Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond
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WP-Tests-Flying-Prob
What Electronics Manufacturers Test and Inspect For, and Why It Matters Authors: Dan Kreider, Test Engineer, Axiom Electronics; John Kim, Manufacturing Engineer, Axiom Electronics October 2017 Test is extremely important when manufacturing low-volume/high-complexity electronics in critical applications, such as secure communications, target acquisition and destruction, or in space applications where the assembly is usually on a one-way trip that will not receive ser- vice calls. This white paper addresses what manufacturers test for and details the important testing and inspection routines from receiving the Printed Circuit Board (PCB) to testing the completed Printed Circuit Board Assembly (PCBA). Defective ICs and bad fabs are rare, and ICs. Boundary scan can be an effective test they can be difficult to detect with our auto- mode for highly complex boards. mated testers. Flying probe test strategy basi- cally assumes the Printed Circuit Board (PCB) Open solder/missing components is the is good (tested at the PCB fabrication facility). most common assembly defect category. Both A defective IC may be shorted or open across flying probe and ICT (bed-of-nails) test for a set of pins. This may lead to a failure of an these issues, particularly for passive and dis- automated test like flying probe or ICT, or it crete components. Lifted pins on IC legs (or may affect a diode junction or capacitance open solder joints on BGAs) can be detected test, otherwise the defect may go undetected. in many cases. It is possible to measure the protection diodes built into many ICs to detect JTAG/boundary-scan testing is effective at open/shorted pins or defective components. -
Integrated Circuit Test Engineering Iana.Grout Integrated Circuit Test Engineering Modern Techniques
Integrated Circuit Test Engineering IanA.Grout Integrated Circuit Test Engineering Modern Techniques With 149 Figures 123 Ian A. Grout, PhD Department of Electronic and Computer Engineering University of Limerick Limerick Ireland British Library Cataloguing in Publication Data Grout, Ian Integrated circuit test engineering: modern techniques 1. Integrated circuits - Verification I. Title 621.3’81548 ISBN-10: 1846280230 Library of Congress Control Number: 2005929631 ISBN-10: 1-84628-023-0 e-ISBN: 1-84628-173-3 Printed on acid-free paper ISBN-13: 978-1-84628-023-8 © Springer-Verlag London Limited 2006 HSPICE® is the registered trademark of Synopsys, Inc., 700 East Middlefield Road, Mountain View, CA 94043, U.S.A. http://www.synopsys.com/home.html MATLAB® is the registered trademark of The MathWorks, Inc., 3 Apple Hill Drive Natick, MA 01760- 2098, U.S.A. http://www.mathworks.com Verifault-XL®, Verilog® and PSpice® are registered trademarks of Cadence Design Systems, Inc., 2655 Seely Avenue, San Jose, CA 95134, U.S.A. http://www.cadence.com/index.aspx T-Spice™ is the trademark of Tanner Research, Inc., 2650 East Foothill Blvd. Pasadena, CA 91107, U.S.A. http://www.tanner.com/ Apart from any fair dealing for the purposes of research or private study, or criticism or review, as permitted under the Copyright, Designs and Patents Act 1988, this publication may only be reproduced, stored or transmitted, in any form or by any means, with the prior permission in writing of the publishers, or in the case of reprographic reproduction in accordance with the terms of licences issued by the Copyright Licensing Agency. -
We Are Boundary-Scan
...We are boundary-scan. WWW.JTAG.COM datasheet Production Systems Stand-alone production system Production integration systems (DLL, LV, LW, TS, VB, .NET and EXE) Symphony and OEM systems ...We are boundary-scan. Production Systems DATA SHEET DATA SHEET Features • Broad set of production alternatives for stand-alone and integrated operation • Execution of all JTAG Technologies boundary-scan applications developed on ProVision or ‘Classic’ platforms • Player for SVF, JAM and STAPL files from third-party sources • Results collection for analysis at repair station • Built-in report generator and ticket printing facility In addition, boundary-scan can simplify test fixtures • Password-protected entry levels and product handling when compared to conventio- • Support for all popular National Instruments’ plat- nal test and programming methods such as in-circuit forms (bed-of-nails) testing and off-line device program- • Support for Microsoft Visual Basic, C, C++, ming. JTAG Technologies tools are ideal for proto- and .NET type hardware debugging and device programming, • Fault analysis to pin-level via BSD (Boundary- Scan production testing and in-system programming (ISP) Diagnostics) and JTAG Visualizer and field service. • Open architecture - links can be provided to virtu- ally all third-party ATE systems. Application development and validation Boundary-scan applications are typically prepared Overview of boundary-scan and validated by test engineering teams or individu- The JTAG Technologies product line is focused on als using the highly automated JTAG Technologies testing printed circuit boards (PCBs) and systems and ProVision development tool (Figure 1) or the prior includes on-board device programming features, all generation known as JTAG Classic. -
JTAG/IEEE 1149.1 Design Considerations
JTAG/IEEE 1149.1 Design Considerations Application Report 1996 Advanced System Logic Products Printed in U.S.A. SCTA029 1196–CP JTAG/IEEE 1149.1 Design Considerations Data Book 1996 Advanced System Logic Products Printed in U.S.A. SCTA029 1196–CP Application Report JTAG/IEEE 1149.1 Design Considerations SCTA029 1 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be directed to TI through a local SC sales office. -
Thesis Electronic In-Circuit PCB Testers Identifier PCB Tester
i ELECTRONIC IN-CIRCUIT PCB TESTERS & IDENTIFIER PCB TESTER by W.P.Kotze July 1989 A thesis submitted in partial fulfillment of· the requirements for the Master Diploma in Technology in Electrical Engineering (Light Current) at the Cape Technikon. ii SUMMARY various types of electronic card test equipment are freely available today for different types of electronic printed circuit boards. A company certainly wants to pick the most suitable tester to suit their needs, and more importantly a tester that will fit into their bUdget. Today a company can easily import in-circuit testers that will cost well in the reglon of six figures. The cheaper the equipment go, the less features one can expect from the equipment. Like all other big decisions in life, this might also be a tough one for a company. Part one of this thesis will consider most of these questions, and will also give more insight on what type of specifications to look for. This section will also explain the different types of faults that occur, the repair costs involved, different types of card testers available and some of their features. Advanced in-circuit testing techniques will also be explained. Part two of this thesis describes the design and development of the Identifier Card Tester. The"Program Control and Impulse Sender Card", (referred to as "Identifier Card") is one of the cards used in a system called "Electronic Identifier". The electronic identifier was developed to enable a subscriber directory number, a line or equipment numbers, or in general, the origin of information and classes-of-service to be determined by way of an existing connection within a telephone exchange. -
Dft) for Embedded Board Test
Design for Test (DfT) for Embedded Board Test Foresighted Board Level Design for Optimal Testability and Coverage Content 1. Design for Test - Embedded Board Test .................................................................................................. 5 1.1 Why Design for Test? ......................................................................................................................... 5 1.2 Why should you care about Embedded Board Test? ..................................................................... 5 1.3 Embedded Board Test Elements ....................................................................................................... 7 2. Chip Level DfT .............................................................................................................................................. 9 2.1 Insert IEEE 1149.1 functionality into ASICs .................................................................................... 9 2.2 Insert BIST functionality into ASICs ................................................................................................. 9 3. Board Level DfT – Main ICs ...................................................................................................................... 10 3.1 Select IEEE 1149.1 compliant ICs, if possible or necessary ........................................................ 10 3.2 Request accurate BSDL files from IC manufacturers ................................................................... 11 3.3 Verify standard compliance of the BSDL files