Towards Soft Errors∗
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Radiation-Induced Soft Errors in Advanced Semiconductor Technologies Robert C
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, VOL. 5, NO. 3, SEPTEMBER 2005 305 Radiation-Induced Soft Errors in Advanced Semiconductor Technologies Robert C. Baumann, Fellow, IEEE Invited Paper Abstract—The once-ephemeral radiation-induced soft error has bit upset (SBU). While MBUs are usually a small fraction of become a key threat to advanced commercial electronic compo- the total observed SEU rate, their occurrence has implications nents and systems. Left unchallenged, soft errors have the poten- for memory architecture in systems utilizing error correction tial for inducing the highest failure rate of all other reliability mechanisms combined. This article briefly reviews the types of [3], [4]. Another type of soft error occurs when the bit that failure modes for soft errors, the three dominant radiation mech- is flipped is in a critical system control register such as that anisms responsible for creating soft errors in terrestrial applica- found in field-programmable gate arrays (FPGAs) or dynamic tions, and how these soft errors are generated by the collection of random access memory (DRAM) control circuitry, so that the radiation-induced charge. The soft error sensitivity as a function error causes the product to malfunction [5]. This type of soft of technology scaling for various memory and logic components is then presented with a consideration of which applications are most error, called a single event interrupt (SEFI), obviously impacts likely to require soft error mitigation. the product reliability since each SEFI leads to a direct product malfunction as opposed to typical memory soft errors that may Index Terms—Radiation effects, reliability, single-event effects, soft errors. -
MARS-C: Modeling and Reduction of Soft Errors in Combinational Circuits
MARS-C: Modeling and Reduction of Soft Errors in Combinational Circuits Natasa Miskov-Zivanov, Diana Marculescu Department of Electrical and Computer Engineering Carnegie Mellon University {nmiskov,dianam}@ece.cmu.edu ABSTRACT completely masked before it reaches the latch; Due to the shrinking of feature size and reduction in supply voltages, • latching-window masking – only if the glitch reaches the latch nanoscale circuits have become more susceptible to radiation induced and satisfies setup and hold time conditions, it will be latched. transient faults. In this paper, we present a symbolic framework based In this work, we estimate the likelihood that a transient fault will on BDDs and ADDs that enables analysis of combinational circuit lead to a soft error. Our main goal is to allow for symbolic modeling reliability from different aspects: output susceptibility to error, and efficient estimation of the susceptibility of a combinational logic influence of individual gates on individual outputs and overall circuit circuit to soft errors. We further use this framework to reduce the cost reliability, and the dependence of circuit reliability on glitch duration, of radiation hardening techniques by selectively resizing the gates that amplitude, and input patterns. This is demonstrated by the set of have the largest impact on circuit error. experimental results, which show that the mean output error The rest of this paper is organized as follows. In Section 2 we susceptibility can vary from less than 0.1%, for large circuits and outline the contribution of our work. In Section 3 we give an overview small glitches, to about 30% for very small circuits and large enough of related work. -
Scaling and Technology Issues for Soft Error Rates Allan
Presented at the 4th Annual Research Conference on Reliability, Stanford University, October 2000 Scaling and Technology Issues for Soft Error Rates Allan. H. Johnston Jet Propulsion Laboratory California Institute of Technology Pasadena, California Abstract - The effects of device technology and scaling on Figure 2 shows how various contributions to the soft error rates are discussed, using information obtained from terrestrial error rate are affected by critical charge [3]. The both the device and space communities as a guide to determine work was done with SRAM cells, fabricated with a 0.35 µm the net effect on soft errors. Recent data on upset from high- CMOS process. For critical charge < 35 fC it is possible to energy protons indicates that the soft-error problem in DRAMs and microprocessors is less severe for highly scaled devices, in upset the cell with alpha particles. The largest contribution contrast to expectations. Possible improvements in soft-error from alphas comes from solder, but there is also a significant rate for future devices, manufactured with silicon-on-insulator contribution from impurities in the metallization. By technology, are also discussed. increasing the critical charge it is possible to eliminate errors from alpha particles, but terrestrial neutrons are still able to I. INTRODUCTION induce errors. The gradual decrease in neutron-induced error Soft-errors from alpha particles were first reported by rate with increasing critical charge is due to the distribution May and Woods [1], and considerable effort was spent by the of neutron energies, which extends over a very wide range. semiconductor device community during the ensuing years to Figure 2. -
