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Thermal Interface Materials Table of Contents Selection Guide Thermal Interface Materials Table of Contents Introduction . 2 Thermal Properties and Testing 4 Interface Material Selection Guide 5 GAP PAD Thermally Conductive Materials . 6 GAP PAD Comparison Data 7 Frequently Asked Questions 8 GAP PAD VO 9 GAP PAD VO Soft 10 GAP PAD VO Ultra Soft 11 GAP PAD HC 3.0 12 GAP PAD HC 5.0 13 GAP PAD 1000HD 14 GAP PAD 1000SF 15 GAP PAD HC1000 16 GAP PAD 1450 17 GAP PAD 1500 18 GAP PAD 1500R 19 GAP PAD 1500S30 20 GAP PAD A2000 21 GAP PAD 2000S40 22 GAP PAD 2200SF 23 GAP PAD A3000 24 GAP PAD 3500ULM 25 GAP PAD 5000S35 26 GAP PAD EMI 1.0 27 Gap Filler Liquid Dispensed Materials and Comparison Data . 28 Frequently Asked Questions 29 Gap Filler 1000 (Two-Part) 30 Gap Filler 1000SR (Two-Part) 31 Gap Filler 1100SF (Two-Part) 32 Gap Filler 1400SL (Two-Part) 33 Gap Filler 1500 (Two-Part) 34 Gap Filler 1500LV (Two-Part) 35 Gap Filler 2000 (Two-Part) 36 Gap Filler 3500LV (Two-Part) 37 Gap Filler 3500S35 (Two-Part) 38 Gap Filler 4000 (Two-Part) 39 Thermal Interface Compounds Comparison and FAQs. 40 TIC 1000A 41 TIC 4000 42 LIQUI-FORM 2000 43 LIQUI-FORM 3500 44 HI-FLOW Phase Change Interface Materials. 45 HI-FLOW Comparison Data 46 Frequently Asked Questions 47 HI-FLOW 105 48 HI-FLOW 225F-AC 49 HI-FLOW 225UT 50 Thermal Interface Selection Guide | HIFLOW P HIFLOW UT HIFLOW HIFLOW P Thermally Conductive Insulators Frequently Asked Questions Choosing SIL PAD Thermally Conductive Insulators SIL PAD Comparison Data Mechanical, Electrical and Thermal Properties SIL PAD Thermally Conductive Insulator Selection Table SIL PAD SIL PAD SIL PAD S SIL PAD SIL PAD ST SIL PAD SIL PAD A SIL PAD ST SIL PAD SIL PAD A SIL PAD K- SIL PAD K- SIL PAD K- QPAD II QPAD POLYPAD POLYPAD POLYPAD K- POLYPAD K- SIL PAD Tubes BONDPLY and LIQUIBOND Adhesives ...................... ­ BONDPLY and LIQUIBOND Comparison Data and FAQs BONDPLY BONDPLY BONDPLY P BONDPLY BONDPLY LMS-HD LIQUIBOND EA (Two-Part) LIQUIBOND SA (One-Part) LIQUIBOND SA (One-Part) LIQUIBOND SA (One-Part) LIQUIBOND SA (Two-Part) Ordering ............................................... SIL PAD Configurations HIFLOW Configurations Solutions for Surface Mount Applications .................... Where Thermal Solutions Come Together .................... Ordering Information ..................................... | Thermal Interface Selection Guide — INTRODUCTION Henkel. Developing solutions for the electronics industry. Proven thermal management solutions and problem-solving partnership. We make it our business to know your business. We understand your problems. We also know that there will always be a better way to help you reach your goals and objectives. To that end, our company continually invests considerable time and money into research and development. Henkel is in the business of solving problems. With our history and experience in the electronics industry, our experts can help find ways to improve your process, control and manage heat, and back it all with exceptional service. Let us show you the value Henkel offers. Thermal Interface Selection Guide — INTRODUCTION | GLOBAL SUPPORT with locations in North America, THERMAL Asia and Europe, and sales staff in INNOVATION MANAGEMENT LEADER 30 countries Henkel’s BERGQUIST thermal Our solutions to control and solutions were often developed for manage heat in electronic specific customer requests assemblies and printed circuit boards are used by many of the world’s largest OEMs in a wide range of industries WHY Henkel? Henkel, the leading solution provider for adhesives, sealants and functional coatings worldwide, uses high-quality BERGQUIST thermal management products—like BERGQUIST TCLAD, BERGQUIST SIL PAD and BERGQUIST LIQUI-BOND—to offer technological solutions for electronics. Beyond that, we work closely with our customers to understand your problems and deliver technologically advanced solutions backed by exceptional service. GLOBAL SUPPLY CHAIN R&D to maintain a reliable supply of Over 10 R&D Centers around the products to our customers world staffed by 3,000 design and application professionals BROAD PRODUCT PORTFOLIO that includes LOCTITE, TECHNOMELT and BERGQUIST products | Thermal Interface Selection Guide — INTRODUCTION Thermal Properties and Testing Thermal Conductivity Thermal Resistance The time rate of heat flow through a unit area producing a unit The opposition to the flow of heat through a unit area of material temperature difference across a unit thickness. across an undefined thickness. Thermal conductivity is an inherent or absolute property of Thermal resistance varies with thickness. the material. Test Methods – ASTM D Thermal Impedance A property of a particular assembly measured by the ratio of the temperature difference between