric Breakdown Voltage (Vac.) , ASTM D Flame Rating V-O UL THERMAL Thermal Conductivity (W/m-K) . ASTM D THERMAL PERFORMANCE VS. PRESSURE Initial Assembly Pressure (psi for seconds) TO- Thermal Performance (°C/W) . in. . . . . . Thermal Impedance (°C-in./W)() .
BERGQUIST BOND PLY is an ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual unreinforced, thermally conductive, application performance is directly related to the surface roughness, flatness and pressure applied. pressure sensitive adhesive tape. The tape is supplied with protective topside Shelf Life: The double-sided pressure sensitive adhesive used in BOND PLY products tabs and a carrier liner. BOND PLY is requires the use of dual liners to protect the surfaces from contaminants. Henkel designed to attain high bond strength to a recommends a -month shelf life at a maximum continuous storage temperature of variety of “low energy” surfaces, including °C, or -month shelf life at a maximum continuous storage temperature of °C, many plastics, while maintaining high for maintenance of controlled adhesion to the liner. The shelf life of the BOND PLY bond strength with long-term exposure to material, without consideration of liner adhesion (which is often not critical for manual heat and high humidity. assembly processing), is recommended at months from date of manufacture at a maximum continuous storage temperature of °C. Typical Applications Include: Building a Part Number Standard Options Secure: BP–– .–– / NA || example • Heat sink onto BGA graphic processor NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and • Heat sink to computer processor revision level. Section E Section C Section B Section A Section D • Heat sink onto drive processor / ® " x -foot rolls or ® custom configuration • Heat spreader onto power converter PCB ® No adhesive • Heat spreader onto motor control PCB Standard thicknesses available: .", ." BP ® BOND-PLY Material Configurations Available: Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. • Die-cut parts (supplied on rolls with easy release, protective tabs) Thermal Interface Selection Guide — BOND-PLY |
BOND PLY P
Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape
Features and Benefits TYPICAL PROPERTIES OF BOND-PLY §§P • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Highly puncture-resistant polyimide Color Light Brown Light Brown Visual reinforcement carrier Reinforcement Carrier Polyimide Film Polyimide Film — Thickness (in.) / (mm) . . ASTM D • Double-sided pressure sensitive Glass Transition (°F) / (°C) - - ASTM E adhesive tape Continuous Use Temp. (°F) / (°C) - to - to — • Provides a mechanical bond, ADHESION eliminating the need for mechanical fasteners or screws Lap Shear @ RT (psi) / (mPa) . ASTM D Lap Shear after hrs. @ °C . ASTM D BOND PLY P is a thermally Lap Shear after mins. @ °C . ASTM D conductive, electrically insulating, double- ELECTRICAL VALUE TEST METHOD sided pressure sensitive adhesive tape. Dielectric Breakdown Voltage (VAC) , ASTM D The tape consists of a high performance, Flame Rating V-O UL thermally conductive acrylic adhesive THERMAL coated on both sides of a polyimide film. Thermal Conductivity (W/m-K) . ASTM D Use BOND PLY P in applications to THERMAL PERFORMANCE VS. PRESSURE replace mechanical fasteners or screws. Initial Assembly Pressure (psi for seconds) TO- Thermal Performance (°C/W) . . . . . Typical Applications Include: Thermal Impedance (°C-in./W)() . . . . . • Heat sink onto BGA graphic processor ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. • Heat sink onto drive processor • Heat spreader onto power Shelf Life: The double-sided pressure sensitive adhesive used in BOND PLY products converter PCB requires the use of dual liners to protect the surfaces from contaminants. Henkel • Heat spreader onto motor control PCB recommends a -month shelf life at a maximum continuous storage temperature of °C, or -month shelf life at a maximum continuous storage temperature of °C, Configurations Available: for maintenance of controlled adhesion to the liner. The shelf life of the BOND PLY • Roll form and die-cut parts material, without consideration of liner adhesion (which is often not critical for manual The material as delivered will assembly processing), is recommended at months from date of manufacture at a include a continuous base liner with maximum continuous storage temperature of °C. differential release properties to allow for simplicity in roll packaging and Building a Part Number Standard Options application assembly. BPP–– . –– / NA || example NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D ® " x " Sheets, / ® " x ' rolls or ® custom configuration
® No adhesive
Standard thicknesses available: ."