Increasing Reliability and Fault Tolerance of a Secure Distributed Cloud Storage
Increasing reliability and fault tolerance of a secure distributed cloud storage Nikolay Kucherov1;y, Mikhail Babenko1;yy, Andrei Tchernykh2;z, Viktor Kuchukov1;zz and Irina Vashchenko1;yz 1 North-Caucasus Federal University,Stavropol,Russia 2 CICESE Research Center,Ensenada,Mexico E-mail: [email protected], [email protected], [email protected], [email protected], [email protected] Abstract. The work develops the architecture of a multi-cloud data storage system based on the principles of modular arithmetic. This modification of the data storage system allows increasing reliability of data storage and fault tolerance of the cloud system. To increase fault- tolerance, adaptive data redistribution between available servers is applied. This is possible thanks to the introduction of additional redundancy. This model allows you to restore stored data in case of failure of one or more cloud servers. It is shown how the proposed scheme will enable you to set up reliability, redundancy, and reduce overhead costs for data storage by adapting the parameters of the residual number system. 1. Introduction Currently, cloud services, Google, Amazon, Dropbox, Microsoft OneDrive, providing cloud storage, and data processing services, are gaining high popularity. The main reason for using cloud products is the convenience and accessibility of the services offered. Thanks to the use of cloud technologies, it is possible to save financial costs for maintaining and maintaining servers for storing and securing information. All problems arising during the storage and processing of data are transferred to the cloud provider [1]. Distributed infrastructure represents the conditions in which competition for resources between high-priority computing tasks of data analysis occurs regularly [2]. -
Radiation Hardening Efficiency of Gate Sizing and Transistor Stacking Based on Standard Cells
Radiation hardening efficiency of gate sizing and transistor stacking based on standard cells Y.Q. Aguiar, Frédéric Wrobel, S. Guagliardo, J.-L. Autran, P. Leroux, F. Saigné, A.D. Touboul, V. Pouget To cite this version: Y.Q. Aguiar, Frédéric Wrobel, S. Guagliardo, J.-L. Autran, P. Leroux, et al.. Radiation hardening efficiency of gate sizing and transistor stacking based on standard cells. Microelectronics Reliability, Elsevier, 2019, 100-101, pp.113457. 10.1016/j.microrel.2019.113457. hal-02515096 HAL Id: hal-02515096 https://hal.archives-ouvertes.fr/hal-02515096 Submitted on 24 Mar 2020 HAL is a multi-disciplinary open access L’archive ouverte pluridisciplinaire HAL, est archive for the deposit and dissemination of sci- destinée au dépôt et à la diffusion de documents entific research documents, whether they are pub- scientifiques de niveau recherche, publiés ou non, lished or not. The documents may come from émanant des établissements d’enseignement et de teaching and research institutions in France or recherche français ou étrangers, des laboratoires abroad, or from public or private research centers. publics ou privés. Radiation Hardening Efficiency of Gate Sizing and Transistor Stacking based on Standard Cells Y. Q. Aguiara,*, F. Wrobela, S. Guagliardoa, J-L. Autranb, P. Lerouxc, F. Saignéa, A. D. Touboula and V. Pougeta a Institut d’Electronique et des Systèmes, University of Montpellier, Montpellier, France b Institut Materiaux Microelectronique Nanoscience de Provence, Aix-Marseille University, Marseille, France c Advanced Integrated Sensing Lab, KU Leuven University, Leuven, Belgium Abstract Soft error mitigation schemes inherently lead to penalties in terms of area usage, power consumption and/or performance metrics. -
Design of Robust CMOS Circuits for Soft Error Tolerance
Design of Robust CMOS Circuits for Soft Error Tolerance Debopriyo Chowdhury, Mohammad Amin Arbabian Department of EECS, Univ. of California, Berkeley, CA 94720 Abstract - With the continuous downscaling of technology, take care of the problems and analyze the merits and lowering of supply voltage and increase of operating demerits. Finally, we want to design robust latches and frequency, integrated circuits become increasingly susceptible combinational blocks that have good soft-error tolerance. to single event effects (SEE) caused by high energy particles The report is organized into four sections; section II covers like alpha particles, neutrons from cosmic rays etc. A SEU the background, origin and effect of soft error on may cause a bit flip in some latch or memory element, thereby altering the state of the system, leading to a ‘soft error’. Soft nanometer circuits. Section III is a literature review with an errors in memory have traditionally been a much greater analytical flavor, while section IV outlines the proposed concern than soft errors in logic circuits. However, as process work for the rest of the semester as well as shows some technology scales below 100 nanometers, voltage levels go initial simulation results. down and noise margins reduce, soft errors in logic circuits seem to be a potential threat too. In this work, we propose to analyze the effect of various circuit parameters on soft error susceptibility of logic circuits. Also, we plan to design a robust II. SOFT ERRORS: ORIGIN AND EFFECT ON latch that has simultaneous SET and SEU tolerance. INTEGRATED CIRCUITS Index Terms - Soft Errors, SET, SEU Hardened Latch A soft error occurs when a radiation event causes enough of a charge distribution to reverse or flip the data state of a memory cell, latch, flip-flop or even a node in a I. -