two surfaces to the steady-state heat flow through them. Factors affecting thermal impedance include: Area: Increasing the area of thermal contact decreases thermal impedance. in. diameter stack (ref. in.) – - psi, hour per layer Thickness: Increasing the insulator thickness increases thermal impedance. Pressure: Increasing mounting pressure under ideal conditions decreases thermal impedance. Time: Thermal impedance decreases over time. Measurement: Thermal impedance is affected by the method of temperature measurement. Thermal Impedance Per BERGQUIST TO- Thermal Performance (°C Cold Plate Testing) i Thermal Interface Selection Guide — INTRODUCTION | Interface Material Selection Guide PRODUCT OVERVIEW INTERFACE APPLICATIONS MOUNTING METHODS TYPICAL CONVERTED OPTIONS MARKET APPLICATIONS PRODUCTS FOR DEVICES POWER DISCRETE COMPUTERS, SUPPLIES, POWER THRUHOLE TELECOM COMPONENTS: POWER ACTIVE INDUCTORS, CAPACITORS, RESISTORS FOR MODULES ELECTRONIC WIPER AND MOTOR AUTOMOTIVE: ETC. ANTILOCK, CONTROLS, FOR MODULES ELECTRONIC SUPPLIES POWER AND TELECOM CPU, APPLICATIONS: COMPUTER I DRIVES HARD ASICS, GPU, INSULATOR ELECTRICAL PRESSURE LOW CLIP, PRESSURE HIGH SCREW/RIVETS, APPLICABLE NOT STOCK SHEET CONTINUOUS FORM, ROLL CONFIGURATIONS STANDARD SHAPES EXTERNAL CUSTOM FEATURES INTERNAL CUSTOM OFFERINGS PSA STANDARD QPAD II T TTT TT AAAAAA QPAD T TTT TT AAAAAA HIFLOW T AS AS T AAAAAA Grease Replacement Materials HIFLOW G T TT T AS AAAAAA HIFLOW F-AC T T T AAA AS HIFLOW UT T T AS AA AS HIFLOW UT TT T AS AA AS HIFLOW T TT AAAAAA Grease Replacement HIFLOW P T TT AAAAAA Materials - Insulated HIFLOW P T TT AAAAA Bonding - Thin Film BONDPLY P T TTT TAAAAA BONDPLY T TTT TAAAAA Bonding - Fiberglass BONDPLY T TTT TAAAAA Bonding - Unreinforced BONDPLY T TTT T AAAA Bonding - Laminates BONDPLY LMS-HD T T AS T TAAAAA SIL PAD T TT TTT AAAAAA SIL PAD T TT TT AAAAAA SIL PAD S T TT TTT AAAAAA SIL PAD T TT T T AAAAAA SIL PAD ST T TT TTT AAAAA SIL PAD - Fiberglass SIL PAD T TT TTT AAAAAA SIL PAD A T TT TTT AAAAAA SIL PAD ST T TT TTT AAAAA SIL PAD T TT T AS AAAAAA SIL PAD A T TT T AS T AAAAAA SIL PAD K- T TT TTT AAAAAA SIL PAD - Thin Film Polyimide SIL PAD K- T TT TTT AAAAAA SIL PAD K- T TT TTT AAAAAA GAP PAD VO TTTTTTT A A* AA AS A GAP PAD VO Soft TTTTTTT A A* A A AS A GAP PAD VO Ultra Soft TTTTTTT A A* AA AS A GAP PAD HC . TTTTTTT A A* AA AS A GAP PAD HC . TTTTTTT A A* AA AS A GAP PAD HD TTTTTTT A A* AA AS A GAP PAD SF TTTTTTT A AA AS GAP PAD HC TT TTT A A* AAA GAP PAD TT TTT A A* AAA GAP PAD GAP PAD TT TTT A A* AA AS GAP PAD R TTT TTT A A* AAA GAP PAD S TTTT AS TT A AAA GAP PAD A TT T AS TT A A* AAA GAP PAD S TT T AS TT A AAA GAP PAD SF TTTTTTT A AA AS GAP PAD A TTTT AS TT A A* AAA GAP PAD ULM TTTT AS TT A A* AAA GAP PAD S TTTT AS TT AAA Gap Filler TTT AS T NA Gap Filler SR TTT AS T NA Gap Filler SF TTTT AS T NA Gap Filler SL AS T AS NA Gap Filler TTT AS T NA Gap Filler Gap Filler LV TTT AS T NA Gap Filler TTT AS T NA Gap Filler LV TTT AS T NA Gap Filler S TTT AS T NA Gap Filler TTT AS T NA LIQUIBOND EA T T AS T NA LIQUIBOND SA T T AS T NA Liquid Adhesive LIQUIBOND SA T T AS T NA LIQUIBOND SA T T AS T NA LIQUIBOND SA T T AS T NA T ® Typical; AS ® Application-Specific (contact Henkel Sales); A ® Available; * ® Roll stock configurations are limited — contact your Henkel Sales Representative for more information. Note: For HIFLOW UT, F-AC and HIFLOW UT, the adhesive is not a pressure sensitive adhesive (PSA). | Thermal Interface Selection Guide — GAP PAD GAP PAD Thermally Conductive Materials Solution-Driven Thermal Management Products for Electronic Devices A Complete Range of Choices for Filling Air Gaps and Enhancing Thermal Conductivity The BERGQUIST brand is a world leader in thermal interface The extensive GAP PAD family provides an effective thermal materials. The GAP PAD family of products was developed interface between heat sinks and electronic devices where to meet the electronic industry’s growing need for interface uneven surface topography, air gaps and rough surface textures materials with greater conformability, higher thermal are present. Henkel application specialists work closely with performance and easier application. customers to specify the proper GAP PAD material for each unique thermal management requirement. Features Benefits Options Applications Each of the many products GAP PAD thermal products Some GAP PAD products have GAP PAD products are well- within the GAP PAD family are designed to improve special features for particular suited to a wide variety of is unique in its construction, an assembly’s thermal applications, including: electronics, automotive, properties and performance. performance and reliability • Available with or medical, aerospace and Following is an overview of the while saving time and money.
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