BPP ® BOND-PLY P Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. | Thermal Interface Selection Guide — BOND-PLY
BOND PLY
Thermally Conductive, Fiberglass-Reinforced Pressure Sensitive Adhesive Tape
Features and Benefits TYPICAL PROPERTIES OF BOND-PLY • Thermal impedance: .°C-in./W (@ psi) PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • High bond strength to most epoxies Color Gray Gray Visual and metals Reinforcement Carrier Fiberglass Fiberglass — Thickness (in.) / (mm) ., . ., . ASTM D • Double-sided, pressure sensitive Elongation (·, ° to Warp & Fill) ASTM D adhesive tape Tensile Strength (psi) / (mPa) , ASTM D • High performance, thermally CTE (um/m-°C), -°C to Æ°C ASTM D conductive acrylic adhesive Continuous Use Temp. (°F) / (°C) - to - to — • More cost-effective than heat- ADHESION cure adhesive, screw mounting or Lap Shear @ RT (psi) / (mPa)() . ASTM D clip mounting ELECTRICAL VALUE TEST METHOD Dielectric Breakdown Voltage (Vac.), . , ASTM D Dielectric Breakdown Voltage (Vac.), . , ASTM D Dielectric Constant (, Hz) . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O UL THERMAL Thermal Conductivity (W/m-K) . ASTM D THERMAL PERFORMANCE VS. PRESSURE Initial Assembly Pressure (psi for seconds) TO- Thermal Performance (°C/W), . . . . . . TO- Thermal Performance (°C/W), . . . . . . Thermal Impedance (°C-in./W), .() . . . . . BOND PLY is a thermally conductive, Thermal Impedance (°C-n./W), .() . . . . . electrically isolating double-sided tape. ) Tested per ASTM D with aluminum lap shear samples, psi applied for seconds then pressure removed. . square inch BOND PLY sample. ) The ASTM D test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual BOND PLY is used in lighting application performance is directly related to the surface roughness, flatness and pressure applied. applications that require thermal transfer and electric isolation. High bond strengths Building a Part Number Standard Options obtained at ambient temperature lead BP–– .–– NA || example to significant processing cost savings in NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and labor, materials and throughput due to revision level. Section E Section C Section B Section A the elimination of mechanical fasteners Section D ® " x " sheets, ® " x ' rolls and high temperature curing. or ® custom configuration
® Standard double-sided adhesive Typical Applications Standard thicknesses available: .", ." Include: BP ® BOND-PLY Material • Mount LED assembly to troffer housing Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. • Mount LED assembly to heat sink • Mount heat spreader onto power converter PCB or onto motor control PCB • Mount heat sink to BGA graphic processor or drive processor Configurations Available: • Sheet form, roll form and die-cut parts Thermal Interface Selection Guide — BOND-PLY | ¥
BOND PLY LMS-HD
Laminate Material – Silicone, High Durability, Optional Lamination Methods
Features and Benefits TYPICAL PROPERTIES OF BOND-PLY LMS-HD • TO- thermal performance: .°C/W, initial pressure only lamination PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Exceptional dielectric strength Color Yellow Yellow Visual Reinforcement Carrier Fiberglass Fiberglass — • Very low interfacial resistance Thickness (in.) / (mm) . to . . to . ASTM D • psi adhesion strength Continuous Use Temp. (°F) / (°C) - to - to — • Continuous use of - to °C ADHESION • Eliminates mechanical fasteners Lap Shear @ RT (psi) / (mPa) . ASTM D ELECTRICAL VALUE TEST METHOD Breakdown Voltage, Sheet (Vac.)() , ASTM D Breakdown Voltage, Laminated (Vac.)() , ASTM D Dielectric Constant (, Hz) . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O UL THERMAL Post-Cured Thermal Conductivity (W/m-K)() . ASTM D THERMAL IMPEDANCE VS. LAMINATION METHOD Lamination Pressure ( psi)() Constant IPO TO- Thermal Performance (°C/W) . . CURE SCHEDULE BOND PLY LMS-HD is a thermally Cure @ °C (mins.)() () conductive heat curable laminate Cure @ °C (mins.) ) The ASTM D test method on cured LMS-HD material. No pressure was applied to the LMS-HD during the cure cycle. material. The product consists of a high ) A / in. diameter probe was laminated with LMS-HD to a in. X in. plate at psi for seconds, then cured with no pressure at °C for minutes. The cured assembly was then tested per ASTM D. This LMS-HD sample resembles a typical lamination application. performance thermally conductive low ). The ASTM D (Bergquist Modified) test procedure was used on post-cured LMS-HD material. The recorded value includes interfacial thermal resistance. These values are given for customer reference only. modulus silicone compound coated ). TO- Thermal Performance testing, per The Bergquist RD specification for laminates, was completed on laminated TO- assemblies. Lamination was completed at psi for seconds for “IPO” (Initial Pressure Only) and at a constant psi during the lamination and curing process for “Constant.” No on a cured core, and double lined with additional pressure was applied during TO- thermal performance testing. protective films. The low modulus silicone ). Cure Schedule – time after cure temperature is achieved at the interface. Ramp time is application dependent. design effectively absorbs mechanical stresses induced by assembly-level Configurations Available: CTE mismatch, shock and vibration • Roll form while providing exceptional thermal • Die-cut parts performance (vs. PSA technologies) and • Sheet form long-term integrity. BOND PLY LMS-HD will typically be used for structurally Shelf Life: BOND PLY LMS-HD is a heat-cured material and should be stored in adhering power components and PCBs to temperature controlled conditions. The recommended storage temperature range of a heat sink. -°C should be used to maintain optimum characteristics for a -month shelf life.
Liner Building a Part Number Standard Options Overall Uncured Thickness Silicone Cured Core Fiberglass Dispersion BPLMSHD–– . –– / NA
Liner NA ® Selected standard option. If not selecting a standard Note: Not to scale option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D Typical Applications Include: ® " x " Sheets, / ® " x ' rolls • Discrete semiconductor packages bonded to heat spreader or heat sink ® No adhesive Standard thicknesses available: .", .", .", ."
