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Thesis Electronic In-Circuit PCB Testers Identifier PCB Tester

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Thesis Electronic In-Circuit PCB Testers Identifier PCB Tester i ELECTRONIC IN-CIRCUIT PCB TESTERS & IDENTIFIER PCB TESTER by W.P.Kotze July 1989 A thesis submitted in partial fulfillment of· the requirements for the Master Diploma in Technology in Electrical Engineering (Light Current) at the Cape Technikon. ii SUMMARY various types of electronic card test equipment are freely available today for different types of electronic printed circuit boards. A company certainly wants to pick the most suitable tester to suit their needs, and more importantly a tester that will fit into their bUdget. Today a company can easily import in-circuit testers that will cost well in the reglon of six figures. The cheaper the equipment go, the less features one can expect from the equipment. Like all other big decisions in life, this might also be a tough one for a company. Part one of this thesis will consider most of these questions, and will also give more insight on what type of specifications to look for. This section will also explain the different types of faults that occur, the repair costs involved, different types of card testers available and some of their features. Advanced in-circuit testing techniques will also be explained. Part two of this thesis describes the design and development of the Identifier Card Tester. The"Program Control and Impulse Sender Card", (referred to as "Identifier Card") is one of the cards used in a system called "Electronic Identifier". The electronic identifier was developed to enable a subscriber directory number, a line or equipment numbers, or in general, the origin of information and classes-of-service to be determined by way of an existing connection within a telephone exchange. The system was designed for the purpose of incorporating it into the existing public exchanges where no identifier wires are available. It operates on the principle of a switching circuit (line) tester. The identification pulses are evaluated with the aid of 6 mm bistable magnetic ring cores according to the current steering principle. The program control and the output circuit uses a transistor, a magnetic core/transistor or a magnetic core/thyristor circuit. The electronic identifier is mostly used with "Routiners" in Electra-mechanical exchanges. The biggest percentage of failures on these systems are caused by the Identifier Card and hence the request for the development of a "Identifier Card Tester". Hi SCOPE PART 1: To investigate the techniques and features of the differen types of Card Testers available. PART 2: To describe the design and development of the "Identifie Card Tester". iv CONTENTS PART 1: CARD TESTERS 1.0 INTRODUCTION. 1.1 Types of PC faults after assembly. p.l 1.2 Types of faults during field-service. p.3 1.3 Repair cost. p.4 2.0 DIGITAL TEST EQUIPMENT: 2.1 Sixteen-pin logic monitor. p.5 2.2 Trendar-Faultrack 200. p.5 2.3 A portable logic card tester. p.8 2.4 Factron testers. p.9 2.5 PST-I00 Pre-screening test system. p.l0 3.0 TECHNIOUES OF ADVANCED IN CIRCUIT TESTING: 3.1 Manual testing. p.l1 3.2 Automatic test equipment. p.ll 3.3 Bed of nails. p.12 3.4 Testing components. p.15 3.5 Type of configurations. p.19 3.6 Advanced analog testing features. p.19 3.7 Digital testing. p.20 3.8 Timing generators. p.27 3.9 Requirements for a test program. p.30 3.10 Debugging. p.31 3.11 Fault isolation. p.34 3.12 Testing features. p.34 4.0 SURFACE-MOUNT TESTING (FLUKE 9100): 4.1 Automated testing of surface-mount boards. p.36 4.2 Automated testing solutions. p.37 4.3 Design solutions. p.37 4.4 Equipment configuration for automated testing/troubleshooting. p.38 4.5 9100 Series digital tester and troubleshooter. p.38 4.6 The benefits of automation. p.43 4.6.3 Better management. v 5.0 LATEST TECHNOLOGY OF TESTING: 5.1 Infra-red testing of assembled printed circuit boards. p.46 5.2 Three step process. P.47 5.3 Software. p.47 5.4 Test results. p.49 5.5 Applications. p.49 6.0 IN-CIRCUIT ECONOMICS: 6.1 Repair ratio. p.50 6.2 Turning data into information. p.51 6.3 controlling the uncontrollable. p.51 6.4 Cut spare board inventory by 30% with distributed repair. p.52 6.5 ATE :A cost-effective solution. p.60 6.6 Conclusions. p.61 7.0 REFERENCES: p.62 PART 2 : IDENTIFIER CARD TESTER 1.0 INTRODUCTION: p.63 1.1 Purpose of the Identifier Card Tester. p.63 1.2 General circuit description of the p.66 1.3 Design considerations. p.73 2.0 DESIGN IMPLEMENTATION: p.74 2.1 Block diagram of Identifier Card Tester. p.74 2.2 Timing module. p.77 2.3 Pulse Sender module. p.85 2.4 Driver Interface module. p.91 2.5 Display Interface module. p.98 2.6 Display unit. p.105 2.7 Comparator module. p.107 2.8 Power module. p.1l3 vi 3.0 TESTING: p.120 3.1 Modifications. p.120 3.2 Commissioning. p.120 4.0 CONCLUSION: p.121 5.0 REFERENCES: p.122 PART 1: LIST OF FIGURES : 2.2.1 Basic method of IC testing with the Faultrack 200. 