Evaluation of Soft Errors Rate in a Commercial Memory Eeprom
2011 International Nuclear Atlantic Conference - INAC 2011 Belo Horizonte,MG, Brazil, October 24-28, 2011 ASSOCIAÇÃO BRASILEIRA DE ENERGIA NUCLEAR - ABEN ISBN: 978-85-99141-04-5 EVALUATION OF SOFT ERRORS RATE IN A COMMERCIAL MEMORY EEPROM Luiz H. Claro1, A. A. Silva1, José A. Santos1, Suzy F. L. Nogueira2, Ary G. Barrios Jr2. 1 Divisão de Energia Nuclear Instituto de Estudos Avançados , IEAv Caixa Postal 6044 12231-970 São José dos Campos, SP [email protected] 2 Faculdade de Tecnologia São Francisco, FATESF Av. Siqueira Campos, 1174 12307-000 Jacareí, SP [email protected] ABSTRACT Soft errors are transient circuit errors caused by external radiation. When an ion intercepts a p-n region in an electronic component, the ionization produces excess charges along the track. These charges when collected can flip internal values, especially in memory cells. The problem affects not only space application but also terrestrial ones. Neutrons induced by cosmic rays and alpha particles, emitted from traces of radioactive contaminants contained in packaging and chip materials, are the predominant sources of radiation. The soft error susceptibility is different for different memory technology hence the experimental study are very important for Soft Error Rate (SER) evaluation. In this work, the methodology for accelerated tests is presented with the results for SER in a commercial electrically erasable and programmable read-only memory (EEPROM). 1. INTRODUCTION From all possible kinds of radiation damages to electronic components, the soft errors are included in the class of transitory errors induced by a single particle. In the other class, the hard errors, the ionizing radiation permanently changes the structural array in the electronic components. -
Soft Error Modeling and Analysis of the Neutron Intercepting Silicon Chip (NISC) C
Soft Error Modeling and Analysis of the Neutron Intercepting Silicon Chip (NISC) C. Çelik,1,2 K. Ünlü,1,2 N. Vijaykrishnan,3 M. J. Irwin3 Service Provided: Neutron Beam Laboratory Sponsors: National Science Foundation, U. S. Department of Energy, INIE Mini Grant, the Penn State Radiation Science and Engineering Center, and the Penn State Department of Computer Science and Engineering detailed records for particles, including the mother Introduction particle of the particle that causes the soft error. Advances in microelectronic technologies result in semiconductor memories with sub-micrometer NISC Simulation Model transistor dimensions. While the decrease in the dimensions satisfy both the producers’ and consumers’ The semiconductor device node represents the basic requirements, it also leads to a higher susceptibility of data storage unit in a semiconductor memory, and for the NISC design it is chosen to be as simple as possible the integrated circuit designs to temperature, magnetic 10 7 interference, power supply and environmental noise, in order to focus on the B(n,α) Li reaction. A cross and radiation. sectional view of the memory node model is illustrated in Figure 1. The BPSG layer is designed to produce Soft errors are transient circuit errors caused due to energetic α and 7Li particles, hence it acts as a source excess charge carriers induced primarily by external for producing soft errors. In a semiconductor memory, radiations. The Neutron Intercepting Silicon Chip (NISC) depending on the architecture and vendors, there are promises an unconventional, portable, power efficient different layers to produce depletion regions, gates, neutron monitoring and detection system by enhancing and isolation layers. -
And Intra-Set Write Variations
i2WAP: Improving Non-Volatile Cache Lifetime by Reducing Inter- and Intra-Set Write Variations 1 2 1,3 4 Jue Wang , Xiangyu Dong ,YuanXie , Norman P. Jouppi 1Pennsylvania State University, 2Qualcomm Technology, Inc., 3AMD Research, 4Hewlett-Packard Labs 1{jzw175,yuanxie}@cse.psu.edu, [email protected], [email protected], [email protected] Abstract standby power, better scalability, and non-volatility. For example, among many ReRAM prototype demonstrations Modern computers require large on-chip caches, but [11, 14, 21–25], a 4Mb ReRAM macro [21] can achieve a the scalability of traditional SRAM and eDRAM caches is cell size of 9.5F 2 (15X denser than SRAM) and a random constrained by leakage and cell density. Emerging non- read/write latency of 7.2ns (comparable to SRAM caches volatile memory (NVM) is a promising alternative to build with similar capacity). Although its write access energy is large on-chip caches. However, limited write endurance is usually on the order of 10pJ per bit (10X of SRAM write a common problem for non-volatile memory technologies. energy, 5X of DRAM), the actual energy saving comes from In addition, today’s cache management might result in its non-volatility property. Non-volatility can eliminate the unbalanced write traffic to cache blocks causing heavily- standby leakage energy, which can be as high as 80% of the written cache blocks to fail much earlier than others. total energy consumption for an SRAM L2 cache [10]. Unfortunately, existing wear-leveling techniques for NVM- Given the potential energy and cost saving opportunities based main memories cannot be simply applied to NVM- (via reducing cell size) from the adoption of non-volatile based on-chip caches because cache writes have intra-set technologies, replacing SRAM and eDRAM with them can variations as well as inter-set variations. -