BPLMSHD ® BOND-PLY LMS-HD Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. ¥¦ | Thermal Interface Selection Guide — LIQUI-BOND
LIQUI BOND EA (Two-Part)
Thermally Conductive, Liquid Epoxy Adhesive
Features and Benefits TYPICAL PROPERTIES OF LIQUI-BOND EA • Room temperature cure PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Room temperature storage Color / Part A Grey Grey Visual • Thermal Conductivity: . W/m-K Color / Part B Pale Yellow Pale Yellow Visual • Eliminates need for Viscosity / Part A, High Shear (Pa·s)() ASTM D mechanical fasteners Viscosity / Part B, High Shear (Pa·s)() ASTM D • Maintains structural bond in Density (g/cc) . . ASTM D severe environment applications Mix Ratio By Volume : : — Shelf Life @ °C (months) — • Excellent chemical and mechanical stability PROPERTY AS CURED Hardness (Shore D)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — Shear Strength (psi) / (mPa)() . ASTM D ELECTRICAL AS CURED Dielectric Strength (V/mil) / (V/mm) , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL AS CURED Thermal Conductivity (W/m-K) . . ASTM D cure schedule Cure @ °C (hrs.) — LIQUI BOND EA is a two-component, Cure @ °C (mins.)() — ) Capillary Viscosity, /sec., Part A and B measured separately. epoxy based, liquid-dispensable adhesive. ) Thirty-second delay value Shore D hardness scale. LIQUI BOND EA has a thermal ) Al to Al, cured at room temperature ) · cure cycle - time after cure temperature is achieved at the interface. Ramp time is application dependent. conductivity of . W/mK. LIQUI BOND EA will be supplied in a Typical Applications: two-component format, and refrigeration • LED lighting is not required. • Power supplies LIQUI BOND EA has a high bond • Discrete component to heat spreader strength with room temperature • Automotive lighting cure that can be accelerated with • White goods additional heat. The high bond strength eliminates the need for fasteners and Configurations Available: maintains structural bond in severe • Supplied in cartridge or kit form environments. Recommended usage is filling any surface irregularities between Building a Part Number Standard Options heat sources and heat spreaders of LBEA –– –– cc NA || example similar CTE. LIQUI BOND EA is NA ® Selected standard option. If not selecting a standard option, insert company name, drawing number, and thixotropic and will remain in place revision level. Section E Section C Section B Section A during dispensing, and the material Section D Cartridges: c c ® .cc, cc ® .cc, cc ® .cc will flow easily under minimal pressure, Kits: cc ® .cc, or G ® gallon resulting in thin bond lines and very Working time - minutes ® No spacer beads low stress placed on fragile components ® ." spacer beads during assembly. ® ." spacer beads LBEA ® LIQUI-BOND EA Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — LIQUI-BOND | ¥
LIQUI BOND SA (One-Part)
Thermally Conductive, Liquid Silicone Adhesive
Features and Benefits TYPICAL PROPERTIES OF LIQUI-BOND SA • High thermal performance PROPERTY AS SUPPLIED IMPERIAL VALUE METRIC VALUE TEST METHOD • Eliminates need for mechanical fasteners Color Black Black Visual Viscosity (cPs)() , , ASTM D • Low viscosity for ease of screening Density (g/cc) . . ASTM D or stenciling Shelf Life @ °C (months) — • Can achieve a very thin bond line PROPERTY AS CURED ® PHYSICAL • Mechanical and chemical stability Hardness (Shore A) ASTM D • Maintains structural bond in Continuous Use Temp. (°F) / (°C) - to - to — severe environment applications Shear Strength (psi) / (mPa) . ASTM D • Heat cure PROPERTY AS CURED ® ELECTRICAL Dielectric Strength (V/mil) / (V/mm) , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL PROPERTY AS CURED ® THERMAL Thermal Conductivity (W/m-K) . . ASTM D CURE SCHEDULE Pot Life @ °C (hrs.)() — Cure @ °C (mins.)() — Cure @ °C (mins.)() —
) Brookfield RV, Heli-path, Spindle TF @ rpm, °C. ) Based on / in. diameter bead. ) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent. LIQUI BOND SA is a thermally conductive, one-part liquid silicone Typical Applications Include: adhesive with a low viscosity for easy • PCBA to housing screenability. LIQUI BOND SA • Discrete component to heat spreader features a high thermal performance and maintains its structure even in Configurations Available: severe environment applications. • With or without glass beads LIQUI BOND SA features excellent low and high temperature mechanical Building a Part Number Standard Options and chemical stability. The material’s LBSA–– –– cc NA || example NA ® Selected standard option. If not selecting a standard mild elastic properties assist in relieving option, insert company name, drawing number, and CTE stresses during thermal cycling. revision level. Section E Section C Section B Section A Section D Cartridges: cc ® .cc, cc ® .cc (ml) LIQUI BOND SA contains no Pail: .G ® .-gallon, G ® -gallon cure by-products, cures at elevated ® No adhesive temperatures and requires refrigeration ® No spacer beads storage at °C. The material is ® ." spacer beads LBSA ® LIQUI-BOND SA Liquid Adhesive available in both tube and mid-sized Material container forms. Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. ¥ | Thermal Interface Selection Guide — LIQUI-BOND
LIQUI BOND SA (One-Part)
Thermally Conductive, Liquid Silicone Adhesive
Features and Benefits TYPICAL PROPERTIES OF LIQUI-BOND SA • High thermal conductivity: . W/m-K PROPERTY AS SUPPLIED IMPERIAL VALUE METRIC VALUE TEST METHOD • Eliminates need for mechanical fasteners Color Black Black Visual Viscosity (cPs)() , , ASTM D • Low viscosity for ease of screening Density (g/cc) . . ASTM D or stenciling Shelf Life @ °C (months) — • Maintains structural bond in severe PROPERTY AS CURED ® PHYSICAL environment applications Hardness (Shore A) ASTM D • Heat cure Continuous Use Temp. (°F) / (°C) - to - to — Shear Strength (psi) / (mPa) . ASTM D PROPERTY AS CURED ® ELECTRICAL Dielectric Strength (V/mil) / (V/mm) , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL PROPERTY AS CURED ® THERMAL Thermal Conductivity (W/m-K) . . ASTM D CURE SCHEDULE Pot Life @ °C (hrs.)() — Cure @ °C (mins.)() — Cure @ °C (mind.)() —