3.7.2 A J-K FjF in clock feedback with a nand gate. 4.5.1 Automated test and troubleshooting system. 6.4.1 Centralized repair philosophy. 6.4.5.1 Normal repair pipeline. 6.4.5.2 Board 'Float' repair pipeline. 6.4.6 Distributed repair philosophy. PART 2: LIST OF FIGURES : 1.1 The Identifier System in the auto-mechanical exchange. 1.2 The "Program control and Impulse Sender" card (Identifier card). 1.3 The "Identifier" card tester with outrigger ( two Identifier cards plug-in). vii 2.1.1 Face plate removed from Identifier card tester. 2.1. 2 Identifier block diagram. 2.2.2 Timing diagram of Timing module. 2.2.3 Circuit diagram of Timing module. 2.2.5.1 PC board layout (Silk screen) of Timing module. 2.2.5.2 PC board layout (Component side) of Timing module. 2.2.5.3 PC board layout (Solder side) of Timing module. 2.3.2 Circuit diagram of Pulse Sender module. 2.3.4.1 PC board layout (Silk screen) of Pulse Sender module. 2.3.4.2 PC board layout (Component side) of Pulse Sender module. 2.3.4.3 PC board layout (Solder side) of Pulse Sender module. 2.4.2 Circuit diagram of Driver Interface module. 2.4.3 Timing diagram of input signals to Identifier card. 2.4.5.1 PC board layout (Silk screen) of Driver Interface module. 2.4.5.2 PC board layout (Component side) of Driver Interface module. 2.4.5.3 PC board layout (Solder side) of Driver Interface module. 2.5.2 Circuit diagram of Display Interface module. 2.5.4.1 PC board layout (Silk screen) of Display Interface module. 2.5.4.2 PC board layout (Component side) of Display Interface module. viii 2.5.4.3 PC board layout (Solder side) of Display Interface module. 2.6.2 Circuit diagram of Display unit. 2.7.2 Circuit diagram of Comparator module. 2.7.4.1 PC board layout (silk screen) of comparator module. 2.7.4.2 PC board layout (Component side) of comparator module. 2.7.4.3 PC board layout (Solder side) of comparator module. 2.8.2 Circuit diagram of Power module. 2.8.4.1 PC board layout (Silk screen) of Power module. 2.8.4.2 PC board layout (Component side) of Power module. 2.8.4.3 PC board layout (Solder side) of Power module. 1 1.0 INTRODUCTION There are two types of repairs or testing: The first type will be just after assembly, (a new factory card) and the other type will be a card already in use. The two types of repairs will not have the same major fault categories, and therefore the two repair or testing lines will be different. 1.1 TYPES OF PC FAULTS AFTER ASSEMBLY: It appears that two major fault categories may be found after assembly, namely Catastrophic faults and Dynamic faults. 1.1.1 CATASTROPHIC FAULTS: FAULTS SYMPTOMS MOST COMMON CAUSES 11 OCCURRENCE I I 11 11 Shorts * Electrical * Solder process. 25% - 75% conduction in * Mechanical defect. the wrong place. Dry- * No electrical * Over etched tracks. 5% - 25% joints conduction where * Mechanical defects. there should be. * Solder process. * Repair process. Wrong * Component * possible human 10% - 25% component installed in the error. wrong place. Backward * Improperly * Possible human 5% -20% component mounted error. component. Out of * Value of part * No incoming 20% - 40% tolerance does not meet inspection. specification. Missing * Component not * Possible human 10% - 20% Component installed. error. Dead or * Defective * No incoming partially component inspection. dead * Exposure to heat 10% - 40% device during solder or repair process. * Infant mortality. 2 1.1.2 DYNAMIC FAULTS: FAULTS SYMPTOMS MOST COMMON CAUSES 11 OCCURRENCE I I 11 11 Dynamic * Too slow * No incoming 1% - 10% on the device inspection. component * Set up and * Change in vendors. level. hold problem. * Cycle time problem. Dynamic * Interactive/ * Usually some 1% - 10% on the functional tweaking of a design board problems which is pushed to level. involving the its limits and/or the communication combined results of between two or component level more devices. dynamic problems. 3 1.2 TYPES OF FAULTS DURING FIELD-SERVICE: Also two types of fault categories: 1.2.1 Catastrophic faults: , FAULTS SYMPTOMS 11 MOST COMMON CAUSE 11 OCCURRENCE! 11 Shorts.
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