ECE 571 – Advanced Microprocessor-Based Design Lecture 17
ECE 571 { Advanced Microprocessor-Based Design Lecture 17 Vince Weaver http://web.eece.maine.edu/~vweaver [email protected] 3 April 2018 Announcements • HW8 is readings 1 More DRAM 2 ECC Memory • There's debate about how many errors can happen, anywhere from 10−10 error/bit*h (roughly one bit error per hour per gigabyte of memory) to 10−17 error/bit*h (roughly one bit error per millennium per gigabyte of memory • Google did a study and they found more toward the high end • Would you notice if you had a bit flipped? • Scrubbing { only notice a flip once you read out a value 3 Registered Memory • Registered vs Unregistered • Registered has a buffer on board. More expensive but can have more DIMMs on a channel • Registered may be slower (if it buffers for a cycle) • RDIMM/UDIMM 4 Bandwidth/Latency Issues • Truly random access? No, burst speed fast, random speed not. • Is that a problem? Mostly filling cache lines? 5 Memory Controller • Can we have full random access to memory? Why not just pass on CPU mem requests unchanged? • What might have higher priority? • Why might re-ordering the accesses help performance (back and forth between two pages) 6 Reducing Refresh • DRAM Refresh Mechanisms, Penalties, and Trade-Offs by Bhati et al. • Refresh hurts performance: ◦ Memory controller stalls access to memory being refreshed ◦ Refresh takes energy (read/write) On 32Gb device, up to 20% of energy consumption and 30% of performance 7 Async vs Sync Refresh • Traditional refresh rates ◦ Async Standard (15.6us) ◦ Async Extended (125us) ◦ SDRAM - -
Improving Performance and Reliability of Flash Memory Based Solid State Storage Systems
Improving Performance And Reliability Of Flash Memory Based Solid State Storage Systems A dissertation submitted to the Graduate School of the University of Cincinnati in partial fulfillment of the requirements for the degree of Doctor of Philosophy in Computer Science and Engineering in the Department of Electrical Engineering and Computing Systems of the College of Engineering and Applied Science by Mingyang Wang 2015 B.E. University of Science and Technology Beijing, China Committee: Professor Yiming Hu, Chair Professor Kenneth Berman Professor Karen Davis Professor Wen-Ben Jone Professor Carla Purdy Abstract Flash memory based Solid State Disk systems (SSDs) are becoming increasingly popular in enterprise applications where high performance and high reliability are paramount. While SSDs outperform traditional Hard Disk Drives (HDDs) in read and write operations, they pose some unique and serious challenges to I/O and file system designers. The performance of an SSD has been found to be sensitive to access patterns. Specifically read operations perform much faster than write ones, and sequential accesses deliver much higher performance than random accesses. The unique properties of SSDs, together with the asymmetric overheads of different operations, imply that many traditional solutions tailored for HDDs may not work well for SSDs. The close relation between performance overhead and access patterns motivates us to design a series of novel algorithms for I/O scheduler and buffer cache management. By exploiting refined access patterns such as sequential, page clustering, block clustering in a per-process per- file manner, a series of innovative algorithms on I/O scheduler and buffer cache can deliver higher performance of the file system and SSD devices. -
Managing Correctable Memory Errors on Cisco UCS Servers
Managing Correctable Memory Errors on Cisco UCS Servers This document provides empirical evidence that shows no correlation between correctable and uncorrectable errors on UCS M4 and earlier generation servers. Furthermore, using industry-standard benchmarks, this document demonstrates that systems with correctable errors do not exhibit system performance degradation. Given these findings, starting with UCS Manager (UCSM) 2.2(7), 3.1(1), and Cisco Integrated Management Controller (CIMC) 2.0(9) for rack standalone, Cisco UCS server memory-error threshold policies will not declare modules with correctable errors to be degraded. For customers who are not on UCSM 2.2(7), 3.1(1), or CIMC 2.0(9) or newer that experience a degraded memory alert for correctable errors, the Cisco UCS team recommends that memory modules with correctable errors not be replaced immediately upon alert. Instead please reset the memory-error counters and resume operation. See the Additional Resources section for UCS M5 servers. © 2020 Cisco and/or its affiliates. All rights reserved. This document is Cisco Public. Page 1 of 9 Contents Field Recommendations: Correctable Errors and Threshold Policies................................................................ 3 Overview of Memory Errors .................................................................................................................................... 3 Classification of Memory Errors ...........................................................................................................................