) Brookfield RV, Heli-path, Spindle TF @ rpm, °C. LIQUI BOND SA is a high ) Based on / in. diameter bead. performance, liquid silicone adhesive that ) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent. cures to a solid bonding elastomer. The adhesive is supplied as a one-part liquid Typical Applications Include: component, offered in a tube or mid-size • PCB assembly to housing container. • Discrete component to heat spreader LIQUI BOND SA features a combination of high thermal conductivity Configurations Available: with a low viscosity which allows for • With or without glass beads ease of screen or stencil application. This material is also ideal for high volume Building a Part Number Standard Options automated pattern dispensing. LBSA–– –– cc NA || example NA ® Selected standard option. If not selecting a standard LIQUI BOND SA ’s low viscosity option, insert company name, drawing number, and allows the material to achieve a very thin revision level. Section E Section C Section B Section A Section D bond line, producing excellent thermal Cartridges: cc ® .cc, cc ® .cc (ml) Pail: .G ® .-gallon, G ® -gallon performance and a high shear strength. ® No adhesive The mild elastic properties of ® No spacer beads ® ." spacer beads LIQUI BOND SA assist in relieving LBSA ® LIQUI-BOND SA (One-Part) CTE stresses during thermal cycling. The Liquid Adhesive Material material cures at elevated temperatures Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. and requires refrigeration storage at °C. LIQUI BOND SA is available with optional glass beads to provide a consistent stand-off and ensure dielectric integrity. Thermal Interface Selection Guide — LIQUI-BOND | ¥
LIQUI BOND SA (One-Part)
Thermally Conductive, Liquid Silicone Adhesive
Features and Benefits TYPICAL PROPERTIES OF LIQUI-BOND SA • High thermal conductivity: . W/m-K PROPERTY AS SUPPLIED IMPERIAL VALUE METRIC VALUE TEST METHOD • Eliminates need for mechanical fasteners Color Yellow Yellow Visual Viscosity (cPs)() , , ASTM D • One-part formulation for easy Density (g/cc) . . ASTM D dispensing Shelf Life @ °C (months) — • Mechanical and chemical stability PROPERTY AS CURED ® PHYSICAL • Maintains structural bond in Hardness (Shore A) ASTM D severe environment applications Continuous Use Temp. (°F) / (°C) - to - to — • Heat cure Shear Strength (psi) / (mPa) . ASTM D PROPERTY AS CURED ® ELECTRICAL Dielectric Strength (V/mil) / (V/mm) , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL PROPERTY AS CURED ® THERMAL Thermal Conductivity (W/m-K) . . ASTM D CURE SCHEDULE Pot Life @ °C (hrs.)() — Cure @ °C (mins.)() — Cure @ °C (mins.)() —
) Brookfield RV, Heli-path, Spindle TF @ rpm, °C. ) Based on / in. diameter bead. LIQUI BOND SA is a high ) Cure Schedule - time after cure temperature is achieved at the interface. Ramp time is application dependent. performance, thermally conductive silicone adhesive that cures to a solid Typical Applications Include: bonding elastomer. LIQUI BOND • PCBA to housing SA is supplied as a one-part liquid • Discrete component to heat spreader component, in either tube or mid-sized container form. Configurations Available: LIQUI BOND SA features excellent • With or without glass beads low and high-temperature mechanical and chemical stability. The material’s Building a Part Number Standard Options mild elastic properties assist in relieving LBSA–– –– cc NA || example NA ® Selected standard option. If not selecting a standard CTE stresses during thermal cycling. option, insert company name, drawing number, and LIQUI BOND SA cures at elevated revision level. Section E Section C Section B Section A Section D temperatures and requires refrigeration Cartridges: cc ® .cc, cc ® .cc (ml) Pail: .G ® .-gallon, G ® -gallon storage at °C. ® No adhesive ® No spacer beads ® ." spacer beads LBSA ® LIQUI-BOND SA Liquid Adhesive Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. ¥ | Thermal Interface Selection Guide — LIQUI-BOND
LIQUI BOND SA (Two-Part)
Thermally Conductive, Liquid Silicone Adhesive
Features and Benefits TYPICAL PROPERTIES OF LIQUI-BOND SA • Thermal conductivity: . W/m-K PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD • Eliminates need for mechanical fasteners Color / Part A Brown Brown Visual Color / Part B Light Grey Light Grey Visual • Room temperature storage Viscosity / Part A, High Shear (Pa·s)() ASTM D • Maintains structural bond in Viscosity / Part B, High Shear (Pa·s)() ASTM D severe environment applications Density (g/cc) . . ASTM D • Heat cure Mix Ratio : : — Shelf Life @ °C (months) — PROPERTY AS CURED Color Light Brown Light Brown Visual Hardness (Shore A)() ASTM D Continuous Use Temp. (°F) / (°C) - to - to — Shear Strength (psi) / (mPa) . ASTM D ELECTRICAL AS CURED Dielectric Strength (V/mil) / (V/mm) , ASTM D Dielectric Constant (, Hz) . . ASTM D Volume Resistivity (Ohmmeter) ASTM D Flame Rating V-O V-O UL THERMAL AS CURED LIQUI BOND SA is a high Thermal Conductivity (W/m-K) . . ASTM D performance, thermally conductive, CURE SCHEDULE () liquid adhesive. This material is supplied Pot Life @ °C mins. ( hrs.) mins. ( hrs.) — Cure @ °C (mins.)() — as a two-part material and requires Cure @ °C (mins.)() — no refrigeration. ) Capillary Viscosity, /sec., Part A and B measured separately. ) Thirty-second delay value Shore A hardness scale. The mixed material cures at ) Based on / in. diameter bead. ) Cure schedule — time after cure temperature is achieved at the interface. Ramp time is application dependent. elevated temperatures. As cured, LIQUI BOND SA provides a strong bonding, form-in-place elastomer. The Typical Applications: material’s mild elastic properties assist • Power supplies in relieving CTE stresses during thermal • Discrete component to heat spreader cycling. • PCBA to housing Liquid dispensed thermal materials offer infinite thickness variations and impart Configurations Available: little to no stress on sensitive components • Supplied in cartridge or kit form during assembly. LIQUI BOND SA is available with optional glass spacer beads Building a Part Number Standard Options –––– to provide a consistent bond line and LBSA cc NA || example NA ® Selected standard option. If not selecting a standard ensure dielectric integrity. option, insert company name, drawing number, and revision level. Section E Section C Section B Section A Section D Cartridges: cc ® .cc, cc ® .cc Kits: cc ® .cc, or G ® gallon
Pot Life: ® minutes ® No spacer beads ® ." spacer beads ® ." spacer beads LBSA ® LIQUI-BOND SA Material Note: To build a part number, go to www.bergquistcompany.com/Part_Number_Builder.php. Thermal Interface Selection Guide — Ordering | ¥
SIL PAD Configurations
Imperial Measurements
LEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . .
PART PART PLASTIC NUMBER DIMENSIONS PLASTIC NUMBER DIMENSIONS POWER SUFFIX “A” “B” “C” “D” POWER SUFFIX “A” “B” “C” “D” Various - . . . . Various - . . . . (Clip Mount) - . . Various - . . . . TO- - . . . Various - . . TO- Various - . . . . Various - . . . . Various - . . . . Various - . . . . TO- - . . . . Various - . . . . TO- - . . . . Various - . . . . Various - . . . . Various - . . . . TO- - . . . . Various - . . . . TO- - . . . . TO-P - . . . . Various - . . . . Various - . . . . TO- - . . . . Various - . . . . Various - . . . . Various - . . . . Various - . . . . Various - . . . . TO- - . . . . Various - . . . . Various - . . . . Various - . . . . Various - . . . . Various - . . Various - . . . . Various - . . . . Various - . . . . Various - . . . . DIMENSIONS POWER MODULE PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” - . . . . . . - . . . . . . DIMENSIONS PLASTIC POWER PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . . - . . . . . . . DIMENSIONS PLASTIC POWER PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” - . . . . . . . . DIMENSIONS POWER RESISTORS PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” “I” RH- - . . . . . . . . . RH- - . . . . . . . . . RH- - . . . . . . . . . RH- - . . . . . . . . . RH- - . . . . . . . . . RH- - . . . . . . . . .
TO ¦ DIMENSIONS MULTIPLES PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” ¯ OF HOLES Parts - . . . . . . Parts - . . . . . . - . . . . . . - . . . . . . - . . . . . . - . . . . . . - . . . . . .
DIMENSIONS POWER MODULE PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” - . . . . . . - . . . . . . - . . . . . . - . . . . . . ¥ | Thermal Interface Selection Guide — Ordering
SIL PAD Configurations
Imperial Measurements
C D-DIA E DIMENSIONS MULTIWATT PART NUMBER SUFFIX “A” “B” “C” “D” “E” B - . . . . . x ° - . . . . . x °
A DIMENSIONS MULTILEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” - . . . . . .
PART NUMBER DIMENSIONS PART NUMBER DIMENSIONS DIODE WASHER SUFFIX “A” “B” DIODE WASHER SUFFIX “A” “B” Various - . . Various - . . DO- - . . Various - . . DO- - . . Various - . . DO- (oversized) - . . DO- - . . DO- (oversized) - . . Various - . . Various - . . Various - . . Various - . . Various - . . Various - . . Various - . . Various - . . Various - . .
DIMENSIONS TO PART NUMBER SUFFIX “A” “B” “C” - . . .
DIMENSIONS SMALL POWER DEVICES PART NUMBER SUFFIX “A” “B” “C” TO-, Holes - . . . TO-, Holes - . . . TO-, Holes - . . . TO-, Holes - . . . TO-, Holes - . . . TO-, Holes - . . .
DIMENSIONS RECTIFIER PART NUMBER SUFFIX “A” “B” “C” - . . . - . . . - . . .
DIMENSIONS TIP PACKAGES PART NUMBER SUFFIX “A” “B” “C” “D” “E” Clip Mount - . . . TIP- Plastic Tip - . . . . . TO-P - . . . . . Plastic Clip - . . . . .
DIMENSIONS POWER MODULE PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . . - . . . . . . .
DIMENSIONS C D SIP PACKAGE PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . . B
A DIMENSIONS QUARTZ PART NUMBER SUFFIX “A” “B” “C” “D”
E F RAD (TYP) - . . . .
B C DIMENSIONS D (2) G Dia POWER MODULE PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” A - . . . . . . . Thermal Interface Selection Guide — Ordering | ¥
SIL PAD Configurations
Imperial Measurements
TO & TO DIMENSIONS STYLE PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . I - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . F DIA. A - . . . . . . . - . . . . . . . D DIA. (4) - . . . . . . . B - Leadless . . . . C DIA. - . . . . . . . (2) 18¡ G¡ - . . . . . . . E - . . . . . . . - . . . . . . . - . . . . . . ..
LEAD DIMENSIONS TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” “I” - . . . . . . . . .
DIMENSIONS LEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . ° - . . . . . . °
DIMENSIONS LEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . ° .
DIMENSIONS ¦ LEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” - . . . . . . . .°
DIMENSIONS LEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” - . . . . . . . .
DIMENSIONS ¥ LEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” - . . . . . . . °
DIMENSIONS POWER MODULE PART NUMBER SUFFIX “A” “B” “C” “D” “E” - . . . . .
D E
B
C - DIA. (2) A ¥ | Thermal Interface Selection Guide — Ordering
SIL PAD Configurations
Metric Measurements
DIMENSIONS LEAD TO§§ PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . .
PART PART PLASTIC NUMBER DIMENSIONS PLASTIC NUMBER DIMENSIONS POWER SUFFIX “A” “B” “C” “D” POWER SUFFIX “A” “B” “C” “D” Various - . . . . Various - . . . . (Clip - . . Various - . . . . TO- Mount) TO- - . . . . Various - . . Various - . . . . Various - . . . . Various - . . . . Various - . . . . TO- - . . . . Various - . . . . TO- - . . . . Various - . . . . Various - . . . . Various - . . . . TO- - . . . . Various - . . . . TO- - . . . . TO-P - . . . . Various - . . . . Various - . . . . TO- - . . . . Various - . . . . Various - . . . . Various - . . . . Various - . . . . Various - . . . . TO- - . . . . Various - . . . . Various - . . . . Various - . . . . Various - . . . . Various - . . Various - . . . . Various - . . . . Various - . . . . Various - . . . . DIMENSIONS POWER MODULE NUMBER SUFFIX “A” “B” “C” “D” “E” “F” - . . . . . . - . . . . . . DIMENSIONS PLASTIC POWER PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . . - . . . . . . . DIMENSIONS PLASTIC POWER PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” - . . . . . . . . DIMENSIONS POWER RESISTORS PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” “I” RH- - . . . . . . . . . RH- - . . . . . . . . . RH- - . . . . . . . . . RH- - . . . . . . . . . RH- - . . . . . . . . . RH- - . . . . . . . . . DIMENSIONS TO MULTIPLES PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” ® OF HOLES Parts - . . . . . . Parts - . . . . . . - . . . . . . - . . . . . . - . . . . . . - . . . . . . - . . . . . . DIMENSIONS POWER MODULE PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” - . . . . . . - . . . . . . - . . . . . . - . . . . . . Thermal Interface Selection Guide — Ordering | ¥¥
SIL PAD Configurations
Metric Measurements
C D-DIA E DIMENSIONS MULTIWATT PART NUMBER SUFFIX “A” “B” “C” “D” “E”
B - . . . . . x ° - . . . . . x °
A DIMENSIONS MULTI LEAD TO§§ PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” - . . . . . .
PART NUMBER DIMENSIONS PART NUMBER DIMENSIONS DIODE WASHER SUFFIX “A” “B” DIODE WASHER SUFFIX “A” “B” Various - . . Various - . . DO- - . . Various - . . DO- - . . Various - . . DO- (oversized) - . . DO- - . . DO- (oversized) - . . Various - . . Various - . . Various - . . Various - . . Various - . . Various - . . Various - . . Various - . . - . .
DIMENSIONS TO§ PART NUMBER SUFFIX “A” “B” “C” - . . .
DIMENSIONS SMALL POWER DEVICES PART NUMBER SUFFIX “A” “B” “C” TO-, Holes - . . . TO-, Holes - . . . TO-, Holes - . . . TO-, Holes - . . . TO-, Holes - . . . TO-, Holes - . . .
DIMENSIONS RECTIFIER PART NUMBER SUFFIX “A” “B” “C” - . . . - . . . - . . .
DIMENSIONS TIP PACKAGES PART NUMBER SUFFIX “A” “B” “C” “D” “E” Clip Mount - . . . TIP- Plastic Tip - . . . . . TO-P - . . . . . Plastic Clip - . . . . .
DIMENSIONS POWER MODULE PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . . - . . . . . . .
DIMENSIONS C SIP PACKAGE PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” D - . . . . . . .
B DIMENSIONS A POWER MODULE PART NUMBER SUFFIX “A” “B” “C” “D”
E F RAD - . . . . (TYP)
B PART NUMBER DIMENSIONS C POWER MODULE SUFFIX “A” “B” “C” “D” “E” “F” “G” D (2) G Dia
A - . . . . . . . ¦¦ | Thermal Interface Selection Guide — Ordering
SIL PAD Configurations
Metric Measurements
DIMENSIONS TO STYLE PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . I - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . - . . . . . . . F DIA. A - . . . . . . . - . . . . . . . D DIA. (4) - Leadless . . . .
B - . . . . . . . C DIA. - . . . . . . . (2) 18¡ G¡ - . . . . . . . E - . . . . . . . - . . . . . . .
DIMENSIONS LEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” “I” - . . . . . . . . .
DIMENSIONS LEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . . ° - . . . . . . °
DIMENSIONS LEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” - . . . . . ° .
DIMENSIONS LEAD TO PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” - . . . . . . . .°
DIMENSIONS LEAD TO§§ PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” - . . . . . . . .
DIMENSIONS LEAD TO§§ PART NUMBER SUFFIX “A” “B” “C” “D” “E” “F” “G” “H” - . . . . . . . °
DIMENSIONS POWER MODULE PART NUMBER SUFFIX “A” “B” “C” “D” “E” - . . . . .
D E
B
C - DIA. (2) A Thermal Interface Selection Guide — Ordering | ¦
HI FLOW Configurations
Imperial Measurements HIFLOW UT/§UT Tab Configurations
.+.
COLORED PSA TAPE DIMENSIONS ¯° . ± PART NUMBER SUFFIX “A” “B” “C” MIN. PCS./ROLL LINER .+. - . . . , MATERIAL PSA STRIP - . . . , ("B") CLEAR PSA TAPE - . . . , .+. .+. LINER - . . . , - . . . , - . . . , ("B") - . . . ,
("A") ("A")
("C")
HI-FLOW Configurations
Metric Measurements HIFLOW UT/§UT Tab Configurations
+ . . DIMENSIONS ¯° . ± COLORED PSA TAPE PART NUMBER SUFFIX “A” “B” “C” MIN. PCS./ROLL LINER .+. - . . . , MATERIAL PSA STRIP - . . . ,
("B") CLEAR PSA TAPE - . . . , .+. .+. LINER - . . . , - . . . , - . . . , ("B") - . . . ,
("A") ("A")
("C") ¦ | Thermal Interface Selection Guide — Ordering
Solutions for Surface Mount Applications
HI-FLOW The HI FLOW family of phase change materials offers an easy-to-apply thermal interface for many surface mount packages. At the phase change temperature, HI FLOW materials change from a solid and flow with minimal applied pressure. This characteristic optimizes heat transfer by maximizing wet-out of the interface. HI FLOW is commonly used to replace messy thermal grease. BERGQUIST phase change materials are specially compounded to prevent pump-out of the interface area, which is often associated with thermal grease. Typical applications for HI FLOW materials include: • High performance CPUs and integrated circuits • DC/DC converters • Power modules HI-FLOW materials are manufactured with or without film or foil carriers. Custom shapes and sizes for non-standard applications are also available.
Power Device
THERMAL CLAD HI-FLOW Heat Spreader High Power Application HI-FLOW with THERMAL CLAD
Heat Spreader Processor HI-FLOW FR- Board High Power Application HI-FLOW without THERMAL CLAD
SIL PAD SIL PAD sets a benchmark in thermal interface materials. The SIL PAD family of materials is thermally conductive and electrically insulating. Available in custom shapes, sheets, and rolls, SIL PAD materials come in a variety of thicknesses and are frequently used in SMT applications such as: • Interface between thermal vias in a PCB, and a heat sink or casting • Heat sink interface to many surface mount packages
Power Device
SIL PAD or BOND-PLY FR- Heat Spreader Mid Power Application with BOND-PLY or SIL PAD Thermal Interface Selection Guide — Ordering | ¦
Where Thermal Solutions Come Together
BONDPLY and LIQUIBOND The BOND PLY family of materials is thermally conductive and electrically isolating. BOND PLY is available in a pressure sensitive adhesive or laminating format. BOND PLY provides for the mechanical decoupling of bonded materials with mismatched thermal coefficients of expansion. LIQUI BOND is a high thermal performance liquid silicone adhesive that cures to a solid bonding elastomer. Typical applications include: • Bonding bus bars in a variety of electronic modules and sub-assemblies • Attaching a metal-based component to a heat sink • Bonding a heat sink to a variety of ASIC, graphic chip and CPU packages • Bonding flexible circuits to a rigid heat spreader or thermal plane • Assembly tapes for BGA heat spreader • Attaching PCB assemblies to housings GAP PAD and Gap Filler GAP PAD and Gap Filler product families are highly conformable, thermally conductive materials in pad or liquid dispensable format. Varying degrees of thermal conductivity and compression deflection characteristics are available. Typical applications include: • On top of a semiconductor package such as a QFP or BGA. Often times, several packages with varying heights can use a common heat sink when using GAP PAD. • Between a PCB or substrate and a chassis, frame, or other heat spreader • Areas where heat needs to be transferred to any type of heat spreader • For interfacing pressure sensitive devices • Filling various gaps between heat-generating devices and heat sinks or housings GAP PADs are available in thickness of . in. to . in., and in custom shapes, with or without adhesive. Gap Fillers are available in cartridge or kit form. Heat Spreader GAP PAD or GAP FILLER Power Device
FR- Board Lower Power Application with GAP PAD
Top Efficiency In Thermal Materials For Today’s Changing Technology. Contact Henkel for additional information regarding our thermal solutions. We are constantly innovating to offer you the greatest selection of options and flexibility to meet today’s changing technology. ¦ | Thermal Interface Selection Guide — Ordering
Ordering Information
Ordering Procedure: Typical Configuration Tolerances: The last or digits define the part number selected. The • Roll width: ¶. in. (. mm) for standard widths ( in., in., in., etc.) “footprint” and dimensions are shown on pages -. • SIL PAD sheet: -. in. / Æ. in. (-. mm / Æ. mm) Special Shapes: • GAP PAD sheet: -. in. / Æ. in. (-. mm / Æ. mm) For applications requiring non-standard or custom SIL PAD • Typical SIL PAD roll length: -foot to -foot configurations, contact your Henkel Sales Representative. We • Typical number of splices per roll: produce thousands of custom die shapes and designs. • Typical butt splice: -sided colored tape • Material thickness tolerances: SIL PAD ¶. in. Tolerances: (. mm) Typical converting tolerances are held on length (L), width GAP PAD VO ¶· GAP PAD S-Class ¶· (W), hole diameter and hole location for most materials as noted below: Note: Tighter tolerances are available per factory review. TYPICAL SIL PAD / HIFLOW TOLERANCES Sheets: Part ( ) Length and Width Rule Defined Hole Location Dimension Tolerance Features () and Diameter Standard sheet size for most materials is in. x in., with or Ê in. ¶ . in. (. mm) ¶ . in. (. mm) ¶ . in. (. mm) without adhesive as specified on the individual data sheet.
in. - in. ¶ . in. (. mm) ¶ . in. (. mm) ¶ . in. (. mm) When ordering sheets, please specify material type, thickness and include all dimensions. Contact Henkel Sales if other sizes ¸ in. ¶ . in. (. mm) ¶ . in. (. mm) ¶ . in. (. mm) are required. TYPICAL GAP PAD TOLERANCES Note: SIL PAD A maximum sheet size is in. x in. GAP Material Hole Location Length and Width Tolerance Thickness and Diameter PAD standard sheet size is in. x in. mil ¶ . in. (. mm) ¶ . in. (. mm)
mil ¶ . in. (. mm) ¶ . in. (. mm) Rolls:
mil ¶ . in. (. mm) ¶ . in. (. mm) SIL PAD materials are available in roll form, with or without
mil ¶ . in. (. mm) ¶ . in. (. mm) adhesive, with the exception of SIL PAD and SIL PAD .
mil ¶ . in. (. mm) ¶ . in. (. mm) HI FLOW materials are available in roll form. Certain GAP PAD materials are available in roll form. Please contact Henkel Sales mil ¶ . in. (. mm) ¶ . in. (. mm) for more information. mil ¶ . in. (. mm) ¶ . in. (. mm) mil ¶ . in. (. mm) ¶ . in. (. mm) Color Matching: mil ¶ . in. (. mm) ¶ . in. (. mm) We identify product color as a reference product characteristic mil ¶ . in. (. mm) ¶ . in. (. mm) and/or specification for SIL PAD and GAP PAD products. Slight mil ¶ . in. (. mm) ¶ . in. (. mm) color variation is normal across lot-to-lot splicing due to the mil ¶ . in. (. mm) ¶ . in. (. mm) different variations in natural colorants used to achieve the mil ¶ . in. (. mm) ¶ . in. (. mm) desired hue and shade in these products. We continue to monitor
mil ¶ . in. (. mm) ¶ . in. (. mm) and control incoming raw material specifications and production processes to ensure the highest possible mil ¶ . in. (. mm) ¶ . in. (. mm) consistency of quality and product performance. If you have mil ¶ . in. (. mm) ¶ . in. (. mm) any questions regarding color matching, please contact
) Material thicknesses: Ê in. (.mm), - in. (.-.mm), ¸ in. (.mm). Henkel Product Management. ) Rule defined by geometry can be notches, internal shapes not created by a punch or cutouts that are created by a rule and not a punch. ) GAP PAD VO materials have a SIL PAD Side / Cutline tolerance of parts on the liner to within ¶ . in. (.mm) typically, GAP PAD may deform to the standard tolerances when handled or removed from the liner.
Note: Dependent upon material and application requirements, tighter tolerances may be feasible and available. Please contact Henkel Sales for these requests and additional information regarding tolerances. Thermal Interface Selection Guide — Ordering | ¦
Ordering Information
Adhesives: BERGQUIST adhesives include: Acrylic Adhesives: One () year from date of manufacture when stored in original packaging at °F (°C) and · SILICONE: (AC) - Unloaded relative humidity. (ACA) - Unloaded, Low Tack (TAC) - Loaded (Thermally Enhanced) Peel adhesion data is available upon request. Please contact Henkel Sales for more information. ACRYLIC: (AAC) - Unloaded (TAAC) - Thermally Loaded PSA Characteristics: (EAAC) - Thermally Enhanced Standard pressure sensitive adhesive coated on one side of a THICKNESS: . in. - . in., (-µm) SIL PAD will increase the thermal resistance (per ASTM D) (adhesive only) by .°C-in./W. Standard pressure sensitive adhesive on two Note: For non-symmetrical parts, please indicate on print which sides increases the thermal impedance by .°C-in. /W. side the adhesive is on. Thermally conductive pressure sensitive adhesive on one side increases the thermal resistance by .°C-in./W and on two Peel Strength: See data below. sides by .°C-in./W. POL ® Peel-Off Liner (force per unit width of the liner to The effect of an adhesive layer on the thermal impedance in an the adhesive) application will vary. In low-pressure applications, the pressure QS ® Quick Stick (simulated force per unit width of the adhesive sensitive adhesive will wet-out the interface easier and eliminate to the heat sink) the interfacial thermal resistance. g/in. ® Grams per inch UL Recognition: TYPICAL ADHESIVE PROPERTIES ADHESIVE POL QS For information regarding the UL (Underwriters Laboratories, Silicone AC - g/in. - g/in. Inc.) recognition status of Henkel (BERGQUIST) SIL PAD, Silicone ACA - g/in. - g/in. GAP PAD and HI FLOW materials, the UL web site provides the Silicone TAC - g/in. - g/in. most current information. Acrylic AAC - g/in. - g/in. Using the URL: http://www.ul.com, select “Online Certification Acrylic TAAC - g/in. - g/in. Directory.” You may then enter one of the following file numbers Acrylic EAAC - g/in. - g/in. for the applicable BERGQUIST file: Note: These values are typical after the material has aged for - QMFZ.E: Plastics – Component. This category includes all weeks and are significantly different immediately after coating. SIL PAD, GAP PAD and HI FLOW materials. Upon completion of coating, QS is - g/in. and POL is - QOQW.E: Polymeric Adhesive Systems, Electrical g/in. for all silicone adhesives. Equipment – Component. This category includes Shelf Life: BOND PLY adhesive only. Silicone Adhesives: Six () months from date of manufacture In each group there is a “Guide Information” section which gives when stored in original packaging at °F (°C) and · a detailed description of the categories listed and all recognized relative humidity. materials will be listed with supporting data.
August All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product for its intended use, and the user assumes all risks and liability whatsoever in connection there-with. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
© Copyright , Henkel Corporation. All rights reserved. ®
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